RTAX4000S-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
Référence : RTAX4000S-1CQ352V ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
RTAX4000S-1CQ352V Présentation
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space, including total ionizing dose (TID) and single-event effects (SEE), where commercial FPGAs would fail or accumulate configuration errors. Within the power hierarchy of space electronics, it sits at the digital payload level, below radiation-hardened ASICs in cost but above COTS devices in reliability, making it the workhorse programmable logic device for spaceflight systems.
Key features include the largest density of the RTAX-S family at 4 million system gates, live-at-power-up operation enabled by antifuse one-time-programmable (OTP) configuration technology, a true single-chip form factor that eliminates external configuration memory, and embedded SRAM blocks with built-in FIFO control logic for on-chip buffering.
Architecturally, the RTAX4000S is based on the commercial Axcelerator family fabric, providing segmentable clocks, chip-wide highway routing, and high-performance interconnect. The antifuse fabric is immune to configuration upset from single-event latchup in the configuration store, a decisive advantage over SRAM-based FPGAs in orbit.
Typical applications include satellite payload data processing, spacecraft bus control and telemetry, image processing for Earth-observation instruments, and communications transponder logic in LEO, MEO, and GEO missions.
A key design consideration is that antifuse devices are one-time programmable: prototype on the equivalent commercial Axcelerator device using the documented Microchip prototyping flow before committing hardware.
This page synthesizes distributor sourcing data, drop-in family alternatives, and practical space-design notes not consolidated in the manufacturer datasheet. Pricing and availability are quoted-on-request due to the space-grade nature of this device, as of 2026-09-01.
Alternatives de remplacement direct pour RTAX4000S-1CQ352V — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTAX4000S-1CQ352V (même facteur de forme et même empreinte) — différant par Package, Family, Radiation Tolerance, Configuration, Logic Cells.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTAX4000S-1CQ352EV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
RTAX4000SL-CQ352E
✅ Remplacement direct✓ En stock
$2620 / unité
Voir la fiche technique →RTAX4000SL-CQ352E
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2620 / unité
Voir la fiche technique →RTAX4000S-CQ352
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
RTAX4000SL-1CQ352
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
RTAX4000S-1CQ352V Valeurs maximales et caractéristiques électriques
| Equivalent System Gates | 4,000,000 gates |
| Logic Cells | 60,480 |
| Combinational Logic Blocks (CLBs) | 40,320 |
| User I/Os | 166 |
| Configuration Technology | Antifuse (OTP), live at power-up |
| Radiation Tolerance | Radiation-tolerant (RTAX-S family, space-flight grade) |
| Family | RTAX-S/SL and RTAX-DSP |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Speed Grade | -1 |
| Boîtier | CQ352 (352-pin ceramic quad flat package) |
| Type de montage | Surface Mount |
| Operating Temperature Min | -55 C |
| Operating Temperature Max | +125 C |
| Process Technology | CMOS |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Typical Applications | Space-flight systems, satellites |
Guide de configuration des broches du RTAX4000S-1CQ352V cq352 (352-pin ceramic quad flat package)
Configuration des broches du RTAX4000S-1CQ352V (boîtier cq352 (352-pin ceramic quad flat package)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RTAX4000S-1CQ352V.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RTAX4000S-1CQ352V convient pour 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Earth-Observation Image Processing, Communications Transponder Logic, Launch Vehicle and Avionics Digital Logic, Instrument Control and Data Acquisition.
Satellite Payload Data Processing
The RTAX4000S-1CQ352V fits payload data processing because its 4,000,000 equivalent system gates and 60,480 logic cells provide the largest RTAX-S family density, enough for framing, compression pre-processing, and packetization of high-rate instrument data. The 166 user I/Os and embedded SRAM blocks with built-in FIFO control logic support wide data-path interfaces and on-chip buffering without external memory. Placed between the payload sensor chain and the downlink formatter, the antifuse fabric is live at power-up with no boot delay, eliminating a cold-start failure mode in orbit, while its radiation-tolerant qualification addresses total ionizing dose and single-event effects over the mission lifetime.
Recommandé
Spacecraft Bus Control and Telemetry
For spacecraft bus control, the RTAX4000S-1CQ352V implements command decoders, telemetry encoders, mode state machines, and watchdog logic with deterministic timing. Its live-at-power-up antifuse configuration means the bus controller FPGA is functional the instant solar-array power arrives, with no configuration memory to corrupt under single-event upset - a decisive advantage over SRAM FPGAs in this safety-critical role. The -55C to +125C operating range covers eclipse-to-sunlit thermal swings on unheated bus boards, and the ceramic CQ352 package withstands launch vibration and thermal cycling. Segmentable clocks allow independent timing domains for the RTU, telemetry FIFO, and safety logic on one chip.
Recommandé
Earth-Observation Image Processing
Imaging payloads for Earth observation benefit directly from the RTAX4000S-1CQ352V's 40,320 CLBs, which implement correlation, dark-level correction, defect mapping, and CCSDS-compliant data formatting pipelines at sensor line rates. Embedded SRAM with FIFO control logic buffers line data between the image sensor front end and the compression stage without external SRAM parts that would add board area and radiation-sensitive devices. The chip-wide highway routing sustains the wide parallel buses typical of CCD/CMOS sensor interfaces, and the 166 user I/Os support multi-bank sensor connectivity. Radiation tolerance protects mission-critical image chains from single-event functional interrupts during high-radiation passes.
Recommandé
Communications Transponder Logic
In satellite communications transponders, the RTAX4000S-1CQ352V implements framing/deframing, scramblers, forward-error-correction interfacing, and baseband glue logic. The high-performance Axcelerator-derived fabric delivers the routing speed needed for wide parallel baseband data paths, while segmentable clocks isolate the transmit and receive chains to minimize clock-domain crossings. Because transponders operate continuously for the mission life, the antifuse fabric's immunity to configuration upset and the -55C to +125C temperature range are essential reliability features. The single-chip form factor also removes external configuration PROMs from the RF-adjacent board, reducing both area and failure points near sensitive circuitry.
Recommandé
Launch Vehicle and Avionics Digital Logic
Launch-vehicle avionics require logic that is guaranteed functional at power application and stable under severe vibration and thermal stress - exactly the profile of the RTAX4000S-1CQ352V. The ceramic CQ352 package with surface-mount attachment withstands launch loads, and the -55C to +125C range accommodates unconditioned avionics bays. The FPGA implements flight-event sequencing, redundancy voting, and discrete I/O handling across its 166 user I/Os. Its radiation-tolerant design also covers high-altitude radiation exposure for suborbital trajectories. Designers typically verify the logic on the commercial Axcelerator equivalent via Microchip's documented prototyping flow before committing one-time-programmable flight parts.
Recommandé
Instrument Control and Data Acquisition
Science instruments - spectrometers, particle detectors, and star trackers - use the RTAX4000S-1CQ352V as the central acquisition controller, timestamping events, histogramming detector hits, and streaming science data over the spacecraft bus. The 4M-gate fabric accommodates deep counters and on-chip SRAM FIFOs, while live-at-power-up antifuse configuration guarantees acquisition readiness at instrument turn-on, critical for short-duration observation windows. Radiation tolerance prevents data corruption from single-event effects during high-fluence segments of the orbit. The segmentable clock structure lets each instrument sub-function - detector timing, buffer control, bus interface - run on independent, well-controlled clock domains on the same ceramic-packaged chip.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTAX4000S-1CQ352V — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTAX4000S-1CQ352EV | RTAX4000SL-CQ352E | RTAX4000S-CQ352 | RTAX4000SL-1CQ352 |
|---|---|---|---|---|---|
| Package | CQ352 (352-pin ceramic QFP) | CQ352 - same | CQ352 - same | CQ352 - same | CQ352 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microsemi / Microchip Technology | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 (SL variant) | 4,000,000 | 4,000,000 (SL variant) |
| Logic Cells | 60,480 | 60,480 | 60,480 | 60,480 | 60,480 |
| Configuration Technology | Antifuse OTP, live at power-up | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
| Screening / Order Suffix | V (flight, extended temp) | EV (evaluation/engineering) | E (SL family, extended) | Standard (non-extended) | SL, -1 speed grade, standard |
Principaux différenciateurs
- Largest RTAX-S density in the CQ352 footprint (vs RTAX4000SL-CQ352E)
- Flight screening suffix V vs EV (vs RTAX4000S-1CQ352EV)
- Antifuse OTP live-at-power-up configuration (vs Commercial Axcelerator SRAM FPGAs)
Notes de conception
RTAX-S devices use antifuse one-time-programmable technology - a programmed flight part cannot be reworked. Microchip's documented prototyping flow lets you target the equivalent commercial Axcelerator device first, using Extender circuit boards that map the commercial package onto the RTAX-S package footprint. Complete full timing simulation and hardware verification on the commercial device before programming any RTAX4000S-1CQ352V flight unit, and order one spare die per program milestone.
Plan power rails according to the RTAX-S/SL datasheet banking and core supply requirements before layout; space power budgets are tight and the 4M-gate fabric draws more current than lower-density family members. Estimate core current from your actual utilization of the 60,480 logic cells rather than worst-case full-fabric figures, and verify startup inrush against the live-at-power-up behavior of the antifuse fabric, which needs no configuration current draw.
The ceramic CQ352 package is a 352-lead ceramic QFP intended for surface-mount attachment; confirm your assembly house supports ceramic-package soldering profiles and lead-coplanarity inspection, which are common trip points for boards built with space-grade ceramic QFPs. Provide generous thermal relief and support the package corners mechanically, since ceramic packages are heavier than plastic QFPs and more sensitive to board flex during launch vibration.
With 166 user I/Os available, group I/O banks by voltage standard and keep wide payload buses on contiguous banks to preserve timing. Use series termination on high-speed output banks and review the datasheet I/O banking tables before pin assignment; changing banks after layout on an OTP device is costly because board respins and flight-part reprogramming both carry long lead times.
Informations de conformité
Space-grade ceramic-package device; compliance declarations are typically provided per program documentation. Consult Microchip for the current RoHS/REACH statement for this MPN.
