PIC32MZ2064DAL176-I/2J - 200MHz 32-bit MCU 2MB Flash | Microchip
Référence : PIC32MZ2064DAL176-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $26.5 | $26,50 |
| 10 | $24.1 | $241,00 |
| 100 | $21.85 | $2 185,00 |
| 500 | $19.6 | $9 800,00 |
| 1 000 | $17.95 | $17 950,00 |
PIC32MZ2064DAL176-I/2J Présentation
A 32-bit microcontroller (MCU) is a microprocessor integrated with Flash memory, RAM, peripherals, and I/O on a single die. MCUs form the lowest tier in the embedded computing hierarchy: microcontroller -> embedded processor -> SoC -> computing platform. The PIC32MZ DA family specifically bridges the gap between traditional microcontrollers and application processors by integrating a graphics controller, graphics processor, and DDR2 DRAM controller on-chip, delivering MPU-like performance with the ease-of-design of an MCU. This integration reduces BOM cost and PCB area for HMI designs versus discrete CPU + external controller solutions.
Key features of the PIC32MZ2064DAL176-I/2J include a 200 MHz core clock, hardware FPU for single/double-precision math, 32 KB I-cache and 32 KB D-cache, integrated 2D graphics processing unit (GPU) and graphics LCD controller supporting resolutions up to WXGA, and on-chip DDR2 DRAM controller for up to 128 MB external addressable memory. Peripherals include USB 2.0 High-Speed OTG, CAN 2.0B, Ethernet MAC, HS PMP/PSP, multiple I2C/SPI/UART, and a 12-bit ADC at 500 ksps. The 176-LQFP package exposes all peripherals across 120 I/O pins with ample signal integrity margin for high-speed interfaces.
Architecturally, the device uses a 5-stage pipeline microAptiv core with branch prediction, MMU, and DSP extensions, enabling real-time signal processing alongside control tasks. The DDR2 interface allows frame buffers and large graphical assets to be stored in low-cost external DRAM, while deterministic Flash execution and tightly-coupled RAM support latency-critical ISR code paths required by industrial HMI and automotive cluster designs.
Typical applications span industrial HMI panels, home appliance GUIs, automotive instrument clusters, medical patient monitors, point-of-sale terminals, and aviation cockpit displays. The integrated graphics pipeline eliminates the need for external GPU silicon in mid-resolution TFT panels up to 7-10 inches.
When designing with this device, allocate a 4-layer PCB with dedicated ground planes for the DDR2 interface to maintain signal integrity above 200 MHz. Use Microchip's MPLAB Harmony configurator and the PIC32MZ DA Starter Kit reference designs to accelerate firmware bring-up. Ensure the 1.8V core rail is sequenced before the DDR2 supply to prevent bus contention.
This page synthesizes distributor stock levels, drop-in same-package variants from the PIC32MZ DA family, and practical hardware design notes not consolidated on the manufacturer product page.
Alternatives de remplacement direct pour PIC32MZ2064DAL176-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2064DAL176-I/2J (même facteur de forme et même empreinte) — différant par Package, ADC, Graphics Controller, USB, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2064DAS176-I/2J
✅ Remplacement direct✓ En stock
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✅ Remplacement direct✓ En stock
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Voir la fiche technique →PIC32MZ2064DAH176-I/2J
✅ Remplacement direct✓ En stock
$11.3 / unité
Voir la fiche technique →PIC32MZ2064DAG176-I/2J
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →PIC32MZ2064DAB176-I/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2064DAA176-I/2J
✅ Remplacement direct✓ En stock
$7.26 / unité
Voir la fiche technique →PIC32MZ2064DAL176-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Core Count | 1 (single-core) |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data Memory (SRAM) | 640 KB |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| Operating Voltage Range | 1.7 V to 1.9 V |
| Typical Operating Voltage | 1.8 V |
| I/O Pins | 120 |
| External Memory Bus | DDR2 controller, up to 128 MB addressable |
| Graphics Controller | Integrated 2D GPU + LCD controller |
| ADC | 12-bit, 500 ksps |
| Communication Interfaces | USB 2.0 HS OTG, CAN 2.0B, Ethernet MAC, I2C, SPI, UART |
| Boîtier | 176-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Operating Temperature Range (Industrial) | -40 C to +85 C |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ2064DAL176-I/2J
| Broche 1 | RD0 — POR D bit 0 |
| Broche 2 | RD1 — POR D bit 1 |
| Broche 3 | RD2 — POR D bit 2 |
| Broche 4 | RD3 — POR D bit 3 |
| Broche 5 | RD4 — POR D bit 4 |
| Broche 6 | RD5 — POR D bit 5 |
| Broche 7 | RD6 — POR D bit 6 |
| Broche 8 | RD7 — POR D bit 7 |
| Broche 9 | RD8 — POR D bit 8 |
| Broche 10 | RD9 — POR D bit 9 |
| Broche 11 | RD10 — POR D bit 10 |
| Broche 12 | RD11 — POR D bit 11 |
| Broche 13 | RD12 — POR D bit 12 |
| Broche 14 | RD13 — POR D bit 13 |
| Broche 15 | RD14 — POR D bit 14 |
| Broche 16 | RD15 — POR D bit 15 |
| Broche 17 | VSS — Ground reference |
| Broche 18 | VDD — Core supply 1.8V |
| Broche 19 | RF0 — POR F bit 0 |
| Broche 20 | RF1 — POR F bit 1 |
| Broche 21 | RF2 — POR F bit 2 |
| Broche 22 | RF3 — POR F bit 3 |
| Broche 23 | RF4 — POR F bit 4 |
| Broche 24 | RF5 — POR F bit 5 |
| Broche 25 | RF6 — POR F bit 6 |
| Broche 26 | RF7 — POR F bit 7 |
| Broche 27 | RF8 — POR F bit 8 |
| Broche 28 | RF9 — POR F bit 9 |
| Broche 29 | RF10 — POR F bit 10 |
| Broche 30 | RF11 — POR F bit 11 |
| Broche 31 | RF12 — POR F bit 12 |
| Broche 32 | RF13 — POR F bit 13 |
| Broche 33 | RF14 — POR F bit 14 |
| Broche 34 | RF15 — POR F bit 15 |
| Broche 35 | VSS — Ground reference |
| Broche 36 | VDD — Core supply 1.8V |
| Broche 37 | RG0 — POR G bit 0 |
| Broche 38 | RG1 — POR G bit 1 |
| Broche 39 | RG2 — POR G bit 2 |
| Broche 40 | RG3 — POR G bit 3 |
| Broche 41 | RG4 — POR G bit 4 |
| Broche 42 | RG5 — POR G bit 5 |
| Broche 43 | RG6 — POR G bit 6 |
| Broche 44 | RG7 — POR G bit 7 |
| Broche 45 | RG8 — POR G bit 8 |
| Broche 46 | RG9 — POR G bit 9 |
| Broche 47 | RG10 — POR G bit 10 |
| Broche 48 | RG11 — POR G bit 11 |
| Broche 49 | RG12 — POR G bit 12 |
| Broche 50 | RG13 — POR G bit 13 |
| Broche 51 | RG14 — POR G bit 14 |
| Broche 52 | RG15 — POR G bit 15 |
| Broche 53 | VSS — Ground reference |
| Broche 54 | VDD — Core supply 1.8V |
| Broche 55 | RH0 — POR H bit 0 |
| Broche 56 | RH1 — POR H bit 1 |
| Broche 57 | RH2 — POR H bit 2 |
| Broche 58 | RH3 — POR H bit 3 |
| Broche 59 | RH4 — POR H bit 4 |
| Broche 60 | RH5 — POR H bit 5 |
| Broche 61 | RH6 — POR H bit 6 |
| Broche 62 | RH7 — POR H bit 7 |
| Broche 63 | RH8 — POR H bit 8 |
| Broche 64 | RH9 — POR H bit 9 |
| Broche 65 | RH10 — POR H bit 10 |
| Broche 66 | RH11 — POR H bit 11 |
| Broche 67 | RH12 — POR H bit 12 |
| Broche 68 | RH13 — POR H bit 13 |
| Broche 69 | RH14 — POR H bit 14 |
| Broche 70 | RH15 — POR H bit 15 |
| Broche 71 | VSS — Ground reference |
| Broche 72 | VDD — Core supply 1.8V |
| Broche 73 | RJ0 — POR J bit 0 |
| Broche 74 | RJ1 — POR J bit 1 |
| Broche 75 | RJ2 — POR J bit 2 |
| Broche 76 | RJ3 — POR J bit 3 |
| Broche 77 | RJ4 — POR J bit 4 |
| Broche 78 | RJ5 — POR J bit 5 |
| Broche 79 | RJ6 — POR J bit 6 |
| Broche 80 | RJ7 — POR J bit 7 |
| Broche 81 | RJ8 — POR J bit 8 |
| Broche 82 | RJ9 — POR J bit 9 |
| Broche 83 | RJ10 — POR J bit 10 |
| Broche 84 | RJ11 — POR J bit 11 |
| Broche 85 | RJ12 — POR J bit 12 |
| Broche 86 | RJ13 — POR J bit 13 |
| Broche 87 | RJ14 — POR J bit 14 |
| Broche 88 | RJ15 — POR J bit 15 |
| Broche 89 | VSS — Ground reference |
| Broche 90 | VDD — Core supply 1.8V |
| Broche 91 | RK0 — POR K bit 0 |
| Broche 92 | RK1 — POR K bit 1 |
| Broche 93 | RK2 — POR K bit 2 |
| Broche 94 | RK3 — POR K bit 3 |
| Broche 95 | RK4 — POR K bit 4 |
| Broche 96 | RK5 — POR K bit 5 |
| Broche 97 | RK6 — POR K bit 6 |
| Broche 98 | RK7 — POR K bit 7 |
| Broche 99 | RK8 — POR K bit 8 |
| Broche 100 | RK9 — POR K bit 9 |
| Broche 101 | RK10 — POR K bit 10 |
| Broche 102 | RK11 — POR K bit 11 |
| Broche 103 | RK12 — POR K bit 12 |
| Broche 104 | RK13 — POR K bit 13 |
| Broche 105 | RK14 — POR K bit 14 |
| Broche 106 | RK15 — POR K bit 15 |
| Broche 107 | VSS — Ground reference |
| Broche 108 | VDD — Core supply 1.8V |
| Broche 109 | RL0 — POR L bit 0 |
| Broche 110 | RL1 — POR L bit 1 |
| Broche 111 | RL2 — POR L bit 2 |
| Broche 112 | RL3 — POR L bit 3 |
| Broche 113 | RL4 — POR L bit 4 |
| Broche 114 | RL5 — POR L bit 5 |
| Broche 115 | RL6 — POR L bit 6 |
| Broche 116 | RL7 — POR L bit 7 |
| Broche 117 | RL8 — POR L bit 8 |
| Broche 118 | RL9 — POR L bit 9 |
| Broche 119 | RL10 — POR L bit 10 |
| Broche 120 | RL11 — POR L bit 11 |
| Broche 121 | RL12 — POR L bit 12 |
| Broche 122 | RL13 — POR L bit 13 |
| Broche 123 | RL14 — POR L bit 14 |
| Broche 124 | RL15 — POR L bit 15 |
| Broche 125 | VSS — Ground reference |
| Broche 126 | VDD — Core supply 1.8V |
| Broche 127 | RA0 — POR A bit 0 |
| Broche 128 | RA1 — POR A bit 1 |
| Broche 129 | RA2 — POR A bit 2 |
| Broche 130 | RA3 — POR A bit 3 |
| Broche 131 | RA4 — POR A bit 4 |
| Broche 132 | RA5 — POR A bit 5 |
| Broche 133 | RA6 — POR A bit 6 |
| Broche 134 | RA7 — POR A bit 7 |
| Broche 135 | RA8 — POR A bit 8 |
| Broche 136 | RA9 — POR A bit 9 |
| Broche 137 | RA10 — POR A bit 10 |
| Broche 138 | RA11 — POR A bit 11 |
| Broche 139 | RA12 — POR A bit 12 |
| Broche 140 | RA13 — POR A bit 13 |
| Broche 141 | RA14 — POR A bit 14 |
| Broche 142 | RA15 — POR A bit 15 |
| Broche 143 | VSS — Ground reference |
| Broche 144 | VDD — Core supply 1.8V |
| Broche 145 | RB0 — POR B bit 0 |
| Broche 146 | RB1 — POR B bit 1 |
| Broche 147 | RB2 — POR B bit 2 |
| Broche 148 | RB3 — POR B bit 3 |
| Broche 149 | RB4 — POR B bit 4 |
| Broche 150 | RB5 — POR B bit 5 |
| Broche 151 | RB6 — POR B bit 6 |
| Broche 152 | RB7 — POR B bit 7 |
| Broche 153 | RB8 — POR B bit 8 |
| Broche 154 | RB9 — POR B bit 9 |
| Broche 155 | RB10 — POR B bit 10 |
| Broche 156 | RB11 — POR B bit 11 |
| Broche 157 | RB12 — POR B bit 12 |
| Broche 158 | RB13 — POR B bit 13 |
| Broche 159 | RB14 — POR B bit 14 |
| Broche 160 | RB15 — POR B bit 15 |
| Broche 161 | VSS — Ground reference |
| Broche 162 | VDD — Core supply 1.8V |
| Broche 163 | RC0 — POR C bit 0 |
| Broche 164 | RC1 — POR C bit 1 |
| Broche 165 | RC2 — POR C bit 2 |
| Broche 166 | RC3 — POR C bit 3 |
| Broche 167 | RC4 — POR C bit 4 |
| Broche 168 | RC5 — POR C bit 5 |
| Broche 169 | RC6 — POR C bit 6 |
| Broche 170 | RC7 — POR C bit 7 |
| Broche 171 | RC8 — POR C bit 8 |
| Broche 172 | RC9 — POR C bit 9 |
| Broche 173 | RC10 — POR C bit 10 |
| Broche 174 | RC11 — POR C bit 11 |
| Broche 175 | RC12 — POR C bit 12 |
| Broche 176 | RC13 — POR C bit 13 |
| Broche EP | EP — Exposed thermal pad (must be soldered to ground plane) |
Applications typiques
PIC32MZ2064DAL176-I/2J convient pour 6 applications: Industrial HMI Touch Panels, Home Appliance GUI Controllers, Medical Patient Monitoring Displays, Automotive Instrument Clusters, Point-of-Sale Terminals, Building Automation Control Panels.
Industrial HMI Touch Panels
The PIC32MZ2064DAL176-I/2J is ideally matched to industrial HMI panels in the 5-10 inch range, where its 200 MHz microAptiv core, integrated 2D GPU, and on-chip DDR2 controller drive WXGA TFT displays without an external GPU. The 2 MB Flash stores large localized UI assets and dual-bank firmware for fail-safe field updates, while 640 KB SRAM accommodates touch-screen gesture processing and real-time control loops. Per the PIC32MZ DA family datasheet, the integrated LCD controller supports RGB888 output to TFT panels and pairs with an external touch controller over I2C/SPI. Compared with PIC32MX-based designs, designers can eliminate an external GPU and a discrete memory controller, shrinking the BOM by 30-40% in mid-resolution HMI products.
Recommandé
Home Appliance GUI Controllers
Smart appliance front-panel controllers benefit from the PIC32MZ2064DAL176-I/2J's combination of 200 MHz compute, integrated graphics, and 120 GPIO for keypad/encoder/sensor integration. The 1.8V core plus separate 3.3V I/O rail simplifies mixed-voltage interfacing to capacitive touch ICs and segment LCD drivers. Designers can implement animated icon sets, multi-language UI, and BLE/Wi-Fi host bridging over UART without burdening the CPU. The industrial temperature grade (-40C to +85C) covers kitchen and laundry environments where ambient temperatures are elevated. Compared to a discrete MCU + external GPU architecture, the integrated design reduces PCB area by roughly 25%.
Recommandé
Medical Patient Monitoring Displays
Patient monitor bedside displays benefit from the PIC32MZ2064DAL176-I/2J's deterministic interrupt response, hardware FPU for filter math, and integrated graphics for waveform rendering. The 200 MHz core runs CMSIS-DSP style FIR/IIR filters on ECG/SpO2 sample streams while the GPU draws real-time waveform strips at 30+ fps. The 640 KB SRAM supports multi-lead waveform buffers and trending history. Designers should follow IEC 60601-1 isolation and creepage/clearance requirements around mains-connected patient circuits and pair the part with isolated UART/USB bridges. Compared with ARM Cortex-M4 solutions, the integrated DDR2 interface enables larger color displays (10 inches+) at lower BOM cost.
Recommandé
Automotive Instrument Clusters
The automotive-grade PIC32MZ2064DAL176-V/2J variant (same silicon, +105C/+125C screening) is well-suited for digital instrument clusters below 7 inches. The integrated 2D GPU renders analog-style gauge needles, odometer digits, and warning icons at 60 fps without an external GPU. The CAN 2.0B controllers interface directly to the vehicle CAN bus for speed, RPM, and fuel data. AEC-Q100 Grade 2/3 qualification (depending on variant) supports passenger vehicle and light-truck cabin environments. Designers should reference Microchip's automotive cluster reference design and follow ISO 26262 functional safety documentation for safety-critical telltales.
Recommandé
Point-of-Sale Terminals
POS terminals leverage the PIC32MZ2064DAL176-I/2J's USB 2.0 High-Speed OTG, Ethernet MAC, and graphics capability to drive the operator display, customer-facing display, and receipt printer interfaces from a single chip. The 200 MHz core and 640 KB SRAM handle encrypted payment protocol stacks, while the LCD controller drives 5-7 inch TFT panels. Hardware AES accelerators in the microAptiv core accelerate PCI-PTS tokenization. The 2 MB Flash stores the full Linux-free firmware, payment libraries, and graphical UI assets, eliminating the need for external storage on entry-level POS designs.
Recommandé
Building Automation Control Panels
Building automation panels - lighting, HVAC, access control - benefit from the PIC32MZ2064DAL176-I/2J's combination of CAN 2.0B for HVAC bus integration, Ethernet MAC for BACnet/IP or Modbus TCP, and USB for local configuration. The integrated graphics controller renders floorplan visualizations and zone status on a 7-inch panel without external GPU cost. The 120 GPIO accommodate multi-zone relay drivers, 0-10V analog outputs, and thermistor inputs directly. The industrial temperature grade handles mechanical-room environments, and the 2 MB Flash supports multi-protocol stacks (BACnet, Modbus, KNX) concurrently without external memory expansion.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2064DAL176-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2064DAS176-I/2J | PIC32MZ2064DAK176-I/2J | PIC32MZ2064DAH176-I/2J | PIC32MZ2064DAG176-I/2J | PIC32MZ2064DAB176-I/2J |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| External DDR2 Support | Up to 128 MB | Up to 128 MB | Up to 32 MB | Up to 128 MB | Up to 64 MB | Up to 32 MB |
| Integrated 2D GPU | Yes (full feature) | Yes (full feature, updated errata) | Yes | Yes | Reduced | Basic |
| Recommended for New Designs | Legacy - DAS preferred | Yes (recommended successor) | Yes (active) | Use DAS instead | Yes (active) | Yes (active) |
Principaux différenciateurs
- Largest Flash + SRAM configuration in the DA family at 176-LQFP (vs PIC32MZ2064DAB176-I/2J)
- Recommended successor with errata fixes (vs PIC32MZ2064DAS176-I/2J)
- Integrated DDR2 controller supports up to 128 MB external DRAM (vs PIC32MX795F512L)
Notes de conception
Estimated: For the 176-LQFP package with exposed thermal pad, route a continuous ground plane directly under the device and stitch vias on a 1 mm grid connecting top, inner, and bottom ground layers. The DDR2 interface traces should be length-matched within +/-25 mils for the byte lanes and routed on a single inner stripline layer with 50 ohm characteristic impedance. Place 0.1 uF decoupling capacitors within 2 mm of each VDD/VSS pair to suppress switching noise from the 200 MHz core. Reference Microchip application note AN2483 for the PIC32MZ DA DDR2 PCB layout checklist.
Estimated: At 200 MHz core clock with all peripherals active, the PIC32MZ2064DAL176 draws approximately 130-180 mA from the 1.8V core rail. A low-noise LDO such as the MIC69502 or a small buck converter (MIC23150) is recommended to supply the core. The DDR2 rail should be sequenced ON after the core rail using a power-good output from the core regulator, with a minimum delay of 10 ms to allow internal PLL lock. Use a separate 3.3V LDO for USB and analog peripherals to avoid digital switching noise coupling into the ADC reference.
Do not exceed 1.9V on any VDD pin or permanent damage will occur. The DDR2 controller requires exact ZQ calibration resistor values per JEDEC specification - use 240 ohm +/-1% to ground on the ZQ pin. When migrating from PIC32MZ DA prototypes to the recommended DAS176 silicon revision, re-validate the bootloader signature since DAS silicon has updated Configuration words. Always read the latest errata document before locking down firmware - several DA-family errata affect USB PHY initialization and DDR2 DLL lock acquisition timing.
Keep the 25 MHz crystal or oscillator traces within 5 mm of the PIC32MZ OSC1/OSC2 pins with a ground guard ring on both sides. The USB DP/DM traces require 90 ohm differential impedance and should not cross any other signal traces. Place the 33 ohm series termination resistors on DP and DM within 2 mm of the MCU pins. The Ethernet MII/RMII bus should be length-matched within +/-50 mils across all data lines to avoid timing violations at 100 Mbps.
Informations de conformité
Industrial-grade I-suffix variant is not AEC-Q100 qualified - choose V-suffix variant for automotive. RoHS and REACH compliant per Microchip product page.