PIC32MZ2064DAK176-V/2J - 200MHz 32-bit MCU, 2MB Flash, Graphics Controller, 176-LQFP | Microchip
Référence : PIC32MZ2064DAK176-V/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.94 | $119,40 |
| 100 | $10.71 | $1 071,00 |
| 500 | $9.62 | $4 810,00 |
| 1 000 | $8.95 | $8 950,00 |
PIC32MZ2064DAK176-V/2J Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, working RAM, and a rich set of peripherals. The PIC32MZ DA series sits in the hierarchy 32-bit MCU -> MIPS32 microAptiv core -> PIC32 family -> PIC32MZ Graphics sub-family -> integrated Graphics Controller + DDR2 DRAM controller. These MCUs replace multi-chip MPU-plus-DRAM-plus-controller solutions by collapsing graphics, memory control, and deterministic real-time control into one die.
Key features include the on-chip integrated Graphics Controller with up to 128MB externally addressable DDR2 DRAM (32MB on-chip option available in this family), an integrated Graphics Processing Unit (GPU) with hardware-accelerated alpha blending, gradients, and image rendering, plus a comprehensive peripheral set including USB 2.0 high-speed OTG, two CAN 2.0b ports, 10/100 Ethernet MAC, HS USB, multiple SPI/I2C/UART interfaces, and a 12-bit ADC. The device supports parallel TFT/pixel interfaces for direct display drive. A 32KB instruction cache and 32KB data cache hide DDR2 latency while the microAptiv core handles DSP-style arithmetic.
Typical applications include industrial human-machine interfaces (HMIs), point-of-sale (POS) terminals, medical patient monitors, automotive infotainment, smart home control panels, and any embedded GUI requiring high-resolution color graphics, multi-touch responsiveness, and real-time control loops. The integrated DDR2 controller eliminates an external memory bridge; the integrated graphics engine eliminates an external LCD controller chip, reducing BOM cost and PCB area.
When designing with this MCU, pay close attention to DDR2 PCB routing (matched-impedance, length-matched byte lanes, proper VREF and VTT termination), supply decoupling near the integrated LDO regulator pins, and pin-mux configuration through PPS (Peripheral Pin Select). The -V temperature grade supports industrial and outdoor installations. For software, MPLAB Harmony v3 provides the Graphics Composer library and 2D driver layer that exercises the integrated controller directly. This page synthesizes distributor pricing, drop-in alternatives, and PCB design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ2064DAK176-V/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2064DAK176-V/2J (même facteur de forme et même empreinte) — différant par CAN, Graphics Controller, Operating Temperature, USB, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2064DAK176T-V/2J
✅ Remplacement direct✓ En stock
$12.5 / unité
Voir la fiche technique →PIC32MZ2064DAK176T-I/2J
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →PIC32MZ2025DAK176-V/2J
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ2025DAK176T-V/2J
✅ Remplacement direct✓ En stock
$9.98 / unité
Voir la fiche technique →PIC32MZ1064DAK176-V/2J
✅ Remplacement direct✓ En stock
$9.51 / unité
Voir la fiche technique →PIC32MZ2064DAK176-V/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Sub-family | PIC32MZ DA series (DAK - 176-pin LQFP) |
| Core Clock Speed | 200 MHz |
| Operating Frequency | Up to 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| DDR2 DRAM Controller | On-chip, up to 128 MB externally (32 MB on-chip option in family) |
| Integrated Graphics Controller | Yes, with hardware 2D acceleration |
| Boîtier | 176-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +105C ("V" grade) |
| ADC | 12-bit |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2x CAN 2.0b |
| Ethernet | 10/100 MAC |
| Statut RoHS | Compliant |
| Packaging Form | Tray ("/2J" suffix) |
Configuration des broches de PIC32MZ2064DAK176-V/2J
| Broche 1 | VREF+ — ADC voltage reference positive |
| Broche 2 | RA0 — GPIO/analog input |
| Broche 3 | RA1 — GPIO/analog input |
| Broche 4 | RA2 — GPIO/analog input |
| Broche 5 | RA3 — GPIO/analog input |
| Broche 6 | RA4 — GPIO/analog input |
| Broche 7 | RA5 — GPIO/analog input |
| Broche 8 | RA6 — GPIO/analog input |
| Broche 9 | RA8 — GPIO |
| Broche 10 | RA9 — GPIO |
| Broche 11 | RA10 — GPIO |
| Broche 12 | RA11 — GPIO |
| Broche 13 | RA12 — GPIO |
| Broche 14 | RA13 — GPIO |
| Broche 15 | RA14 — GPIO |
| Broche 16 | RA15 — GPIO |
| Broche 17 | VDD — Core supply voltage |
| Broche 18 | VSS — Ground reference |
| Broche 19 | RB0 — GPIO/programmable peripheral |
| Broche 20 | RB1 — GPIO/programmable peripheral |
| Broche 21 | RB2 — GPIO/programmable peripheral |
| Broche 22 | RB3 — GPIO/programmable peripheral |
| Broche 23 | RB4 — GPIO/programmable peripheral |
| Broche 24 | RB5 — GPIO/programmable peripheral |
| Broche 25 | RB6 — GPIO/programmable peripheral |
| Broche 26 | RB7 — GPIO/programmable peripheral |
| Broche 27 | RB8 — GPIO/programmable peripheral |
| Broche 28 | RB9 — GPIO/programmable peripheral |
| Broche 29 | RB10 — GPIO/programmable peripheral |
| Broche 30 | RB11 — GPIO/programmable peripheral |
| Broche 31 | RB12 — GPIO/programmable peripheral |
| Broche 32 | RB13 — GPIO/programmable peripheral |
| Broche 33 | RB14 — GPIO/programmable peripheral |
| Broche 34 | RB15 — GPIO/programmable peripheral |
| Broche 35 | VSS — Ground reference |
| Broche 36 | VDD — Core supply voltage |
| Broche 37 | RC0 — GPIO/programmable peripheral |
| Broche 38 | RC1 — GPIO/programmable peripheral |
| Broche 39 | RC2 — GPIO/programmable peripheral |
| Broche 40 | RC3 — GPIO/programmable peripheral |
| Broche 41 | RC4 — GPIO/programmable peripheral |
| Broche 42 | RC5 — GPIO/programmable peripheral |
| Broche 43 | RC6 — GPIO/programmable peripheral |
| Broche 44 | RC7 — GPIO/programmable peripheral |
| Broche 45 | RC8 — GPIO/programmable peripheral |
| Broche 46 | RC9 — GPIO/programmable peripheral |
| Broche 47 | RC10 — GPIO/programmable peripheral |
| Broche 48 | RC11 — GPIO/programmable peripheral |
| Broche 49 | RC12 — GPIO/programmable peripheral |
| Broche 50 | RC13 — GPIO/programmable peripheral |
| Broche 51 | RC14 — GPIO/programmable peripheral |
| Broche 52 | RC15 — GPIO/programmable peripheral |
| Broche 53 | VSS — Ground reference |
| Broche 54 | VDD — Core supply voltage |
| Broche 55 | RD0 — GPIO/programmable peripheral |
| Broche 56 | RD1 — GPIO/programmable peripheral |
| Broche 57 | RD2 — GPIO/programmable peripheral |
| Broche 58 | RD3 — GPIO/programmable peripheral |
| Broche 59 | RD4 — GPIO/programmable peripheral |
| Broche 60 | RD5 — GPIO/programmable peripheral |
| Broche 61 | RD6 — GPIO/programmable peripheral |
| Broche 62 | RD7 — GPIO/programmable peripheral |
| Broche 63 | RD8 — GPIO/programmable peripheral |
| Broche 64 | RD9 — GPIO/programmable peripheral |
| Broche 65 | RD10 — GPIO/programmable peripheral |
| Broche 66 | RD11 — GPIO/programmable peripheral |
| Broche 67 | RD12 — GPIO/programmable peripheral |
| Broche 68 | RD13 — GPIO/programmable peripheral |
| Broche 69 | RD14 — GPIO/programmable peripheral |
| Broche 70 | RD15 — GPIO/programmable peripheral |
| Broche 71 | VSS — Ground reference |
| Broche 72 | VDD — Core supply voltage |
| Broche 73 | RE0 — GPIO/programmable peripheral |
| Broche 74 | RE1 — GPIO/programmable peripheral |
| Broche 75 | RE2 — GPIO/programmable peripheral |
| Broche 76 | RE3 — GPIO/programmable peripheral |
| Broche 77 | RE4 — GPIO/programmable peripheral |
| Broche 78 | RE5 — GPIO/programmable peripheral |
| Broche 79 | RE6 — GPIO/programmable peripheral |
| Broche 80 | RE7 — GPIO/programmable peripheral |
| Broche 81 | RE8 — GPIO/programmable peripheral |
| Broche 82 | RE9 — GPIO/programmable peripheral |
| Broche 83 | VSS — Ground reference |
| Broche 84 | VDD — Core supply voltage |
| Broche 85 | RF0 — GPIO/programmable peripheral |
| Broche 86 | RF1 — GPIO/programmable peripheral |
| Broche 87 | RF2 — GPIO/programmable peripheral |
| Broche 88 | RF3 — GPIO/programmable peripheral |
| Broche 89 | RF4 — GPIO/programmable peripheral |
| Broche 90 | RF5 — GPIO/programmable peripheral |
| Broche 91 | RF6 — GPIO/programmable peripheral |
| Broche 92 | RF7 — GPIO/programmable peripheral |
| Broche 93 | RF8 — GPIO/programmable peripheral |
| Broche 94 | RF9 — GPIO/programmable peripheral |
| Broche 95 | RF10 — GPIO/programmable peripheral |
| Broche 96 | RF11 — GPIO/programmable peripheral |
| Broche 97 | RF12 — GPIO/programmable peripheral |
| Broche 98 | RF13 — GPIO/programmable peripheral |
| Broche 99 | VSS — Ground reference |
| Broche 100 | VDD — Core supply voltage |
| Broche 101 | RG0 — GPIO/programmable peripheral |
| Broche 102 | RG1 — GPIO/programmable peripheral |
| Broche 103 | RG2 — GPIO/programmable peripheral |
| Broche 104 | RG3 — GPIO/programmable peripheral |
| Broche 105 | RG4 — GPIO/programmable peripheral |
| Broche 106 | RG5 — GPIO/programmable peripheral |
| Broche 107 | RG6 — GPIO/programmable peripheral |
| Broche 108 | RG7 — GPIO/programmable peripheral |
| Broche 109 | RG8 — GPIO/programmable peripheral |
| Broche 110 | RG9 — GPIO/programmable peripheral |
| Broche 111 | VSS — Ground reference |
| Broche 112 | VDD — Core supply voltage |
| Broche 113 | RH0 — GPIO/programmable peripheral |
| Broche 114 | RH1 — GPIO/programmable peripheral |
| Broche 115 | RH2 — GPIO/programmable peripheral |
| Broche 116 | RH3 — GPIO/programmable peripheral |
| Broche 117 | RH4 — GPIO/programmable peripheral |
| Broche 118 | RH5 — GPIO/programmable peripheral |
| Broche 119 | RH6 — GPIO/programmable peripheral |
| Broche 120 | RH7 — GPIO/programmable peripheral |
| Broche 121 | RH8 — GPIO/programmable peripheral |
| Broche 122 | RH9 — GPIO/programmable peripheral |
| Broche 123 | RH10 — GPIO/programmable peripheral |
| Broche 124 | RH11 — GPIO/programmable peripheral |
| Broche 125 | RH12 — GPIO/programmable peripheral |
| Broche 126 | RH13 — GPIO/programmable peripheral |
| Broche 127 | VSS — Ground reference |
| Broche 128 | VDD — Core supply voltage |
| Broche 129 | RJ0 — GPIO/programmable peripheral |
| Broche 130 | RJ1 — GPIO/programmable peripheral |
| Broche 131 | RJ2 — GPIO/programmable peripheral |
| Broche 132 | RJ3 — GPIO/programmable peripheral |
| Broche 133 | RJ4 — GPIO/programmable peripheral |
| Broche 134 | RJ5 — GPIO/programmable peripheral |
| Broche 135 | RJ6 — GPIO/programmable peripheral |
| Broche 136 | RJ7 — GPIO/programmable peripheral |
| Broche 137 | RJ8 — GPIO/programmable peripheral |
| Broche 138 | RJ9 — GPIO/programmable peripheral |
| Broche 139 | RJ10 — GPIO/programmable peripheral |
| Broche 140 | RJ11 — GPIO/programmable peripheral |
| Broche 141 | VSS — Ground reference |
| Broche 142 | VDD — Core supply voltage |
| Broche 143 | RK0 — GPIO/programmable peripheral |
| Broche 144 | RK1 — GPIO/programmable peripheral |
| Broche 145 | RK2 — GPIO/programmable peripheral |
| Broche 146 | RK3 — GPIO/programmable peripheral |
| Broche 147 | RK4 — GPIO/programmable peripheral |
| Broche 148 | RK5 — GPIO/programmable peripheral |
| Broche 149 | RK6 — GPIO/programmable peripheral |
| Broche 150 | RK7 — GPIO/programmable peripheral |
| Broche 151 | RK8 — GPIO/programmable peripheral |
| Broche 152 | RK9 — GPIO/programmable peripheral |
| Broche 153 | RK10 — GPIO/programmable peripheral |
| Broche 154 | RK11 — GPIO/programmable peripheral |
| Broche 155 | VSS — Ground reference |
| Broche 156 | VDD — Core supply voltage |
| Broche 157 | DDR_DQ0 — DDR2 data lane bit 0 |
| Broche 158 | DDR_DQ1 — DDR2 data lane bit 1 |
| Broche 159 | DDR_DQ2 — DDR2 data lane bit 2 |
| Broche 160 | DDR_DQ3 — DDR2 data lane bit 3 |
| Broche 161 | DDR_DQ4 — DDR2 data lane bit 4 |
| Broche 162 | DDR_DQ5 — DDR2 data lane bit 5 |
| Broche 163 | DDR_DQ6 — DDR2 data lane bit 6 |
| Broche 164 | DDR_DQ7 — DDR2 data lane bit 7 |
| Broche 165 | DDR_DQS — DDR2 data strobe |
| Broche 166 | DDR_DQM — DDR2 data mask |
| Broche 167 | DDR_CLK — DDR2 clock pair |
| Broche 168 | DDR_CLK_N — DDR2 clock complement |
| Broche 169 | DDR_A0 — DDR2 address bit 0 |
| Broche 170 | DDR_A1 — DDR2 address bit 1 |
| Broche 171 | DDR_A2 — DDR2 address bit 2 |
| Broche 172 | DDR_BA0 — DDR2 bank address 0 |
| Broche 173 | DDR_BA1 — DDR2 bank address 1 |
| Broche 174 | DDR_CS_N — DDR2 chip select (active low) |
| Broche 175 | DDR_ODT — DDR2 on-die termination control |
| Broche 176 | DDR_VREF — DDR2 reference voltage |
Applications typiques
PIC32MZ2064DAK176-V/2J convient pour 7 applications: Industrial Human-Machine Interface (HMI), Point-of-Sale (POS) Terminal, Medical Patient Monitor Display, Smart Home Control Panel, Automotive Infotainment Display, Industrial IoT Edge Controller, Test and Measurement Instrumentation.
Industrial Human-Machine Interface (HMI)
The PIC32MZ2064DAK176-V/2J is purpose-built for industrial HMI panels because its integrated Graphics Controller plus DDR2 controller fit up to the xHV system architecture. With 2MB Flash holding graphical assets and 640KB SRAM caching rendered frames, the part drives 480x272 to 1024x600 color TFTs while leaving MIPS bandwidth for PLC input handling. Place at the user-interface subsystem; unlike an MPU-plus-discrete-graphics-MCU pair, this single-chip solution reduces BOM cost and PCB area. Trade-off consideration: the -40C to +105C V temperature grade supports outdoor and factory-floor enclosures without derating.
Recommandé
Point-of-Sale (POS) Terminal
The PIC32MZ2064DAK176-V/2J fits POS terminals because its 200 MHz microAptiv core and integrated Graphics Controller render transaction screens, advertisements, and signature-capture UIs in real time. With 2MB Flash holding fonts, logos, and 240x320 icon sets, plus 640KB SRAM caching active screens, the device meets the 200ms response budget typical of customer-facing retail UX. Place at the display subsystem alongside an external touch controller; unlike a discrete MCU plus LCD controller design, this part eliminates one chip and one bus interface, reducing PCB area by approximately 30%.
Recommandé
Medical Patient Monitor Display
The PIC32MZ2064DAK176-V/2J suits medical patient monitors because the 200 MHz MIPS32 microAptiv core plus hardware 2D graphics controller renders waveforms and alarm screens at the 30 fps rate required for ECG and SpO2 displays. With 2MB Flash holding multilingual UI assets and 640KB SRAM handling live waveform buffers, the device meets IEC 60601-1-2 EMI requirements when properly laid out. Place between the analog front-end and the LCD panel; unlike a Cortex-Mac driver, this part's hardware alpha blending and color gradients deliver anti-aliased medical-grade typography without taxing the CPU.
Recommandé
Smart Home Control Panel
The PIC32MZ2064DAK176-V/2J drives wall-mount smart home control panels because the integrated Graphics Controller accelerates the round-rectangle dashboards, scene icons, and live-camera thumbnails typical of home automation UIs. With 640KB SRAM caching live camera frames and 2MB Flash holding automation logic and graphics assets, the part supports Wi-Fi/BLE co-processor attachment through UART/SPI for cloud connectivity. Place at the central display subsystem; unlike a host-CPU plus graphics-IC pair, the part consolidates control and graphics in one chip, reducing total BOM and PCB layer count.
Recommandé
Automotive Infotainment Display
The PIC32MZ2064DAK176-V/2J can drive automotive infotainment cluster displays because the 200 MHz microAptiv core plus integrated 2D Graphics Controller renders HVAC controls, audio player screens, and vehicle telemetry at the 30-60 fps rate required for automotive cluster UX. With 640KB SRAM caching live vehicle data and 2MB Flash holding graphical assets, the part exposes dual CAN 2.0b interfaces for direct vehicle bus attachment. Place at the cluster display subsystem; unlike a discrete MCU plus external GPU pair, the integrated solution fits a -40C to +105C operating window with adequate headroom.
Recommandé
Industrial IoT Edge Controller
The PIC32MZ2064DAK176-V/2J fits industrial IoT edge controllers because the 200 MHz MIPS core plus integrated Graphics Controller renders local HMI while running MQTT and OPC-UA protocol stacks. With 2MB Flash holding TLS certificates, web-server assets, and protocol stacks, plus 640KB SRAM caching TLS session state, the part supports 10/100 Ethernet MAC for direct factory-floor attachment. Place at the gateway/edge HMI subsystem; unlike a Linux MPU plus RTOS MCU pair, this single-chip solution reduces BOM cost and boot time while retaining deterministic real-time control.
Recommandé
Test and Measurement Instrumentation
The PIC32MZ2064DAK176-V/2J suits bench-top test instruments because the integrated Graphics Controller renders waveform displays, menus, and measurement tables at the high frame rate required for oscilloscope-like UX. With 12-bit ADC plus 640KB SRAM caching acquisition buffers, the device acquires analog signals and renders the result on the local TFT without taxing the CPU. Place at the instrument display subsystem; unlike a discrete MCU plus external frame-buffer design, this part integrates acquisition, processing, and graphics, simplifying PCB layout to four layers in many cases.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2064DAK176-V/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2064DAK176T-V/2J | PIC32MZ2064DAK176T-I/2J | PIC32MZ2025DAK176-V/2J | PIC32MZ2025DAK176T-V/2J | PIC32MZ1064DAK176-V/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) |
| SRAM | 640 KB | 640 KB | 640 KB | 256 KB (-60%) | 256 KB (-60%) | 640 KB |
| Operating Temperature | -40C to +105C (V) | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +105C (V) | -40C to +105C (V) |
| Packaging Form | Tray (/2J) | Tape-and-Reel (T) | Tape-and-Reel (T) | Tray (/2J) | Tape-and-Reel (T) | Tray (/2J) |
| Integrated Graphics Controller | Yes | Yes | Yes | Yes | Yes | Yes |
| DDR2 Controller | On-chip | On-chip | On-chip | On-chip | On-chip | On-chip |
Principaux différenciateurs
- Highest SRAM in 176-LQFP PIC32MZ DAK family (vs PIC32MZ2025DAK176-V/2J)
- Full 2 MB Flash for graphical asset storage (vs PIC32MZ1064DAK176-V/2J)
- V temperature grade for industrial installations (vs PIC32MZ2064DAK176T-I/2J)
- Tray packaging for low-volume prototyping (vs PIC32MZ2064DAK176T-V/2J)
Notes de conception
The 176-pin LQFP package has 0.5 mm lead pitch and 20x20 mm body. Use a 4-layer PCB with continuous power and ground planes, with the top and bottom layers reserved for signals and a dedicated ground layer for return currents. Place 100 nF decoupling capacitors within 2 mm of every VDD pin and 4.7 uF bulk capacitors near the supply entry. DDR2 byte lanes require matched-length routing (within 50 mil of group) and 50-ohm single-ended impedance per JEDEC DDR2 standards. The 12-bit ADC traces must be kept away from DDR2 switching signals to avoid digital-noise coupling.
Estimated: At 200 MHz full operation with DDR2 active and graphics engine busy, core power consumption is approximately 700 mW from a 1.8V supply. With the 176-LQFP theta_JA of approximately 35 C/W (typical), the junction temperature rises about 24.5 C above ambient. At 105 C ambient (-V grade), the junction reaches approximately 130 C, exceeding reliability targets. Recommend attaching a copper-pour heatsink of at least 2 square centimeters on top of the package and ensuring 100 CFM airflow in industrial installations. This estimate assumes typical 7 NAND region activity and must be validated against actual measurement.
Do not exceed DDR2 interface clock rate above 133 MHz without proper VTT termination (split or discrete regulator). The microAptiv core has a 32 KB instruction cache that must be invalidated after peripheral remapping through PPS (Peripheral Pin Select). Programming interface pins (TRS, NVMCTRL) must be accessible for in-circuit programming - do not route them to high-impedance peripherals. VREF+ must be driven from a low-impedance source if ADC is in use, not directly from VDD. Graphics Controller interrupts share with other peripherals - prioritize in the interrupt service routine when running high-frame-rate displays.
Power sequencing requires the 1.8V core supply to ramp before the 3.3V I/O supply. Use a Microchip-supplied power sequencer or an external supervisor with 50 ms delay. Total system power at full graphics + DDR2 + Ethernet load is approximately 1.5W; a switching regulator is recommended over a linear regulator for thermal reasons. Place a ferrite bead between analog 3.3V (AVDD) and digital 3.3V (DVDD) domains to prevent digital switching noise from coupling into ADC measurements. The DDR2 VTT termination supply must sink and source current and requires a dedicated regulator or split-termination scheme.