S9S08AW32E5MPUE - Automotive 8-bit MCU, 32KB Flash, 40MHz | NXP
Référence : S9S08AW32E5MPUE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.8 | $6,80 |
| 10 | $6.18 | $61,80 |
| 100 | $5.32 | $532,00 |
| 500 | $4.85 | $2 425,00 |
| 1 000 | $4.4 | $4 400,00 |
| 3 000 | $3.95 | $11 850,00 |
S9S08AW32E5MPUE Présentation
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and peripherals on a single die. The S08 family sits within NXP's broader HCS08 product hierarchy: HCS08 family -> S08 core -> AWx sub-family -> specific device (AW32). These MCUs are designed for cost-sensitive, deterministic real-time control where 32-bit performance is overkill but 4-bit too limited. Compared to discrete logic, an 8-bit MCU consolidates timing, decision logic, and peripheral control into one reprogrammable device, reducing PCB area and BOM cost.
Key features of the S9S08AW32E5MPUE include its 32KB Flash program memory (32K x 8), 2KB SRAM, an enhanced S08 core with the standard HCS08 instruction set, on-chip peripherals LVD (Low-Voltage Detect), POR (Power-On Reset), PWM, and WDT (Watchdog Timer), plus connectivity through I2C, SCI (UART), and SPI buses. The -40C to +125C operating range and automotive qualification ("E5" suffix) make this MCU well suited for under-hood and chassis ECUs that must endure harsh thermal and electrical environments.
Architecturally, the S9S08AW32 uses NXP's S08 enhanced core with up to 40 MHz internal bus speed, internal Flash with security features, and an integrated clock module with an internal oscillator option. The wide operating voltage typically supports 2.7V-5.5V operation, allowing direct connection to 5V automotive rails without additional level shifting.
Typical applications include automotive body and chassis controllers, HVAC control modules, instrument cluster sub-processors, industrial sensor interface boards, and low-end CAN/LIN slave nodes. The 54 I/O count is particularly well matched to multi-switch and multi-LED front-panel interfaces.
When designing with this device, allocate adequate decoupling (100 nF + bulk) close to the VDD pins, configure the watchdog timer for safety-critical loops, and verify that the operating voltage range covers cold-crank and load-dump transients common in 12V automotive systems.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour S9S08AW32E5MPUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S08AW32E5MPUE (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Communication Interfaces, Core, Program Memory Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08AW60CPUE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S08AW32CPUE
✅ Remplacement direct✓ En stock
$6.1 / unité
Voir la fiche technique →MC9S08AW48CPUE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S9S08AW32E5MPUE
✅ Remplacement direct✓ En stock
$3.95 / unité
Voir la fiche technique →S9S08AW32E5MPUE Valeurs maximales et caractéristiques électriques
| Core | HCS08 S08 (enhanced 8-bit) |
| Core Size | 8-bit |
| Fréquence d'horloge maximale | 40 MHz |
| Program Memory Size | 32 KB (32K x 8) Flash |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O Pins | 54 |
| Boîtier / Format | 64-LQFP (10x10 mm) |
| Style de montage | SMD/SMT |
| Plage de température de fonctionnement | -40C to +125C |
| Connectivity | I2C, SCI (UART), SPI |
| On-chip Peripherals | LVD, POR, PWM, WDT |
| Oscillator Type | Internal/External (per datasheet) |
| Series | S08 / MC9S08AW |
| Qualification | Automotive (E5 suffix) |
| EEPROM Size | Not available on this variant |
| Largeur du bus de données | 8-bit |
| Statut RoHS | Compliant |
Configuration des broches de S9S08AW32E5MPUE
| Broche 1 | PTA0 — General-purpose I/O / TCLK0 |
| Broche 2 | PTA1 — General-purpose I/O |
| Broche 3 | PTA2 — General-purpose I/O |
| Broche 4 | PTA3 — General-purpose I/O |
| Broche 5 | PTA4 — General-purpose I/O / BKGD |
| Broche 6 | PTA5 — General-purpose I/O / RESET_b |
| Broche 7 | PTA6 — General-purpose I/O |
| Broche 8 | PTA7 — General-purpose I/O |
| Broche 9 | PTB0 — General-purpose I/O / AD0 |
| Broche 10 | PTB1 — General-purpose I/O / AD1 |
| Broche 11 | VDD — Power supply (2.7V-5.5V per datasheet) |
| Broche 12 | VSS — Ground |
| Broche 13 | PTB2 — General-purpose I/O / AD2 |
| Broche 14 | PTB3 — General-purpose I/O / AD3 |
| Broche 15 | PTB4 — General-purpose I/O / AD4 |
| Broche 16 | PTB5 — General-purpose I/O / AD5 |
| Broche 17 | PTB6 — General-purpose I/O / AD6 |
| Broche 18 | PTB7 — General-purpose I/O / AD7 |
| Broche 19 | PTC0 — General-purpose I/O / SDA |
| Broche 20 | PTC1 — General-purpose I/O / SCL |
| Broche 21 | PTC2 — General-purpose I/O / TxD |
| Broche 22 | PTC3 — General-purpose I/O / RxD |
| Broche 23 | PTC4 — General-purpose I/O / MOSI |
| Broche 24 | PTC5 — General-purpose I/O / MISO |
| Broche 25 | PTC6 — General-purpose I/O / SPSCK |
| Broche 26 | PTC7 — General-purpose I/O / SS_b |
| Broche 27 | PTD0 — General-purpose I/O |
| Broche 28 | PTD1 — General-purpose I/O |
| Broche 29 | PTD2 — General-purpose I/O / PWM0 |
| Broche 30 | PTD3 — General-purpose I/O / PWM1 |
| Broche 31 | PTD4 — General-purpose I/O / PWM2 |
| Broche 32 | PTD5 — General-purpose I/O / PWM3 |
| Broche 33 | PTD6 — General-purpose I/O / PWM4 |
| Broche 34 | PTD7 — General-purpose I/O / PWM5 |
| Broche 35 | PTE0 — General-purpose I/O / TCLK1 |
| Broche 36 | PTE1 — General-purpose I/O |
| Broche 37 | PTE2 — General-purpose I/O |
| Broche 38 | PTE3 — General-purpose I/O |
| Broche 39 | PTE4 — General-purpose I/O |
| Broche 40 | PTE5 — General-purpose I/O |
| Broche 41 | PTE6 — General-purpose I/O |
| Broche 42 | PTE7 — General-purpose I/O |
| Broche 43 | PTF0 — General-purpose I/O |
| Broche 44 | PTF1 — General-purpose I/O |
| Broche 45 | PTF2 — General-purpose I/O |
| Broche 46 | PTF3 — General-purpose I/O |
| Broche 47 | PTF4 — General-purpose I/O |
| Broche 48 | PTF5 — General-purpose I/O |
| Broche 49 | PTF6 — General-purpose I/O |
| Broche 50 | PTF7 — General-purpose I/O |
| Broche 51 | PTG0 — General-purpose I/O |
| Broche 52 | PTG1 — General-purpose I/O |
| Broche 53 | PTG2 — General-purpose I/O |
| Broche 54 | PTG3 — General-purpose I/O |
| Broche 55 | VDD — Power supply |
| Broche 56 | VSS — Ground |
| Broche 57 | PTG4 — General-purpose I/O |
| Broche 58 | PTG5 — General-purpose I/O |
| Broche 59 | PTG6 — General-purpose I/O |
| Broche 60 | PTG7 — General-purpose I/O |
| Broche 61 | PTH0 — General-purpose I/O |
| Broche 62 | PTH1 — General-purpose I/O |
| Broche 63 | OSC1 — Crystal oscillator input (or NC on internal clock) |
| Broche 64 | OSC2 — Crystal oscillator output (or NC on internal clock) |
Applications typiques
S9S08AW32E5MPUE convient pour 6 applications: Automotive Body Control Module, HVAC Control Module, Instrument Cluster Sub-Processor, Industrial Sensor Interface Board, Low-End LIN Slave Node, Battery-Management Slave Monitor.
Automotive Body Control Module
The S9S08AW32E5MPUE fits automotive body controllers managing door locks, exterior lighting, wiper control, and accessory switching. Its 54 GPIO pins comfortably handle the multi-switch and multi-load front-panel interface, while the 32KB Flash stores state machines and LED dimming curves. AEC-Q100 E5 qualification across -40C to +125C survives under-cab and cabin thermal stress. The integrated PWM timers drive LED tail-lamps and motor loads with no extra timer ICs, and the SCI/UART links to a CAN transceiver for chassis bus communication. With 2KB RAM the firmware can buffer diagnostic snapshots in RAM while waiting for Flash writes. This part replaces MC9S08AW32CPUE in -40C/-125C builds without PCB change.
Recommandé
HVAC Control Module
Climate-control ECUs benefit from the S9S08AW32E5MPUE's 54 I/O count for driving multiple stepper motors, reading cabin temperature sensors via ADC, and switching blower speeds through PWM. The 32KB Flash accommodates PID control loops, sensor linearization tables, and diagnostics, while 2KB RAM buffers real-time sensor samples. -40C to +125C thermal range handles engine-compartment adjacent mounting. The integrated LVD and POR ensure clean resets during cranking transients when battery voltage dips below 6V. SPI links to a temperature/pressure sensor front-end and I2C connects to the dashboard display controller. Replace MC9S08AW60CPUE family members with this part when 32KB code size suffices.
Recommandé
Instrument Cluster Sub-Processor
Cluster ECUs benefit from the S9S08AW32E5MPUE handling switch-matrix scanning, telltale LED dimming via PWM, and stepper gauge drives. Its 54 GPIOs easily handle 30+ switch inputs and 20+ indicator outputs, freeing the main cluster MCU to render displays. AEC-Q100 E5 qualification satisfies instrument-panel thermal stress; the SCI/UART interface streams gauge positions to the main graphics MCU. The watchdog timer protects against firmware lockups in safety-relevant telltale functions. Code size of 32KB covers configuration tables and gauge calibration. Use the same AW32 family firmware across platform variants, scaling to MC9S08AW32CPUE for non-automotive variants.
Recommandé
Industrial Sensor Interface Board
PLC I/O modules and process-sensor front-ends benefit from the S9S08AW32E5MPUE's industrial -40C to +125C operating range and 32KB Flash for protocol stacks like Modbus RTU or simple IO-Link. The 54 I/O lines can scan multiple 24V industrial inputs with optocoupler isolation interfaces, and the PWM module can drive analog output conditioning. I2C/SPI/SCI provide multiple host-side connectivity. The S08 core offers deterministic interrupt latency for time-critical industrial control loops. Use MC9S08AW32CPUE for cost-down non-automotive variants; both share the same 64-LQFP footprint.
Recommandé
Low-End LIN Slave Node
The S9S08AW32E5MPUE fits LIN-bus slave nodes in comfort systems like seat controls, mirror adjusters, and roof modules. Its SCI (UART) interface drives a LIN transceiver (such as MC33662) at 19.2 kbps, while the 32KB Flash stores node-configuration, diagnostics, and actuator control laws. AEC-Q100 E5 qualification and 54 GPIO drive multiple motor outputs directly. The watchdog timer meets LIN conformance requirements for slave-node supervision. With 2KB RAM, the slave holds update frames and diagnostic snapshot data. Use MC9S08AW60CPUE where larger firmware needs arise.
Recommandé
Battery-Management Slave Monitor
Cell-monitoring boards in 12V/48V battery stacks can use the S9S08AW32E5MPUE to read analog cell voltages, broadcast via SPI to a master BMS controller, and run balancing via PWM. AEC-Q100 E5 thermal range handles battery-pack locations near engine compartments. The 32KB Flash fits battery-state algorithms, fault logging, and SOC calibration tables. The 54 I/O can monitor 12+ cell voltages through external multiplexers. SCI links to an MCU gateway or CAN gateway. The LVD and POR ensure clean cold-crank operation; watchdog timer resets on firmware lockups in safety-critical monitoring.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S08AW32E5MPUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08AW60CPUE | MC9S08AW32CPUE | MC9S08AW48CPUE | MC9S08LL36CLK |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 80-LQFP - different |
| Program Flash Memory | 32 KB | 60 KB | 32 KB | 48 KB | 36 KB |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 1.5 KB |
| Core Speed | 40 MHz (S08) | 40 MHz (S08) | 40 MHz (S08) | 40 MHz (S08) | 40 MHz (S08) |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +85C (Commercial) | -40C to +85C (Commercial) | -40C to +85C (Commercial) | -40C to +125C |
| Number of I/O | 54 | 54 | 54 | 54 | 55 |
| AEC-Q100 Qualification | Yes (E5 grade) | No (commercial) | No (commercial) | No (commercial) | Yes (automotive variants) |
| Connectivity | I2C, SCI (UART), SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI |
Principaux différenciateurs
- Automotive E5 grade qualification (vs MC9S08AW32CPUE)
- Larger Flash headroom without footprint change (vs MC9S08AW32CPUE)
- Lowest-cost entry into S08AW family (vs MC9S08AW60CPUE / MC9S08AW48CPUE)
Notes de conception
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin pair (the device has multiple VDD/VSS pairs across the 64-LQFP). Add a bulk 4.7-10 uF tantalum or aluminum-polymer capacitor on the main 5V rail to absorb cold-crank transients in automotive designs. Per the S9S08AW32 datasheet, supply voltage tolerance allows direct connection to 12V battery rails through a 5V regulator with adequate headroom.
Estimated: at full 40 MHz operation with all peripherals active, S08 core current consumption is in the 25-35 mA range, giving dissipation around 150 mW at 5V; the 64-LQFP theta_JA is approximately 60 C/W, resulting in a junction-to-ambient rise of 9-12 C. This is well within the 125 C automotive limit. For best thermal margin in enclosed enclosures, provide a copper pour under the exposed pad area and stitch thermal vias to inner ground planes.
Do not confuse S9S08AW32E5MPUE (automotive E5) with MC9S08AW32CPUE (commercial): the package suffix MPUE vs CPUE is the visual differentiator, but the temperature-range difference (125 C vs 85 C) is critical for AEC-Q100 designs. Always verify the temperature suffix on the shipping label before mounting. Use the BackGround Debug Mode (BKGD/MS) pin for in-circuit programming; ensure the BKGD resistor divider matches the recommended 4.7k/10k values for reliable ISP operation.
Route the external crystal traces (OSC1/OSC2) symmetrically and shield them with a ground guard ring if the design is noise-sensitive. Keep high-speed switching signals (PWM outputs) away from analog inputs to avoid coupling. The 0.5 mm LQFP lead pitch requires careful solder-paste stencil design - typically a 4-mil-thick stencil with aperture reductions to prevent solder bridging between adjacent pins during reflow.
Informations de conformité
AEC-Q100 Grade 1 (E5 suffix) per NXP S08 family product markings. RoHS and REACH compliant per DigiKey product listing. Halogen-free per NXP product page.