NXP Semiconductors

S912XEG128J2VAAR - 16-bit 50MHz 128KB Flash MCU | NXP | Automotive

Référence : S912XEG128J2VAAR ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.8 V (typical core) Vdss 80-QFP (14x14 mm) Package 50 MHz Speed 128 KB (128K x 8) Memory
À partir de $10.05 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-18
Tarifs dégressifs
Qté Prix unitaire Total
1 $14.9 $14,90
10 $13.85 $138,50
100 $12.4 $1 240,00
500 $11.2 $5 600,00
1 000 $10.05 $10 050,00
ℹ️ Tous les prix sont en USD

S912XEG128J2VAAR Présentation

The NXP S912XEG128J2VAAR is a 16-bit HCS12X microcontroller (MCU) delivering 50 MHz core performance with 128 KB of on-chip Flash program memory and 80-pin QFP (14x14 mm) packaging, qualified for automotive temperature grades (-40°C to +105°C). Built on the S12X core architecture, this device combines a 16-bit data path with peripheral co-processors for deterministic CAN, SCI, SPI, I²C, and PWM control, and integrates 59 general-purpose I/O pins for mixed-signal body electronics.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and configurable peripherals such as timers, communication interfaces, and analog blocks. Within the broader electronics taxonomy, an MCU sits under microcontroller -> embedded processor -> semiconductor device. The HCS12X family extends the legacy HC12 architecture by adding a peripheral co-processor (XGATE) that offloads interrupt-driven I/O tasks from the CPU, allowing deterministic real-time responses in CAN and PWM-heavy automotive networks.

Key differentiating specifications include: 50 MHz CPU clock, 128 KB Flash, 50 ns minimum instruction cycle, on-chip LVD/POR/WDT supervision, and an extended (-40°C to +105°C) operating range. The 80-QFP package provides a low-cost plastic leaded footprint compatible with standard SMT assembly lines. The peripheral set targets body and chassis ECUs: up to 59 I/O, multiple CAN nodes (msCAN), and an enhanced capture timer suit the device for distributed in-vehicle networks.

The HCS12X core's two-stage pipeline and BGND/debug background mode are accessible through a single-wire BDM (Background Debug Mode) port, eliminating the need for a costly JTAG emulator during lab bring-up. The internal XGATE coprocessor executes data-movement and peripheral-event service routines in parallel with the CPU, freeing main-line cycles for application logic and effectively doubling throughput on interrupt-bound workloads.

Typical automotive applications include body control modules, instrument cluster slaves, HVAC controllers, and gateway/bridge nodes that aggregate CAN/LIN sub-networks. Industrial variants can be deployed in PLC I/O expanders and small-form-factor motor controllers.

When designing with this device, allocate the XGATE vector table in protected Flash and reserve at least 4 KB of RAM for stack and interrupt context to prevent overflow under heavy CAN traffic. Use the internal regulated 2.5 V core voltage to simplify power-tree design; place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pin pair.

This page synthesizes distributor stock and pricing, drop-in alternative listings, and engineering design notes that go beyond the manufacturer datasheet to help procurement and firmware teams make informed decisions.

Alternatives de remplacement direct pour S912XEG128J2VAAR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec S912XEG128J2VAAR (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Flash Memory, Core Processor, ADC Resolution.

NXP Semiconductors
Package: 80-QFP (14x14 mm), Square, Gull Wing
Operating Temperature: -40C to +125C (TA)
ADC Resolution: 10-bit, 8-channel
Comparer avec S912XEG128J2VAAR →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
Flash Memory: 384 KB (384K x 8)
Comparer avec S912XEG128J2VAAR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
Flash Memory: 256KB (256K x 8)
Comparer avec S912XEG128J2VAAR →
NXP Semiconductors
Package: 144-LQFP (LFQFP), 20x20 mm square
Operating Temperature: -40C to +105C
Flash Memory: 512 KB (512K x 8)
Comparer avec S912XEG128J2VAAR →
NXP Semiconductors
Package: 112-pin LQFP (QFP), S-PQFP-G112, square
Operating Temperature: -40C to +125C
Flash Memory: 384 KB
Comparer avec S912XEG128J2VAAR →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

S912XET512J2VAGR

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 80-QFP (14x14 mm)
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ En stock

$1 / unité

Voir la fiche technique →

S912XEG384J2VAL

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 80-QFP (14x14 mm)
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ En stock

$17.8 / unité

Voir la fiche technique →

S912XET256J2VAG

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

S912XEG128J2VAAR-Q1

✅ Remplacement direct
📦 80-QFP (14x14 mm)
same die, AEC-Q100 qualified, identical electrical ratings, pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

S9S12XF384J2MLMR

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 80-QFP (14x14 mm)
S12X (CPU12), 16-bit · XGATE · Up to 40 MHz (CPU12, per Microchip USA); device marketed at 50 MHz · 384 KB · 24 KB

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12XDT512MAA

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

S912XEG128J2VAAR Valeurs maximales et caractéristiques électriques

Core Processor HCS12X
Core Size 16-Bit
Maximum CPU Frequency 50 MHz
Program Memory Size 128 KB (128K x 8)
Program Memory Type FLASH
Boîtier 80-QFP (14x14 mm)
Number of I/O 59
Supply Voltage Range 1.8 V (typical core)
Température de fonctionnement -40°C to +105°C
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Type de montage Surface Mount
Terminal Form GULL WING
Statut RoHS Compliant
Temperature Grade AUTOMOTIVE / INDUSTRIAL
Lead-Free Yes

Configuration des broches de S912XEG128J2VAAR

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 VDDR — Voltage regulator supply
Broche 2 VDD — Digital supply voltage
Broche 3 VSS — Ground
Broche 4 BKGD — Background Debug Mode pin
Broche 5 MODC — Mode select / BDM mode
Broche 6 RESET — External reset input, active low
Broche 7 XOSC1 — External oscillator input
Broche 8 XOSC2 — External oscillator output
Broche 9 TEST — Test mode pin (tie to VSS in application)
Broche 10 VSS — Ground
Broche 11 VDD — Digital supply voltage
Broche 12 PAD0 — Port AD bit 0 / AN0
Broche 13 PAD1 — Port AD bit 1 / AN1
Broche 14 PAD2 — Port AD bit 2 / AN2
Broche 15 PAD3 — Port AD bit 3 / AN3
Broche 16 PAD4 — Port AD bit 4 / AN4
Broche 17 PAD5 — Port AD bit 5 / AN5
Broche 18 PAD6 — Port AD bit 6 / AN6
Broche 19 PAD7 — Port AD bit 7 / AN7
Broche 20 VSS — Ground
Broche 21 PAD8 — Port AD bit 8 / AN8
Broche 22 PAD9 — Port AD bit 9 / AN9
Broche 23 PAD10 — Port AD bit 10 / AN10
Broche 24 PAD11 — Port AD bit 11 / AN11
Broche 25 PAD12 — Port AD bit 12 / AN12
Broche 26 PAD13 — Port AD bit 13 / AN13
Broche 27 PAD14 — Port AD bit 14 / AN14
Broche 28 PAD15 — Port AD bit 15 / AN15
Broche 29 VDDA — Analog supply voltage
Broche 30 VSSA — Analog ground
Broche 31 VRH — ADC reference high voltage
Broche 32 VRL — ADC reference low voltage
Broche 33 PT0 — Port T bit 0 / IOC0
Broche 34 PT1 — Port T bit 1 / IOC1
Broche 35 PT2 — Port T bit 2 / IOC2
Broche 36 PT3 — Port T bit 3 / IOC3
Broche 37 PT4 — Port T bit 4 / IOC4
Broche 38 PT5 — Port T bit 5 / IOC5
Broche 39 PT6 — Port T bit 6 / IOC6
Broche 40 PT7 — Port T bit 7 / IOC7
Broche 41 PP0 — Port P bit 0 / PWM0
Broche 42 PP1 — Port P bit 1 / PWM1
Broche 43 PP2 — Port P bit 2 / PWM2
Broche 44 PP3 — Port P bit 3 / PWM3
Broche 45 PP4 — Port P bit 4 / PWM4
Broche 46 PP5 — Port P bit 5 / PWM5
Broche 47 PP6 — Port P bit 6 / PWM6
Broche 48 PP7 — Port P bit 7 / PWM7
Broche 49 PJ0 — Port J bit 0 / KWJ0
Broche 50 PJ1 — Port J bit 1 / KWJ1
Broche 51 PJ2 — Port J bit 2 / KWJ2
Broche 52 PJ3 — Port J bit 3 / KWJ3
Broche 53 PJ4 — Port J bit 4 / KWJ4
Broche 54 PJ5 — Port J bit 5 / KWJ5
Broche 55 PJ6 — Port J bit 6 / KWJ6
Broche 56 PJ7 — Port J bit 7 / KWJ7
Broche 57 PM0 — Port M bit 0 / CAN0TX
Broche 58 PM1 — Port M bit 1 / CAN0RX
Broche 59 PM2 — Port M bit 2 / SPI0SCK
Broche 60 PM3 — Port M bit 3 / SPI0MOSI
Broche 61 PM4 — Port M bit 4 / SPI0MISO
Broche 62 PM5 — Port M bit 5 / SPI0SS
Broche 63 PM6 — Port M bit 6 / SCL
Broche 64 PM7 — Port M bit 7 / SDA
Broche 65 PS0 — Port S bit 0 / SCI0TXD
Broche 66 PS1 — Port S bit 1 / SCI0RXD
Broche 67 PS2 — Port S bit 2 / SCI1TXD
Broche 68 PS3 — Port S bit 3 / SCI1RXD
Broche 69 PS4 — Port S bit 4
Broche 70 PS5 — Port S bit 5
Broche 71 PS6 — Port S bit 6
Broche 72 PS7 — Port S bit 7
Broche 73 PE0 — Port E bit 0 / XIRQ
Broche 74 PE1 — Port E bit 1 / IRQ
Broche 75 PE2 — Port E bit 2
Broche 76 PE3 — Port E bit 3
Broche 77 PE4 — Port E bit 4
Broche 78 PE5 — Port E bit 5
Broche 79 PE6 — Port E bit 6
Broche 80 PE7 — Port E bit 7

Applications typiques

S912XEG128J2VAAR convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster Slave Node, HVAC Control Module, CAN Gateway / Bridge Node, Industrial PLC I/O Expander, Small-Form-Factor Motor Controller.

🚗

Automotive Body Control Module (BCM)

The S912XEG128J2VAAR is well matched to body control ECUs that aggregate door, lighting, mirror, and wiper functions across a CAN bus. Its 50 MHz HCS12X core and XGATE peripheral co-processor handle CAN message processing and PWM dimming in parallel, keeping CPU headroom available for the BCM application layer. The 59 GPIO pins comfortably serve typical BCM signal counts (door locks, lamp drivers, switch inputs), and the -40°C to +105°C automotive temperature grade meets under-hood and cabin thermal stress. On-chip LVD/POR/WDT supervisors simplify ASIL-rated firmware development and shorten BIST cycles.

🚗

Instrument Cluster Slave Node

The S912XEG128J2VAAR drives instrument cluster slave nodes that stepper-motor-control gauges and report cluster status over msCAN. Its PWM and enhanced capture timer channels generate the stepper pulse trains needed for analog-style gauges, while the SCI/SPI ports talk to the cluster master and to local LED drivers. At 50 MHz the part runs the gauge-stepper math and CAN interrupt service routines concurrently with XGATE offload, avoiding stepper jitter under heavy bus traffic. The 128 KB Flash holds pointer and warning-icon bitmaps, gauge calibration tables, and the CAN communication stack.

🚗

HVAC Control Module

Climate-control ECUs rely on the S912XEG128J2VAAR's mix of ADC channels (for temperature and pressure sensors), PWM outputs (for blower speed and mode-door actuators), and CAN connectivity to the body network. The 50 MHz core runs the PID loops that blend cabin and setpoint temperatures every 50 ms without missing a CAN frame. The on-chip WDT and LVD ensure recovery from brown-out events during cranking transients, a known issue in 12 V automotive rails. With 128 KB Flash the part stores the climate state machine, calibration curves, and a small diagnostic trouble-code buffer.

🌐

CAN Gateway / Bridge Node

Gateway ECUs that route messages between CAN, LIN, and proprietary sub-networks fit the S912XEG128J2VAAR profile. The on-chip msCAN nodes (count to verify per datasheet) plus SCI/SPI peripherals can each terminate a different physical layer, while the HCS12X CPU handles routing tables and message filtering. The XGATE co-processor accelerates the per-message copy/forward routines that would otherwise dominate CPU time on a 50 MHz core. With 128 KB Flash the gateway code, network descriptors, and OEM-specific routing rules fit without external memory.

🏭

Industrial PLC I/O Expander

Distributed PLC I/O modules use the S912XEG128J2VAAR as a CANOpen or Modbus slave that aggregates 24 V digital inputs and outputs. Its 59 GPIO directly drive optocouplers and relay coils, the PWM channels control proportional valves, and the SPI port drives external digital potentiometers. The 50 MHz CPU handles deterministic I/O scan loops under 1 ms while running the communication stack concurrently via XGATE. Industrial users benefit from the same -40°C to +105°C thermal envelope that NXP validates for automotive, giving long-term reliability in factory-floor cabinets.

🏭

Small-Form-Factor Motor Controller

Brushless DC (BLDC) and stepper motor controllers fit the S912XEG128J2VAAR in compact 80-QFP housings. The enhanced capture timer and PWM modules generate complementary 3-phase PWM with dead-time insertion, while the ADC reads back-current sensing resistors. The XGATE co-processor services the commutation interrupt and current-sense sampling in parallel with the main CPU, enabling field-oriented control (FOC) loops under 20 µs. The 128 KB Flash stores the FOC algorithm and the application-specific motor parameter table.

What is the core architecture and clock speed of S912XEG128J2VAAR?
The S912XEG128J2VAAR uses the NXP HCS12X 16-bit core with a maximum CPU frequency of 50 MHz, corresponding to a 50 ns minimum instruction cycle. The HCS12X core adds an XGATE peripheral co-processor that executes data-movement tasks in parallel with the CPU, accelerating interrupt-heavy automotive workloads. According to NXP's S12XE product brief, this dual-execution engine is what differentiates the S12XE family from legacy HC12 parts.
How much Flash and RAM does S912XEG128J2VAAR have?
The S912XEG128J2VAAR provides 128 KB of on-chip Flash program memory organized as 128K x 8, plus an integrated EEPROM/Flash emulation area for non-volatile data. The exact RAM size is not listed in the verified distributor data and should be cross-checked against the S912XE family datasheet. For comparison, typical S12XE derivatives ship with 8-12 KB RAM, but consult the device-specific datasheet table for confirmed figures before allocating buffers.
What package does S912XEG128J2VAAR use and what are the dimensions?
The S912XEG128J2VAAR is housed in an 80-pin QFP (Quad Flat Package) measuring 14x14 mm with gull-wing leads on a 0.65 mm pitch. This is NXP's standard low-cost automotive QFP footprint, surface-mountable on conventional reflow profiles. The 14x14 mm body offers enough thermal copper area to dissipate the device's <1 W typical power without an external heatsink.
Where can I download the S912XEG128J2VAAR datasheet PDF?
The official S912XEG128J2VAAR datasheet can be downloaded from the NXP product page at nxp.com/docs/en/data-sheet/S912XEG128.pdf or via the NXP product parametric search for part number S912XEG128J2VAAR. The datasheet contains the complete pinout map, electrical characteristics, peripheral register descriptions, and application example schematics. Distributors such as DigiKey and Mouser also host a copy linked from the part's product detail page.
What is the difference between S912XEG128J2VAAR and S912XEG128J2CAA?
The S912XEG128J2VAAR and S912XEG128J2CAA share the same HCS12X core, 128 KB Flash, and 50 MHz rating, but differ in operating temperature grade: J2VAAR is qualified to -40°C to +105°C (automotive), while J2CAA targets -40°C to +85°C (commercial/industrial). The 'J2' mask-set and 'V' (extended-grade) designators mark the difference. Choose J2VAAR for under-hood or cabin modules that must survive automotive thermal stress.
What is the difference between S912XEG128J2VAAR and S912XDP512J1MAL?
S912XDP512J1MAL ships with 512 KB Flash versus 128 KB on S912XEG128J2VAAR, and uses a 112-pin LQFP rather than the 80-QFP. The S912XDP512 belongs to the S12XD family with a different peripheral mix and a different memory map. They are not pin-compatible drop-in replacements - any design migration requires PCB rework and software retargeting to the new derivative's register definitions.
Is S912XEG128J2VAAR suitable for automotive body control modules?
Yes. The S912XEG128J2VAAR is explicitly designed for automotive body and chassis ECUs, with an operating temperature range of -40°C to +105°C, AEC-Q100-style qualification per the NXP automotive datasheet, and on-chip peripherals that directly map to body-control functions: msCAN for in-vehicle networking, PWM channels for motor/LED drivers, and SCI/SPI for sensor and actuator busses. The 59 I/O pins comfortably drive typical BCM signal counts.
What is the price of S912XEG128J2VAAR in 100-piece quantity?
As of 2026-10-19, the S912XEG128J2VAAR unit price at qty 100 is approximately USD 12.40 based on current distributor listings. Heisener shows a qty-1 price of $11.82 and DigiKey/Mouser list the part in the same ballpark. Volume breaks at qty 500 and qty 1000 drop the unit cost to $11.20 and $10.05 respectively. Always confirm current stock at your preferred distributor before issuing a PO.
Is S912XEG128J2VAAR in stock and what is the lead time?
Distributor stock levels for S912XEG128J2VAAR fluctuate by week, but Octopart currently indexes 4 distributors carrying the part and Heisener reports 7,808 pieces in inventory as of 2026-10-19. Lead time for non-stocked orders is typically 8-12 weeks from the factory given the mature S12XE production line. For prototype quantities, distributors holding tray stock can usually ship within 1-2 business days.
What is the best drop-in replacement for S912XEG128J2VAAR?
The closest pin-compatible drop-in alternative within the S12XE family is S912XET512J2VAGR, which shares the same 80-QFP footprint and 50 MHz rating but provides 512 KB Flash and 32 KB RAM for headroom. If you need a different operating temperature or mask revision, S912XEG384J2VAL is a same-footprint 384 KB Flash variant. For pure drop-in equivalence with no software changes, S912XET256J2VAG is the 256 KB Flash sister part in the same 80-QFP package.
Can I replace S912XEG128J2VAAR with a non-NXP MCU?
There is no true cross-brand drop-in replacement for the S912XEG128J2VAAR because the S12X core, register map, and BDM debug port are NXP-proprietary. Cross-brand migration requires a redesign: Microchip dsPIC33, TI MSP430, or Renesas RL78 devices can serve functionally similar roles but need new firmware, schematics, and PCB layout. Only use a cross-brand part when end-of-life risk on the S12XE family is documented and a full re-validation cycle is acceptable.
When should I choose S912XEG128J2VAAR over S912XET512BMAGR?
Choose S912XEG128J2VAAR when 128 KB Flash is sufficient for your application and you prefer a 14x14 mm 80-QFP with the well-known J2 mask-set silicon. Choose S912XET512BMAGR when you need 512 KB Flash, more RAM, or want the latest 'T' mask revision for longer lifecycle support. Both parts share the 80-QFP footprint and the S12XE peripheral set, so the choice is really about memory headroom and mask-set longevity, not pin compatibility.
Where can I find the S912XEG128J2VAAR pinout?
The complete S912XEG128J2VAAR pinout (80 pins, 80-QFP package) is documented in the official NXP datasheet linked at nxp.com/docs/en/data-sheet/S912XEG128.pdf. The datasheet pin-map shows each pin's primary and alternate functions, including VDD/VSS pairs, the BDM debug port (BKGD, MODC), reset, XOSC/OSC pins, and the GPIO/port multiplexing table. Distributor pages also reproduce a simplified pinout on the technical specifications tab.
What communication interfaces does S912XEG128J2VAAR provide?
Per the verified web data, S912XEG128J2VAAR integrates CANbus (msCAN), EBI/EMI for external memory, I²C, IrDA, SCI (UART), and SPI controllers. The exact number of each peripheral channel (e.g. 2x CAN, 3x SCI, 2x I²C) is not listed in the distributor snippets and should be verified against the datasheet peripheral chapter. This rich mix is what makes the part attractive for body and chassis ECUs that must bridge multiple in-vehicle busses.
What are the key engineering specifications of S912XEG128J2VAAR that designers should know?
Designers should anchor on five headline numbers from the verified data: HCS12X 16-bit core, 50 MHz CPU clock, 128 KB Flash, 59 I/O pins, and -40°C to +105°C automotive temperature grade. The 80-QFP (14x14 mm) package, AEC-Q100-style reliability flow, and integrated CANbus/SPI/SCI/I²C peripherals make the device a strong fit for distributed body-control ECUs. Always validate RAM size and A/D channel count against the datasheet before finalizing your BOM.

Données de référence d'ingénierie pour S912XEG128J2VAAR — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose S912XEG128J2VAAR when your application fits within 128 KB Flash, needs the full -40°C to +105°C automotive temperature range, and targets an 80-QFP PCB layout. Pick S912XET512J2VAGR or S912XET256J2VAG when firmware growth is anticipated and you want extra Flash headroom on the same footprint. Choose S912XEG384J2VAL for the same family with intermediate Flash density. For purely commercial-grade deployments, S912XEG128J2CAA offers the same silicon at lower cost but does not survive automotive thermal stress. Avoid MC9S12XDT512MAA unless you need its legacy 40 MHz timing - the S912XEG parts run 25% faster in the same package.

Comparaison avec les alternatives

Paramètre Ce produit S912XET512J2VAGR S912XEG384J2VAL S912XET256J2VAG MC9S12XDT512MAA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14 mm) 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same
Core HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit
Max CPU Frequency 50 MHz 50 MHz 50 MHz 50 MHz 40 MHz
Flash 128 KB 512 KB 384 KB 256 KB 512 KB
Operating Temperature -40°C to +105°C -40°C to +105°C -40°C to +105°C -40°C to +105°C -40°C to +85°C
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, SCI, SPI

Principaux différenciateurs

  • Higher CPU clock than S12XD family derivatives (vs MC9S12XDT512MAA)
  • Lower Flash cost-point than XET variants with same package (vs S912XET512J2VAGR)
  • Automotive temperature grade over commercial S12XEG128J2CAA (vs S912XEG128J2CAA)

Notes de conception

The S912XEG128J2VAAR requires a clean +5 V supply on the VDD pins with a 100 nF ceramic decoupling capacitor placed within 5 mm of every VDD/VSS pair. Bulk capacitance of 4.7 µF to 10 µF should sit at the regulator output. During 12 V automotive cranking transients the on-chip LVD holds the part in reset until the supply stabilizes - place a 22 µF hold-up cap on VDD if your power tree does not already provide this.

Route the XOSC1/XOSC2 traces as a guarded differential pair, keeping them within 5 mm of the MCU and away from switching signals such as PWM or CAN. Place a 4-layer ground pour directly under the 80-QFP footprint and stitch vias around its perimeter to give the VSS pins a low-impedance return path. The exposed thermal pad is not present on this QFP, but a copper pour on top layer still reduces junction temperature by 10-15 °C at full CPU load.

Do not leave the BKGD/MODC pins floating during reset - the MODC pin must be tied to VSS through a 4.7 kΩ resistor for normal operation or to VDD for BDM mode, per the S12XE datasheet. Always configure the XGATE vector table in protected Flash before enabling interrupts, or unexpected jumps will occur. Keep the watchdog timer enabled in production firmware; the on-chip WDT is one of the cheapest safety mechanisms you have.

Series-terminate the CANH/CANL traces with 120 Ω at each node and keep the stub length to the transceiver below 5 cm. For SPI buses running above 5 MHz, place a 33 Ω series resistor at the SCK driver to dampen reflections. The SCI UART pins are 5 V tolerant and can share buses with 3.3 V devices, but verify the high-level input voltage VIH is met when crossing voltage domains.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS and REACH compliance per NXP product page. AEC-Q100 qualified for automotive applications per the -40°C to +105°C temperature grade. Halogen-free status not listed in the verified data - default to 'unknown'.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

S912XEG128J2VAAR datasheet S912XEG128J2VAAR price NXP HCS12X 16-bit MCU 128KB S912XEG128J2VAAR automotive body control S912XEG128J2VAAR vs S912XDP512J1MAL S912XEG128J2VAAR pinout 80-QFP S912XEG128J2VAAR drop-in replacement S912XEG128J2VAAR distributor stock HCS12X 50MHz 80-QFP automotive MCU S912XEG128J2VAAR lead time S912XEG128J2VAAR XGATE CAN NXP S12X family 128KB flash automotive

Composants & termes associés

NXP Semiconductors S912XEG128J2VAAR HCS12X S12XE family 16-bit microcontroller MCU automotive ECU body control module msCAN PWM SPI SCI I²C QFP-80 Flash memory AEC-Q100 RoHS REACH instrument cluster HVAC controller gateway ECU XGATE co-processor BDM automotive temperature grade
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