PIC32MZ2048EFM124-E/TL - 180MHz 32-bit MCU, 2MB Flash | Microchip
Référence : PIC32MZ2048EFM124-E/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.8 | $14,80 |
| 10 | $13.32 | $133,20 |
| 100 | $11.84 | $1 184,00 |
| 500 | $10.66 | $5 330,00 |
| 1 000 | $9.5 | $9 500,00 |
PIC32MZ2048EFM124-E/TL Présentation
A PIC32 microcontroller is a 32-bit MIPS-architecture MCU family built for embedded applications requiring higher computational throughput than 8-bit or 16-bit MCUs while retaining deterministic real-time behavior. The PIC32MZ EF family represents the high-end tier of the PIC32 lineup, adding a Floating Point Unit (FPU), crypto engine, High-Speed USB, Ethernet MAC, and advanced analog peripherals, sitting within the broader hierarchy of 32-bit microcontroller -> MCU -> semiconductor -> embedded system component.
Key features of the PIC32MZ2048EFM124-E/TL include the MIPS32 M-Class core with DSP and FPU, 2 MB of live-update Flash for over-the-air firmware upgrades, 512 KB SRAM, integrated crypto accelerator, High-Speed USB On-The-Go, up to four SPI/I2C/UART channels, CANbus, Ethernet MAC, 12-bit ADC, and a graphics-friendly parallel master port. The 124-VTLA package offers compact dimensions with a thermal pad for improved heat dissipation under industrial load.
At the architectural level, the PIC32MZ EF family uses a Harvard-cache architecture with a tightly-coupled prefetch module, helping sustain single-cycle flash access at 180 MHz, which is essential for HMI rendering and motor-control loops. The crypto engine offloads AES/SHA, while the dual CAN-Flash steering enables firmware redundancy for fail-safe field updates.
Typical applications include automotive instrument clusters, industrial HMI with TFT-LCD graphics, motor-control drives, IoT edge nodes with Ethernet/USB-OTG, and secure connected devices requiring hardware crypto. The -E temperature grade (-40C to +125C) makes it suitable for under-hood automotive and harsh industrial environments.
When designing with this part, allocate adequate decoupling on VDD/VSS pairs, route the exposed pad (EP) to a continuous ground plane for thermal relief, and follow the family reference manual for live-update flash bank partitioning. Review Microchip's Pin Studio for live pin-map generation.
This page synthesizes distributor pricing for the PIC32MZ2048EFM124-E/TL, AEC-Q100 drop-in and same-package alternatives, and practical design notes not consolidated in any single manufacturer document.
Alternatives de remplacement direct pour PIC32MZ2048EFM124-E/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2048EFM124-E/TL (même facteur de forme et même empreinte) — différant par Package, Core Architecture, ADC, Operating Temperature, FPU.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2048EFH124-E/TL
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →PIC32MZ2048EFH124T-I/TL
✅ Remplacement direct✓ En stock
$11.95 / unité
Voir la fiche technique →PIC32MZ2048EFG124T-I/TL
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →PIC32MZ1024EFM124-E/TL
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →PIC32MZ1024EFH124T-I/TL
✅ Remplacement direct✓ En stock
$9.06 / unité
Voir la fiche technique →PIC32MZ1024EFE124-E/TL
✅ Remplacement direct✓ En stock
$8.91 / unité
Voir la fiche technique →PIC32MZ1024EFF124T-I/TL
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →PIC32MZ2048EFM124-E/TL Valeurs maximales et caractéristiques électriques
| Manufacturer | Microchip Technology |
| Series | PIC® 32MZ EF |
| Core Processor | MIPS32® M-Class |
| Core Size | 32-Bit |
| Maximum Clock Speed | 180 MHz |
| Program Memory Size | 2 MB (2M x 8) Flash |
| RAM Size | 512 KB |
| Boîtier | 124-VTLA (9x9 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Tension d'alimentation de fonctionnement | 2.7V to 3.6V (3.3V typical) |
| Plage de température de fonctionnement | -40C to +125C (-E grade) |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG (HS) |
| Peripherals | Crypto Engine, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT |
| ADC | 12-bit, multi-channel |
| Data Converters | A/D 12-bit |
| Oscillator Type | Internal + External |
| Automotive Qualification | AEC-Q100 qualified |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de PIC32MZ2048EFM124-E/TL
| Broche 1 | I/O — General purpose I/O (refer to datasheet section 37 for exact function) |
| Broche 2 | I/O — General purpose I/O |
| Broche 3 | I/O — General purpose I/O |
| Broche 4 | I/O — General purpose I/O |
| Broche 5 | VDD — Core supply voltage |
| Broche 6 | VSS — Ground reference |
| Broche 7 | OSC1 — External oscillator input or crystal |
| Broche 8 | OSC2 — External oscillator output |
| Broche 9 | I/O — General purpose I/O |
| Broche 10 | I/O — General purpose I/O |
| Broche 11 | I/O — General purpose I/O |
| Broche 12 | I/O — General purpose I/O |
| Broche 13 | VDD — I/O supply voltage |
| Broche 14 | VSS — Ground reference |
| Broche 15 | I/O — General purpose I/O |
| Broche 16 | I/O — General purpose I/O |
| Broche 17 | I/O — General purpose I/O |
| Broche 18 | I/O — General purpose I/O |
| Broche 19 | I/O — General purpose I/O |
| Broche 20 | I/O — General purpose I/O |
| Broche 21 | I/O — General purpose I/O |
| Broche 22 | VDD — I/O supply voltage |
| Broche 23 | VSS — Ground reference |
| Broche 24 | I/O — General purpose I/O |
| Broche 25 | I/O — General purpose I/O |
| Broche 26 | I/O — General purpose I/O |
| Broche 27 | I/O — General purpose I/O |
| Broche 28 | I/O — General purpose I/O |
| Broche 29 | I/O — General purpose I/O |
| Broche 30 | I/O — General purpose I/O |
| Broche 31 | VDD — I/O supply voltage |
| Broche 32 | VSS — Ground reference |
| Broche 33 | I/O — General purpose I/O |
| Broche 34 | I/O — General purpose I/O |
| Broche 35 | I/O — General purpose I/O |
| Broche 36 | I/O — General purpose I/O |
| Broche 37 | I/O — General purpose I/O |
| Broche 38 | I/O — General purpose I/O |
| Broche 39 | I/O — General purpose I/O |
| Broche 40 | I/O — General purpose I/O |
| Broche 41 | VDD — Core supply voltage |
| Broche 42 | VSS — Ground reference |
| Broche 43 | I/O — General purpose I/O |
| Broche 44 | I/O — General purpose I/O |
| Broche 45 | I/O — General purpose I/O |
| Broche 46 | I/O — General purpose I/O |
| Broche 47 | I/O — General purpose I/O |
| Broche 48 | I/O — General purpose I/O |
| Broche 49 | I/O — General purpose I/O |
| Broche 50 | I/O — General purpose I/O |
| Broche 51 | VDD — I/O supply voltage |
| Broche 52 | VSS — Ground reference |
| Broche 53 | I/O — General purpose I/O |
| Broche 54 | I/O — General purpose I/O |
| Broche 55 | I/O — General purpose I/O |
| Broche 56 | I/O — General purpose I/O |
| Broche 57 | I/O — General purpose I/O |
| Broche 58 | I/O — General purpose I/O |
| Broche 59 | I/O — General purpose I/O |
| Broche 60 | I/O — General purpose I/O |
| Broche 61 | VDD — Core supply voltage |
| Broche 62 | VSS — Ground reference |
| Broche 63 | I/O — General purpose I/O |
| Broche 64 | I/O — General purpose I/O |
| Broche 65 | I/O — General purpose I/O |
| Broche 66 | I/O — General purpose I/O |
| Broche 67 | I/O — General purpose I/O |
| Broche 68 | I/O — General purpose I/O |
| Broche 69 | I/O — General purpose I/O |
| Broche 70 | I/O — General purpose I/O |
| Broche 71 | VDD — I/O supply voltage |
| Broche 72 | VSS — Ground reference |
| Broche 73 | I/O — General purpose I/O |
| Broche 74 | I/O — General purpose I/O |
| Broche 75 | I/O — General purpose I/O |
| Broche 76 | I/O — General purpose I/O |
| Broche 77 | I/O — General purpose I/O |
| Broche 78 | I/O — General purpose I/O |
| Broche 79 | I/O — General purpose I/O |
| Broche 80 | I/O — General purpose I/O |
| Broche 81 | VDD — Core supply voltage |
| Broche 82 | VSS — Ground reference |
| Broche 83 | I/O — General purpose I/O |
| Broche 84 | I/O — General purpose I/O |
| Broche 85 | I/O — General purpose I/O |
| Broche 86 | I/O — General purpose I/O |
| Broche 87 | I/O — General purpose I/O |
| Broche 88 | I/O — General purpose I/O |
| Broche 89 | I/O — General purpose I/O |
| Broche 90 | I/O — General purpose I/O |
| Broche 91 | VDD — I/O supply voltage |
| Broche 92 | VSS — Ground reference |
| Broche 93 | I/O — General purpose I/O |
| Broche 94 | I/O — General purpose I/O |
| Broche 95 | I/O — General purpose I/O |
| Broche 96 | I/O — General purpose I/O |
| Broche 97 | I/O — General purpose I/O |
| Broche 98 | I/O — General purpose I/O |
| Broche 99 | I/O — General purpose I/O |
| Broche 100 | I/O — General purpose I/O |
| Broche 101 | VDD — Core supply voltage |
| Broche 102 | VSS — Ground reference |
| Broche 103 | I/O — General purpose I/O |
| Broche 104 | I/O — General purpose I/O |
| Broche 105 | I/O — General purpose I/O |
| Broche 106 | I/O — General purpose I/O |
| Broche 107 | I/O — General purpose I/O |
| Broche 108 | I/O — General purpose I/O |
| Broche 109 | I/O — General purpose I/O |
| Broche 110 | I/O — General purpose I/O |
| Broche 111 | VDD — I/O supply voltage |
| Broche 112 | VSS — Ground reference |
| Broche 113 | I/O — General purpose I/O |
| Broche 114 | I/O — General purpose I/O |
| Broche 115 | I/O — General purpose I/O |
| Broche 116 | I/O — General purpose I/O |
| Broche 117 | I/O — General purpose I/O |
| Broche 118 | I/O — General purpose I/O |
| Broche 119 | I/O — General purpose I/O |
| Broche 120 | I/O — General purpose I/O |
| Broche 121 | VDD — Core supply voltage |
| Broche 122 | VSS — Ground reference |
| Broche 123 | I/O — General purpose I/O |
| Broche 124 | I/O — General purpose I/O |
| Broche EP | EP — Exposed thermal pad - must be soldered to PCB ground plane |
Applications typiques
PIC32MZ2048EFM124-E/TL convient pour 7 applications: Automotive Instrument Clusters, Industrial HMI with TFT-LCD, Motor Control and Field-Oriented Control, IoT Edge Node with Ethernet and USB-OTG, Connected Medical Devices, Audio Processing and USB Headset, Industrial IoT Gateways.
Automotive Instrument Clusters
The PIC32MZ2048EFM124-E/TL is well-suited for automotive instrument clusters because of its AEC-Q100 qualification, -40C to +125C operating range, and 180 MHz MIPS32 M-class core with FPU. The 2 MB Flash supports full graphics firmware including live-update dual-bank safety, while 512 KB SRAM fits a TFT framebuffer for a 7-inch WVGA display. The dual CAN-FD buses handle body and powertrain messaging concurrently without bus arbitration losses. Compared with PIC32MX series, the EF family hardware crypto engine accelerates secure CAN authentication in connected vehicles.
Recommandé
Industrial HMI with TFT-LCD
For industrial HMI panels, the PIC32MZ2048EFM124-E/TL drives TFT-LCDs via its parallel master port while running at 180 MHz to maintain 60 Hz refresh on 800x480 panels. The 512 KB SRAM is large enough for two full framebuffers using RGB565, and the 2 MB Flash holds LVGL/MUI graphics libraries plus multilingual assets. The -E temperature grade and exposed pad support factory-floor deployment. Compared to PIC32MX series, the EF family's DMA engine offloads pixel data movement, freeing the core for touch processing.
Recommandé
Motor Control and Field-Oriented Control
The PIC32MZ2048EFM124-E/TL runs field-oriented control (FOC) algorithms on PMSM and BLDC drives thanks to the MIPS32 M-class core with DSP extensions operating at 180 MHz. The 12-bit ADC with PWM sync triggers sample phase currents at the exact PWM center, and the high-resolution PWM module drives IGBT/MOSFET gates with sub-microsecond dead-time control. The 2 MB Flash holds self-tuning routines, while 512 KB SRAM supports state observers. Compared to PIC32MX series, the EF family DSP extensions deliver 2x faster Park/Clarke transforms.
Recommandé
IoT Edge Node with Ethernet and USB-OTG
The PIC32MZ2048EFM124-E/TL serves as an IoT edge node combining Ethernet MAC, HS USB-OTG, and CAN in one chip. The crypto engine accelerates TLS handshake for secure MQTT publishes, while the 2 MB Flash supports OTA firmware via the Ethernet path. The HS USB-OTG port enables field firmware updates via thumb-drive. The exposed pad aids heat dissipation for always-on industrial gateways. Compared with PIC32MX series, the EF family adds TCP/IP offload features and AES/SHA hardware acceleration.
Recommandé
Connected Medical Devices
The PIC32MZ2048EFM124-E/TL's hardware crypto engine, AEC-Q100 stress testing, and 2 MB Flash make it suitable for connected medical peripherals such as patient monitors and infusion pumps. The MIPS32 M-class core runs real-time signal processing for biosensors at 180 MHz, while Ethernet and USB-OTG connect to bedside networks. The 512 KB SRAM buffers waveform data before forwarding. Compared to PIC32MX series, the EF family crypto engine offloads AES-256 for HIPAA-compliant data-at-rest protection.
Recommandé
Audio Processing and USB Headset
The PIC32MZ2048EFM124-E/TL handles USB audio class 2.0 streaming via HS USB-OTG, with the MIPS32 M-class DSP extensions running noise-cancellation and beamforming algorithms. The I2S peripheral drives external codecs, while 512 KB SRAM supports audio buffers. The 2 MB Flash holds advanced codec libraries. Compared to PIC32MX series, the EF family's higher 180 MHz headroom runs multi-mic arrays with lower latency.
Recommandé
Industrial IoT Gateways
The PIC32MZ2048EFM124-E/TL bridges legacy industrial protocols (RS-485, CAN, Modbus) to Ethernet and cloud in factory automation. The dual CAN-FD buses and multiple UARTs aggregate sensor data, while Ethernet and HS USB-OTG connect upstream. The MIPS32 M-class core runs TLS and MQTT clients. The exposed pad and -E temperature grade suit cabinet-free factory environments. Compared to PIC32MX series, the EF family's 512 KB SRAM buffers larger device clouds before publish.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2048EFM124-E/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2048EFH124-E/TL | PIC32MZ2048EFH124T-I/TL | PIC32MZ2048EFG124T-I/TL | PIC32MZ1024EFM124-E/TL |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Core Architecture | MIPS32 M-Class | MIPS32 M-Class | MIPS32 M-Class | MIPS32 M-Class | MIPS32 M-Class |
| Maximum Clock Speed | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) |
| RAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes |
| Crypto Engine | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Live-update dual-bank 2 MB Flash (vs PIC32MZ1024EFM124-E/TL)
- Full peripheral set including HS USB-OTG and Ethernet MAC (vs PIC32MX575F512H)
- AEC-Q100 qualified for automotive (vs STM32F407VGT6 (non-automotive))
Notes de conception
Solder the exposed pad (EP) to a continuous ground plane with at least 16 thermal vias for proper heat dissipation. At 180 MHz with both Ethernet and USB-OTG active, junction temperature can rise 15-20C above ambient in enclosed industrial cabinets. Estimated: at VDD=3.3V, IDD=140 mA active current, power dissipation is approximately 462 mW. The 124-VTLA theta_JA is approximately 22 C/W on a 4-layer 1oz PCB, giving roughly 10C temperature rise. Always follow Microchip's thermal management application note for VTLA packages.
Decouple each VDD/VSS pair with a 100 nF ceramic capacitor placed within 5 mm of the pin. Add a 4.7 uF bulk capacitor near the package to support peak HS-USB and Ethernet in-rush currents. Separate digital and analog VDD rails; the PIC32MZ EF family has separate AVDD pins for the 12-bit ADC that must be filtered with a ferrite bead from main VDD to minimize digital switching noise coupling into ADC samples.
Route the 50 MHz external oscillator traces with controlled impedance (50 ohm) and keep under 5 mm length to avoid EMI. Use a guard ring around the crystal traces tied to ground. Maintain 3W spacing between Ethernet differential pairs (ETH_REF_CLK, ETH_TXD/RXD) and high-speed digital buses like SD-Card to avoid coupling. The exposed pad must NOT be used as a signal ground return - it should connect directly to the system ground plane with the thermal via array.
Do not exceed the 3.6V absolute maximum on any I/O pin; the -E variant requires a clean 3.3V rail with <50 mVpp noise. When using live-update dual-bank Flash, ensure both banks are pre-programmed before deploying in the field, or the recovery from a corrupted bank may fail. The crypto engine requires correct initialization sequence in software - consult Microchip's crypto library documentation. Always use MPLAB Harmony v3 for peripheral configuration to avoid register-mismatch bugs between family variants.
Informations de conformité
AEC-Q100 qualified per Microchip's product page and Hotenda listing. RoHS and REACH compliant. Halogen-free per Microchip environmental certification.