SPC5602BF1MLL6 - 32-bit Auto MCU, 256KB Flash, 64MHz | NXP
Référence : SPC5602BF1MLL6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $7.68 | $76,80 |
| 100 | $6.42 | $642,00 |
| 500 | $5.19 | $2 595,00 |
| 1 000 | $4.36 | $4 360,00 |
SPC5602BF1MLL6 Présentation
An automotive microcontroller (MCU) is a ruggedized microprocessor variant qualified for the under-hood and in-cabin operating environment. It belongs to the broader category of embedded microcontrollers within the semiconductor hierarchy: MCU -> microcontroller -> embedded processor -> integrated circuit. The SPC5602BF1MLL6 belongs to NXP's SPC560 family, which is positioned for cost-sensitive automotive body applications that require functional safety features without the higher performance of the SPC56xx multi-core parts.
Key features include the e200z0 PowerPC core for deterministic real-time performance, 256 KB of on-chip Flash for application code and calibration data, multiple CAN and LIN interfaces for in-vehicle networking, and a 10-bit ADC for analog sensing. The device operates from a 3.3 V or 5 V supply and is rated for the -40C to +125C automotive temperature range, conforming to AEC-Q100 stress-test requirements.
The architecture integrates a memory protection unit, watchdog timer, and error-correcting code support on the Flash array to support ISO 26262 functional-safety design patterns. A peripheral set including timers, PWM channels, and communication interfaces allows direct interfacing with sensors and actuators typically found in body control modules.
Typical applications include automotive body control modules, instrument clusters, lighting controllers, HVAC panels, and seat control units. The combination of Flash memory, CAN connectivity, and AEC-Q100 qualification makes the part suitable for use in safety-relevant body electronics that must operate reliably across -40C to +125C.
When designing with this part, ensure the supply decoupling network follows the SPC560 hardware design guidelines, and place a 10 nF plus 100 nF bypass combination close to each supply pin. The 5 V-tolerant I/O must be correctly configured for 3.3 V peripherals to avoid long-term reliability degradation.
This page synthesizes distributor pricing, package options, and NXP product family cross-references that go beyond the manufacturer datasheet to support sourcing and BOM decisions.
Alternatives de remplacement direct pour SPC5602BF1MLL6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SPC5602BF1MLL6 (même facteur de forme et même empreinte) — différant par Package, Supply Voltage, ADC, Communication Interfaces, Core Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC5602BF2MLL6
✅ Remplacement direct✓ En stock
$5.59 / unité
Voir la fiche technique →SPC5604BF1MLL6
✅ Remplacement direct✓ En stock
$6.2 / unité
Voir la fiche technique →SPC5602BF1MLU6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5603BF1MLL6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC5604BMLL6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5602BF1MLL6 Valeurs maximales et caractéristiques électriques
| Core | PowerPC e200z0 |
| CPU Architecture | 32-bit |
| Maximum CPU Frequency | 64 MHz |
| Program Memory (Flash) | 256 KB |
| Tension d'alimentation | 3.3 V / 5 V |
| Plage de température de fonctionnement | -40C to +125C (Automotive) |
| Boîtier | 100-LQFP (14x14 mm) |
| Terminal Form | GULL WING |
| Number of Terminals | 100 |
| Package Code | QFP |
| Package Shape | SQUARE |
| ADC | 10-bit (integrated) |
| Communication Interfaces | CAN, LIN, SPI, SCI |
| Temperature Grade | AUTOMOTIVE |
| Type de montage | Surface Mount |
| Statut RoHS | ROHS3 Compliant |
Guide de configuration des broches du SPC5602BF1MLL6 square
Configuration des broches du SPC5602BF1MLL6 (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour SPC5602BF1MLL6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
SPC5602BF1MLL6 convient pour 6 applications: Automotive Body Control Module (BCM), Automotive Lighting Controller (Headlamp / Tail Lamp), Instrument Cluster Display Driver, HVAC Climate Control Module, Power Seat and Power Mirror Control Module, Automotive Gateway and Diagnostic Interface.
Automotive Body Control Module (BCM)
The SPC5602BF1MLL6 is well suited for central body control modules that coordinate lighting, door locks, wipers, and turn signals via CAN/LIN buses. With 256 KB Flash and the e200z0 core at 64 MHz, it can run OSEK/ AUTOSAR-compliant BCM stacks while leaving headroom for diagnostic and fail-safe monitoring routines. The integrated 10-bit ADC handles sensor inputs (ambient light, switch contacts) and the PWM channels drive LED drivers. The AEC-Q100 automotive grade and -40C to +125C operation ensure reliability in under-hood and cabin locations. Compared to a higher-tier SPC56xx MCU, the BF1 cuts cost while preserving the CAN/LIN peripheral set and AEC-Q100 qualification - a sweet spot for mass-market BCM programs where thousands of units ship per month.
Recommandé
Automotive Lighting Controller (Headlamp / Tail Lamp)
For LED matrix headlamps or tail-lamp clusters, the SPC5602BF1MLL6 provides deterministic PWM control and CAN connectivity needed to manage dynamic lighting functions. The e200z0 core handles LIN-based light multiplexing while the 64 MHz clock budget supports smoother dimming transitions, fault diagnostics, and turn-animation sequences. Its 256 KB Flash stores calibration tables for LED current control and matrix-drive algorithms. The 100-LQFP package's ample GPIO count maps cleanly to the multi-channel LED driver interfaces typical in modern exterior lighting. The -40C to +125C qualification ensures operation under sun-load and cold-soak conditions. Designers favor this device over cheaper 8-bit MCUs because the e200z0 power architecture supports automotive safety libraries and CAN-based diagnostic UDS sessions without performance headroom concerns.
Recommandé
Instrument Cluster Display Driver
The SPC5602BF1MLL6 acts as a slave-display controller that drives stepper motors or segment LCDs in analog-style instrument clusters. Its 64 MHz e200z0 core has enough bandwidth to drive CAN-based dashboards that receive vehicle data over 500 kbps CAN. The 256 KB Flash stores the bootloader, gauge calibration, and warning-icon bitmaps. Hardware timers generate PWM outputs for backlight brightness and gauge pointer control. The 100-LQFP package exposes sufficient I/O for redundant sensors (speed, fuel, temperature) and segment-LCD drivers. AEC-Q100 qualification and the 5 V-tolerant I/O simplify integration with traditional analog cluster hardware. Compared to microcontroller-less cluster designs, the SPC5602BF1MLL6 enables remote firmware update over CAN - critical for OEM field-failure management.
Recommandé
HVAC Climate Control Module
For HVAC control panels, the SPC5602BF1MLL6 manages blower-speed PWM, blend-door actuators, and temperature-sensor acquisition via its integrated 10-bit ADC. The e200z0 core at 64 MHz runs the climate-control algorithm - dew-point compensation, sun-load adjustment, and CAN-based status reporting. The 256 KB Flash is sufficient for lookup tables and PID tuning constants per vehicle variant. The AEC-Q100 grade and -40C to +125C rating support under-dash mounting where thermal stress is high. Its LIN interface allows the panel to communicate with distributed sensor nodes (in-cabin temperature, humidity) while the CAN channel talks to the vehicle backbone. Designers value this MCU's combination of automotive qualification, ample peripheral set, and 100-LQFP pin count - all at a price point suited to mid-volume HVAC platforms.
Recommandé
Power Seat and Power Mirror Control Module
The SPC5602BF1MLL6 is a strong fit for seat-control ECUs that need multiple H-bridge drivers, position memory, and CAN diagnostics. The e200z0 core drives brushed-DC motor PWM at up to 64 MHz while leaving bandwidth for position-tracking calculations and end-of-travel detection algorithms. The 256 KB Flash stores seat-position memory per driver profile and fault-recovery logic. The 100-LQFP footprint provides ample GPIO for limit-switch inputs and H-bridge enable signals. AEC-Q100 qualification supports door-mounted modules that experience full automotive thermal swing. Often paired with NXP LIN transceivers to communicate with door-modules, the BF1MLL6 supports up to two CAN channels - one for backbone integration and one for diagnostics - making it a preferred MCU in body-electronics domains.
Automotive Gateway and Diagnostic Interface
As a low-cost CAN-to-LIN gateway or diagnostic bridge, the SPC5602BF1MLL6 routes messages between body-domain CAN buses and sub-network LIN clusters. The e200z0 core at 64 MHz handles modest gateway throughput requirements, and the 256 KB Flash allows UDS/KWP2000 diagnostic stack plus bootloader. Hardware CAN acceptance filters and the integrated 10-bit ADC monitor bus voltage and external sensor health. The 100-LQFP package accommodates external watchdog and EEPROM interfaces needed for OBD-II compliance. AEC-Q100 qualification permits under-hood mounting near the vehicle OBD port. Compared to a full multi-core SPC56xx, this single-core BF1 device reduces BOM cost while retaining all critical peripherals - ideal for entry-level body-network gateway designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC5602BF1MLL6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC5602BF2MLL6 | SPC5604BF1MLL6 | SPC5602BF1MLU6 | SPC5603BF1MLL6 | MPC5604BMLL6 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Core | PowerPC e200z0 (32-bit) | PowerPC e200z0 | PowerPC e200z0 | PowerPC e200z0 | PowerPC e200z0 | PowerPC e200z0 |
| Maximum CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Automotive Grade (-40C to +125C) | Yes | Yes | Yes | Yes | Yes | Yes |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Communication Interfaces | CAN, LIN, SPI, SCI | CAN, LIN, SPI, SCI | CAN, LIN, SPI, SCI | CAN, LIN, SPI, SCI | CAN, LIN, SPI, SCI | CAN, LIN, SPI, SCI |
Principaux différenciateurs
- Optimized Flash size for entry-level body modules (vs SPC5604BF1MLL6)
- Same SPC5602 family, BF2 upgrade path (vs SPC5602BF2MLL6)
- Tray packaging for low-volume prototyping (vs SPC5602BF1MLU6)
Notes de conception
Place a 10 nF X7R ceramic bypass plus a 4.7 uF bulk decoupling capacitor within 5 mm of each VDD/VSS pin pair. For 100-LQFP packages, fan out power pins on the inner PCB layers using wide copper pours and at least two vias per supply pin to minimize inductance. The SPC560 hardware design manual recommends separate analog and digital ground planes tied at a single point beneath the MCU to reduce ADC noise coupling during high-speed CAN switching.
Route the CAN_H and CAN_L signals as a 100-ohm differential pair with characteristic impedance matched to the transceiver datasheet (typically 120 ohm). Keep stubs below 1/10 of the signal rise time and avoid 90-degree bends. The integrated CAN module on the SPC5602BF1MLL6 requires a quality crystal oscillator; place a 4-30 pF load cap network within 10 mm of the XTAL pins to ensure CAN baud-rate stability across the -40C to +125C range.
Do not exceed 5.5 V on any 5 V-tolerant I/O pin - the absolute-maximum rating is 6 V. When migrating from a 3.3 V to 5 V analog sensor, verify that the input threshold of the corresponding GPIO bank matches the sensor output swing. Also confirm Flash erase/write timing under low-voltage conditions: writing to Flash below 2.7 V can corrupt ECC data. Use NXP's SPC560 flash programming driver and avoid disabling the watchdog during development.
Informations de conformité
ROHS3 Compliant per distributor data; AUTOMOTIVE temperature grade per Partstack listing. AEC-Q100 qualification per NXP automotive product family. REACH and halogen-free status not explicitly stated in the verified web data - set to 'unknown'.