RTAX2000D-1CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip
MPN: RTAX2000D-1CQ352E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4650 | $4,650.00 |
| 10 | $4400 | $44,000.00 |
| 100 | $4150 | $415,000.00 |
| 500 | $3900 | $1,950,000.00 |
| 1,000 | $3650 | $3,650,000.00 |
Drop-in alternatives for RTAX2000D-1CQ352E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX2000D-CQ352E
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →RTAX2000D-1CQ352V
✅ Drop-In✓ In Stock
$3950 / Unit
View Datasheet →RTAX2000DL-1CQ352E
✅ Drop-In✓ In Stock
$2300 / Unit
View Datasheet →RTAX2000DL-CQ352E
✅ Drop-In✓ In Stock
$3360 / Unit
View Datasheet →RTAX2000D-CQ352B
✅ Drop-In✓ In Stock
$3100 / Unit
View Datasheet →RTAX4000D-1CQ352B
✅ Drop-In✓ In Stock
$2600 / Unit
View Datasheet →RTAX4000D-CQ352B
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →RTAX2000D-1CQ352E Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 2000000 gates |
| Logic Organization | 19712 CLBs |
| Technology | Digital CMOS FPGA, antifuse (nonvolatile) |
| Package | CQFP352 (352-terminal Ceramic Quad Flat Pack) |
| Operating Temperature Range | -55C to +125C |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Total Ionizing Dose (Functional) | 300 krad |
| Total Ionizing Dose (Rated) | 200 krad |
| DSP Mathblocks | Up to 120 |
| DSP MAC Performance | 125 MHz, 18-bit x 18-bit multiply-accumulate |
| Embedded Memory | Up to 540 kbits with optional EDAC protection |
| Programmability | One-time programmable (antifuse) |
| Radiation Environment Target | Space-based applications |
| Commercial Prototype Equivalent | Axcelerator family device |
RTAX2000D-1CQ352E cqfp352 (352-terminal ceramic quad flat pack) Pin Configuration Guide
Complete pinout information for RTAX2000D-1CQ352E (cqfp352 (352-terminal ceramic quad flat pack) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000D-1CQ352E.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000D-1CQ352E is suitable for 6 applications: Spacecraft Command and Data Handling, Payload Signal Processing, Satellite Telecommunications Payloads, Instrumentation and Sensor Data Formatting, Avionics Bus Bridging and Glue Logic, Launch Vehicle and Missile Electronics.
Spacecraft Command and Data Handling
The RTAX2000D-1CQ352E fits spacecraft command and data handling (C&DH) subsystems because its 2,000,000-gate capacity and 19,712 CLBs implement telemetry formatting, command decoders, and MIL-STD-1553 or SpaceWire interfaces while its antifuse configuration is immune to SEU-driven configuration corruption. In a typical architecture, the FPGA sits between the onboard computer and the telemetry/telecommand front end, using the 540 kbits of EDAC-protected embedded memory for packet buffering and FIFO control. The -55C to +125C ceramic CQFP352 package survives launch vibration and orbital thermal cycling, and the 300 krad functional TID rating supports multi-year LEO and MEO missions without shielding redesign.
Recommended
Payload Signal Processing
For payload digital signal processing, the RTAX2000D-1CQ352E offers up to 120 DSP mathblocks executing 18-bit x 18-bit multiply-accumulate operations at 125 MHz, delivering tens of GMACs-class fixed-point throughput for FIR filtering, FFT pre-processing, and correlation on the ground-station downlink chain. The RTAX-DSP subfamily integrates these mathblocks directly into the fabric alongside 19,712 CLBs, so datapath and control logic coexist on one rad-tolerant die, eliminating external DSP glue logic. Because the antifuse fabric is nonvolatile, the processing pipeline powers up instantly at eclipse exit without configuration reload, a decisive advantage over SRAM FPGAs in timing-critical payload sequencers.
Recommended
Satellite Telecommunications Payloads
The RTAX2000D-1CQ352E serves communications-satellite transponder and beam-forming electronics, where its DSP mathblocks perform digital down-conversion, channel filtering, and beam-weight multiply-accumulate at 125 MHz clock rates. The chip-wide highway routing and segmentable clocks of the RTAX family let designers partition independent carrier channels onto one die, while EDAC-protected SRAM stores channel maps and filter coefficients safely against single-event upsets. The CQFP352 ceramic package with 352 terminals provides the guarded, testable interconnect preferred in high-rel payload boards, and the 200 krad rated / 300 krad functional TID performance covers typical GEO 15-year mission dose requirements with standard margin.
Recommended
Instrumentation and Sensor Data Formatting
Scientific instruments on orbital platforms use the RTAX2000D-1CQ352E as the sensor-interface FPGA, conditioning high-rate ADC streams, timestamping events, and packing data frames into downlink formats. Its 19,712 CLBs absorb custom serial interfaces (LVDS deserialization, SPI sensor buses) while the 540 kbits embedded memory with EDAC buffers frames between acquisition bursts, and carry logic accelerates histogramming and accumulations. The nonvolatile antifuse configuration guarantees that the instrument's acquisition logic is active from the first power cycle after integration - critical for instruments that cannot tolerate a configuration-upload step during launch-mode sequencing or autonomous safe-mode recovery operations in orbit.
Recommended
Avionics Bus Bridging and Glue Logic
In spacecraft avionics, the RTAX2000D-1CQ352E consolidates legacy discrete glue logic - address decoders, bus bridges, interrupt controllers, and power-sequencing state machines - into one radiation-tolerant, one-time-programmable device. Consolidation reduces parts count, board area, and the reliability math burden of hundreds of 54-series high-rel parts. The segmentable clock structure allows independent clock domains for a slow housekeeping domain and a fast telemetry domain on the same die, and the chip-wide highway routing simplifies cross-domain register access. The extended -55C to +125C rating covers cold-case eclipse operations of unheated avionics bays without derating the timing budget.
Recommended
Launch Vehicle and Missile Electronics
Launch-vehicle flight computers and stage-separation controllers leverage the RTAX2000D-1CQ352E's combination of immediate power-up, radiation tolerance for transient radiation environments, and -55C to +125C operation across the external tank and high-altitude thermal profile. The antifuse fabric withstands vibration-induced lead fatigue concerns through the rugged 352-terminal ceramic quad flat pack with solder-column attachment options, per the Microsemi package notes. Deterministic, non-reconfigurable logic is often mandated for safety-critical flight termination and sequencing functions because it cannot be altered by an SEU-induced configuration upset, making the RTAX-DSP antifuse architecture a natural compliance choice for range-safety electronics.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000D-1CQ352E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000D-CQ352E | RTAX2000DL-1CQ352E | RTAX4000D-1CQ352B |
|---|---|---|---|---|
| Package | CQFP352 | CQFP352 - same | CQFP352 - same | CQFP352 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2000000 gates | 2000000 gates | 2000000 gates | approx. 4000000 gates |
| Logic Blocks (CLBs) | 19712 | 19712 | 19712 | [DATA_NEEDED] |
| User I/O Terminals | [DATA_NEEDED] | [DATA_NEEDED] | 166 in / 166 out | [DATA_NEEDED] |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Screening Flow | E suffix (extended screening), speed grade 1 | E suffix flow, no speed-grade-1 marking | DL flow, ICCA limit screened at 125C | B suffix flow, speed grade 1 |
| TID Tolerance | 300 krad functional / 200 krad rated | 300 krad functional / 200 krad rated | 300 krad functional / 200 krad rated | 300 krad functional / 200 krad rated |
Key Differentiators
- DSP mathblock architecture for signal processing (vs RTAX2000S-1CG1152V)
- Same-footprint density upgrade path (vs RTAX4000D-1CQ352B)
- Tighter current screening with DL variant (vs RTAX2000DL-1CQ352E)
Design Notes
The RTAX2000D-1CQ352E is one-time programmable antifuse silicon. Never program a flight unit with an unverified design. Follow the Microchip documented flow: target the equivalent commercial Axcelerator device first, validate on Extender circuit boards (which map the commercial package to the RTAX-S footprint), then freeze the bitstream before programming the flight part. Per the RTAX-S/SL datasheet, RTAX-D and RTAX-DL share the same silicon and are distinguished only by ICCA current-limit screening at 125C final electrical test, so ordering the wrong flow suffix cannot be corrected after programming.
Obtain per-program supply current data at your clock rate and utilization from the RTAX-S/SL and RTAX-DSP datasheet power estimation guidance; dynamic power in antifuse fabric scales with clock frequency and toggling activity, and the DL flow exists specifically because ICCA current limits are screened at 125C. Size the primary supply rails with margin for worst-case current at -55C cold start, and sequence power rails per the datasheet power-up requirements to avoid latch-up during radiation environments. Estimated: budgets should include a 20-30% guard band on ICCA for flight screening acceptance.
The CQFP352 ceramic package requires careful land-pattern and solder-column design: per the Microsemi package documentation, only QA electrical and mechanical visual inspection are performed after solder column attachment, so the board assembler owns the joint-quality process. Use symmetric ground/power planes under the package, place 0.1 uF decoupling capacitors at each supply pin pair as close to the CQFP leads as possible, and route high-speed I/O with controlled impedance. The 352 perimeter leads complicate rework - verify lead coplanarity before mounting to avoid bridging on the dense 0.5 mm-class lead pitch.
Compliance Information
Space-grade hermetic ceramic CQFP package; compliance declarations (RoHS/REACH exemptions for high-rel aerospace) must be obtained from Microchip documentation for this specific flow. Not an AEC-Q100 automotive device.
