RTAX4000S-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX4000S-1CQ352V ✓ Active| Qty | Unit Price | Extended |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for RTAX4000S-1CQ352V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX4000S-1CQ352EV
✅ Drop-In📋 Reference alternative (not in catalog)
RTAX4000SL-CQ352E
✅ Drop-In✓ In Stock
$2620 / Unit
View Datasheet →RTAX4000SL-CQ352E
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2620 / Unit
View Datasheet →RTAX4000S-CQ352
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
RTAX4000SL-1CQ352
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
RTAX4000S-1CQ352V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 4,000,000 gates |
| Logic Cells | 60,480 |
| Combinational Logic Blocks (CLBs) | 40,320 |
| User I/Os | 166 |
| Configuration Technology | Antifuse (OTP), live at power-up |
| Radiation Tolerance | Radiation-tolerant (RTAX-S family, space-flight grade) |
| Family | RTAX-S/SL and RTAX-DSP |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Speed Grade | -1 |
| Package | CQ352 (352-pin ceramic quad flat package) |
| Mounting Type | Surface Mount |
| Operating Temperature Min | -55 C |
| Operating Temperature Max | +125 C |
| Process Technology | CMOS |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Typical Applications | Space-flight systems, satellites |
RTAX4000S-1CQ352V cq352 (352-pin ceramic quad flat package) Pin Configuration Guide
Complete pinout information for RTAX4000S-1CQ352V (cq352 (352-pin ceramic quad flat package) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000S-1CQ352V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000S-1CQ352V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Earth-Observation Image Processing, Communications Transponder Logic, Launch Vehicle and Avionics Digital Logic, Instrument Control and Data Acquisition.
Satellite Payload Data Processing
The RTAX4000S-1CQ352V fits payload data processing because its 4,000,000 equivalent system gates and 60,480 logic cells provide the largest RTAX-S family density, enough for framing, compression pre-processing, and packetization of high-rate instrument data. The 166 user I/Os and embedded SRAM blocks with built-in FIFO control logic support wide data-path interfaces and on-chip buffering without external memory. Placed between the payload sensor chain and the downlink formatter, the antifuse fabric is live at power-up with no boot delay, eliminating a cold-start failure mode in orbit, while its radiation-tolerant qualification addresses total ionizing dose and single-event effects over the mission lifetime.
Recommended
Spacecraft Bus Control and Telemetry
For spacecraft bus control, the RTAX4000S-1CQ352V implements command decoders, telemetry encoders, mode state machines, and watchdog logic with deterministic timing. Its live-at-power-up antifuse configuration means the bus controller FPGA is functional the instant solar-array power arrives, with no configuration memory to corrupt under single-event upset - a decisive advantage over SRAM FPGAs in this safety-critical role. The -55C to +125C operating range covers eclipse-to-sunlit thermal swings on unheated bus boards, and the ceramic CQ352 package withstands launch vibration and thermal cycling. Segmentable clocks allow independent timing domains for the RTU, telemetry FIFO, and safety logic on one chip.
Recommended
Earth-Observation Image Processing
Imaging payloads for Earth observation benefit directly from the RTAX4000S-1CQ352V's 40,320 CLBs, which implement correlation, dark-level correction, defect mapping, and CCSDS-compliant data formatting pipelines at sensor line rates. Embedded SRAM with FIFO control logic buffers line data between the image sensor front end and the compression stage without external SRAM parts that would add board area and radiation-sensitive devices. The chip-wide highway routing sustains the wide parallel buses typical of CCD/CMOS sensor interfaces, and the 166 user I/Os support multi-bank sensor connectivity. Radiation tolerance protects mission-critical image chains from single-event functional interrupts during high-radiation passes.
Recommended
Communications Transponder Logic
In satellite communications transponders, the RTAX4000S-1CQ352V implements framing/deframing, scramblers, forward-error-correction interfacing, and baseband glue logic. The high-performance Axcelerator-derived fabric delivers the routing speed needed for wide parallel baseband data paths, while segmentable clocks isolate the transmit and receive chains to minimize clock-domain crossings. Because transponders operate continuously for the mission life, the antifuse fabric's immunity to configuration upset and the -55C to +125C temperature range are essential reliability features. The single-chip form factor also removes external configuration PROMs from the RF-adjacent board, reducing both area and failure points near sensitive circuitry.
Recommended
Launch Vehicle and Avionics Digital Logic
Launch-vehicle avionics require logic that is guaranteed functional at power application and stable under severe vibration and thermal stress - exactly the profile of the RTAX4000S-1CQ352V. The ceramic CQ352 package with surface-mount attachment withstands launch loads, and the -55C to +125C range accommodates unconditioned avionics bays. The FPGA implements flight-event sequencing, redundancy voting, and discrete I/O handling across its 166 user I/Os. Its radiation-tolerant design also covers high-altitude radiation exposure for suborbital trajectories. Designers typically verify the logic on the commercial Axcelerator equivalent via Microchip's documented prototyping flow before committing one-time-programmable flight parts.
Recommended
Instrument Control and Data Acquisition
Science instruments - spectrometers, particle detectors, and star trackers - use the RTAX4000S-1CQ352V as the central acquisition controller, timestamping events, histogramming detector hits, and streaming science data over the spacecraft bus. The 4M-gate fabric accommodates deep counters and on-chip SRAM FIFOs, while live-at-power-up antifuse configuration guarantees acquisition readiness at instrument turn-on, critical for short-duration observation windows. Radiation tolerance prevents data corruption from single-event effects during high-fluence segments of the orbit. The segmentable clock structure lets each instrument sub-function - detector timing, buffer control, bus interface - run on independent, well-controlled clock domains on the same ceramic-packaged chip.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000S-1CQ352V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000S-1CQ352EV | RTAX4000SL-CQ352E | RTAX4000S-CQ352 | RTAX4000SL-1CQ352 |
|---|---|---|---|---|---|
| Package | CQ352 (352-pin ceramic QFP) | CQ352 - same | CQ352 - same | CQ352 - same | CQ352 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microsemi / Microchip Technology | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 (SL variant) | 4,000,000 | 4,000,000 (SL variant) |
| Logic Cells | 60,480 | 60,480 | 60,480 | 60,480 | 60,480 |
| User I/Os | 166 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | -55C to +125C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Configuration Technology | Antifuse OTP, live at power-up | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
| Screening / Order Suffix | V (flight, extended temp) | EV (evaluation/engineering) | E (SL family, extended) | Standard (non-extended) | SL, -1 speed grade, standard |
Key Differentiators
- Largest RTAX-S density in the CQ352 footprint (vs RTAX4000SL-CQ352E)
- Flight screening suffix V vs EV (vs RTAX4000S-1CQ352EV)
- Antifuse OTP live-at-power-up configuration (vs Commercial Axcelerator SRAM FPGAs)
Design Notes
RTAX-S devices use antifuse one-time-programmable technology - a programmed flight part cannot be reworked. Microchip's documented prototyping flow lets you target the equivalent commercial Axcelerator device first, using Extender circuit boards that map the commercial package onto the RTAX-S package footprint. Complete full timing simulation and hardware verification on the commercial device before programming any RTAX4000S-1CQ352V flight unit, and order one spare die per program milestone.
Plan power rails according to the RTAX-S/SL datasheet banking and core supply requirements before layout; space power budgets are tight and the 4M-gate fabric draws more current than lower-density family members. Estimate core current from your actual utilization of the 60,480 logic cells rather than worst-case full-fabric figures, and verify startup inrush against the live-at-power-up behavior of the antifuse fabric, which needs no configuration current draw.
The ceramic CQ352 package is a 352-lead ceramic QFP intended for surface-mount attachment; confirm your assembly house supports ceramic-package soldering profiles and lead-coplanarity inspection, which are common trip points for boards built with space-grade ceramic QFPs. Provide generous thermal relief and support the package corners mechanically, since ceramic packages are heavier than plastic QFPs and more sensitive to board flex during launch vibration.
With 166 user I/Os available, group I/O banks by voltage standard and keep wide payload buses on contiguous banks to preserve timing. Use series termination on high-speed output banks and review the datasheet I/O banking tables before pin assignment; changing banks after layout on an OTP device is costly because board respins and flight-part reprogramming both carry long lead times.
Compliance Information
Space-grade ceramic-package device; compliance declarations are typically provided per program documentation. Consult Microchip for the current RoHS/REACH statement for this MPN.
