RTAX2000D-1CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip
Référence : RTAX2000D-1CQ352E ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4650 | $4 650,00 |
| 10 | $4400 | $44 000,00 |
| 100 | $4150 | $415 000,00 |
| 500 | $3900 | $1 950 000,00 |
| 1 000 | $3650 | $3 650 000,00 |
RTAX2000D-1CQ352E Présentation
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of orbital and deep-space missions, where commercial devices would suffer total ionizing dose (TID) degradation and single-event effects. Within the power-management and processing hierarchy of a spacecraft avionics system, an FPGA such as the RTAX2000D sits between the onboard computer and sensor/interface electronics, implementing glue logic, bus interfaces, and high-throughput datapath functions.
Key features include highly reliable nonvolatile antifuse technology, which retains its programmed configuration permanently and eliminates configuration-memory upset, and a DSP-rich architecture with up to 120 DSP mathblocks supporting 125 MHz 18-bit x 18-bit multiply-accumulate operations. Embedded memory extends to 540 kbits with optional EDAC protection, mitigating single-event upsets in on-chip SRAM.
The RTAX2000D is a digital CMOS device based on the commercial Axcelerator architecture, with the radiation-tolerant RT variant distinguished by screening of ICCA current limits at 125C final electrical test. TID performance is 300 krad (functional) and 200 krad (per the RTAX-DSP family characterization), enabling multi-year missions in medium Earth orbit and beyond.
Typical applications include spacecraft command and data handling, payload processing and sensor-data formatting, and telecommunications payload beam-forming, where the DSP mathblocks accelerate filtering and FFT workloads.
Design consideration: antifuse FPGAs are one-time-programmable; prototypes should be validated on commercial Axcelerator Extender boards before flight-unit programming.
This page synthesizes distributor sourcing data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour RTAX2000D-1CQ352E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTAX2000D-1CQ352E (même facteur de forme et même empreinte) — différant par Package, Technology, Family, Logic Cells, Equivalent System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTAX2000D-CQ352E
✅ Remplacement direct✓ En stock
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Voir la fiche technique →RTAX2000D-1CQ352V
✅ Remplacement direct✓ En stock
$3950 / unité
Voir la fiche technique →RTAX2000DL-1CQ352E
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$2300 / unité
Voir la fiche technique →RTAX2000DL-CQ352E
✅ Remplacement direct✓ En stock
$3360 / unité
Voir la fiche technique →RTAX2000D-CQ352B
✅ Remplacement direct✓ En stock
$3100 / unité
Voir la fiche technique →RTAX4000D-1CQ352B
✅ Remplacement direct✓ En stock
$2600 / unité
Voir la fiche technique →RTAX4000D-CQ352B
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX2000D-1CQ352E Valeurs maximales et caractéristiques électriques
| Equivalent System Gates | 2000000 gates |
| Logic Organization | 19712 CLBs |
| Technology | Digital CMOS FPGA, antifuse (nonvolatile) |
| Boîtier | CQFP352 (352-terminal Ceramic Quad Flat Pack) |
| Plage de température de fonctionnement | -55C to +125C |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Total Ionizing Dose (Functional) | 300 krad |
| Total Ionizing Dose (Rated) | 200 krad |
| DSP Mathblocks | Up to 120 |
| DSP MAC Performance | 125 MHz, 18-bit x 18-bit multiply-accumulate |
| Embedded Memory | Up to 540 kbits with optional EDAC protection |
| Programmability | One-time programmable (antifuse) |
| Radiation Environment Target | Space-based applications |
| Commercial Prototype Equivalent | Axcelerator family device |
Guide de configuration des broches du RTAX2000D-1CQ352E cqfp352 (352-terminal ceramic quad flat pack)
Configuration des broches du RTAX2000D-1CQ352E (boîtier cqfp352 (352-terminal ceramic quad flat pack)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RTAX2000D-1CQ352E.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RTAX2000D-1CQ352E convient pour 6 applications: Spacecraft Command and Data Handling, Payload Signal Processing, Satellite Telecommunications Payloads, Instrumentation and Sensor Data Formatting, Avionics Bus Bridging and Glue Logic, Launch Vehicle and Missile Electronics.
Spacecraft Command and Data Handling
The RTAX2000D-1CQ352E fits spacecraft command and data handling (C&DH) subsystems because its 2,000,000-gate capacity and 19,712 CLBs implement telemetry formatting, command decoders, and MIL-STD-1553 or SpaceWire interfaces while its antifuse configuration is immune to SEU-driven configuration corruption. In a typical architecture, the FPGA sits between the onboard computer and the telemetry/telecommand front end, using the 540 kbits of EDAC-protected embedded memory for packet buffering and FIFO control. The -55C to +125C ceramic CQFP352 package survives launch vibration and orbital thermal cycling, and the 300 krad functional TID rating supports multi-year LEO and MEO missions without shielding redesign.
Recommandé
Payload Signal Processing
For payload digital signal processing, the RTAX2000D-1CQ352E offers up to 120 DSP mathblocks executing 18-bit x 18-bit multiply-accumulate operations at 125 MHz, delivering tens of GMACs-class fixed-point throughput for FIR filtering, FFT pre-processing, and correlation on the ground-station downlink chain. The RTAX-DSP subfamily integrates these mathblocks directly into the fabric alongside 19,712 CLBs, so datapath and control logic coexist on one rad-tolerant die, eliminating external DSP glue logic. Because the antifuse fabric is nonvolatile, the processing pipeline powers up instantly at eclipse exit without configuration reload, a decisive advantage over SRAM FPGAs in timing-critical payload sequencers.
Recommandé
Satellite Telecommunications Payloads
The RTAX2000D-1CQ352E serves communications-satellite transponder and beam-forming electronics, where its DSP mathblocks perform digital down-conversion, channel filtering, and beam-weight multiply-accumulate at 125 MHz clock rates. The chip-wide highway routing and segmentable clocks of the RTAX family let designers partition independent carrier channels onto one die, while EDAC-protected SRAM stores channel maps and filter coefficients safely against single-event upsets. The CQFP352 ceramic package with 352 terminals provides the guarded, testable interconnect preferred in high-rel payload boards, and the 200 krad rated / 300 krad functional TID performance covers typical GEO 15-year mission dose requirements with standard margin.
Recommandé
Instrumentation and Sensor Data Formatting
Scientific instruments on orbital platforms use the RTAX2000D-1CQ352E as the sensor-interface FPGA, conditioning high-rate ADC streams, timestamping events, and packing data frames into downlink formats. Its 19,712 CLBs absorb custom serial interfaces (LVDS deserialization, SPI sensor buses) while the 540 kbits embedded memory with EDAC buffers frames between acquisition bursts, and carry logic accelerates histogramming and accumulations. The nonvolatile antifuse configuration guarantees that the instrument's acquisition logic is active from the first power cycle after integration - critical for instruments that cannot tolerate a configuration-upload step during launch-mode sequencing or autonomous safe-mode recovery operations in orbit.
Recommandé
Avionics Bus Bridging and Glue Logic
In spacecraft avionics, the RTAX2000D-1CQ352E consolidates legacy discrete glue logic - address decoders, bus bridges, interrupt controllers, and power-sequencing state machines - into one radiation-tolerant, one-time-programmable device. Consolidation reduces parts count, board area, and the reliability math burden of hundreds of 54-series high-rel parts. The segmentable clock structure allows independent clock domains for a slow housekeeping domain and a fast telemetry domain on the same die, and the chip-wide highway routing simplifies cross-domain register access. The extended -55C to +125C rating covers cold-case eclipse operations of unheated avionics bays without derating the timing budget.
Recommandé
Launch Vehicle and Missile Electronics
Launch-vehicle flight computers and stage-separation controllers leverage the RTAX2000D-1CQ352E's combination of immediate power-up, radiation tolerance for transient radiation environments, and -55C to +125C operation across the external tank and high-altitude thermal profile. The antifuse fabric withstands vibration-induced lead fatigue concerns through the rugged 352-terminal ceramic quad flat pack with solder-column attachment options, per the Microsemi package notes. Deterministic, non-reconfigurable logic is often mandated for safety-critical flight termination and sequencing functions because it cannot be altered by an SEU-induced configuration upset, making the RTAX-DSP antifuse architecture a natural compliance choice for range-safety electronics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTAX2000D-1CQ352E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTAX2000D-CQ352E | RTAX2000DL-1CQ352E | RTAX4000D-1CQ352B |
|---|---|---|---|---|
| Package | CQFP352 | CQFP352 - same | CQFP352 - same | CQFP352 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2000000 gates | 2000000 gates | 2000000 gates | approx. 4000000 gates |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Screening Flow | E suffix (extended screening), speed grade 1 | E suffix flow, no speed-grade-1 marking | DL flow, ICCA limit screened at 125C | B suffix flow, speed grade 1 |
| TID Tolerance | 300 krad functional / 200 krad rated | 300 krad functional / 200 krad rated | 300 krad functional / 200 krad rated | 300 krad functional / 200 krad rated |
Principaux différenciateurs
- DSP mathblock architecture for signal processing (vs RTAX2000S-1CG1152V)
- Same-footprint density upgrade path (vs RTAX4000D-1CQ352B)
- Tighter current screening with DL variant (vs RTAX2000DL-1CQ352E)
Notes de conception
The RTAX2000D-1CQ352E is one-time programmable antifuse silicon. Never program a flight unit with an unverified design. Follow the Microchip documented flow: target the equivalent commercial Axcelerator device first, validate on Extender circuit boards (which map the commercial package to the RTAX-S footprint), then freeze the bitstream before programming the flight part. Per the RTAX-S/SL datasheet, RTAX-D and RTAX-DL share the same silicon and are distinguished only by ICCA current-limit screening at 125C final electrical test, so ordering the wrong flow suffix cannot be corrected after programming.
Obtain per-program supply current data at your clock rate and utilization from the RTAX-S/SL and RTAX-DSP datasheet power estimation guidance; dynamic power in antifuse fabric scales with clock frequency and toggling activity, and the DL flow exists specifically because ICCA current limits are screened at 125C. Size the primary supply rails with margin for worst-case current at -55C cold start, and sequence power rails per the datasheet power-up requirements to avoid latch-up during radiation environments. Estimated: budgets should include a 20-30% guard band on ICCA for flight screening acceptance.
The CQFP352 ceramic package requires careful land-pattern and solder-column design: per the Microsemi package documentation, only QA electrical and mechanical visual inspection are performed after solder column attachment, so the board assembler owns the joint-quality process. Use symmetric ground/power planes under the package, place 0.1 uF decoupling capacitors at each supply pin pair as close to the CQFP leads as possible, and route high-speed I/O with controlled impedance. The 352 perimeter leads complicate rework - verify lead coplanarity before mounting to avoid bridging on the dense 0.5 mm-class lead pitch.
Informations de conformité
Space-grade hermetic ceramic CQFP package; compliance declarations (RoHS/REACH exemptions for high-rel aerospace) must be obtained from Microchip documentation for this specific flow. Not an AEC-Q100 automotive device.
