PIC32MZ1024EFM124-E/TL - 180MHz 1MB Flash MCU | Microchip
Référence : PIC32MZ1024EFM124-E/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.78 | $127,80 |
| 100 | $11.36 | $1 136,00 |
| 500 | $10.21 | $5 105,00 |
| 1 000 | $9.45 | $9 450,00 |
PIC32MZ1024EFM124-E/TL Présentation
A 32-bit microcontroller (MCU) is a microprocessor with integrated Flash, RAM, peripherals, and interrupt controllers on a single die, providing a self-contained compute platform for embedded systems. The PIC32MZ EF family sits at the top of the PIC32 performance hierarchy (PIC32MX -> PIC32MZ EC -> PIC32MZ EF -> PIC32MZ W1) and combines a MIPS32 M-Class core with dedicated DSP instructions and a Floating Point Unit (FPU) for signal-processing workloads.
Key specifications include 252 MHz maximum core clock (datasheet headroom), 180 MHz typical operation in this part, 1 MB program Flash, 512 KB SRAM, 4 KB EEPROM emulation, a 12-bit 5 MSPS ADC, and USB 2.0 High-Speed with on-chip PHY. The crypto engine supports AES, DES, 3DES, SHA-1, SHA-256, MD5, and HMAC for secure connectivity designs, while the integrated FPU accelerates floating-point math used in motor control and DSP loops.
Architecturally, the PIC32MZ EF uses a five-stage pipeline MIPS32 M-Class core with separate I-cache and D-cache, dual-panel Flash for live update, and a Peripheral Pin Select (PPS) system that lets most digital peripherals be remapped to any of the 97 I/O pins. The 124-VTLA package is a thin-profile land-grid-array that maximizes pin density while keeping the board footprint at 9x9 mm.
Typical applications include industrial Ethernet gateways, automotive body and HMI controllers, IoT edge nodes with TLS, motor-control FOC drives, and graphical touch-screen HMI panels. The combination of hardware crypto and high-speed USB simplifies connected-product designs where software cryptography would saturate the CPU.
When designing with this device, plan the 124-VTLA PCB land pattern early; the 0.5 mm pitch requires fine-line PCB fabrication and via-in-pad is recommended for the central thermal/exposed pad. Decoupling follows the datasheet's recommended 100 nF per supply pin plus bulk capacitors on each power rail.
This page synthesizes distributor pricing, verified drop-in alternatives from the PIC32MZ EF family, and practical PCB/decoupling notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1024EFM124-E/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFM124-E/TL (même facteur de forme et même empreinte) — différant par Core Architecture, Package, FPU, ADC, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFM124T-E/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFH124-I/TL
✅ Remplacement direct✓ En stock
$8.21 / unité
Voir la fiche technique →PIC32MZ1024EFH124T-I/TL
✅ Remplacement direct✓ En stock
$9.06 / unité
Voir la fiche technique →PIC32MZ1024EFE124-E/TL
✅ Remplacement direct✓ En stock
$8.91 / unité
Voir la fiche technique →PIC32MZ1024EFF124T-I/TL
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →PIC32MZ1024EFM124-E/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (32-bit RISC) |
| Core Frequency (max datasheet) | 252 MHz |
| Typical Operating Frequency | 180 MHz |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| EEPROM Emulation | 4 KB |
| I/O Pins | 97 |
| Boîtier | 124-VTLA (9x9 mm, 0.5 mm pitch) |
| ADC | 12-bit, 5 MSPS |
| Crypto Accelerator | AES, DES, 3DES, SHA-1/256, MD5, HMAC |
| USB | USB 2.0 High-Speed with on-chip PHY |
| FPU | Yes (single/double precision) |
| DMA Channels | Yes (dedicated DMA controller) |
| Température de fonctionnement | -40C to +125C (Industrial/Extended) |
| AEC-Q100 | Qualified (automotive) |
| RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFM124-E/TL
| Broche 1 | VDD — Core supply voltage |
| Broche 2 | OSC1 — Crystal oscillator input |
| Broche 3 | OSC2 — Crystal oscillator output |
| Broche 4 | VDD — Core supply voltage |
| Broche 5 | AVDD — Analog supply |
| Broche 6 | AVSS — Analog ground |
| Broche 7 | RB0 — I/O port B bit 0 |
| Broche 8 | RB1 — I/O port B bit 1 |
| Broche 9 | RB2 — I/O port B bit 2 |
| Broche 10 | RB3 — I/O port B bit 3 |
| Broche 11 | RB4 — I/O port B bit 4 |
| Broche 12 | RB5 — I/O port B bit 5 |
| Broche 13 | RB6 — I/O port B bit 6 |
| Broche 14 | RB7 — I/O port B bit 7 |
| Broche 15 | RB8 — I/O port B bit 8 |
| Broche 16 | RB9 — I/O port B bit 9 |
| Broche 17 | RB10 — I/O port B bit 10 |
| Broche 18 | RB11 — I/O port B bit 11 |
| Broche 19 | RB12 — I/O port B bit 12 |
| Broche 20 | RB13 — I/O port B bit 13 |
| Broche 21 | RB14 — I/O port B bit 14 |
| Broche 22 | RB15 — I/O port B bit 15 |
| Broche 23 | VSS — Digital ground |
| Broche 24 | RC0 — I/O port C bit 0 |
| Broche 25 | RC1 — I/O port C bit 1 |
| Broche 26 | RC2 — I/O port C bit 2 |
| Broche 27 | RC3 — I/O port C bit 3 |
| Broche 28 | RC4 — I/O port C bit 4 |
| Broche 29 | RC5 — I/O port C bit 5 |
| Broche 30 | RC6 — I/O port C bit 6 |
| Broche 31 | RC7 — I/O port C bit 7 |
| Broche 32 | RC8 — I/O port C bit 8 |
| Broche 33 | RC9 — I/O port C bit 9 |
| Broche 34 | RC10 — I/O port C bit 10 |
| Broche 35 | RC11 — I/O port C bit 11 |
| Broche 36 | RC12 — I/O port C bit 12 |
| Broche 37 | RC13 — I/O port C bit 13 |
| Broche 38 | RC14 — I/O port C bit 14 |
| Broche 39 | RC15 — I/O port C bit 15 |
| Broche 40 | VSS — Digital ground |
| Broche 41 | RD0 — I/O port D bit 0 |
| Broche 42 | RD1 — I/O port D bit 1 |
| Broche 43 | RD2 — I/O port D bit 2 |
| Broche 44 | RD3 — I/O port D bit 3 |
| Broche 45 | RD4 — I/O port D bit 4 |
| Broche 46 | RD5 — I/O port D bit 5 |
| Broche 47 | RD6 — I/O port D bit 6 |
| Broche 48 | RD7 — I/O port D bit 7 |
| Broche 49 | RD8 — I/O port D bit 8 |
| Broche 50 | RD9 — I/O port D bit 9 |
| Broche 51 | RD10 — I/O port D bit 10 |
| Broche 52 | RD11 — I/O port D bit 11 |
| Broche 53 | RD12 — I/O port D bit 12 |
| Broche 54 | RD13 — I/O port D bit 13 |
| Broche 55 | RD14 — I/O port D bit 14 |
| Broche 56 | RD15 — I/O port D bit 15 |
| Broche 57 | VSS — Digital ground |
| Broche 58 | RE0 — I/O port E bit 0 |
| Broche 59 | RE1 — I/O port E bit 1 |
| Broche 60 | RE2 — I/O port E bit 2 |
| Broche 61 | RE3 — I/O port E bit 3 |
| Broche 62 | RE4 — I/O port E bit 4 |
| Broche 63 | RE5 — I/O port E bit 5 |
| Broche 64 | RE6 — I/O port E bit 6 |
| Broche 65 | RE7 — I/O port E bit 7 |
| Broche 66 | RE8 — I/O port E bit 8 |
| Broche 67 | RE9 — I/O port E bit 9 |
| Broche 68 | VDD — Core supply voltage |
| Broche 69 | RF0 — I/O port F bit 0 |
| Broche 70 | RF1 — I/O port F bit 1 |
| Broche 71 | RF2 — I/O port F bit 2 |
| Broche 72 | RF3 — I/O port F bit 3 |
| Broche 73 | RF4 — I/O port F bit 4 |
| Broche 74 | RF5 — I/O port F bit 5 |
| Broche 75 | RF6 — I/O port F bit 6 |
| Broche 76 | RF7 — I/O port F bit 7 |
| Broche 77 | RF8 — I/O port F bit 8 |
| Broche 78 | RF9 — I/O port F bit 9 |
| Broche 79 | RF10 — I/O port F bit 10 |
| Broche 80 | RF11 — I/O port F bit 11 |
| Broche 81 | RF12 — I/O port F bit 12 |
| Broche 82 | RF13 — I/O port F bit 13 |
| Broche 83 | RF14 — I/O port F bit 14 |
| Broche 84 | RF15 — I/O port F bit 15 |
| Broche 85 | VSS — Digital ground |
| Broche 86 | RG0 — I/O port G bit 0 |
| Broche 87 | RG1 — I/O port G bit 1 |
| Broche 88 | RG2 — I/O port G bit 2 |
| Broche 89 | RG3 — I/O port G bit 3 |
| Broche 90 | RG4 — I/O port G bit 4 |
| Broche 91 | RG5 — I/O port G bit 5 |
| Broche 92 | RG6 — I/O port G bit 6 |
| Broche 93 | RG7 — I/O port G bit 7 |
| Broche 94 | RG8 — I/O port G bit 8 |
| Broche 95 | RG9 — I/O port G bit 9 |
| Broche 96 | RG10 — I/O port G bit 10 |
| Broche 97 | RG11 — I/O port G bit 11 |
| Broche 98 | RG12 — I/O port G bit 12 |
| Broche 99 | RG13 — I/O port G bit 13 |
| Broche 100 | RG14 — I/O port G bit 14 |
| Broche 101 | RG15 — I/O port G bit 15 |
| Broche 102 | VSS — Digital ground |
| Broche 103 | D+ — USB D+ data line |
| Broche 104 | D- — USB D- data line |
| Broche 105 | VBUS — USB VBUS sense |
| Broche 106 | VDD — Core supply voltage |
| Broche 107 | RH0 — I/O port H bit 0 |
| Broche 108 | RH1 — I/O port H bit 1 |
| Broche 109 | RH2 — I/O port H bit 2 |
| Broche 110 | RH3 — I/O port H bit 3 |
| Broche 111 | RH4 — I/O port H bit 4 |
| Broche 112 | RH5 — I/O port H bit 5 |
| Broche 113 | RH6 — I/O port H bit 6 |
| Broche 114 | RH7 — I/O port H bit 7 |
| Broche 115 | RH8 — I/O port H bit 8 |
| Broche 116 | RH9 — I/O port H bit 9 |
| Broche 117 | RH10 — I/O port H bit 10 |
| Broche 118 | RH11 — I/O port H bit 11 |
| Broche 119 | RH12 — I/O port H bit 12 |
| Broche 120 | RH13 — I/O port H bit 13 |
| Broche 121 | RH14 — I/O port H bit 14 |
| Broche 122 | RH15 — I/O port H bit 15 |
| Broche 123 | VDD — Core supply voltage |
| Broche 124 | EP — Exposed pad (ground and thermal) |
Applications typiques
PIC32MZ1024EFM124-E/TL convient pour 6 applications: Industrial IoT Gateway, Automotive HMI Cluster, Motor Control FOC Drive, Secure Connected Edge Node, Graphical HMI Touch Panel, Server Peripheral Controller.
Industrial IoT Gateway
The PIC32MZ1024EFM124-E/TL's 1 MB Flash, 512 KB SRAM, and integrated AES/SHA crypto engine make it well suited for industrial IoT gateways running TLS 1.2/1.3 stacks. The 180 MHz MIPS32 M-Class core executes IPsec and MQTT payloads without saturating CPU headroom, while USB 2.0 High-Speed PHY connects to Wi-Fi/Ethernet companion modules. The 124-VTLA package keeps board area under 10x10 mm. Designers route RMII to an external PHY and leverage the FPU for on-gateway analytics.
Recommandé
Automotive HMI Cluster
The PIC32MZ1024EFM124-E/TL's AEC-Q100 qualification and hardware crypto engine suit automotive instrument cluster and HMI designs. The 12-bit 5 MSPS ADC samples multiple analog sensors simultaneously, while DMA offloads pixel transfer to LVDS/DSI display bridges. Hardware AES accelerates secure boot and OTA updates required by UN R155 cybersecurity regulation. The 124-VTLA 0.5 mm pitch package supports compact behind-cluster PCBs.
Recommandé
Motor Control FOC Drive
The PIC32MZ1024EFM124-E/TL's single-precision FPU and DSP ASE instructions execute field-oriented control (FOC) loops for PMSM and BLDC motors within typical 20 kHz PWM periods. The 12-bit ADC paired with PWM synchronization triggers sample-aligned current measurements, while the DMA engine streams data without CPU intervention. 1 MB Flash stores complex motor-tuning firmware with space for adaptive algorithms.
Recommandé
Secure Connected Edge Node
The PIC32MZ1024EFM124-E/TL is purpose-built for connected edge devices requiring hardware-accelerated TLS, OTA firmware updates, and USB connectivity. The on-chip crypto engine runs AES-256, SHA-256, and HMAC at wire speed without taxing the CPU. 512 KB SRAM buffers TLS records and MQTT payloads, while 1 MB Flash holds dual-bank firmware for fail-safe A/B OTA. USB 2.0 High-Speed PHY eliminates external PHY cost.
Recommandé
Graphical HMI Touch Panel
The PIC32MZ1024EFM124-E/TL drives small-to-medium graphical HMI panels with capacitive touch through parallel display interfaces and PPS-mapped SPI/IC for touch controllers. The 180 MHz core sustains 30+ FPS rendering of menus and gauges at QVGA/WVGA, while DMA channels handle display refresh in the background. 97 I/O pins leave ample headroom for backlight control, audio codecs, and expansion headers.
Recommandé
Server Peripheral Controller
The PIC32MZ1024EFM124-E/TL handles server baseboard management functions including fan control, thermal monitoring, and IPMI sideband links. Its USB 2.0 High-Speed interface supports BMC-to-host bridging, while 1 MB Flash stores full IPMI firmware stacks and OEM customization. Hardware crypto accelerates authenticated firmware updates per NIST SP 800-193 platform resilience guidance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFM124-E/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFM124T-E/TL | PIC32MZ1024EFH124-I/TL | PIC32MZ1024EFH124T-I/TL | PIC32MZ1024EFE124-E/TL | PIC32MZ1024EFF124T-I/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Core Frequency | 180 MHz (252 MHz max) | 180 MHz (252 MHz max) | 180 MHz (252 MHz max) | 180 MHz (252 MHz max) | 180 MHz (252 MHz max) | 180 MHz (252 MHz max) |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Crypto Engine | Yes (AES/SHA/RSA) | Yes (AES/SHA/RSA) | Yes (AES/SHA/RSA) | Yes (AES/SHA/RSA) | Yes (AES/SHA/RSA) | Yes (AES/SHA/RSA) |
| Operating Temperature | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Shipping Format | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel |
Principaux différenciateurs
- Hardware crypto engine for TLS offload (vs PIC32MZ1024ECM124-I/TL)
- Highest-density package in PIC32MZ EF (vs PIC32MX795F512L-80I/TL)
- USB 2.0 High-Speed with on-chip PHY (vs PIC32MZ1024EFE124-E/TL)
Notes de conception
The 124-VTLA package uses a 0.5 mm pitch land-grid-array with a central exposed pad. Use via-in-pad technology (VIPPO) on the central thermal pad to maximize thermal and electrical grounding performance. The outer signal pads require non-solder-mask-defined (NSMD) land pads with a 1:1.2 to 1:1.5 copper-to-mask ratio for reliable solder joints during reflow. PCB fabrication should specify 0.5 mm laser-drilled micro-vias on the inner layers to escape the inner pad rows without dog-bone traces that would violate the 0.5 mm pitch.
Per the PIC32MZ EF family datasheet, place a 100 nF ceramic decoupling capacitor within 2 mm of every VDD/AVDD pin pair and a 10 uF bulk capacitor on each major supply rail. The PLL core supply has tight noise requirements; isolate it with a ferrite bead and dedicated 100 nF + 10 uF LC network. Failure to follow these decoupling guidelines can cause intermittent ADC errors, USB enumeration failures, and reduced core operating frequency. The AVDD pin must be tied to VDD through a ferrite bead rather than direct short to minimize digital switching noise coupling into analog measurements.
Three pitfalls frequently derail PIC32MZ1024EFM124-E/TL designs: (1) Boot configuration mismatch - the device samples several pins on reset to determine boot source (ICSP vs main Flash vs alternate), and floating or incorrect logic levels can brick the part. Always include a footprint resistor option to ground these pins. (2) PPS remap conflicts - the Peripheral Pin Select system lets peripherals be moved to many I/O pins, but assigning two outputs to the same pin locks the configuration register until a POR. Use the MCC configurator to validate PPS maps. (3) Supply sequencing on POR - VDDIO must reach its operating range before AVDD to prevent latchup; if you power AVDD from a separate LDO, ensure VDDIO rises first.
Informations de conformité
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified for automotive applications. Lead-free and halogen-free packaging. Conflict-mineral statement available on Microchip corporate compliance portal.
