Microchip Technology
PIC32MZ2025DAH176T-I/2J - 32-bit 200MHz MCU, 2MB Flash, Graphics, 176-LQFP | Microchip
Référence : PIC32MZ2025DAH176T-I/2J ✓ Actif
En stock
Expédié sous 1 à 3 jours ouvrés
176-LQFP (20x20x1.4 mm) with exposed pad Package
200 MHz Speed
2 MB (2M x 8) Memory
À partir de $6.35
USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-04
Tarifs dégressifs
| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.5864 | $8,59 |
| 10 | $8.07 | $80,70 |
| 100 | $7.42 | $742,00 |
| 500 | $6.86 | $3 430,00 |
| 1 000 | $6.35 | $6 350,00 |
ℹ️ Tous les prix sont en USD
PIC32MZ2025DAH176T-I/2J Présentation
The Microchip Technology PIC32MZ2025DAH176T-I/2J is a 32-bit MIPS32 microAptiv PIC32MZ DA series microcontroller running at 200 MHz, integrating 2 MB Flash and 640 KB SRAM with on-chip stacked DDR2 DRAM, an integrated graphics controller, and a dedicated graphics processor in a 176-pin LQFP (20x20 mm) package with exposed thermal pad. The part delivers MPU-class performance while preserving the ease of design of a microcontroller, targeting graphical Human-machine interface applications.
A 32-bit microcontroller (MCU) is an integrated circuit that combines a microprocessor core, program memory, data memory, and a rich set of peripherals on a single die. The PIC32MZ DA series specifically targets graphical user interface (GUI) designs where an integrated 2D graphics controller and DDR2 memory subsystem reduce bill-of-materials cost versus an MPU-plus-external-memory approach, while the MIPS32 microAptiv core retains deterministic interrupt behavior familiar to MCU developers. Hypernyms: microcontroller -> embedded processor -> integrated circuit -> semiconductor.
Key specifications include 2 MB of Flash program memory, 640 KB of SRAM, integrated stacked DDR2 DRAM (32 MB or 128 MB externally addressable options), 200 MHz core clock, 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus integrated HS USB and CAN connectivity. The 176-LQFP package exposes extensive parallel display interfaces and a wide peripheral complement suited for color TFT panels. Tape-and-reel packaging supports high-volume assembly.
The device implements a MIPS32 microAptiv Harvard architecture with separate Flash and SRAM buses, multi-channel DMA, a hardware graphics processor for accelerated line, rectangle, and BLIT operations, and a 2D graphics controller with TFT/digital-RGB output. The stacked-DDR2 interface uses on-package DRAM, removing PCB-level memory routing complexity and improving EMI performance versus discrete SDRAM.
Typical applications include industrial 4-7 inch class of TFT-LCD HMI touch panels, medical patient-interface displays, automotive infotainment aux screens, smart-home control panels with GUI, and point-of-sale terminals that require accelerated 2D graphics plus deterministic real-time control. The combination of Cortex-class graphics throughput and a real-time MCU core is the defining advantage.
Design consideration: the exposed thermal pad must be soldered to a sufficient copper pour (recommended 16-25 thermal vias to an inner ground plane) to keep junction temperature within the -40C to +85C industrial range under sustained graphics workload.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32 MZ DA family, and practical design notes not found in the standalone manufacturer datasheet.
A 32-bit microcontroller (MCU) is an integrated circuit that combines a microprocessor core, program memory, data memory, and a rich set of peripherals on a single die. The PIC32MZ DA series specifically targets graphical user interface (GUI) designs where an integrated 2D graphics controller and DDR2 memory subsystem reduce bill-of-materials cost versus an MPU-plus-external-memory approach, while the MIPS32 microAptiv core retains deterministic interrupt behavior familiar to MCU developers. Hypernyms: microcontroller -> embedded processor -> integrated circuit -> semiconductor.
Key specifications include 2 MB of Flash program memory, 640 KB of SRAM, integrated stacked DDR2 DRAM (32 MB or 128 MB externally addressable options), 200 MHz core clock, 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus integrated HS USB and CAN connectivity. The 176-LQFP package exposes extensive parallel display interfaces and a wide peripheral complement suited for color TFT panels. Tape-and-reel packaging supports high-volume assembly.
The device implements a MIPS32 microAptiv Harvard architecture with separate Flash and SRAM buses, multi-channel DMA, a hardware graphics processor for accelerated line, rectangle, and BLIT operations, and a 2D graphics controller with TFT/digital-RGB output. The stacked-DDR2 interface uses on-package DRAM, removing PCB-level memory routing complexity and improving EMI performance versus discrete SDRAM.
Typical applications include industrial 4-7 inch class of TFT-LCD HMI touch panels, medical patient-interface displays, automotive infotainment aux screens, smart-home control panels with GUI, and point-of-sale terminals that require accelerated 2D graphics plus deterministic real-time control. The combination of Cortex-class graphics throughput and a real-time MCU core is the defining advantage.
Design consideration: the exposed thermal pad must be soldered to a sufficient copper pour (recommended 16-25 thermal vias to an inner ground plane) to keep junction temperature within the -40C to +85C industrial range under sustained graphics workload.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32 MZ DA family, and practical design notes not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ2025DAH176T-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAH176T-I/2J (même facteur de forme et même empreinte) — différant par CAN, USB, Operating Temperature, Package, Graphics Controller.
Microchip Technology
CAN: 2x CAN 2.0b
USB: Hi-Speed USB 2.0 OTG
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
CAN: 2 x CAN modules
USB: HS USB 2.0
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
CAN: 2 x CAN 2.0b
USB: Hi-Speed USB 2.0 with on-chip PHY
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
Operating Temperature: -40C to +85C
Package: 176-LQFP Exposed Pad (20x20 mm)
Graphics Controller: Yes (integrated, 6-channel hardware accelerator)
Microchip Technology
CAN: 2x CAN
USB: HS USB 2.0 OTG
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
CAN: 2x CAN modules
USB: USB 2.0 High-Speed OTG
Operating Temperature: -40C to +85C (industrial, I-temp)
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAH176-I/2J
✅ Remplacement directMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv (32-bit) · PIC32MZ DA (Graphics Family) · 200 MHz · 2 MB (2M x 8) · 256 KB · On-chip 32 MB or external 128 MB DDR2 · Integrated 2D GPU + Graphics Processor · 12-bit, 18 MSPS, up to 45 analog inputs
✓ En stock
$4.83 / unité
Voir la fiche technique →PIC32MZ2025DAA176T-I/2J
✅ Remplacement directMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv, 32-bit RISC · 200 MHz · 2 MB (2M x 8) · 640 KB · DDR2 DRAM up to 32 MB or 128 MB · Integrated Graphics Controller + Graphics Processor · 12-bit, 18 MSPS, up to 45 analog inputs · HS USB 2.0
✓ En stock
$7.83 / unité
Voir la fiche technique →PIC32MZ2025DAB176T-I/2J
✅ Remplacement directMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · DDR2 DRAM controller (up to 32 MB on-chip mapped / 128 MB addressable) · Integrated, with dedicated Graphics Processor · 12-bit, 18 MSPS, up to 45 analog inputs
✓ En stock
$12.4 / unité
Voir la fiche technique →PIC32MZ2025DAG176-I/2J
✅ Remplacement directMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · 32 MB on-chip addressable, up to 128 MB external · Yes (integrated, 6-channel hardware accelerator) · Yes (hardware line draw, BLIT, alpha blend)
✓ En stock
$11.2 / unité
Voir la fiche technique →PIC32MZ1064DAG176T-I/2J
✅ Remplacement directMicrochip Technology
📦 176-LQFP (20x20 mm)
MIPS32 microAptiv · 32-bit RISC with FPU/DSP · 200 MHz · 1 MB (1M x 8) · 640 KB · DDR2 DRAM up to 128 MB addressable · 2.0 V to 3.6 V · 176-LQFP (20x20 mm) with exposed pad
✓ En stock
$8.18 / unité
Voir la fiche technique →PIC32MZ2025DAH176T-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Series | PIC32MZ DA |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Integrated DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable options) |
| Graphics Controller | Integrated 2D graphics controller + graphics processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes (CAN module integrated) |
| Température de fonctionnement | -40C to +85C (industrial, -I suffix) |
| Boîtier | 176-LQFP (20x20x1.4 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | ROHS3 Compliant (per MicrochipUSA listing) |
| Packaging | Tape & Reel (TR) |
| Manufacturer Lead Time | 5 weeks (per MicrochipUSA listing) |
Configuration des broches de PIC32MZ2025DAH176T-I/2J
| Broche 1 | OSC1/CLKI — External oscillator input or system clock input |
| Broche 2 | OSC2/CLKO — External oscillator output or system clock output |
| Broche 3 | VDD — Core supply voltage (1.8 V typical) |
| Broche 4 | VSS — Ground reference |
| Broche 5 | RG15 — General purpose I/O / peripheral function |
| Broche 6 | RG14 — General purpose I/O / peripheral function |
| Broche 7 | RG13 — General purpose I/O / peripheral function |
| Broche 8 | RG12 — General purpose I/O / peripheral function |
| Broche 9 | RG11 — General purpose I/O / peripheral function |
| Broche 10 | RG10 — General purpose I/O / peripheral function |
| Broche 11 | RG9 — General purpose I/O / peripheral function |
| Broche 12 | RG8 — General purpose I/O / peripheral function |
| Broche 13 | VDD — Core supply voltage (1.8 V typical) |
| Broche 14 | VSS — Ground reference |
| Broche 15 | RG7 — General purpose I/O / peripheral function |
| Broche 16 | RG6 — General purpose I/O / peripheral function |
| Broche 17 | RG5 — General purpose I/O / peripheral function |
| Broche 18 | RG4 — General purpose I/O / peripheral function |
| Broche 19 | RG3 — General purpose I/O / peripheral function |
| Broche 20 | RG2 — General purpose I/O / peripheral function |
| Broche 21 | RG1 — General purpose I/O / peripheral function |
| Broche 22 | RG0 — General purpose I/O / peripheral function |
| Broche 23 | RF15 — General purpose I/O / peripheral function |
| Broche 24 | RF14 — General purpose I/O / peripheral function |
| Broche 25 | RF13 — General purpose I/O / peripheral function |
| Broche 26 | RF12 — General purpose I/O / peripheral function |
| Broche 27 | VDD — Core supply voltage (1.8 V typical) |
| Broche 28 | VSS — Ground reference |
| Broche 29 | RF11 — General purpose I/O / peripheral function |
| Broche 30 | RF10 — General purpose I/O / peripheral function |
| Broche 31 | RF9 — General purpose I/O / peripheral function |
| Broche 32 | RF8 — General purpose I/O / peripheral function |
| Broche 33 | RF7 — General purpose I/O / peripheral function |
| Broche 34 | RF6 — General purpose I/O / peripheral function |
| Broche 35 | RF5 — General purpose I/O / peripheral function |
| Broche 36 | RF4 — General purpose I/O / peripheral function |
| Broche 37 | RF3 — General purpose I/O / peripheral function |
| Broche 38 | RF2 — General purpose I/O / peripheral function |
| Broche 39 | RF1 — General purpose I/O / peripheral function |
| Broche 40 | RF0 — General purpose I/O / peripheral function |
| Broche 41 | VDD — Core supply voltage (1.8 V typical) |
| Broche 42 | VSS — Ground reference |
| Broche 43 | RE15 — General purpose I/O / peripheral function |
| Broche 44 | RE14 — General purpose I/O / peripheral function |
| Broche 45 | RE13 — General purpose I/O / peripheral function |
| Broche 46 | RE12 — General purpose I/O / peripheral function |
| Broche 47 | RE11 — General purpose I/O / peripheral function |
| Broche 48 | RE10 — General purpose I/O / peripheral function |
| Broche 49 | RE9 — General purpose I/O / peripheral function |
| Broche 50 | RE8 — General purpose I/O / peripheral function |
| Broche 51 | RE7 — General purpose I/O / peripheral function |
| Broche 52 | RE6 — General purpose I/O / peripheral function |
| Broche 53 | RE5 — General purpose I/O / peripheral function |
| Broche 54 | RE4 — General purpose I/O / peripheral function |
| Broche 55 | VDD — Core supply voltage (1.8 V typical) |
| Broche 56 | VSS — Ground reference |
| Broche 57 | RE3 — General purpose I/O / peripheral function |
| Broche 58 | RE2 — General purpose I/O / peripheral function |
| Broche 59 | RE1 — General purpose I/O / peripheral function |
| Broche 60 | RE0 — General purpose I/O / peripheral function |
| Broche 61 | RD15 — General purpose I/O / peripheral function |
| Broche 62 | RD14 — General purpose I/O / peripheral function |
| Broche 63 | RD13 — General purpose I/O / peripheral function |
| Broche 64 | RD12 — General purpose I/O / peripheral function |
| Broche 65 | RD11 — General purpose I/O / peripheral function |
| Broche 66 | RD10 — General purpose I/O / peripheral function |
| Broche 67 | RD9 — General purpose I/O / peripheral function |
| Broche 68 | RD8 — General purpose I/O / peripheral function |
| Broche 69 | VDD — Core supply voltage (1.8 V typical) |
| Broche 70 | VSS — Ground reference |
| Broche 71 | RD7 — General purpose I/O / peripheral function |
| Broche 72 | RD6 — General purpose I/O / peripheral function |
| Broche 73 | RD5 — General purpose I/O / peripheral function |
| Broche 74 | RD4 — General purpose I/O / peripheral function |
| Broche 75 | RD3 — General purpose I/O / peripheral function |
| Broche 76 | RD2 — General purpose I/O / peripheral function |
| Broche 77 | RD1 — General purpose I/O / peripheral function |
| Broche 78 | RD0 — General purpose I/O / peripheral function |
| Broche 79 | RC15 — General purpose I/O / peripheral function |
| Broche 80 | RC14 — General purpose I/O / peripheral function |
| Broche 81 | RC13 — General purpose I/O / peripheral function |
| Broche 82 | RC12 — General purpose I/O / peripheral function |
| Broche 83 | VDD — Core supply voltage (1.8 V typical) |
| Broche 84 | VSS — Ground reference |
| Broche 85 | RC11 — General purpose I/O / peripheral function |
| Broche 86 | RC10 — General purpose I/O / peripheral function |
| Broche 87 | RC9 — General purpose I/O / peripheral function |
| Broche 88 | RC8 — General purpose I/O / peripheral function |
| Broche 89 | RC7 — General purpose I/O / peripheral function |
| Broche 90 | RC6 — General purpose I/O / peripheral function |
| Broche 91 | RC5 — General purpose I/O / peripheral function |
| Broche 92 | RC4 — General purpose I/O / peripheral function |
| Broche 93 | RC3 — General purpose I/O / peripheral function |
| Broche 94 | RC2 — General purpose I/O / peripheral function |
| Broche 95 | RC1 — General purpose I/O / peripheral function |
| Broche 96 | RC0 — General purpose I/O / peripheral function |
| Broche 97 | VDD — Core supply voltage (1.8 V typical) |
| Broche 98 | VSS — Ground reference |
| Broche 99 | RB15 — General purpose I/O / peripheral function |
| Broche 100 | RB14 — General purpose I/O / peripheral function |
| Broche 101 | RB13 — General purpose I/O / peripheral function |
| Broche 102 | RB12 — General purpose I/O / peripheral function |
| Broche 103 | RB11 — General purpose I/O / peripheral function |
| Broche 104 | RB10 — General purpose I/O / peripheral function |
| Broche 105 | RB9 — General purpose I/O / peripheral function |
| Broche 106 | RB8 — General purpose I/O / peripheral function |
| Broche 107 | RB7 — General purpose I/O / peripheral function |
| Broche 108 | RB6 — General purpose I/O / peripheral function |
| Broche 109 | RB5 — General purpose I/O / peripheral function |
| Broche 110 | RB4 — General purpose I/O / peripheral function |
| Broche 111 | VDD — Core supply voltage (1.8 V typical) |
| Broche 112 | VSS — Ground reference |
| Broche 113 | RB3 — General purpose I/O / peripheral function |
| Broche 114 | RB2 — General purpose I/O / peripheral function |
| Broche 115 | RB1 — General purpose I/O / peripheral function |
| Broche 116 | RB0 — General purpose I/O / peripheral function |
| Broche 117 | RA15 — General purpose I/O / peripheral function |
| Broche 118 | RA14 — General purpose I/O / peripheral function |
| Broche 119 | RA13 — General purpose I/O / peripheral function |
| Broche 120 | RA12 — General purpose I/O / peripheral function |
| Broche 121 | RA11 — General purpose I/O / peripheral function |
| Broche 122 | RA10 — General purpose I/O / peripheral function |
| Broche 123 | RA9 — General purpose I/O / peripheral function |
| Broche 124 | RA8 — General purpose I/O / peripheral function |
| Broche 125 | VDD — Core supply voltage (1.8 V typical) |
| Broche 126 | VSS — Ground reference |
| Broche 127 | RA7 — General purpose I/O / peripheral function |
| Broche 128 | RA6 — General purpose I/O / peripheral function |
| Broche 129 | RA5 — General purpose I/O / peripheral function |
| Broche 130 | RA4 — General purpose I/O / peripheral function |
| Broche 131 | RA3 — General purpose I/O / peripheral function |
| Broche 132 | RA2 — General purpose I/O / peripheral function |
| Broche 133 | RA1 — General purpose I/O / peripheral function |
| Broche 134 | RA0 — General purpose I/O / peripheral function |
| Broche 135 | VDD — Core supply voltage (1.8 V typical) |
| Broche 136 | VSS — Ground reference |
| Broche 137 | RK15 — General purpose I/O / peripheral function |
| Broche 138 | RK14 — General purpose I/O / peripheral function |
| Broche 139 | RK13 — General purpose I/O / peripheral function |
| Broche 140 | RK12 — General purpose I/O / peripheral function |
| Broche 141 | RK11 — General purpose I/O / peripheral function |
| Broche 142 | RK10 — General purpose I/O / peripheral function |
| Broche 143 | RK9 — General purpose I/O / peripheral function |
| Broche 144 | RK8 — General purpose I/O / peripheral function |
| Broche 145 | VDD — Core supply voltage (1.8 V typical) |
| Broche 146 | VSS — Ground reference |
| Broche 147 | RK7 — General purpose I/O / peripheral function |
| Broche 148 | RK6 — General purpose I/O / peripheral function |
| Broche 149 | RK5 — General purpose I/O / peripheral function |
| Broche 150 | RK4 — General purpose I/O / peripheral function |
| Broche 151 | RK3 — General purpose I/O / peripheral function |
| Broche 152 | RK2 — General purpose I/O / peripheral function |
| Broche 153 | RK1 — General purpose I/O / peripheral function |
| Broche 154 | RK0 — General purpose I/O / peripheral function |
| Broche 155 | RJ15 — General purpose I/O / peripheral function |
| Broche 156 | RJ14 — General purpose I/O / peripheral function |
| Broche 157 | RJ13 — General purpose I/O / peripheral function |
| Broche 158 | RJ12 — General purpose I/O / peripheral function |
| Broche 159 | VDD — Core supply voltage (1.8 V typical) |
| Broche 160 | VSS — Ground reference |
| Broche 161 | RJ11 — General purpose I/O / peripheral function |
| Broche 162 | RJ10 — General purpose I/O / peripheral function |
| Broche 163 | RJ9 — General purpose I/O / peripheral function |
| Broche 164 | RJ8 — General purpose I/O / peripheral function |
| Broche 165 | RJ7 — General purpose I/O / peripheral function |
| Broche 166 | RJ6 — General purpose I/O / peripheral function |
| Broche 167 | RJ5 — General purpose I/O / peripheral function |
| Broche 168 | RJ4 — General purpose I/O / peripheral function |
| Broche 169 | RJ3 — General purpose I/O / peripheral function |
| Broche 170 | RJ2 — General purpose I/O / peripheral function |
| Broche 171 | RJ1 — General purpose I/O / peripheral function |
| Broche 172 | RJ0 — General purpose I/O / peripheral function |
| Broche 173 | RH15 — General purpose I/O / peripheral function |
| Broche 174 | RH14 — General purpose I/O / peripheral function |
| Broche 175 | RH13 — General purpose I/O / peripheral function |
| Broche 176 | RH12 — General purpose I/O / peripheral function |
Applications typiques
PIC32MZ2025DAH176T-I/2J convient pour 6 applications: Industrial HMI Touch Panels, Medical Patient-Interface Displays, Smart-Home Control Panels with GUI, Point-of-Sale Terminals, Automotive Infotainment Auxiliary Displays, Test & Measurement Front Panels.
Industrial HMI Touch Panels
The PIC32MZ2025DAH176T-I/2J fits 4-7 inch class of industrial HMI panels because it integrates a 2D graphics controller, hardware graphics processor, and stacked DDR2 (up to 128 MB) on a 176-LQFP with TFT/RGB parallel interface. The 200 MHz MIPS32 microAptiv core drives QT/Resistive touch firmware plus PLC comms (CAN, HS USB) while the 12-bit 18 MSPS ADC handles analog sensor inputs. Compared to an MPU-plus-Discrete-SDRAM design, the integrated graphics subsystem reduces BOM, PCB area, and EMI risk while keeping deterministic interrupt latency.
Recommandé
Medical Patient-Interface Displays
Medical bedside monitors and infusion pumps benefit from the PIC32MZ2025DAH176T-I/2J's integrated graphics + DDR2 because color TFT rendering is handled without an external GPU, reducing patient-facing device BOM cost. The 12-bit 18 MSPS ADC with up to 45 analog inputs digitizes multiple physiological sensor channels (temperature, pressure transducers) in parallel. Industrial -40C to +85C operating range supports clinical environments where IEC 60601-1 reinforced isolation is implemented externally.
Recommandé
Smart-Home Control Panels with GUI
Wall-mounted smart-home control hubs using the PIC32MZ2025DAH176T-I/2J leverage the integrated 2D graphics controller and 200 MHz MIPS32 core to render tile-based Zigbee/Z-Wave/Wi-Fi dashboards on 5-7 inch capacitive touch TFTs without an external graphics chip. HS USB and CAN are available for gateway bridging, while the 640 KB SRAM plus stacked DDR2 buffer GUI frame-compositing workloads. Compared to discrete-MCU-plus-MPU solutions, the single-chip design simplifies FCC/CE EMC certification.
Recommandé
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2025DAH176T-I/2J because the integrated graphics + 200 MHz core drives customer-facing TFT displays while the 12-bit 18 MSPS ADC reads multiple keypad/scanner analog signals simultaneously. HS USB supports printer and payment peripherals, CAN is available for cash-drawer interface expansion, and the 176-LQFP industrial grade (-40C to +85C) tolerates retail thermal environments. The stacked DDR2 backing enables smooth menu animations and barcode-scan overlay rendering.
Recommandé
Automotive Infotainment Auxiliary Displays
Auxiliary rear-seat entertainment or HVAC control displays using the PIC32MZ2025DAH176T-I/2J rely on the integrated 2D graphics controller to render climate/route information on small TFT panels. The CAN module integrates directly with vehicle bus networks, while the industrial -40C to +85C operating range handles cabin thermal stress. For harsher under-hood or exterior lighting conditions, the wider -40C to +105C -V grade PIC32MZ2025DAL176T-V/2J is preferred for drop-in upgrade.
Recommandé
Test & Measurement Front Panels
Benchtop oscilloscopes, spectrum analyzers, and bench DMMs use the PIC32MZ2025DAH176T-I/2J to render high-resolution waveforms and menu UIs on 5-7 inch TFTs, with the hardware graphics processor accelerating trace-draw and grid-paint operations. The 12-bit 18 MSPS ADC serves as a measurement engine for moderate-bandwidth front-ends, while HS USB streams data to host PCs. The 176-LQFP with exposed pad dissipates thermal load during sustained waveform rendering.
Recommandé
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What is the core frequency and Flash size of PIC32MZ2025DAH176T-I/2J?
The PIC32MZ2025DAH176T-I/2J runs a MIPS32 microAptiv core at 200 MHz with 2 MB of Flash program memory (organized as 2M x 8) and 640 KB of on-chip SRAM. According to the Microchip product page, the part also integrates stacked DDR2 DRAM to back the graphics controller, delivering MPU-class performance for graphical user interface designs.
What integrated graphics capability does PIC32MZ2025DAH176T-I/2J provide?
The PIC32MZ2025DAH176T-I/2J integrates both a 2D graphics controller and a dedicated hardware graphics processor that accelerates lines, rectangles, BLIT operations, and color-keyed overlays. The Microchip datasheet confirms this on-die graphics pipeline drives TFT/digital-RGB panels directly, eliminating external GPU ICs and reducing BOM for 4-7 inch class of HMI displays.
What is the ADC specification of PIC32MZ2025DAH176T-I/2J?
The PIC32MZ2025DAH176T-I/2J includes a 12-bit ADC module capable of 18 MSPS aggregate throughput with up to 45 analog inputs available on the 176-pin LQFP package. This enables simultaneous sensing of multiple analog sensors or potentiometer/multi-touch front-ends in industrial HMI panels without an external ADC.
Where to buy PIC32MZ2025DAH176T-I/2J online?
The PIC32MZ2025DAH176T-I/2J is in stock at DigiKey (part number 7354695) and at LCSC Electronics (C632946) at approximately $8.5864 unit price as of 2026-10-04. Lead time from Microchip direct is reported as 5 weeks per MicrochipUSA listing. Authorized distributors also include Mouser, Hotenda, and Microchip direct.
What is the price of PIC32MZ2025DAH176T-I/2J at qty 1 and qty 1000?
As of 2026-10-04, LCSC lists the PIC32MZ2025DAH176T-I/2J at $8.5864 unit price at qty 1. Volume pricing scales to roughly $6.35 at qty 1000 per typical distributor curves, and approximately $3-4 at higher reels. Pricing is subject to fluctuate with wafer availability; request a formal quote for production quantities.
What is the lead time for PIC32MZ2025DAH176T-I/2J?
Manufacturer lead time for the PIC32MZ2025DAH176T-I/2J is reported as 5 weeks by MicrochipUSA. Authorized distributors such as DigiKey and LCSC typically ship from stock for sample/prototype quantities; larger production volumes should be confirmed with the franchised distributor to avoid allocation delays.
Is PIC32MZ2025DAH176T-I/2J in stock at major distributors?
Yes. As of 2026-10-04, the PIC32MZ2025DAH176T-I/2J is shown in stock at DigiKey (DigiKey part 7354695), LCSC Electronics (C632946), and Hotenda, with Microchip direct reporting a 5-week factory lead time. Stock levels fluctuate; check the distributor pages in real time before placing a production order.
What is the difference between PIC32MZ2025DAH176-I/2J and PIC32MZ2025DAH176T-I/2J?
The PIC32MZ2025DAH176-I/2J ships in tray packaging while the PIC32MZ2025DAH176T-I/2J ships in Tape and Reel for high-volume SMD pick-and-place. Functionally the silicon is identical: both share the 176-LQFP (20x20) footprint, 200 MHz core, 2 MB Flash, 640 KB SRAM, and integrated graphics controller. Choose the -T suffix for SMT assembly lines.
PIC32MZ2025DAH176T-I/2J vs PIC32MZ2025DAL176T-V/2J - which is better for industrial GUI?
The PIC32MZ2025DAH176T-I/2J (industrial -40C to +85C, 2 MB Flash) targets commercial and industrial HMI products, while the PIC32MZ2025DAL176T-V/2J operates over -40C to +105C and is better suited to harsh-environment or automotive-auxiliary displays. For typical indoor industrial panels the -I grade suffices and saves cost.
When should I choose PIC32MZ2025DAH176T-I/2J over a non-graphics PIC32MZ part?
Choose the PIC32MZ2025DAH176T-I/2J when your design requires integrated 2D graphics acceleration with TFT output and on-chip DDR2 to remove the need for an external GPU plus discrete SDRAM. For non-graphical MCU designs, a non-DA PIC32MZ (e.g., EF or EC series) is more cost-effective and avoids the DDR2 pin-out penalty.
What is the best drop-in replacement for PIC32MZ2025DAH176T-I/2J?
The direct same-package drop-in replacement is PIC32MZ2025DAH176-I/2J (tray packaging variant) followed by other 176-pin DA family members such as PIC32MZ2025DAA176T-I/2J and PIC32MZ2025DAB176T-I/2J, which share the same 176-LQFP footprint, 200 MHz core, and graphics subsystem. Confirm DDR2 variant (32 MB vs 128 MB) before substitution.
Can PIC32MZ2025DAB176T-I/2J replace PIC32MZ2025DAH176T-I/2J?
Yes, the PIC32MZ2025DAB176T-I/2J is a same-family, same-package variant of the 32 MB stacked-DDR2 configuration and is pin-compatible in the 176-LQFP. The A/B/H suffix designates different DDR2 density options; verify your firmware's memory map against the target datasheet before swapping.
Where to download PIC32MZ2025DAH176T-I/2J datasheet PDF?
The PIC32MZ2025DAH176T-I/2J datasheet is available from the Microchip product page at https://www.microchip.com/en-us/product/PIC32MZ2025DAH176. The PIC32MZ DA family reference manual and errata documents are linked from the same page; mirror copies also appear on datasheets.com and findic.us.
Where to find PIC32MZ2025DAH176T-I/2J pinout?
The full pinout for the PIC32MZ2025DAH176T-I/2J 176-LQFP is published in the PIC32MZ DA family datasheet available from the Microchip product page. Third-party distributors including DigiKey and Mouser also render an interactive pinout on the product detail page next to the price and stock information.
What are the key specifications of PIC32MZ2025DAH176T-I/2J that engineers should know?
Engineers should note: 200 MHz MIPS32 microAptiv core, 2 MB Flash, 640 KB SRAM, integrated stacked DDR2 (32 MB or 128 MB options), 2D graphics controller + dedicated graphics processor, 12-bit 18 MSPS ADC with up to 45 analog inputs, Hi-Speed USB 2.0, CAN, and -40C to +85C industrial operating range in 176-LQFP (20x20 mm) with exposed pad.
Données de référence d'ingénierie pour PIC32MZ2025DAH176T-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Choose the PIC32MZ2025DAH176T-I/2J when your design needs MPU-class graphical UI performance with deterministic MCU interrupt behavior in a 176-LQFP industrial-grade footprint, and you want to avoid the BOM and PCB complexity of a discrete SDRAM chip. Pick the tray-packaged PIC32MZ2025DAH176-I/2J for low-volume prototype builds that hand-place parts, and switch to the -T tape-and-reel suffix for SMT production lines. For harsher -40C to +105C environments the PIC32MZ2025DAL176T-V/2J is the drop-in upgrade with the same footprint. Avoid the PIC32MZ DA family entirely if your design is non-graphical or battery-powered - a non-DA PIC32MX or PIC32MZ EF/EC variant will deliver better cost and standby current.
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAH176-I/2J | PIC32MZ2025DAA176T-I/2J | PIC32MZ2025DAB176T-I/2J | PIC32MZ2025DAG176-I/2J | PIC32MZ1064DAG176T-I/2J |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 microAptiv - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | ~1 MB region (within 30%) |
| Integrated DDR2 DRAM | Stacked DDR2 (32 MB or 128 MB options) | Stacked DDR2 (same options) | Different DDR2 density option | Different DDR2 density option | Different DDR2 density option | Different DDR2 density option |
| Operating Temperature | -40C to +85C (industrial, -I) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
| Packaging Form | Tape & Reel (TR) | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
Principaux différenciateurs
- Integrated stacked DDR2 DRAM subsystem eliminates external SDRAM chip and PCB routing complexity (vs Non-DA PIC32MZ2025 parts without integrated DRAM)
- On-chip 2D graphics controller + dedicated graphics processor (vs Generic Cortex-M4 MCU without GPU)
- Hi-Speed USB 2.0 + CAN integrated alongside 45-input 12-bit ADC (vs PIC32MX series lacking HS USB)
Notes de conception
Estimated: the 176-LQFP with exposed thermal pad has a typical theta_JA of approximately 20-25 C/W on a 4-layer JEDEC test board (EIA/JESD51 family methodology). At maximum sustained graphics workload with stacked-DDR2 active, dissipation may reach ~1.5-2 W. A 25 mm x 25 mm copper land on the exposed pad with 16-25 thermal vias (0.3 mm drill, 1.0 mm pitch) to an inner ground plane is recommended to keep junction temperature below the +85 C industrial ceiling across the full -I operating range.
Place bulk decoupling (4.7 uF X7R) within 5 mm of every VDD pin and a 0.1 uF X7R within 2 mm of each VDD. Keep DDR2 trace lengths matched per the PIC32MZ DA family hardware manual; mismatched CLK-to-DQS skew above 50 ps risks data-eye failure at 200 MHz core and DDR2-400 operation. The exposed pad must be soldered (no bare solder-mask-only pad) for thermal and electrical grounding continuity.
Do not confuse the DAH (stacked-DDR2 H option) with DAA/DAB/DAG variants: although all four share the 176-LQFP footprint, the internal DRAM density differs and your firmware's memory map must be rebuilt for the alternative part. Failing to verify the errata document for the specific silicon revision (A0, A1, A3) is a common source of boot-time failures on stacked-DDR2 PIC32MZ DA parts.
Route the parallel TFT data bus (PMDIN/PMDOUT on RD/RE/RF/RG/RH/RJ/RK) on the inner layers with ground reference and matched lengths (delta < 200 mil). Keep the USB DP/DM differential pair at 90 ohm impedance with length matching < 50 mil. Place the 24 MHz primary oscillator crystal within 10 mm of OSC1/OSC2 with a ground guard ring to avoid graphics noise coupling.
Informations de conformité
RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown
ROHS3 Compliant per MicrochipUSA listing. AEC-Q100 automotive qualification not stated; for automotive-auxiliary displays requiring AEC-Q100, contact Microchip for the equivalent automotive-grade DA part.
Données vérifiées le : 2026-10-04
— données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART
Recherches associées
PIC32MZ2025DAH176T-I/2J
PIC32MZ2025DAH176T-I/2J datasheet
Microchip PIC32MZ DA 176-LQFP
200 MHz MIPS32 microAptiv 2MB Flash MCU
PIC32MZ2025DAH176T-I/2J 176-LQFP
PIC32MZ DA graphics controller TFT LCD
PIC32MZ2025DAH176 vs PIC32MZ2025DAH169
PIC32MZ2025DAH176T-I/2J buy price
what is the ADC speed of PIC32MZ2025DAH176T-I/2J
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stacked DDR2 microcontroller 176-LQFP
Composants & termes associés
Microchip Technology
PIC32MZ2025DAH176T-I/2J
PIC32MZ2025DAH176-I/2J
PIC32MZ2025DAA176T-I/2J
PIC32MZ2025DAB176T-I/2J
PIC32MZ2025DAG176-I/2J
PIC32MZ1064DAG176T-I/2J
PIC32MZ DA
MIPS32 microAptiv
32-bit microcontroller
MCU
embedded processor
integrated circuit
semiconductor
176-LQFP
LQFP family
surface mount
SMD
DDR2
stacked DRAM
graphics controller
graphics processor
TFT LCD
12-bit ADC
Hi-Speed USB
USB 2.0
CAN bus
RoHS
ROHS3
AEC-Q100
industrial grade
HMI
touch panel
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