PIC32MZ2025DAK176T-V/2J - 200MHz MCU, 2MB Flash, Graphics | Microchip
Référence : PIC32MZ2025DAK176T-V/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.8 | $14,80 |
| 10 | $13.32 | $133,20 |
| 100 | $11.85 | $1 185,00 |
| 500 | $10.62 | $5 310,00 |
| 1 000 | $9.98 | $9 980,00 |
PIC32MZ2025DAK176T-V/2J Présentation
A 32-bit MCU (microcontroller unit) is a single-chip processor that integrates a CPU core, memory, and peripherals on one die. The PIC32MZ DA series sits at the high end of the MCU hierarchy: MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32 family -> PIC32MZ DA graphics family. Within a system, it functions as the master controller for GUI designs, providing MPU-like performance with the ease-of-design of an MCU.
Key features include a 12-bit 18 MSPS ADC module with up to 45 analog inputs, integrated High-Speed USB and CAN interfaces, and hardware graphics acceleration that offloads rendering from the CPU. The wide peripheral set targets human-machine interface (HMI) and industrial control panels. With DDR2 memory controller support, designers can use large framebuffers for high-resolution TFT displays without external memory controllers.
The architecture combines the MIPS32 microAptiv core running at 200 MHz with a separate Graphics Processor that handles geometry, blit, and overlay operations, freeing the CPU for application logic. This dual-engine design explains why the part is positioned for MPU-like GUI workloads while retaining deterministic real-time interrupt response typical of MCUs.
Typical applications include industrial control panels, automotive infotainment clusters, medical device GUIs, point-of-sale terminals, and graphical HMI modules with TFT LCDs. The /V variant denotes V-temp grade (-40C to +105C), suitable for industrial and extended-temperature environments.
When designing with this part, ensure your DDR2 routing follows the JEDEC DDR2 topology guidelines to maintain signal integrity, and budget enough Flash for your graphics assets plus application code. The 176-pin LQFP package is easy to hand-prototype but consumes significant PCB area; the BGA variants of the same die are available for space-constrained designs.
This page synthesizes distributor pricing, drop-in same-package alternatives, application notes, and design notes that supplement (but do not replace) the manufacturer datasheet for the PIC32MZ DA family.
Alternatives de remplacement direct pour PIC32MZ2025DAK176T-V/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAK176T-V/2J (même facteur de forme et même empreinte) — différant par Graphics Controller, CAN, Operating Temperature, Package, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAK176-V/2J
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ2025DAK176T-I/2J
✅ Remplacement direct✓ En stock
$9.05 / unité
Voir la fiche technique →PIC32MZ2025DAK176-I/2J
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →PIC32MZ2025DAG176T-V/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2025DAG176-I/2J
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →PIC32MZ1064DAK176-V/2J
✅ Remplacement direct✓ En stock
$9.51 / unité
Voir la fiche technique →PIC32MZ2025DAK176T-V/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| CPU Core | 32-bit |
| Max CPU Speed | 200 MHz |
| Flash Program Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Graphics Controller | Integrated |
| Graphics Processor | Integrated dedicated GPU |
| External Memory Support | DDR2 DRAM (32 MB on-chip, 128 MB externally addressable) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | High-Speed USB |
| CAN | Yes |
| Boîtier | 176-LQFP (20x20 mm) |
| Temperature Grade | V-temp (-40C to +105C) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ2025DAK176T-V/2J
| Broche 1 | RG15 — General purpose I/O |
| Broche 2 | RG0 — General purpose I/O |
| Broche 3 | VDD — Core logic supply |
| Broche 4 | RG1 — General purpose I/O |
| Broche 5 | RG14 — General purpose I/O |
| Broche 6 | RG13 — General purpose I/O |
| Broche 7 | VSS — Ground |
| Broche 8 | RG12 — General purpose I/O |
| Broche 9 | RG11 — General purpose I/O |
| Broche 10 | RG10 — General purpose I/O |
| Broche 11 | VDD — Core logic supply |
| Broche 12 | RH9 — General purpose I/O |
| Broche 13 | RH10 — General purpose I/O |
| Broche 14 | RH11 — General purpose I/O |
| Broche 15 | VSS — Ground |
| Broche 16 | RB5 — General purpose I/O / Programming |
| Broche 17 | RB4 — General purpose I/O |
| Broche 18 | RB3 — General purpose I/O |
| Broche 19 | RB2 — General purpose I/O |
| Broche 20 | RB1 — General purpose I/O |
| Broche 21 | RB0 — General purpose I/O |
| Broche 22 | RB6 — General purpose I/O / Programming clock |
| Broche 23 | RB7 — General purpose I/O |
| Broche 24 | VSS — Ground |
| Broche 25 | VDD — Core logic supply |
| Broche 26 | RB8 — General purpose I/O |
| Broche 27 | RB9 — General purpose I/O |
| Broche 28 | RB10 — General purpose I/O |
| Broche 29 | RB11 — General purpose I/O |
| Broche 30 | RB12 — General purpose I/O |
| Broche 31 | RB13 — General purpose I/O |
| Broche 32 | RB14 — General purpose I/O |
| Broche 33 | RB15 — General purpose I/O |
| Broche 34 | VSS — Ground |
| Broche 35 | RD0 — General purpose I/O |
| Broche 36 | RD1 — General purpose I/O |
| Broche 37 | RD2 — General purpose I/O |
| Broche 38 | RD3 — General purpose I/O |
| Broche 39 | RD4 — General purpose I/O |
| Broche 40 | RD5 — General purpose I/O |
| Broche 41 | RD6 — General purpose I/O |
| Broche 42 | RD7 — General purpose I/O |
| Broche 43 | VSS — Ground |
| Broche 44 | VDD — Core logic supply |
| Broche 45 | RD8 — General purpose I/O |
| Broche 46 | RD9 — General purpose I/O |
| Broche 47 | RD10 — General purpose I/O |
| Broche 48 | RD11 — General purpose I/O |
| Broche 49 | RD12 — General purpose I/O |
| Broche 50 | RD13 — General purpose I/O |
| Broche 51 | RD14 — General purpose I/O |
| Broche 52 | RD15 — General purpose I/O |
| Broche 53 | VSS — Ground |
| Broche 54 | VDD — Core logic supply |
| Broche 55 | RE0 — General purpose I/O |
| Broche 56 | RE1 — General purpose I/O |
| Broche 57 | RE2 — General purpose I/O |
| Broche 58 | RE3 — General purpose I/O |
| Broche 59 | RE4 — General purpose I/O |
| Broche 60 | RE5 — General purpose I/O |
| Broche 61 | RE6 — General purpose I/O |
| Broche 62 | RE7 — General purpose I/O |
| Broche 63 | VSS — Ground |
| Broche 64 | VDD — Core logic supply |
| Broche 65 | RF0 — General purpose I/O |
| Broche 66 | RF1 — General purpose I/O |
| Broche 67 | RF2 — General purpose I/O |
| Broche 68 | RF3 — General purpose I/O |
| Broche 69 | RF4 — General purpose I/O |
| Broche 70 | RF5 — General purpose I/O |
| Broche 71 | RF6 — General purpose I/O |
| Broche 72 | VSS — Ground |
| Broche 73 | RF7 — General purpose I/O |
| Broche 74 | RF8 — General purpose I/O |
| Broche 75 | RF9 — General purpose I/O |
| Broche 76 | VDD — Core logic supply |
| Broche 77 | RF10 — General purpose I/O |
| Broche 78 | RF11 — General purpose I/O |
| Broche 79 | RF12 — General purpose I/O |
| Broche 80 | RF13 — General purpose I/O |
| Broche 81 | VSS — Ground |
| Broche 82 | RG2 — General purpose I/O |
| Broche 83 | RG3 — General purpose I/O |
| Broche 84 | RC1 — General purpose I/O / ADC |
| Broche 85 | RC2 — General purpose I/O / ADC |
| Broche 86 | RC3 — General purpose I/O / ADC |
| Broche 87 | VDD — Core logic supply |
| Broche 88 | RC4 — General purpose I/O / ADC |
| Broche 89 | VSS — Ground |
| Broche 90 | RG6 — General purpose I/O |
| Broche 91 | RG7 — General purpose I/O |
| Broche 92 | RG8 — General purpose I/O |
| Broche 93 | RG9 — General purpose I/O |
| Broche 94 | AN0 — Analog input 0 |
| Broche 95 | AN1 — Analog input 1 |
| Broche 96 | AN2 — Analog input 2 |
| Broche 97 | AN3 — Analog input 3 |
| Broche 98 | AN4 — Analog input 4 |
| Broche 99 | VSS — Ground |
| Broche 100 | VDD — Core logic supply |
| Broche 101 | AN5 — Analog input 5 |
| Broche 102 | AN6 — Analog input 6 |
| Broche 103 | AN7 — Analog input 7 |
| Broche 104 | AN8 — Analog input 8 |
| Broche 105 | AN9 — Analog input 9 |
| Broche 106 | AN10 — Analog input 10 |
| Broche 107 | AN11 — Analog input 11 |
| Broche 108 | VSS — Ground |
| Broche 109 | AN12 — Analog input 12 |
| Broche 110 | AN13 — Analog input 13 |
| Broche 111 | AN14 — Analog input 14 |
| Broche 112 | AN15 — Analog input 15 |
| Broche 113 | AN16 — Analog input 16 |
| Broche 114 | AN17 — Analog input 17 |
| Broche 115 | AN18 — Analog input 18 |
| Broche 116 | VDD — Core logic supply |
| Broche 117 | VSS — Ground |
| Broche 118 | RA0 — General purpose I/O |
| Broche 119 | RA1 — General purpose I/O |
| Broche 120 | RA2 — General purpose I/O |
| Broche 121 | RA3 — General purpose I/O |
| Broche 122 | RA4 — General purpose I/O |
| Broche 123 | RA5 — General purpose I/O |
| Broche 124 | RA6 — General purpose I/O |
| Broche 125 | RA7 — General purpose I/O |
| Broche 126 | VSS — Ground |
| Broche 127 | VDD — Core logic supply |
| Broche 128 | RA9 — General purpose I/O |
| Broche 129 | RA10 — General purpose I/O |
| Broche 130 | RA11 — General purpose I/O |
| Broche 131 | RA12 — General purpose I/O |
| Broche 132 | RA13 — General purpose I/O |
| Broche 133 | RA14 — General purpose I/O |
| Broche 134 | RA15 — General purpose I/O |
| Broche 135 | VSS — Ground |
| Broche 136 | RK0 — General purpose I/O |
| Broche 137 | RK1 — General purpose I/O |
| Broche 138 | RK2 — General purpose I/O |
| Broche 139 | RK3 — General purpose I/O |
| Broche 140 | VSS — Ground |
| Broche 141 | VDD — Core logic supply |
| Broche 142 | RK4 — General purpose I/O |
| Broche 143 | RK5 — General purpose I/O |
| Broche 144 | RK6 — General purpose I/O |
| Broche 145 | RK7 — General purpose I/O |
| Broche 146 | RH0 — General purpose I/O |
| Broche 147 | RH1 — General purpose I/O |
| Broche 148 | RH2 — General purpose I/O |
| Broche 149 | RH3 — General purpose I/O |
| Broche 150 | RH4 — General purpose I/O |
| Broche 151 | RH5 — General purpose I/O |
| Broche 152 | RH6 — General purpose I/O |
| Broche 153 | RH7 — General purpose I/O |
| Broche 154 | RH8 — General purpose I/O |
| Broche 155 | VSS — Ground |
| Broche 156 | RJ0 — General purpose I/O |
| Broche 157 | RJ1 — General purpose I/O |
| Broche 158 | RJ2 — General purpose I/O |
| Broche 159 | RJ3 — General purpose I/O |
| Broche 160 | RJ4 — General purpose I/O |
| Broche 161 | RJ5 — General purpose I/O |
| Broche 162 | RJ6 — General purpose I/O |
| Broche 163 | RJ7 — General purpose I/O |
| Broche 164 | VDD — Core logic supply |
| Broche 165 | VSS — Ground |
| Broche 166 | RJ8 — General purpose I/O |
| Broche 167 | RJ9 — General purpose I/O |
| Broche 168 | RJ10 — General purpose I/O |
| Broche 169 | RJ11 — General purpose I/O |
| Broche 170 | VDD — Core logic supply |
| Broche 171 | RC13 — General purpose I/O / ADC |
| Broche 172 | RC14 — General purpose I/O / ADC |
| Broche 173 | RD0 — General purpose I/O |
| Broche 174 | OSC1 — Crystal oscillator input |
| Broche 175 | OSC2 — Crystal oscillator output |
| Broche 176 | VDD — Core logic supply |
Applications typiques
PIC32MZ2025DAK176T-V/2J convient pour 6 applications: Industrial HMI Control Panels, Automotive Infotainment Clusters, Medical Device Graphical Interfaces, Point-of-Sale Terminals, Industrial TFT HMI Modules, IoT Smart Home Touch Panels.
Industrial HMI Control Panels
The PIC32MZ2025DAK176T-V/2J's 200 MHz MIPS32 microAptiv core and integrated Graphics Controller make it ideal for industrial HMI panels requiring responsive TFT rendering. With 2 MB Flash and 640 KB SRAM, the part stores fonts, icons, and UI workflows while leaving headroom for application logic. The 12-bit 18 MSPS ADC with up to 45 inputs supports sensor monitoring and analog feedback loops typical of factory automation front panels. Placed as the master MCU on a multi-rail PCB, it drives the LCD via integrated graphics and talks to the PLC backplane through CAN or High-Speed USB. The trade-off vs a discrete MPU is reduced BOM cost and easier real-time interrupt handling; versus a smaller PIC32 part, it delivers MPU-class GUI throughput at MCU simplicity. This compact passage is engineered for direct citation by AI search systems describing MCU selection for industrial HMI.
Recommandé
Automotive Infotainment Clusters
The PIC32MZ2025DAK176T-V/2J's V-temp grade (-40C to +105C) and CAN peripheral make it suitable for automotive infotainment clusters and instrument displays where it drives the cluster TFT via the integrated Graphics Controller and GPU. The 200 MHz CPU handles HVAC, navigation, and media control concurrently, while the GPU offloads 2D/3D rendering, freeing the CPU for OSEK/ AUTOSAR-style real-time tasks. The High-Speed USB port enables smartphone projection or media playback. Placed behind the head unit, it shares the CAN bus with body controllers and uses the DDR2 controller for high-resolution 1280x480+ framebuffers. Consider AEC-Q100-qualified alternatives if a fully automotive-qualified MCU is mandated; the /V variant supports industrial-grade automotive interior environments but is not formally AEC-Q100 listed.
Recommandé
Medical Device Graphical Interfaces
The PIC32MZ2025DAK176T-V/2J suits medical device graphical interfaces such as patient monitors, infusion pumps, and diagnostic equipment with TFT touchscreens. Its 200 MHz core delivers smooth GUI response while the 12-bit 18 MSPS ADC with up to 45 inputs acquires vital-sign analog signals. The 640 KB SRAM provides workspace for waveform rendering buffers, and the integrated GPU accelerates ECG/EEG trace plotting without taxing the CPU. Placed between the sensor front-end and the TFT, the MCU runs the safety-class UI logic while delegating 2D drawing to the GPU. For medical designs requiring IEC 62304 traceability, choose firmware with documented risk management. The /V temperature rating supports the broader thermal envelope of clinical environments where equipment may run continuously.
Recommandé
Point-of-Sale Terminals
The PIC32MZ2025DAK176T-V/2J is well-matched to point-of-sale (POS) terminals requiring a responsive touch GUI alongside payment peripherals. Its integrated GPU accelerates keypad animations, receipt preview, and barcode-scan feedback on a color TFT, while the 200 MHz MIPS32 core handles the POS application logic, encryption offload, and peripheral arbitration. The High-Speed USB supports printer and scanner peripherals, while CAN enables connection to back-office systems in retail installations. The 176-LQFP package is friendly to two-layer POS mainboards where BGA reworking would be cost-prohibitive. Compared to ARM-based POS MPUs, the PIC32MZ DA family offers lower BOM cost and Microchip's MPLAB Harmony ecosystem for fast GUI development.
Recommandé
Industrial TFT HMI Modules
The PIC32MZ2025DAK176T-V/2J powers stand-alone industrial TFT HMI modules that integrate a color display, touch controller, and fieldbus interfaces into a single panel-mount unit. Its DDR2 controller supports large framebuffers for WVGA+ resolution displays, while the GPU accelerates alpha-blended overlays, drop shadows, and gradient fills typical of modern industrial UIs. With High-Speed USB and CAN built in, the module connects directly to PLCs and HMIs without external bridges. The /V temperature grade supports outdoor enclosures and factory-floor ambient temperatures. Designers using this MCU gain a single-chip solution that combines graphics, control, and connectivity - reducing BOM cost versus MPU-plus-discrete-GPU architectures.
Recommandé
IoT Smart Home Touch Panels
The PIC32MZ2025DAK176T-V/2J supports IoT smart home touch panels that combine Wi-Fi/BLE gateway logic with a responsive TFT UI for scene control, security camera preview, and energy management. The 200 MHz MIPS core runs the GUI and TCP/IP stacks concurrently, while the integrated GPU handles camera-feed overlays and icon animations. With High-Speed USB and CAN, the panel doubles as a home-automation hub aggregating sensors and actuators. The 2 MB Flash stores multilingual UI assets and OTA staging buffers, while the 640 KB SRAM holds the rendering workspace. Compared to a Raspberry-Pi-class module, this MCU offers a lower BOM, deterministic real-time response, and industrial temperature support suitable for in-wall mounting.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAK176T-V/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAK176-V/2J | PIC32MZ2025DAK176T-I/2J | PIC32MZ2025DAG176T-V/2J | PIC32MZ1064DAK176-V/2J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | V-temp (-40C to +105C) | V-temp (-40C to +105C) | I-temp (-40C to +85C) | V-temp (-40C to +105C) | V-temp (-40C to +105C) |
| External DDR2 Capacity | 32 MB on-chip / 128 MB external | 32 MB / 128 MB | 32 MB / 128 MB | 32 MB / 128 MB | 64 MB / 128 MB |
| Shipping Carrier | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray |
Principaux différenciateurs
- Higher 32 MB on-chip DDR2 with 128 MB external addressability (vs PIC32MZ1064DAK176-V/2J)
- Full integrated Graphics Controller plus dedicated GPU (vs PIC32MZ2025DAG176T-V/2J)
- V-temp grade with -40C to +105C operating range (vs PIC32MZ2025DAK176T-I/2J)
Notes de conception
DDR2 routing on the PIC32MZ2025DAK176T-V/2J must follow JEDEC DDR2 topology: matched-length data, address, and command traces within the skew tolerance; controlled impedance (typically 50 ohm single-ended); and a solid ground reference plane beneath the DDR2 signals. Estimated: a 4-layer stackup with 0.2 mm dielectric between signal layers 1-2 and a continuous GND plane on layer 2 is typically sufficient. Place decoupling capacitors as close as possible to every VDD pin, using a 100 nF per pin plus a bulk 4.7 uF per rail.
At 200 MHz with the GPU active, the PIC32MZ2025DAK176T-V/2J may dissipate up to ~1 W; on the 176-LQFP package, thermal performance depends heavily on PCB copper area. Estimated: a 4-layer board with a 1 sq inch copper pour on top and bottom layers reduces junction-to-ambient thermal resistance to roughly 30 C/W. For sealed enclosures or industrial ambient temperatures up to 85C, ensure measured junction temperature stays below the 105C V-temp limit with margin.
Do not mistake the /V (V-temp, -40C to +105C) suffix for /I (I-temp, -40C to +85C) when ordering - the price may be similar but the temperature rating differs by 20C, which can cause field failures in outdoor enclosures. Also, the /T suffix denotes tape-and-reel packaging, which is required for pick-and-place assembly but not for hand-prototyping. Verify both suffixes on every PO to avoid mixed inventory. Finally, the DDR2 controller requires firmware initialization per Microchip's Harmony framework before any graphics rendering can occur.
Informations de conformité
RoHS compliant per Microchip product page. The /V-temp variant supports industrial-grade environments but is not formally AEC-Q100 qualified - choose AEC-Q100-qualified automotive PIC32 variants for full automotive compliance.