PIC32MZ2025DAK176-I/2J - 200MHz MCU 2MB Flash | Microchip
Référence : PIC32MZ2025DAK176-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.75 | $18,75 |
| 10 | $16.95 | $169,50 |
| 100 | $14.5 | $1 450,00 |
| 500 | $12.85 | $6 425,00 |
| 1 000 | $11.4 | $11 400,00 |
PIC32MZ2025DAK176-I/2J Présentation
What is a PIC32MZ DAK microcontroller? The PIC32MZ DAK series combines MPU-class graphics performance with the simplicity of an MCU for GUI-rich human-machine interface (HMI) applications. It belongs to the MIPS32 microAptiv family, which sits in the broader taxonomy of 32-bit embedded controllers (microcontroller -> 32-bit MCU -> MIPS architecture -> microAptiv core). This combination makes it suited for systems that need rich graphics, fast ADC, and connectivity in a single chip.
Key features include 200 MHz core clock, 2 MB Flash program memory, 640 KB SRAM, integrated DDR2 controller for external 32 MB or 128 MB DDR2, hardware Graphics Controller with dedicated Graphics Processor, 12-bit ADC at 18 MSPS with up to 45 analog input channels, HS USB 2.0, CAN 2.0, and a wide set of serial peripherals (UART, SPI, I2C). The 176-LQFP package with exposed pad improves thermal dissipation for full-speed operation.
The device uses a 5-stage MIPS32 microAptiv pipeline with DSP extensions, single-cycle hardware multiply/accumulate, and a tightly-coupled SRAM subsystem for deterministic performance. The integrated DDR2 controller removes the need for an external memory controller, simplifying board design for graphics-heavy GUI applications.
Typical applications include industrial HMI panels, automotive infotainment and cluster displays, medical patient monitors, point-of-sale terminals, smart home control panels, and any embedded GUI requiring hardware-accelerated graphics. The wide feature integration is particularly beneficial when system cost and PCB area must be minimized while still delivering smooth graphics rendering.
When designing with this device, allocate sufficient PCB copper for the exposed thermal pad and follow the manufacturer's DDR2 layout guidelines (matched-length traces, controlled impedance, decoupling close to the DDR2 pins) to achieve the rated 200 MHz operation and reliable DDR2 reads/writes.
This page synthesizes distributor pricing, drop-in alternatives within the PIC32MZ DAK/DA family, and practical design notes that supplement the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ2025DAK176-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAK176-I/2J (même facteur de forme et même empreinte) — différant par CAN, Graphics Controller, USB, External Memory Interface, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAK176-I/2J
✅ Remplacement direct✓ En stock
$15.75 / unité
Voir la fiche technique →PIC32MZ2025DAH176-I/2J
✅ Remplacement direct✓ En stock
$4.83 / unité
Voir la fiche technique →PIC32MZ2025DAG176-I/2J
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →PIC32MZ2025DAB176T-I/2J
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →PIC32MZ2025DAA176T-I/2J
✅ Remplacement direct✓ En stock
$7.83 / unité
Voir la fiche technique →PIC32MZ1064DAK176-V/2J
✅ Remplacement direct✓ En stock
$9.51 / unité
Voir la fiche technique →PIC32MZ1025DAB176T-I/2J
✅ Remplacement direct✓ En stock
$21.75 / unité
Voir la fiche technique →PIC32MZ2025DAK176-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ DAK |
| CPU Bit Width | 32-bit |
| Maximum CPU Speed | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 controller, 32 MB or 128 MB addressable |
| Graphics Controller | Integrated, hardware-accelerated |
| Graphics Processor | Dedicated on-chip GPU |
| ADC Resolution | 12-bit |
| ADC Sampling Rate | 18 MSPS |
| Analog Inputs (max) | 45 channels |
| USB | Hi-Speed USB 2.0 |
| CAN | Yes (CAN 2.0) |
| Tension d'alimentation | 1.8 V (core), 3.3 V (I/O) |
| Température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 176-LQFP (20x20 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de PIC32MZ2025DAK176-I/2J
| Broche 1 | OSC1/CLKI/RC12 — External oscillator input / general I/O |
| Broche 2 | OSC2/CLKO/RC15 — External oscillator output / general I/O |
| Broche 3 | VDD — 3.3 V I/O supply |
| Broche 4 | VSS — Ground reference |
| Broche 5 | AN0/RPB0 — Analog input 0 / GPIO |
| Broche 6 | AN1/RPB1 — Analog input 1 / GPIO |
| Broche 7 | AN2/RPB2 — Analog input 2 / GPIO |
| Broche 8 | AN3/RPB3 — Analog input 3 / GPIO |
| Broche 9 | AN4/RPB4 — Analog input 4 / GPIO |
| Broche 10 | AN5/RPB5 — Analog input 5 / GPIO |
| Broche 11 | AVDD — Analog 3.3 V supply |
| Broche 12 | AVSS — Analog ground |
| Broche 13 | AN6/RPB6 — Analog input 6 / GPIO |
| Broche 14 | AN7/RPB7 — Analog input 7 / GPIO |
| Broche 15 | AN8/RPB8 — Analog input 8 / GPIO |
| Broche 16 | AN9/RPB9 — Analog input 9 / GPIO |
| Broche 17 | AN10/RPB10 — Analog input 10 / GPIO |
| Broche 18 | AN11/RPB11 — Analog input 11 / GPIO |
| Broche 19 | VDD — 3.3 V I/O supply |
| Broche 20 | VSS — Ground reference |
| Broche 21 | AN12/RPB12 — Analog input 12 / GPIO |
| Broche 22 | AN13/RPB13 — Analog input 13 / GPIO |
| Broche 23 | AN14/RPB14 — Analog input 14 / GPIO |
| Broche 24 | AN15/RPB15 — Analog input 15 / GPIO |
| Broche 25 | VREF+/CVREF+/AN16 — ADC voltage reference positive / analog input |
| Broche 26 | VREF-/AN17 — ADC voltage reference negative / analog input |
| Broche 27 | AVDD — Analog 3.3 V supply |
| Broche 28 | AVSS — Analog ground |
| Broche 29 | AN18/RPC0 — Analog input 18 / GPIO |
| Broche 30 | AN19/RPC1 — Analog input 19 / GPIO |
| Broche 31 | AN20/RPC2 — Analog input 20 / GPIO |
| Broche 32 | AN21/RPC3 — Analog input 21 / GPIO |
| Broche 33 | AN22/RPC4 — Analog input 22 / GPIO |
| Broche 34 | AN23/RPC5 — Analog input 23 / GPIO |
| Broche 35 | AN24/RPC6 — Analog input 24 / GPIO |
| Broche 36 | AN25/RPC7 — Analog input 25 / GPIO |
| Broche 37 | AN26/RPC8 — Analog input 26 / GPIO |
| Broche 38 | AN27/RPC9 — Analog input 27 / GPIO |
| Broche 39 | VDD — 3.3 V I/O supply |
| Broche 40 | VSS — Ground reference |
| Broche 41 | DREQ/RPD0 — DMA request / GPIO |
| Broche 42 | PMD0/RE0 — Parallel master data 0 / GPIO |
| Broche 43 | PMD1/RE1 — Parallel master data 1 / GPIO |
| Broche 44 | PMD2/RE2 — Parallel master data 2 / GPIO |
| Broche 45 | PMD3/RE3 — Parallel master data 3 / GPIO |
| Broche 46 | PMD4/RE4 — Parallel master data 4 / GPIO |
| Broche 47 | PMD5/RE5 — Parallel master data 5 / GPIO |
| Broche 48 | PMD6/RE6 — Parallel master data 6 / GPIO |
| Broche 49 | PMD7/RE7 — Parallel master data 7 / GPIO |
| Broche 50 | PMD8/RF0 — Parallel master data 8 / GPIO |
| Broche 51 | PMD9/RF1 — Parallel master data 9 / GPIO |
| Broche 52 | PMD10/RF2 — Parallel master data 10 / GPIO |
| Broche 53 | PMD11/RF3 — Parallel master data 11 / GPIO |
| Broche 54 | PMD12/RF4 — Parallel master data 12 / GPIO |
| Broche 55 | PMD13/RF5 — Parallel master data 13 / GPIO |
| Broche 56 | PMD14/RF6 — Parallel master data 14 / GPIO |
| Broche 57 | PMD15/RF7 — Parallel master data 15 / GPIO |
| Broche 58 | PMA0/RG0 — Parallel master address 0 / GPIO |
| Broche 59 | PMA1/RG1 — Parallel master address 1 / GPIO |
| Broche 60 | PMA2/RG2 — Parallel master address 2 / GPIO |
| Broche 61 | PMA3/RG3 — Parallel master address 3 / GPIO |
| Broche 62 | PMA4/RG4 — Parallel master address 4 / GPIO |
| Broche 63 | PMA5/RG5 — Parallel master address 5 / GPIO |
| Broche 64 | PMA6/RG6 — Parallel master address 6 / GPIO |
| Broche 65 | PMA7/RG7 — Parallel master address 7 / GPIO |
| Broche 66 | VDD — 3.3 V I/O supply |
| Broche 67 | VSS — Ground reference |
| Broche 68 | PMA8/RG8 — Parallel master address 8 / GPIO |
| Broche 69 | PMA9/RG9 — Parallel master address 9 / GPIO |
| Broche 70 | PMCS1/RH0 — Parallel master chip select 1 / GPIO |
| Broche 71 | PMCS2/RH1 — Parallel master chip select 2 / GPIO |
| Broche 72 | PMRD/RH2 — Parallel master read strobe / GPIO |
| Broche 73 | PMWR/RH3 — Parallel master write strobe / GPIO |
| Broche 74 | PMALL/RH4 — Parallel master address latch low / GPIO |
| Broche 75 | PMALH/RH5 — Parallel master address latch high / GPIO |
| Broche 76 | PMDREQ/RJ0 — Parallel master DMA request / GPIO |
| Broche 77 | PMDACK/RJ1 — Parallel master DMA acknowledge / GPIO |
| Broche 78 | RD4 — GPIO |
| Broche 79 | RD5 — GPIO |
| Broche 80 | RD6 — GPIO |
| Broche 81 | RD7 — GPIO |
| Broche 82 | RD8 — GPIO |
| Broche 83 | RD9 — GPIO |
| Broche 84 | RD10 — GPIO |
| Broche 85 | RD11 — GPIO |
| Broche 86 | VDD — 3.3 V I/O supply |
| Broche 87 | VSS — Ground reference |
| Broche 88 | RD12 — GPIO |
| Broche 89 | RD13 — GPIO |
| Broche 90 | RD14 — GPIO |
| Broche 91 | RD15 — GPIO |
| Broche 92 | RB0 — GPIO |
| Broche 93 | RB1 — GPIO |
| Broche 94 | RB2 — GPIO |
| Broche 95 | RB3 — GPIO |
| Broche 96 | RB4 — GPIO |
| Broche 97 | RB5 — GPIO |
| Broche 98 | RB6 — GPIO |
| Broche 99 | RB7 — GPIO |
| Broche 100 | RB8 — GPIO |
| Broche 101 | RB9 — GPIO |
| Broche 102 | VDD — 3.3 V I/O supply |
| Broche 103 | VSS — Ground reference |
| Broche 104 | RB10 — GPIO |
| Broche 105 | RB11 — GPIO |
| Broche 106 | RB12 — GPIO |
| Broche 107 | RB13 — GPIO |
| Broche 108 | RB14 — GPIO |
| Broche 109 | RB15 — GPIO |
| Broche 110 | RC0 — GPIO |
| Broche 111 | RC1 — GPIO |
| Broche 112 | RC2 — GPIO |
| Broche 113 | RC3 — GPIO |
| Broche 114 | RC4 — GPIO |
| Broche 115 | RC5 — GPIO |
| Broche 116 | RC6 — GPIO |
| Broche 117 | RC7 — GPIO |
| Broche 118 | RC8 — GPIO |
| Broche 119 | RC9 — GPIO |
| Broche 120 | VDD — 3.3 V I/O supply |
| Broche 121 | VSS — Ground reference |
| Broche 122 | RC10 — GPIO |
| Broche 123 | RC11 — GPIO |
| Broche 124 | RC12 — GPIO |
| Broche 125 | RC13 — GPIO |
| Broche 126 | RC14 — GPIO |
| Broche 127 | RC15 — GPIO |
| Broche 128 | RD0 — GPIO |
| Broche 129 | RD1 — GPIO |
| Broche 130 | RD2 — GPIO |
| Broche 131 | RD3 — GPIO |
| Broche 132 | RF0 — GPIO |
| Broche 133 | RF1 — GPIO |
| Broche 134 | RF2 — GPIO |
| Broche 135 | RF3 — GPIO |
| Broche 136 | RF4 — GPIO |
| Broche 137 | RF5 — GPIO |
| Broche 138 | VDD — 3.3 V I/O supply |
| Broche 139 | VSS — Ground reference |
| Broche 140 | RF6 — GPIO |
| Broche 141 | RF7 — GPIO |
| Broche 142 | RF8 — GPIO |
| Broche 143 | RF9 — GPIO |
| Broche 144 | RF10 — GPIO |
| Broche 145 | RF11 — GPIO |
| Broche 146 | RF12 — GPIO |
| Broche 147 | RF13 — GPIO |
| Broche 148 | RG0 — GPIO |
| Broche 149 | RG1 — GPIO |
| Broche 150 | RG2 — GPIO |
| Broche 151 | RG3 — GPIO |
| Broche 152 | VDD — 3.3 V I/O supply |
| Broche 153 | VSS — Ground reference |
| Broche 154 | RG4 — GPIO |
| Broche 155 | RG5 — GPIO |
| Broche 156 | RG6 — GPIO |
| Broche 157 | RG7 — GPIO |
| Broche 158 | RG8 — GPIO |
| Broche 159 | RG9 — GPIO |
| Broche 160 | RH0 — GPIO |
| Broche 161 | RH1 — GPIO |
| Broche 162 | RH2 — GPIO |
| Broche 163 | RH3 — GPIO |
| Broche 164 | RH4 — GPIO |
| Broche 165 | RH5 — GPIO |
| Broche 166 | RH6 — GPIO |
| Broche 167 | RH7 — GPIO |
| Broche 168 | RJ0 — GPIO |
| Broche 169 | RJ1 — GPIO |
| Broche 170 | VDD — 3.3 V I/O supply |
| Broche 171 | VSS — Ground reference |
| Broche 172 | RJ2 — GPIO |
| Broche 173 | RJ3 — GPIO |
| Broche 174 | RJ4 — GPIO |
| Broche 175 | MCLR — Master clear reset (active low) |
| Broche 176 | EP — Exposed thermal pad, connect to ground |
Applications typiques
PIC32MZ2025DAK176-I/2J convient pour 6 applications: Industrial HMI Control Panels, Automotive Infotainment and Cluster Displays, Medical Patient Monitors, Point-of-Sale Terminals, Smart Home Control Panels, Industrial Test and Measurement Front Ends.
Industrial HMI Control Panels
The PIC32MZ2025DAK176-I/2J fits industrial HMI panels because its integrated Graphics Controller and dedicated GPU accelerate 2D rendering, freeing the 200 MHz MIPS32 microAptiv cores for application logic, PLC comms, and Modbus/TCP handling. Its 2 MB Flash stores multilingual UI assets, while the 12-bit 18 MSPS ADC reads touch and analog sensors in parallel without burdening the CPU. The wide 1.8 V core / 3.3 V I/O supply simplifies power-tree design against typical 24 V industrial backplanes.
Recommandé
Automotive Infotainment and Cluster Displays
The PIC32MZ2025DAK176-I/2J suits automotive infotainment and instrument clusters because the on-chip DDR2 controller drives WVGA resolution frame buffers at full 60 Hz from external 128 MB DDR2, while the hardware GPU offloads 2D compositing from the CPU. The integrated CAN 2.0 controller talks directly to vehicle networks, and HS USB handles media and diagnostic links. Designers benefit from the 176-LQFP with exposed pad, which simplifies thermal management in closed dashboards.
Recommandé
Medical Patient Monitors
The PIC32MZ2025DAK176-I/2J fits medical patient monitors where the 12-bit 18 MSPS ADC simultaneously samples multi-lead ECG, SpO2, and temperature channels, while the dedicated GPU drives a high-resolution waveform display. Its 640 KB SRAM holds double-buffered waveform data without external memory, and 2 MB Flash supports IEC 62304-validated firmware with revision history. The 200 MHz MIPS32 microAptiv core runs DSP-style FIR filters in single-cycle MAC instructions.
Recommandé
Point-of-Sale Terminals
The PIC32MZ2025DAK176-I/2J powers POS terminals by combining the integrated GPU for receipt preview and signature capture with HS USB for barcode scanners and printers. Its 2 MB Flash holds payment application code, multiple language fonts, and crypto libraries for PCI compliance. The DDR2 controller supports up to 128 MB external memory for transaction logs and product catalog caching at high throughput.
Recommandé
Smart Home Control Panels
The PIC32MZ2025DAK176-I/2J drives smart home control panels because its hardware Graphics Controller accelerates icon-based dashboards for lighting, HVAC, and security, while Wi-Fi companion modules attach over HS USB or SPI. The 12-bit ADC reads capacitive touch controllers, and CAN 2.0 supports HVAC bus communication. Low-power sleep modes with SRAM retention extend battery operation in wireless panels.
Recommandé
Industrial Test and Measurement Front Ends
The PIC32MZ2025DAK176-I/2J fits industrial test and measurement front ends where its 45-channel 12-bit 18 MSPS ADC simultaneously digitizes multi-sensor data while the 200 MHz core runs real-time DSP. The 2 MB Flash accommodates calibration tables and signal-processing libraries, and the DDR2 controller buffers waveform captures up to 128 MB. USB 2.0 Hi-Speed streams data to a host PC for visualization, while CAN reports aggregated results to PLC systems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAK176-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAK176-I/2J | PIC32MZ2025DAH176-I/2J | PIC32MZ2025DAG176-I/2J | PIC32MZ2025DAB176T-I/2J | PIC32MZ2025DAA176T-I/2J |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 1 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| External DDR2 Support | 32 MB or 128 MB | 32 MB or 128 MB | 32 MB or 128 MB (larger) | 32 MB or 128 MB | 32 MB or 128 MB | 32 MB |
| Graphics Controller | Yes (high tier) | Yes (high tier) | Yes (highest tier) | Yes (mid tier) | Yes (mid tier) | Yes (entry tier) |
| ADC | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch |
| Hi-Speed USB | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest Flash density in DAK tier (vs PIC32MZ1025DAK176-I/2J)
- Larger graphics tier than DAB/DAA siblings (vs PIC32MZ2025DAB176T-I/2J)
- Same 176-LQFP pinout as entire DAK family (vs PIC32MZ2025DAH176-I/2J)
Notes de conception
The 176-LQFP package with exposed pad requires a continuous copper pour directly under the EP pin to provide thermal relief and ground reference. According to the Microchip PIC32MZ DAK layout guidelines, the exposed pad must be soldered to a copper area of at least 100 mm^2 for reliable 200 MHz operation, with multiple thermal vias connecting to an internal ground plane.
DDR2 traces to the external DRAM must be length-matched within +/-25 mils and routed with controlled 50 ohm single-ended impedance. The DDR2 clock pair requires 100 ohm differential routing. Place the DDR2 device within 25 mm of the MCU and isolate its power pins with a ferrite bead and dedicated decoupling (100 nF + 4.7 uF close to each supply pin).
Provide separate analog (AVDD) and digital (VDD) supply rails with ferrite-bead isolation, even though the PIC32MZ DAK internally ties them through ESD structures. Decouple each AVDD pin with 100 nF + 10 uF placed within 5 mm of the pin, and each VDD pin with 100 nF + 4.7 uF. The internal 1.8 V core LDO requires a bulk 10 uF on the VCAP pins.
Do not boot the PIC32MZ2025DAK176-I/2J with the DDR2 interface uninitialized - configure DDR2 controller timing registers in the device startup code before any graphics calls. Also avoid routing analog ADC traces near the DDR2 clock and DQS lines to prevent digital switching noise coupling into ADC samples at the 18 MSPS rate.
Informations de conformité
Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified; choose PIC32MZ2025DAK176-V/2J for extended temperature or consult Microchip for AEC-Q100 options in this family.