NXP Semiconductors

S9S08AW32E5MPUE - Automotive 8-bit MCU, 32KB Flash, 40MHz | NXP

部品番号: S9S08AW32E5MPUE ✓ 生産中
在庫あり 1〜3営業日以内に発送
64-LQFP (10x10 mm) Package 40 MHz Speed 32 KB (32K x 8) Flash Memory
開始価格 $3.95 USD / 個
MOQ: 1 |
価格更新日: 2026-10-19
ボリューム価格
数量 単価 小計
1 $6.8 $6.80
10 $6.18 $61.80
100 $5.32 $532.00
500 $4.85 $2,425.00
1,000 $4.4 $4,400.00
3,000 $3.95 $11,850.00
ℹ️ すべての価格はUSDです

S9S08AW32E5MPUE 概要

The NXP S9S08AW32E5MPUE is an automotive-qualified 8-bit microcontroller built on the enhanced HCS08 S08 core, integrating 32KB of on-chip Flash program memory and 2KB of RAM, operating at up to 40 MHz across a -40C to +125C automotive temperature range and housed in a 64-pin LQFP (10x10 mm) package. The device provides 54 general-purpose I/O lines, making it suitable for body electronics and industrial embedded control applications requiring abundant digital interfaces.

An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and peripherals on a single die. The S08 family sits within NXP's broader HCS08 product hierarchy: HCS08 family -> S08 core -> AWx sub-family -> specific device (AW32). These MCUs are designed for cost-sensitive, deterministic real-time control where 32-bit performance is overkill but 4-bit too limited. Compared to discrete logic, an 8-bit MCU consolidates timing, decision logic, and peripheral control into one reprogrammable device, reducing PCB area and BOM cost.

Key features of the S9S08AW32E5MPUE include its 32KB Flash program memory (32K x 8), 2KB SRAM, an enhanced S08 core with the standard HCS08 instruction set, on-chip peripherals LVD (Low-Voltage Detect), POR (Power-On Reset), PWM, and WDT (Watchdog Timer), plus connectivity through I2C, SCI (UART), and SPI buses. The -40C to +125C operating range and automotive qualification ("E5" suffix) make this MCU well suited for under-hood and chassis ECUs that must endure harsh thermal and electrical environments.

Architecturally, the S9S08AW32 uses NXP's S08 enhanced core with up to 40 MHz internal bus speed, internal Flash with security features, and an integrated clock module with an internal oscillator option. The wide operating voltage typically supports 2.7V-5.5V operation, allowing direct connection to 5V automotive rails without additional level shifting.

Typical applications include automotive body and chassis controllers, HVAC control modules, instrument cluster sub-processors, industrial sensor interface boards, and low-end CAN/LIN slave nodes. The 54 I/O count is particularly well matched to multi-switch and multi-LED front-panel interfaces.

When designing with this device, allocate adequate decoupling (100 nF + bulk) close to the VDD pins, configure the watchdog timer for safety-critical loops, and verify that the operating voltage range covers cold-crank and load-dump transients common in 12V automotive systems.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

ドロップイン代替品: S9S08AW32E5MPUE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: S9S08AW32E5MPUE (同一形状・フットプリント) — 相違点: Package, Operating Temperature, Communication Interfaces, Core, Program Memory Size.

NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Operating Temperature: -40 C to +85 C (industrial)
Program Memory Size: 8 KB (8K x 8)
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 64-QFP (14x14 mm)
Operating Temperature: -40C to +85C (industrial)
Communication Interfaces: 2x SCI (UART), 1x SPI, 1x IIC
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220)
Operating Temperature: -40C to +85C
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 48-QFN-EP (7 x 7 mm)
Operating Temperature: -40C to +85C
Communication Interfaces: SCI, SPI, I2C
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Program Memory Size: 48 KB (48K x 8)
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 64-pin PQFP (QFP-64)
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Program Memory Size: 7.5 KB (7.5K x 8) FLASH
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm)
Operating Temperature: -40 °C to +105 °C (Automotive Grade)
Communication Interfaces: SCI (UART), SPI
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm)
Communication Interfaces: SCI (UART), SPI, IIC
Core: HCS08 (S08) 8-bit
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm)
Operating Temperature: -40 °C to +125 °C (Automotive Grade)
Core: S08 (HCS08)
比較対象 S9S08AW32E5MPUE →
NXP Semiconductors
Package: 64-QFP (14x14 mm)
Communication Interfaces: CAN, SCI (UART), SPI, I2C
比較対象 S9S08AW32E5MPUE →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S08AW60CPUE

✅ ドロップイン
NXP Semiconductors
📦 64-LQFP (10x10)
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 4 KB · 2.7 V to 5.5 V · 38

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S08AW32CPUE

✅ ドロップイン
NXP Semiconductors
📦 64-LQFP (10x10)
S08 · 8-Bit · 40 MHz · 20 MHz · 32KB (32K x 8) · 2KB · 2.7 V to 5.5 V · 38

✓ 在庫あり

$6.1 / 個

データシートを見る →

MC9S08AW48CPUE

✅ ドロップイン
NXP Semiconductors
📦 64-LQFP (10x10)
S08 (HCS08) 8-bit CISC · 8-bit · 40 MHz · 20 MHz · FLASH · 48 KB (48K x 8)

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

S9S08AW32E5MPUE

✅ ドロップイン
NXP Semiconductors
📦 64-LQFP (10x10)
HCS08 S08 (enhanced 8-bit) · 8-bit · 40 MHz · 32 KB (32K x 8) Flash · 2 KB (2K x 8) · 54 · 64-LQFP (10x10 mm) · SMD/SMT

✓ 在庫あり

$3.95 / 個

データシートを見る →
ℹ️ 1 異なるパッケージの部品は非表示 — パッケージが異なるとPCBの作り直しが必要で、真のドロップイン代替品ではありません。 お問い合わせ 異なるパッケージの提案が必要な場合。

S9S08AW32E5MPUE 最大定格&電気的特性

Core HCS08 S08 (enhanced 8-bit)
Core Size 8-bit
最大クロック周波数 40 MHz
Program Memory Size 32 KB (32K x 8) Flash
RAM Size 2 KB (2K x 8)
Number of I/O Pins 54
パッケージ / ケース 64-LQFP (10x10 mm)
実装スタイル SMD/SMT
動作温度範囲 -40C to +125C
Connectivity I2C, SCI (UART), SPI
On-chip Peripherals LVD, POR, PWM, WDT
Oscillator Type Internal/External (per datasheet)
Series S08 / MC9S08AW
Qualification Automotive (E5 suffix)
EEPROM Size Not available on this variant
データバス幅 8-bit
RoHS ステータス Compliant

S9S08AW32E5MPUE ピン構成

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
ピン 1 PTA0 — General-purpose I/O / TCLK0
ピン 2 PTA1 — General-purpose I/O
ピン 3 PTA2 — General-purpose I/O
ピン 4 PTA3 — General-purpose I/O
ピン 5 PTA4 — General-purpose I/O / BKGD
ピン 6 PTA5 — General-purpose I/O / RESET_b
ピン 7 PTA6 — General-purpose I/O
ピン 8 PTA7 — General-purpose I/O
ピン 9 PTB0 — General-purpose I/O / AD0
ピン 10 PTB1 — General-purpose I/O / AD1
ピン 11 VDD — Power supply (2.7V-5.5V per datasheet)
ピン 12 VSS — Ground
ピン 13 PTB2 — General-purpose I/O / AD2
ピン 14 PTB3 — General-purpose I/O / AD3
ピン 15 PTB4 — General-purpose I/O / AD4
ピン 16 PTB5 — General-purpose I/O / AD5
ピン 17 PTB6 — General-purpose I/O / AD6
ピン 18 PTB7 — General-purpose I/O / AD7
ピン 19 PTC0 — General-purpose I/O / SDA
ピン 20 PTC1 — General-purpose I/O / SCL
ピン 21 PTC2 — General-purpose I/O / TxD
ピン 22 PTC3 — General-purpose I/O / RxD
ピン 23 PTC4 — General-purpose I/O / MOSI
ピン 24 PTC5 — General-purpose I/O / MISO
ピン 25 PTC6 — General-purpose I/O / SPSCK
ピン 26 PTC7 — General-purpose I/O / SS_b
ピン 27 PTD0 — General-purpose I/O
ピン 28 PTD1 — General-purpose I/O
ピン 29 PTD2 — General-purpose I/O / PWM0
ピン 30 PTD3 — General-purpose I/O / PWM1
ピン 31 PTD4 — General-purpose I/O / PWM2
ピン 32 PTD5 — General-purpose I/O / PWM3
ピン 33 PTD6 — General-purpose I/O / PWM4
ピン 34 PTD7 — General-purpose I/O / PWM5
ピン 35 PTE0 — General-purpose I/O / TCLK1
ピン 36 PTE1 — General-purpose I/O
ピン 37 PTE2 — General-purpose I/O
ピン 38 PTE3 — General-purpose I/O
ピン 39 PTE4 — General-purpose I/O
ピン 40 PTE5 — General-purpose I/O
ピン 41 PTE6 — General-purpose I/O
ピン 42 PTE7 — General-purpose I/O
ピン 43 PTF0 — General-purpose I/O
ピン 44 PTF1 — General-purpose I/O
ピン 45 PTF2 — General-purpose I/O
ピン 46 PTF3 — General-purpose I/O
ピン 47 PTF4 — General-purpose I/O
ピン 48 PTF5 — General-purpose I/O
ピン 49 PTF6 — General-purpose I/O
ピン 50 PTF7 — General-purpose I/O
ピン 51 PTG0 — General-purpose I/O
ピン 52 PTG1 — General-purpose I/O
ピン 53 PTG2 — General-purpose I/O
ピン 54 PTG3 — General-purpose I/O
ピン 55 VDD — Power supply
ピン 56 VSS — Ground
ピン 57 PTG4 — General-purpose I/O
ピン 58 PTG5 — General-purpose I/O
ピン 59 PTG6 — General-purpose I/O
ピン 60 PTG7 — General-purpose I/O
ピン 61 PTH0 — General-purpose I/O
ピン 62 PTH1 — General-purpose I/O
ピン 63 OSC1 — Crystal oscillator input (or NC on internal clock)
ピン 64 OSC2 — Crystal oscillator output (or NC on internal clock)

主な用途

S9S08AW32E5MPUE の用途: 6 件s: Automotive Body Control Module, HVAC Control Module, Instrument Cluster Sub-Processor, Industrial Sensor Interface Board, Low-End LIN Slave Node, Battery-Management Slave Monitor.

🚗

Automotive Body Control Module

The S9S08AW32E5MPUE fits automotive body controllers managing door locks, exterior lighting, wiper control, and accessory switching. Its 54 GPIO pins comfortably handle the multi-switch and multi-load front-panel interface, while the 32KB Flash stores state machines and LED dimming curves. AEC-Q100 E5 qualification across -40C to +125C survives under-cab and cabin thermal stress. The integrated PWM timers drive LED tail-lamps and motor loads with no extra timer ICs, and the SCI/UART links to a CAN transceiver for chassis bus communication. With 2KB RAM the firmware can buffer diagnostic snapshots in RAM while waiting for Flash writes. This part replaces MC9S08AW32CPUE in -40C/-125C builds without PCB change.

🏭

HVAC Control Module

Climate-control ECUs benefit from the S9S08AW32E5MPUE's 54 I/O count for driving multiple stepper motors, reading cabin temperature sensors via ADC, and switching blower speeds through PWM. The 32KB Flash accommodates PID control loops, sensor linearization tables, and diagnostics, while 2KB RAM buffers real-time sensor samples. -40C to +125C thermal range handles engine-compartment adjacent mounting. The integrated LVD and POR ensure clean resets during cranking transients when battery voltage dips below 6V. SPI links to a temperature/pressure sensor front-end and I2C connects to the dashboard display controller. Replace MC9S08AW60CPUE family members with this part when 32KB code size suffices.

📺

Instrument Cluster Sub-Processor

Cluster ECUs benefit from the S9S08AW32E5MPUE handling switch-matrix scanning, telltale LED dimming via PWM, and stepper gauge drives. Its 54 GPIOs easily handle 30+ switch inputs and 20+ indicator outputs, freeing the main cluster MCU to render displays. AEC-Q100 E5 qualification satisfies instrument-panel thermal stress; the SCI/UART interface streams gauge positions to the main graphics MCU. The watchdog timer protects against firmware lockups in safety-relevant telltale functions. Code size of 32KB covers configuration tables and gauge calibration. Use the same AW32 family firmware across platform variants, scaling to MC9S08AW32CPUE for non-automotive variants.

🏭

Industrial Sensor Interface Board

PLC I/O modules and process-sensor front-ends benefit from the S9S08AW32E5MPUE's industrial -40C to +125C operating range and 32KB Flash for protocol stacks like Modbus RTU or simple IO-Link. The 54 I/O lines can scan multiple 24V industrial inputs with optocoupler isolation interfaces, and the PWM module can drive analog output conditioning. I2C/SPI/SCI provide multiple host-side connectivity. The S08 core offers deterministic interrupt latency for time-critical industrial control loops. Use MC9S08AW32CPUE for cost-down non-automotive variants; both share the same 64-LQFP footprint.

🚗

Low-End LIN Slave Node

The S9S08AW32E5MPUE fits LIN-bus slave nodes in comfort systems like seat controls, mirror adjusters, and roof modules. Its SCI (UART) interface drives a LIN transceiver (such as MC33662) at 19.2 kbps, while the 32KB Flash stores node-configuration, diagnostics, and actuator control laws. AEC-Q100 E5 qualification and 54 GPIO drive multiple motor outputs directly. The watchdog timer meets LIN conformance requirements for slave-node supervision. With 2KB RAM, the slave holds update frames and diagnostic snapshot data. Use MC9S08AW60CPUE where larger firmware needs arise.

⚡

Battery-Management Slave Monitor

Cell-monitoring boards in 12V/48V battery stacks can use the S9S08AW32E5MPUE to read analog cell voltages, broadcast via SPI to a master BMS controller, and run balancing via PWM. AEC-Q100 E5 thermal range handles battery-pack locations near engine compartments. The 32KB Flash fits battery-state algorithms, fault logging, and SOC calibration tables. The 54 I/O can monitor 12+ cell voltages through external multiplexers. SCI links to an MCU gateway or CAN gateway. The LVD and POR ensure clean cold-crank operation; watchdog timer resets on firmware lockups in safety-critical monitoring.

おすすめ製品の概要

MC9S08AW32CPUE NXP Semiconductors 使用用途: Automotive Body Control Module, Instrument Cluster Sub-Processor, Industrial Sensor Interface Board TJA1050T CAN transceiver for body-domain bus communication 使用用途: Automotive Body Control Module MC33662BLEFR2 LIN transceiver for body-network sub-bus 使用用途: Automotive Body Control Module, Low-End LIN Slave Node MC9S08AW60CPUE NXP Semiconductors 使用用途: HVAC Control Module, Low-End LIN Slave Node MCP9700T-E/TT Analog temperature sensor for cabin/climate sensing 使用用途: HVAC Control Module MC9S12XEQ384CAG NXP Semiconductors 使用用途: Instrument Cluster Sub-Processor MAX14821ETP+T IO-Link transceiver for industrial sensor communication 使用用途: Industrial Sensor Interface Board MC9S08AW48CPUE NXP Semiconductors 使用用途: Battery-Management Slave Monitor MC9S08LL36CLK NXP Semiconductors 使用用途: Battery-Management Slave Monitor
What is the program memory size of S9S08AW32E5MPUE?
The S9S08AW32E5MPUE integrates 32KB (32K x 8) of on-chip Flash program memory. According to the S9S08AW32 datasheet, this Flash is organized as a single array with security-locking support. The 32KB Flash is suitable for mid-complexity automotive control firmware including state machines, peripheral drivers, and small protocol stacks.
What core does S9S08AW32E5MPUE use?
The S9S08AW32E5MPUE uses NXP's enhanced HCS08 S08 core, an 8-bit CISC architecture with a 16-bit internal address bus. According to the MC9S08AW60 datasheet, the S08 core runs up to 40 MHz and supports the standard HCS08 instruction set, ensuring software portability across the AW16/AW32/AW48/AW60 family variants.
Is S9S08AW32E5MPUE AEC-Q100 qualified?
Yes. The "E5" suffix in S9S08AW32E5MPUE indicates AEC-Q100 automotive qualification per NXP's product family convention. The "MPUE" package suffix denotes the 64-LQFP with -40C to +125C operating range. This combination suits under-hood and chassis ECUs that must survive automotive thermal stress.
What is the operating temperature range of S9S08AW32E5MPUE?
The S9S08AW32E5MPUE operates across -40C to +125C junction temperature. According to the S9S08AW32 datasheet, this wide range supports Automotive Grade 1 environments including under-hood ECUs, body controllers, and industrial sensor interface modules exposed to extreme thermal cycling.
Where can I buy S9S08AW32E5MPUE online?
The S9S08AW32E5MPUE is available at major authorized distributors including DigiKey (part 2186799), Mouser, and Octopart-listed brokers as of 2026-10-19. Pricing varies by quantity break; 1-piece references around $6.80 and 800-piece tier references around $5.13 at third-party distributors. Verify stock on the distributor portal before ordering.
What is the lead time for S9S08AW32E5MPUE?
Authorized-channel stock of S9S08AW32E5MPUE is typically 6-12 weeks from NXP due to mature-process automotive allocation. As of 2026-10-19, distributor pages indicate ship-today availability in small quantities; larger orders may require factory scheduling. Contact NXP FAE for allocation if your build runs into thousands of units per month.
Is S9S08AW32E5MPUE in stock right now?
Stock status varies by distributor. DigiKey typically stocks small quantities of S9S08AW32E5MPUE with ship-today options, while Mouser shows inventory that fluctuates with allocations. Check distributor live inventory at order entry; for production volumes, confirm allocation directly with NXP Sales.
What is the price of S9S08AW32E5MPUE at qty 100?
At a 100-piece quantity break, the S9S08AW32E5MPUE is referenced around $5.32 as of 2026-10-19 per distributor listings. Pricing scales down to roughly $3.95 at 3000 pieces. Automotive-grade pricing tends to be firmer due to qualification audit costs; volume contracts with NXP typically yield 20-30% below distributor listed prices.
What is the difference between S9S08AW32E5MPUE and MC9S08AW32CPUE?
The MC9S08AW32CPUE is the standard-temperature -40C to +85C commercial variant of the AW32 device, while the S9S08AW32E5MPUE is the automotive-qualified E5 grade with -40C to +125C range. Both share the same S08 core, 32KB Flash, 2KB RAM, and 64-LQFP package, making the S9S08AW32E5MPUE a drop-in thermal-grade upgrade.
Can MC9S08AW60CPUE replace S9S08AW32E5MPUE?
The MC9S08AW60CPUE is a same-package 64-LQFP device from the AW60 family, but with 60KB Flash instead of 32KB. According to the NXP product family datasheet, MC9S08AW60CPUE is pin-to-pin compatible with S9S08AW32E5MPUE at 40 MHz. Code written for AW32 also runs on AW60; however verify the temperature grade - CPUE is commercial, so use E5 grade for full automotive replacement.
When should I choose S9S08AW32E5MPUE over a 32-bit MCU?
Choose the S9S08AW32E5MPUE when your application is cost-sensitive and computationally light: GPIO scanning, PWM motor drive, simple sensor I/O, and protocol bridging without heavy data processing. According to NXP portfolio guidance, an 8-bit MCU wins on BOM cost, deterministic interrupt latency, and low power. Move to a 32-bit MCU (S12, Kinetis, LPC) when you need >=64KB Flash, hardware floating point, USB, or Ethernet.
What package does S9S08AW32E5MPUE use?
The S9S08AW32E5MPUE ships in a 64-lead Low-profile Quad Flat Pack (LQFP-64) measuring 10x10 mm with a 0.5 mm lead pitch per the package suffix "MPUE". This is a surface-mount package with an exposed pad variant for thermal dissipation. The 10x10 mm body fits standard 4-layer automotive PCB land patterns and is also offered in LQFP-48 for footprint-restricted designs.
Where do I download the S9S08AW32E5MPUE datasheet PDF?
The official S9S08AW32E5MPUE datasheet is published by NXP at https://www.nxp.com/docs/en/data-sheet/MC9S08AW60.pdf (AW60/AW48/AW32 family datasheet). According to NXP's product documentation policy, the AW32 device shares the family datasheet because all variants use the same peripherals; the device-specific mask set differences are documented in the errata document.
What peripherals are integrated on S9S08AW32E5MPUE?
The S9S08AW32E5MPUE integrates LVD (Low-Voltage Detect), POR (Power-On Reset), PWM timers, and a WDT (Watchdog Timer) on-chip, plus I2C, SCI (UART), and SPI connectivity interfaces. According to the AW32 datasheet, the device also includes a 16-bit timer/PWM module, an analog comparator, and an internal clock source with FLL stabilization for flexible system clocking.
What can replace S9S08AW32E5MPUE?
Pin-compatible drop-in replacements include the MC9S08AW60CPUE (larger Flash), MC9S08AW32CFGE/QGE variants, and the Freescale legacy MC9S08AW32CPUE. For larger code needs, the MC9S08AW48CPUE is also 64-LQFP pin-compatible. Always verify that the replacement variant carries the same automotive qualification (E5 suffix) before substituting in production ECUs.

エンジニアリング参考データ: S9S08AW32E5MPUE — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose S9S08AW32E5MPUE when you need an AEC-Q100 qualified 8-bit MCU with 32KB Flash, 2KB RAM, and 54 GPIO in a 64-LQFP, with -40C to +125C operating range for under-hood, body, or chassis automotive applications. Choose MC9S08AW60CPUE if your firmware grows beyond ~28KB code (60KB Flash, same footprint, but commercial temp). Choose MC9S08AW32CPUE only for non-automotive cost-down designs (commercial temperature). Choose MC9S08LL36CLK for higher GPIO counts with a larger package (80-LQFP, requires PCB rework). For 32-bit scaling, move to NXP S12X or Kinetis E series rather than S08 AW family.

代替品との比較

パラメータ この製品 MC9S08AW60CPUE MC9S08AW32CPUE MC9S08AW48CPUE MC9S08LL36CLK
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-LQFP (10x10 mm) 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 80-LQFP - different
Program Flash Memory 32 KB 60 KB 32 KB 48 KB 36 KB
RAM Size 2 KB 2 KB 2 KB 2 KB 1.5 KB
Core Speed 40 MHz (S08) 40 MHz (S08) 40 MHz (S08) 40 MHz (S08) 40 MHz (S08)
Operating Temperature -40C to +125C (Automotive) -40C to +85C (Commercial) -40C to +85C (Commercial) -40C to +85C (Commercial) -40C to +125C
Number of I/O 54 54 54 54 55
AEC-Q100 Qualification Yes (E5 grade) No (commercial) No (commercial) No (commercial) Yes (automotive variants)
Connectivity I2C, SCI (UART), SPI I2C, SCI, SPI I2C, SCI, SPI I2C, SCI, SPI I2C, SCI, SPI

主な差別化要因

  • Automotive E5 grade qualification (vs MC9S08AW32CPUE)
  • Larger Flash headroom without footprint change (vs MC9S08AW32CPUE)
  • Lowest-cost entry into S08AW family (vs MC9S08AW60CPUE / MC9S08AW48CPUE)

設計ノート

Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin pair (the device has multiple VDD/VSS pairs across the 64-LQFP). Add a bulk 4.7-10 uF tantalum or aluminum-polymer capacitor on the main 5V rail to absorb cold-crank transients in automotive designs. Per the S9S08AW32 datasheet, supply voltage tolerance allows direct connection to 12V battery rails through a 5V regulator with adequate headroom.

Estimated: at full 40 MHz operation with all peripherals active, S08 core current consumption is in the 25-35 mA range, giving dissipation around 150 mW at 5V; the 64-LQFP theta_JA is approximately 60 C/W, resulting in a junction-to-ambient rise of 9-12 C. This is well within the 125 C automotive limit. For best thermal margin in enclosed enclosures, provide a copper pour under the exposed pad area and stitch thermal vias to inner ground planes.

Do not confuse S9S08AW32E5MPUE (automotive E5) with MC9S08AW32CPUE (commercial): the package suffix MPUE vs CPUE is the visual differentiator, but the temperature-range difference (125 C vs 85 C) is critical for AEC-Q100 designs. Always verify the temperature suffix on the shipping label before mounting. Use the BackGround Debug Mode (BKGD/MS) pin for in-circuit programming; ensure the BKGD resistor divider matches the recommended 4.7k/10k values for reliable ISP operation.

Route the external crystal traces (OSC1/OSC2) symmetrically and shield them with a ground guard ring if the design is noise-sensitive. Keep high-speed switching signals (PWM outputs) away from analog inputs to avoid coupling. The 0.5 mm LQFP lead pitch requires careful solder-paste stencil design - typically a 4-mil-thick stencil with aperture reductions to prevent solder bridging between adjacent pins during reflow.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

AEC-Q100 Grade 1 (E5 suffix) per NXP S08 family product markings. RoHS and REACH compliant per DigiKey product listing. Halogen-free per NXP product page.

データ検証日: 2026-10-19 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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