PIC32MZ2064DAA176-I/2J - 200MHz 32-bit MCU, 2MB Flash, 176-LQFP
Référence : PIC32MZ2064DAA176-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.86 | $11,86 |
| 10 | $10.79 | $107,90 |
| 100 | $9.18 | $918,00 |
| 500 | $8.25 | $4 125,00 |
| 1 000 | $7.26 | $7 260,00 |
PIC32MZ2064DAA176-I/2J Présentation
A 32-bit microcontroller (MCU) is a programmable system-on-chip that integrates a high-performance CPU, on-chip memory, and a rich set of peripherals (ADC, timers, communication controllers) into a single silicon die. PIC32MZ DA devices specifically target embedded graphics applications, supporting up to 24-bit color TFT panels via the integrated Graphics LCD (GL) controller. Within the broader taxonomy, the PIC32MZ2064DAA176 belongs to: microcontroller -> 32-bit MCU -> MIPS32 architecture -> embedded graphics MCU -> semiconductor IC.
Key features include a 2 MB dual-panel Flash that enables live firmware updates without downtime, a 12-bit ADC capable of 18 MSPS with up to 45 analog input channels, an integrated Floating Point Unit (FPU) for DSP-class math throughput, hardware crypto accelerators (AES, SHA, DES/SHA-MD5), and a 32-bit external bus interface supporting DDR2 memory. The 176-LQFP package provides abundant I/O (up to 120 GPIO) suitable for parallel display buses and touch controller interfaces.
The MIPS32 microAptiv core includes a Memory Management Unit that supports embedded operating systems such as FreeRTOS, OpenRTOS, and Micrium uC/OS-III. Combined with the 200 MHz clock and zero-wait-state Flash performance (when executing from cache), the device delivers MPU-like performance while retaining MCU-class ease of design. Dual-panel Flash enables safe field firmware upgrades via dual-bank swap, a critical capability for industrial IoT gateways.
Typical applications include industrial HMI panels, automotive infotainment secondary displays, medical patient monitors, point-of-sale terminals, and IoT edge controllers with graphical dashboards. The integrated 18 MSPS 12-bit ADC supports multi-sensor data acquisition for motor control and instrumentation front-ends. The integrated graphics pipeline reduces BOM cost by eliminating external display controllers.
A key design trade-off: the DA variant (vs the EF/EC families) is optimized for cost-effective graphics rather than Ethernet-heavy connectivity - if the design requires dual Ethernet MACs, consider the EF family instead. The large 176-LQFP package offers excellent I/O density but requires a 4-layer PCB with 0.5 mm lead pitch for reliable assembly.
This page synthesizes distributor pricing, drop-in package alternatives within the PIC32MZ DA family, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ2064DAA176-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2064DAA176-I/2J (même facteur de forme et même empreinte) — différant par USB, External Memory Interface, Package, Operating Temperature, CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2064DAH176-I/2J
✅ Remplacement direct✓ En stock
$11.3 / unité
Voir la fiche technique →PIC32MZ2064DAB176
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2064DAS176
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2025DAA176T-I/2J
✅ Remplacement direct✓ En stock
$7.83 / unité
Voir la fiche technique →PIC32MZ2025DAH176-I/2J
✅ Remplacement direct✓ En stock
$4.83 / unité
Voir la fiche technique →PIC32MZ2025DAL176-I/2J
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC32MZ1025DAS176T-V/2J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.1 / unité
Voir la fiche technique →PIC32MZ2025DAG176-I/2J
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →PIC32MZ2064DAA176-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Core Count | 1 |
| Maximum Clock Speed | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| Flash Memory Size | 2 MB (2M x 8) |
| SRAM Size | 640 KB |
| ADC | 12-bit, 18 MSPS, 45 channels |
| Operating Voltage Range | 1.8 V to 3.3 V |
| Boîtier | 176-LQFP (20 x 20 mm) |
| Pin/Pitch | 176 pins, 0.5 mm pitch |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| I/O Pins (GPIO) | Up to 120 |
| Memory Management Unit | Yes (supports embedded OS) |
| Floating Point Unit | Yes (IEEE 754) |
| Graphics LCD Controller | Yes (integrated) |
| External Bus Interface | 32-bit with DDR2 support |
| Crypto Accelerators | AES, SHA, DES/SHA-MD5 |
| Dual-Panel Flash | Yes (live firmware update) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de PIC32MZ2064DAA176-I/2J
| Broche 1 | RA0 — GPIO/analog input |
| Broche 2 | RA1 — GPIO/analog input |
| Broche 3 | RA2 — GPIO/analog input |
| Broche 4 | RA3 — GPIO/analog input |
| Broche 5 | RA4 — GPIO/analog input |
| Broche 6 | RA5 — GPIO/analog input |
| Broche 7 | RA6 — GPIO/analog input |
| Broche 8 | RA7 — GPIO/analog input |
| Broche 9 | RA9 — GPIO/analog input |
| Broche 10 | RA10 — GPIO/analog input |
| Broche 11 | AVDD — Analog supply voltage |
| Broche 12 | AVSS — Analog ground |
| Broche 13 | RB0 — GPIO/programmable |
| Broche 14 | RB1 — GPIO/programmable |
| Broche 15 | RB2 — GPIO/programmable |
| Broche 16 | RB3 — GPIO/programmable |
| Broche 17 | RB4 — GPIO/programmable |
| Broche 18 | RB5 — GPIO/programmable |
| Broche 19 | RB6 — GPIO/programmable |
| Broche 20 | RB7 — GPIO/programmable |
| Broche 21 | RB8 — GPIO/programmable |
| Broche 22 | RB9 — GPIO/programmable |
| Broche 23 | RB10 — GPIO/programmable |
| Broche 24 | RB11 — GPIO/programmable |
| Broche 25 | RB12 — GPIO/programmable |
| Broche 26 | RB13 — GPIO/programmable |
| Broche 27 | RB14 — GPIO/programmable |
| Broche 28 | RB15 — GPIO/programmable |
| Broche 29 | RC0 — GPIO/programmable |
| Broche 30 | RC1 — GPIO/programmable |
| Broche 31 | RC2 — GPIO/programmable |
| Broche 32 | RC3 — GPIO/programmable |
| Broche 33 | RC4 — GPIO/programmable |
| Broche 34 | RC5 — GPIO/programmable |
| Broche 35 | RC6 — GPIO/programmable |
| Broche 36 | RC7 — GPIO/programmable |
| Broche 37 | RC8 — GPIO/programmable |
| Broche 38 | RC9 — GPIO/programmable |
| Broche 39 | RC10 — GPIO/programmable |
| Broche 40 | RC11 — GPIO/programmable |
| Broche 41 | RC12 — GPIO/programmable |
| Broche 42 | RC13 — GPIO/programmable |
| Broche 43 | RC14 — GPIO/programmable |
| Broche 44 | RC15 — GPIO/programmable |
| Broche 45 | RD0 — GPIO/programmable |
| Broche 46 | RD1 — GPIO/programmable |
| Broche 47 | RD2 — GPIO/programmable |
| Broche 48 | RD3 — GPIO/programmable |
| Broche 49 | RD4 — GPIO/programmable |
| Broche 50 | RD5 — GPIO/programmable |
| Broche 51 | RD6 — GPIO/programmable |
| Broche 52 | RD7 — GPIO/programmable |
| Broche 53 | RD8 — GPIO/programmable |
| Broche 54 | RD9 — GPIO/programmable |
| Broche 55 | RD10 — GPIO/programmable |
| Broche 56 | RD11 — GPIO/programmable |
| Broche 57 | RD12 — GPIO/programmable |
| Broche 58 | RD13 — GPIO/programmable |
| Broche 59 | RD14 — GPIO/programmable |
| Broche 60 | RD15 — GPIO/programmable |
| Broche 61 | RE0 — GPIO/programmable |
| Broche 62 | RE1 — GPIO/programmable |
| Broche 63 | RE2 — GPIO/programmable |
| Broche 64 | RE3 — GPIO/programmable |
| Broche 65 | RE4 — GPIO/programmable |
| Broche 66 | RE5 — GPIO/programmable |
| Broche 67 | RE6 — GPIO/programmable |
| Broche 68 | RE7 — GPIO/programmable |
| Broche 69 | RE8 — GPIO/programmable |
| Broche 70 | RE9 — GPIO/programmable |
| Broche 71 | RE10 — GPIO/programmable |
| Broche 72 | RE11 — GPIO/programmable |
| Broche 73 | RE12 — GPIO/programmable |
| Broche 74 | RE13 — GPIO/programmable |
| Broche 75 | RE14 — GPIO/programmable |
| Broche 76 | RE15 — GPIO/programmable |
| Broche 77 | RF0 — GPIO/programmable |
| Broche 78 | RF1 — GPIO/programmable |
| Broche 79 | RF2 — GPIO/programmable |
| Broche 80 | RF3 — GPIO/programmable |
| Broche 81 | RF4 — GPIO/programmable |
| Broche 82 | RF5 — GPIO/programmable |
| Broche 83 | RF6 — GPIO/programmable |
| Broche 84 | RF7 — GPIO/programmable |
| Broche 85 | RF8 — GPIO/programmable |
| Broche 86 | RF9 — GPIO/programmable |
| Broche 87 | RF10 — GPIO/programmable |
| Broche 88 | RF11 — GPIO/programmable |
| Broche 89 | RF12 — GPIO/programmable |
| Broche 90 | RF13 — GPIO/programmable |
| Broche 91 | RF14 — GPIO/programmable |
| Broche 92 | RF15 — GPIO/programmable |
| Broche 93 | RG0 — GPIO/programmable |
| Broche 94 | RG1 — GPIO/programmable |
| Broche 95 | RG2 — GPIO/programmable |
| Broche 96 | RG3 — GPIO/programmable |
| Broche 97 | RG6 — GPIO/programmable |
| Broche 98 | RG7 — GPIO/programmable |
| Broche 99 | RG8 — GPIO/programmable |
| Broche 100 | RG9 — GPIO/programmable |
| Broche 101 | RG10 — GPIO/programmable |
| Broche 102 | RG11 — GPIO/programmable |
| Broche 103 | RG12 — GPIO/programmable |
| Broche 104 | RG13 — GPIO/programmable |
| Broche 105 | RG14 — GPIO/programmable |
| Broche 106 | RG15 — GPIO/programmable |
| Broche 107 | RH0 — GPIO/programmable |
| Broche 108 | RH1 — GPIO/programmable |
| Broche 109 | RH2 — GPIO/programmable |
| Broche 110 | RH3 — GPIO/programmable |
| Broche 111 | RH4 — GPIO/programmable |
| Broche 112 | RH5 — GPIO/programmable |
| Broche 113 | RH6 — GPIO/programmable |
| Broche 114 | RH7 — GPIO/programmable |
| Broche 115 | RH8 — GPIO/programmable |
| Broche 116 | RH9 — GPIO/programmable |
| Broche 117 | RH10 — GPIO/programmable |
| Broche 118 | RH11 — GPIO/programmable |
| Broche 119 | RH12 — GPIO/programmable |
| Broche 120 | RH13 — GPIO/programmable |
| Broche 121 | RH14 — GPIO/programmable |
| Broche 122 | RH15 — GPIO/programmable |
| Broche 123 | RJ0 — GPIO/programmable |
| Broche 124 | RJ1 — GPIO/programmable |
| Broche 125 | RJ2 — GPIO/programmable |
| Broche 126 | RJ3 — GPIO/programmable |
| Broche 127 | RJ4 — GPIO/programmable |
| Broche 128 | RJ5 — GPIO/programmable |
| Broche 129 | RJ6 — GPIO/programmable |
| Broche 130 | RJ7 — GPIO/programmable |
| Broche 131 | RJ8 — GPIO/programmable |
| Broche 132 | RJ9 — GPIO/programmable |
| Broche 133 | RJ10 — GPIO/programmable |
| Broche 134 | RJ11 — GPIO/programmable |
| Broche 135 | RJ12 — GPIO/programmable |
| Broche 136 | RJ13 — GPIO/programmable |
| Broche 137 | RJ14 — GPIO/programmable |
| Broche 138 | RJ15 — GPIO/programmable |
| Broche 139 | RK0 — GPIO/programmable |
| Broche 140 | RK1 — GPIO/programmable |
| Broche 141 | RK2 — GPIO/programmable |
| Broche 142 | RK3 — GPIO/programmable |
| Broche 143 | RK4 — GPIO/programmable |
| Broche 144 | RK5 — GPIO/programmable |
| Broche 145 | RK6 — GPIO/programmable |
| Broche 146 | RK7 — GPIO/programmable |
| Broche 147 | RK8 — GPIO/programmable |
| Broche 148 | RK9 — GPIO/programmable |
| Broche 149 | RK10 — GPIO/programmable |
| Broche 150 | RK11 — GPIO/programmable |
| Broche 151 | RK12 — GPIO/programmable |
| Broche 152 | RK13 — GPIO/programmable |
| Broche 153 | RK14 — GPIO/programmable |
| Broche 154 | RK15 — GPIO/programmable |
| Broche 155 | VDD — Digital supply voltage |
| Broche 156 | VSS — Digital ground |
| Broche 157 | VDD — Digital supply voltage |
| Broche 158 | VSS — Digital ground |
| Broche 159 | OSC1 — Crystal oscillator input |
| Broche 160 | OSC2 — Crystal oscillator output |
| Broche 161 | SOSC1 — Secondary crystal oscillator input |
| Broche 162 | SOSC2 — Secondary crystal oscillator output |
| Broche 163 | MCLR — Master clear (reset) input |
| Broche 164 | PGEC1 — ICSP programming clock |
| Broche 165 | PGED1 — ICSP programming data |
| Broche 166 | PGEC2 — ICSP alternate programming clock |
| Broche 167 | PGED2 — ICSP alternate programming data |
| Broche 168 | TMS — JTAG test mode select |
| Broche 169 | TCK — JTAG test clock |
| Broche 170 | TDI — JTAG test data input |
| Broche 171 | TDO — JTAG test data output |
| Broche 172 | TRST — JTAG test reset |
| Broche 173 | VDD — Digital supply voltage |
| Broche 174 | VSS — Digital ground |
| Broche 175 | VDDIO — I/O supply voltage |
| Broche 176 | EP — Exposed thermal pad (connect to ground) |
Applications typiques
PIC32MZ2064DAA176-I/2J convient pour 7 applications: Industrial HMI Touch Panels, Medical Patient Monitoring Displays, Point-of-Sale Terminals, IoT Edge Gateways with Graphical Dashboard, Automotive Infotainment Secondary Displays, Building Automation Touch Controllers, Industrial Test and Measurement Front-Ends.
Industrial HMI Touch Panels
The PIC32MZ2064DAA176-I/2J is purpose-built for industrial human-machine interface (HMI) panels requiring TFT color displays up to WVGA (800x480) resolution. Its 200 MHz MIPS32 microAptiv core drives the integrated Graphics LCD controller to refresh the panel without CPU intervention, while the 640 KB SRAM holds full-frame buffers at common resolutions. The integrated 12-bit 18 MSPS ADC supports analog sensor inputs (RTD, 4-20 mA loops) directly on the HMI board. Industrial -40C to +85C operation handles factory floor thermal stress. Pair with Freescale (NXP) touch controller or Microchip AT42QT for capacitive touch overlay.
Recommandé
Medical Patient Monitoring Displays
In medical patient monitors and diagnostic equipment, the PIC32MZ2064DAA176-I/2J provides deterministic real-time performance for waveform rendering (ECG, SpO2 plethysmograph) on TFT displays. The 330 DMIPS throughput at 200 MHz supports up to 60 Hz refresh rates of complex waveforms without tearing, and the integrated FPU accelerates DSP filter math for signal conditioning. Hardware crypto accelerators (AES, SHA) enable secure patient data logging for HIPAA compliance. The wide 1.8-3.3 V supply simplifies mixed-signal power tree design with analog sensor front-ends.
Recommandé
Point-of-Sale Terminals
Point-of-sale (POS) terminals leverage the PIC32MZ2064DAA176-I/2J for graphics-rich customer-facing displays combined with secure payment processing. The 2 MB dual-panel Flash supports safe firmware over-the-air (FOTA) updates via bank-swap, critical for PCI PTS compliance and zero-downtime security patching. The integrated hardware crypto accelerators (AES-256, SHA-256) handle encrypted PIN pad communication and EMV contactless transactions. The 176-LQFP package provides 120 GPIO for simultaneous LCD, thermal receipt printer control, and PIN pad interfacing.
Recommandé
IoT Edge Gateways with Graphical Dashboard
IoT edge gateways with web-based graphical dashboards benefit from the PIC32MZ2064DAA176-I/2J's MMU support for embedded web servers and the integrated graphics controller for status displays. The MIPS32 microAptiv core runs at 200 MHz with zero-wait-state Flash performance, hosting lightweight TCP/IP stacks alongside a local TFT dashboard. The 32-bit external bus interface with DDR2 support enables connection to large external memories for data logging. Industrial temperature operation suits outdoor enclosure installations.
Recommandé
Automotive Infotainment Secondary Displays
For automotive rear-seat entertainment (RSE), climate control panels, and instrument cluster secondary displays, the PIC32MZ2064DAA176-I/2J delivers MCU-class ease of design with MPU-class graphics performance. The integrated graphics controller supports 24-bit color TFT panels, and the 640 KB SRAM eliminates the need for external frame buffer memory in many designs. While the standard -40C to +85C industrial grade suits cabin applications, automotive grade qualification (AEC-Q100) requires the -V/2J temperature variant. The dual-panel Flash enables safe FOTA for vehicle firmware updates.
Recommandé
Building Automation Touch Controllers
Building automation systems (lighting control, HVAC touch panels, access control keypads) use the PIC32MZ2064DAA176-I/2J to provide graphical user interfaces in a single-chip solution. The integrated 12-bit ADC handles analog sensor inputs (temperature, humidity, light) directly, while the graphics controller drives color TFT displays without external display drivers. The 2 MB Flash supports multi-language UI assets (fonts, bitmaps), and the MMU enables use of FreeRTOS for task management. Industrial temperature grade ensures reliable operation in unconditioned electrical closets.
Recommandé
Industrial Test and Measurement Front-Ends
Bench-top test and measurement instruments (oscilloscope front-panels, spectrum analyzer displays, laboratory data loggers) leverage the PIC32MZ2064DAA176-I/2J for both high-speed signal acquisition and rich graphical display. The 12-bit 18 MSPS ADC with 45 channels captures multi-channel sensor data, while the integrated graphics controller renders real-time waveform and spectrum visualizations on TFT screens. The 640 KB SRAM holds deep acquisition buffers, and the MIPS32 microAptiv core with FPU executes DSP filtering at line rate. The 176-LQFP package provides abundant GPIO for keypad, rotary encoder, and trigger inputs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2064DAA176-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2064DAH176-I/2J | PIC32MZ2064DAB176 | PIC32MZ2064DAS176 | PIC32MZ2025DAA176T-I/2J | PIC32MZ2025DAH176-I/2J |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Graphics LCD Controller | Integrated | Integrated (enhanced) | Integrated | Integrated | Integrated | Integrated (enhanced) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| ADC | 12-bit, 18 MSPS, 45-ch | 12-bit, 18 MSPS, 45-ch | 12-bit, 18 MSPS, 45-ch | 12-bit, 18 MSPS, 45-ch | 12-bit, 18 MSPS, 45-ch | 12-bit, 18 MSPS, 45-ch |
Principaux différenciateurs
- Largest Flash density in 176-LQFP DA family (vs PIC32MZ2025DAA176T-I/2J)
- Dual-panel Flash for safe firmware live update (vs PIC32MZ2048EFM144T-I/PH)
- Integrated graphics LCD controller with 24-bit color support (vs PIC32MZ2048EFM144T-I/PH)
- MMU for embedded OS support (vs PIC32MX series)
Notes de conception
The 176-LQFP package uses 0.5 mm lead pitch, requiring a minimum 4-layer PCB with 0.1 mm trace/space design rules. Estimated trace width: 0.15 mm signal traces with 0.1 mm clearances. Use 0.2 mm via diameter with 0.1 mm annular ring for breakout routing. The exposed thermal pad (pin 176) MUST be soldered to a ground plane with thermal vias (0.3 mm diameter, 1 mm spacing) for proper heat dissipation of the 200 MHz core under sustained graphics load.
PIC32MZ DA devices require multiple supply rails: AVDD (analog, separate LDO), VDD (digital core, 1.8V typ), VDIO (I/O, 3.3V typ). Decoupling: place 100 nF X7R ceramic capacitors within 2 mm of every VDD/AVDD pin, plus a 10 uF bulk capacitor per rail. Estimated power consumption at 200 MHz full-load: ~250-300 mA core current; design power tree to deliver at least 500 mA peak with 10% margin. Add ferrite bead between digital and analog grounds connected at a single point near the IC.
Route high-speed display parallel bus signals (LCD_DATA, LCD_HSYNC/VSYNC/DE/PCLK) on the top layer adjacent to the MCU with matched lengths within 5 mm. Keep TFT clock traces away from ADC analog inputs to prevent digital switching noise from coupling into ADC readings. The 32-bit external bus with DDR2 support requires strict length matching (±2.5 mm) for byte lanes and impedance control (50 ohm single-ended, 100 ohm differential for DDR2). Refer to Microchip application note AN1428 for detailed layout recommendations.
Estimated junction temperature rise at full 200 MHz operation with graphics pipeline active: ~85 C above ambient with minimum PCB copper. The exposed thermal pad with 16 thermal vias (0.3 mm drill) into a 1 oz inner ground plane drops this to ~45 C rise. For continuous high-temperature industrial operation (>70 C ambient), consider active airflow or heat-spreader copper pour on top layer connected to the thermal pad.
Common pitfalls: (1) Forgetting to enable the 1.8V core voltage regulator (LDO) before code execution - use the on-chip voltage regulator control register. (2) Configuring PPS (Peripheral Pin Select) without locking the assignment, allowing accidental remapping. (3) Drawing >50 mA from any single GPIO pin (absolute max). (4) Operating VDDIO outside 1.8-3.6V specification during in-circuit programming - ensure stable power before asserting MCLR. (5) Not initializing the FPU before executing floating-point code, which causes floating-point exceptions in FreeRTOS contexts.
Informations de conformité
RoHS and REACH compliant per Microchip product environmental compliance documentation. -I/2J suffix denotes industrial temperature grade -40C to +85C; -V/2J suffix denotes automotive grade (AEC-Q100). Standard -I/2J variant is NOT AEC-Q100 qualified.