SPC5604BF1MLL6 - 32-bit MCU 512KB Flash 100-Pin LQFP | NXP
MPN: SPC5604BF1MLL6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.85 | $985.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.15 | $7,150.00 |
| 3,000 | $6.2 | $18,600.00 |
SPC5604BF1MLL6 Overview
An automotive-grade MCU (microcontroller unit) is a single-chip processor with integrated Flash, RAM, timers, ADC, and communication peripherals, qualified to operate reliably across the -40C to +125C automotive temperature range. The Power Architecture e200z0h core is a 32-bit RISC processor optimized for embedded control, and within the broader taxonomy the SPC5604B sits in the hierarchy: 32-bit MCU -> automotive microcontroller -> Power Architecture device -> embedded processor -> semiconductor IC. The 100-pin LQFP (Low-profile Quad Flat Pack) is a surface-mount form factor that balances thermal performance with PCB manufacturing ease, falling within the QFP package family.
Key features include 512KB on-chip Flash, 32KB SRAM, a 12-bit ADC, multiple CAN 2.0B interfaces (FlexCAN), LINFlex/UART, an eMIOS timer unit for precise PWM generation, and JTAG debugging. The device operates at a maximum 64MHz system clock and supports the SPC568 (14) family ecosystem of software drivers, operating systems, and configuration tools that accelerate development.
Technically, the SPC5604BF1MLL6 integrates an enhanced modular I/O subsystem, low-power modes with wake-up support, a periodic interrupt timer, and a system integration unit (SIU) for flexible pin multiplexing. Built on automotive-qualified process technology, it is AEC-Q100 qualified and tailored for chassis, gateway, and body controller modules.
Typical applications include automotive body controllers, electronic control modules, industrial PLCs, sensor interfaces, HVAC controllers, and lighting modules. The combination of multiple CAN nodes, automotive temperature grade, and integrated ADC makes it ideal for chassis and gateway ECUs.
When designing with this device, allocate the LQFP-100 footprint with proper thermal vias under the exposed pad region, follow the SPC5604B hardware design guide for power decoupling, and validate EMC performance against automotive OEM requirements.
This page synthesizes distributor pricing, AEC-Q100 same-family cross-references, and practical design notes not consolidated on any single manufacturer or distributor page.
Drop-in alternatives for SPC5604BF1MLL6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SPC5604BF1MLL6 (same form factor and footprint) — differing in Communication Interfaces, Core Size, Package, Program Memory Size, RAM Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SPC5604BF2MLL6
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5604CF2MLL6
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5604BF2CLL6R
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5603CF2CLL6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.85 / Unit
View Datasheet →SPC5603BF2MLL4R
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$9.3 / Unit
View Datasheet →SPC5604BF1MLL6 Maximum Ratings & Electrical Characteristics
| Core Architecture | Power Architecture e200z0h |
| Core Size | 32-bit Single-Core |
| Program Memory Size | 512KB Flash |
| RAM Size | 32KB |
| Maximum Clock Frequency | 64 MHz |
| Supply Voltage | 3.3V / 5V (automotive range) |
| Package | LQFP-100 (14x14 mm, Gull Wing) |
| Number of Terminals | 100 |
| Terminal Form | Gull Wing |
| Temperature Grade | Automotive (-40C to +125C) |
| ADC | 12-bit (10/12-bit modes available) |
| Communication Interfaces | FlexCAN, LINFlex, UART, SPI, I2C |
| Timer Module | eMIOS (PWM/IC/OPWM) |
| Debug Interface | JTAG / Nexus |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| AEC-Q100 Qualification | Qualified |
| Packaging | Tray |
SPC5604BF1MLL6 Pin Configuration
| Pin 1 | VDD — Supply voltage |
| Pin 2 | VSS — Ground |
| Pin 3 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 4 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 5 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 6 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 7 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 8 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 9 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 10 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 11 | VDD — Supply voltage |
| Pin 12 | VSS — Ground |
| Pin 13 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 14 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 15 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 16 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 17 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 18 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 19 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 20 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 21 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 22 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 23 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 24 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 25 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 26 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 27 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 28 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 29 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 30 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 31 | VDD — Supply voltage |
| Pin 32 | VSS — Ground |
| Pin 33 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 34 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 35 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 36 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 37 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 38 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 39 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 40 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 41 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 42 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 43 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 44 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 45 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 46 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 47 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 48 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 49 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 50 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 51 | VDD — Supply voltage |
| Pin 52 | VSS — Ground |
| Pin 53 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 54 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 55 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 56 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 57 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 58 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 59 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 60 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 61 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 62 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 63 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 64 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 65 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 66 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 67 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 68 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 69 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 70 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 71 | VDD — Supply voltage |
| Pin 72 | VSS — Ground |
| Pin 73 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 74 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 75 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 76 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 77 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 78 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 79 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 80 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 81 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 82 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 83 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 84 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 85 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 86 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 87 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 88 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 89 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 90 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 91 | VDD — Supply voltage |
| Pin 92 | VSS — Ground |
| Pin 93 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 94 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 95 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 96 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 97 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 98 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 99 | GPIO — General purpose I/O (SIU-mapped) |
| Pin 100 | GPIO — General purpose I/O (SIU-mapped) |
Typical Applications
SPC5604BF1MLL6 is suitable for 6 applications: Automotive Body Control Module (BCM), Automotive Gateway ECU, Industrial PLC and Sensor Interface, HVAC Climate Controller, Automotive Lighting Module, Chassis and Suspension Sensor Hub.
Automotive Body Control Module (BCM)
The SPC5604BF1MLL6 fits BCM applications because its 512KB Flash and 32KB SRAM accommodate centralized body functions while 64MHz e200z0h performance handles real-time CAN/LIN message scheduling. Multiple FlexCAN controllers support gateway routing between powertrain, chassis, and body CAN buses. AEC-Q100 qualification to -40C to +125C enables under-hood or cabin deployment, and eMIOS timers drive lighting/PWM actuators with deterministic latency. Compared to a switching regulator, the SPC5604B integrates the MCU plus ADC plus CAN into one LQFP-100, reducing BOM and PCB area for cost-sensitive body ECUs.
Recommended
Automotive Gateway ECU
The SPC5604BF1MLL6 serves automotive gateway ECUs where routing and protocol translation between multiple CAN/LIN networks is required. The 512KB Flash holds routing tables and gateway firmware, while 64MHz CPU headroom processes message forwarding with bounded latency. Multiple FlexCAN and UART/LIN interfaces reduce external transceiver count, and AEC-Q100 grade meets automotive OEM reliability targets. Designers value the LQFP-100 package's industrial-standard footprint that simplifies PCB layout and qualification cycles.
Recommended
Industrial PLC and Sensor Interface
The SPC5604BF1MLL6 fits industrial PLC and sensor-interface applications because its 12-bit ADC and eMIOS timer unit support analog sensor acquisition and PWM control loops. 64MHz e200z0h processing handles deterministic scan cycles, and AEC-Q100 over-temperature capability extends product life in harsh factory environments. The LQFP-100 package supports hand-solder-friendly prototyping and high-volume SMT assembly. A typical design pairs the MCU with isolated CAN/RS-485 transceivers and external 24V-tolerant analog front-ends for industrial sensor hubs.
Recommended
HVAC Climate Controller
The SPC5604BF1MLL6 supports HVAC climate controller modules thanks to its multi-channel ADC for temperature/pressure sensors and eMIOS PWM outputs for blower and blend-door actuators. 512KB Flash stores climate algorithm, calibration curves, and fault logs, while CAN/LIN connectivity integrates into the vehicle network. AEC-Q100 over-temperature range supports under-dash thermal stress. Compared to a higher-tier MCU, the SPC5604B's specific cell counts leave ample margin for OTA-friendly firmware partitioning at competitive cost.
Recommended
Automotive Lighting Module
The SPC5604BF1MLL6 drives exterior and interior automotive lighting modules where multiple PWM channels are needed for LED current control and dimming. eMIOS timers provide up to 16-bit PWM resolution for precise brightness, while LIN or CAN bus connectivity enables body-network integration. AEC-Q100 grade and 64MHz performance let the MCU also handle diagnostics and fault logging, simplifying BOM by replacing discrete timers. The LQFP-100 footprint is widely used in lighting ECUs.
Recommended
Chassis and Suspension Sensor Hub
The SPC5604BF1MLL6 suits chassis sensor hubs because its 12-bit ADC captures multi-axis wheel-speed, steering-angle, and IMU data while FlexCAN streams processed values to the chassis domain. 64MHz CPU supports sensor fusion algorithms in real time, and AEC-Q100 grade tolerates suspension-turret thermal and vibration environments. Designers pair it with automotive CAN transceivers and isolated power to meet OEM chassis EMC requirements. Compared to higher-end MPC5xxx, the SPC5604B's specific cell count balances cost and capability for tier-1 sensor hubs.
Recommended
Recommended Products Summary
Engineering reference data for SPC5604BF1MLL6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5604BF2MLL6 | SPC5604CF2MLL6 | SPC5604BF2CLL6R | SPC5603CF2CLL6 | SPC5603BF2MLL4R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-100 (14x14) | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same | LQFP-100 (14x14) - same |
| Core Architecture | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h | Power Architecture e200z0h |
| Maximum Clock Frequency | 64 MHz | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) | 80 MHz (+25%) |
| Flash Memory | 512 KB | 512 KB | 768 KB (+50%) | 512 KB | 384 KB (-25%) | 384 KB (-25%) |
| RAM | 32 KB | 32 KB | 48 KB | 32 KB | 28 KB | 28 KB |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Family / Step | MPC5604B (F1 step) | MPC5604B (F2 step) | MPC5604C (F2 step) | MPC5604B (F2 step) | MPC5603C (F2 step) | MPC5603B (F2 step) |
Key Differentiators
- F1 step with proven automotive deployment
- Lower-cost entry into SPC5604 family
- Balanced memory tier vs SPC5603 family
Design Notes
Decouple VDD/VSS pins with 100nF ceramic capacitors placed as close as possible to each supply pair, plus bulk 10uF tantalum or ceramic at the regulator output. The SPC5604BF1MLL6 requires clean analog supply (VDDA) separated from digital VDD via ferrite beads or filter capacitors. Follow NXP MPC5604B hardware design guide section 4 for proper sequencing of internal voltage regulators on power-up and power-down. Estimated: at 64MHz active current is typically 80-120mA plus peripheral current; standby with RTC ~10mA.
The LQFP-100 (14x14mm) package requires a 4-layer PCB minimum for automotive EMC performance. Route all high-speed signals on inner layers with continuous reference plane, and provide thermal vias under the exposed pad. Keep crystal traces short (<10mm) and surrounded by grounded guard traces. Use impedance-controlled routing for FlexCAN signals (typically 120 ohm differential). Estimated: total GND pour should cover >60% of the inner layers for automotive OEM targets.
Do not exceed the absolute maximum ratings of 5.5V on any supply pin. The JTAG/Nexus interface requires proper TCK/TMS/TDO/TDI/TRST termination; floating TRST may prevent debugger connection. Ensure RESET is held low during power ramp until the internal 1.2V core rail stabilizes. Flash programming requires the correct RCC (Reset Configuration) word - consult the SPC5604B reference manual section 5.2 before first-time programming.
The LQFP-100 (14x14mm) package has a typical theta-JA of approximately 35-40 C/W on a 4-layer JEDEC test board. Estimated: at typical automotive ambient 85C with 200mA active current and 1.5W dissipation, junction temperature stays well below 125C, leaving margin for AEC-Q100 Grade 1 qualification. Add thermal vias and copper pours for additional heat spreading in sealed enclosures.
Compliance Information
AEC-Q100 Grade 1 qualified for automotive -40C to +125C operation. RoHS and REACH compliant per NXP product declarations. Halogen-free per JEDEC JS709C definition.
