SPC5644BF0VLU1R - 32-bit e200z4d MCU, 1.5MB Flash, 120MHz | NXP
Référence : SPC5644BF0VLU1R ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.85 | $32,85 |
| 10 | $29.4 | $294,00 |
| 100 | $26.5 | $2 650,00 |
| 500 | $23.1 | $11 550,00 |
| 1 000 | $20.75 | $20 750,00 |
SPC5644BF0VLU1R Présentation
Alternatives de remplacement direct pour SPC5644BF0VLU1R — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SPC5644BF0VLU1R (même facteur de forme et même empreinte) — différant par Maximum CPU Frequency, Operating Temperature, Package, RoHS Status, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
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✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5644AF0MLU1R
✅ Remplacement direct✓ En stock
$42.75 / unité
Voir la fiche technique →SPC5645BF1VVU
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
SPC5646BF0VLU1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5674FAMVR3R
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
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Voir la fiche technique →SPC5744PFK1AKLQ8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.8 / unité
Voir la fiche technique →SPC5644BF0VLU1R Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Part Family | MPC56xx Qorivva |
| Core | e200z4d (Power Architecture Book E, dual-issue) |
| Core Architecture | 32-bit RISC |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 1.5 MB (1.5M x 8) |
| SRAM | 128 KB with ECC |
| Cache | 16 KB unified (8 KB I / 8 KB D configurable) |
| Température de fonctionnement | -40C to +105C |
| Boîtier | 176-LQFP (24x24 mm) |
| Nombre de broches | 176 |
| Communication Interfaces | FlexRay, CAN (up to 3), SPI, SCI, LIN, I2C, EBI |
| Timers / PWM | eMIOS, periodic interrupt timer, 32-bit counter, watchdog |
| Debug Interface | Nexus Class 3+ (JTAG, auxiliary port) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per NXP product page) |
| Temperature Grade | Industrial |
| Lead-Free / Terminal Finish | Gull-wing lead-free (per distributor listings) |
Configuration des broches de SPC5644BF0VLU1R
| Broche 1 | [DATA_NEEDED] — 176-LQFP pin functions are described in the device reference manual; specific pin numbering beyond the standard package family is not asserted in the verified snippet data. |
| Broche 44 | [DATA_NEEDED] — Mid-package pin; refer to the SPC5644 reference manual for full peripheral mapping. |
| Broche 88 | [DATA_NEEDED] — Mid-package pin; refer to the SPC5644 reference manual for full peripheral mapping. |
| Broche 132 | [DATA_NEEDED] — Mid-package pin; refer to the SPC5644 reference manual for full peripheral mapping. |
| Broche 176 | [DATA_NEEDED] — Last pin of 176-LQFP; refer to the device reference manual. |
Applications typiques
SPC5644BF0VLU1R convient pour 6 applications: Automotive Gateway Controller, Body Control Module (BCM), Engine/Transmission Control Unit, Battery Management System Controller, Industrial Robotics Motion Controller, HVAC Control Module.
Automotive Gateway Controller
The SPC5644BF0VLU1R integrates three CAN controllers plus a FlexRay network node, making it ideal for in-vehicle gateway ECUs that bridge CAN, CAN-FD, and FlexRay domains. Its 120 MHz e200z4d core provides the throughput to run AUTOSAR communication stacks, network management, and frame-routing tables in real time. The 1.5 MB of Flash comfortably holds large UDS diagnostic handlers and security firmware, while the 128 KB of ECC-protected SRAM buffers message queues without scrubbing delays.
Recommandé
Body Control Module (BCM)
Body Control Modules aggregate lighting, door, mirror, and climate functions across multiple LIN and CAN sub-networks. The SPC5644BF0VLU1R's -40C to +105C range and robust peripheral mix (LINFlex, DSPI, eMIOS PWM, ADC) make it well-suited to BCM tasks. The 16 KB on-core cache and dual-issue e200z4d deliver responsive load management, while ECC on the 128 KB SRAM shields BCM logic from soft-bit events in noisy electrical environments.
Recommandé
Engine/Transmission Control Unit
For transmission and engine ECUs, the SPC5644BF0VLU1R's 120 MHz dual-issue core provides enough headroom to schedule eight cylinder fuel-injection and ignition timing loops at sub-millisecond periods. The on-chip eMIOS timer blocks deliver synchronized PWM generation to drive actuators, while the enhanced ADC sampling converters digitize crank and cam sensor signals for accurate position decoding. Industrial-grade temperature rating allows underhood placement in many chassis regions.
Recommandé
Battery Management System Controller
In Battery Management Systems (BMS), the SPC5644BF0VLU1R acts as the master controller that aggregates cell voltages from daisy-changed monitors over SPI, balances the pack, and reports state-of-charge to the vehicle via CAN-FD. Its 1.5 MB Flash accommodates the look-up tables and Kalman filter code, while ECC RAM ensures cell sample integrity. The wide operating temperature range helps the part survive proximity to inverters and high-current cabling.
Recommandé
Industrial Robotics Motion Controller
Factory robots and CNC tools rely on deterministic real-time control with cycle times down to tens of microseconds. The SPC5644BF0VLU1R's deterministic interrupt latency and dual-issue e200z4d core let motion-control loops process encoder feedback, compute inverse-kinematics, and dispatch PWM phases within one 1 ms servo tick. The 176-LQFP package provides ample GPIO for incremental encoder and H-bridge control, while the on-chip CAN connects easily to EtherCAT/CANopen gateways.
Recommandé
HVAC Control Module
HVAC heads and climate control modules blend temperature, humidity, and blower-speed feedback into driver-controlled setpoints. With the SPC5644BF0VLU1R, designers can run LIN sub-buses for rear-cabin blend actuators and CAN-FD for the climate bridge to the central body controller, all coordinated in one CPU instance. ECC SRAM ensures long-term reliability in temperature-cycled cabin environments, while the 176-LQFP footprint accommodates growth to the SPC5645 without board changes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC5644BF0VLU1R — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC5644BF0MLU1 | SPC5644AF0MLU1R | SPC5645BF1VVU | SPC5646BF0VLU1 | SPC5674FAMVR3R | SPC5744PFK1AKLQ8 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 176-LQFP (24x24 mm) | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same |
| Core | e200z4d 32-bit dual-issue | e200z4d 32-bit dual-issue | e200z4 32-bit single-core | e200z4d 32-bit dual-issue | e200z4 32-bit dual-issue | e200z4 32-bit dual-issue | e200z4 lock-step dual-core |
| CPU Frequency | 120 MHz | 120 MHz | 150 MHz | 120 MHz | 120 MHz | 180 MHz | 200 MHz (lock-step) |
| Flash Memory | 1.5 MB | 1.5 MB | 1.5 MB | 3 MB | 3 MB | 4 MB | 2.5 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 192 KB | 192 KB | 256 KB | 384 KB |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +125C | -40C to +125C |
| CommunICATION Interfaces | FlexRay, 3x CAN, SPI, SCI, LIN, EBI | FlexRay, 3x CAN, SPI, SCI, LIN, EBI | CAN, EBI/EMI, LIN, SCI, SPI | FlexRay, 3x CAN, SPI, SCI, LIN | FlexRay, 3x CAN, SPI, SCI, LIN | FlexRay, 4x CAN, SPI, SCI, LIN, Ethernet MAC | FlexRay, 4x CAN, SPI, SCI, LIN, Ethernet AVB |
Principaux différenciateurs
- Qorivva automotive-tier robustness profile (vs MC9S08SH4MPJ)
- 1.5 MB Flash + 128 KB RAM in LQFP-176 (vs SPC5607BF1VLU6)
- Migration to SPC5744 with same footprint (vs SPC5744PFK1AKLQ8)
Notes de conception
The SPC5644BF0VLU1R requires a clean +5 V regulated supply on its external VDD pins, plus separate digital and analog supply pins for the ADC. Decoupling must include a bulk 10 uF tantalum plus a 100 nF ceramic per supply pin pair to handle the 120 MHz core's edge currents. NRST should be held low for at least 5 ms after all supplies reach the minimum voltage to ensure a clean cold-start sequence.
Estimated: at maximum CPU activity (~150 mA core current) and 5 V, the part dissipates about 750 mW internally; the 176-LQFP package has a junction-to-ambient thermal resistance of approximately 32 C/W (typical 4-layer PCB with no airflow), which yields a self-heating rise near 24 C. For closed-enclosure or underhood installation, add small PCB copper pours to keep junction rise below the -40C to +105C operating range.
Place a 4-layer stack-up with a continuous ground plane under the LQFP-176 footprint to provide a low-impedance return for the high-frequency FlexRay and CAN edges. Keep XTAL traces short and surrounded by ground pour; if a CAN-FD signal is longer than 100 mm, route it across a continuous reference plane with no adjacent high-current traces or vias in parallel.
Do not enable the Flash ECC on the entire array during production without first erasing programmed pages; ECC can report parity mismatches if pages are written to without a corresponding ECC recalculation. Watch out for the standby reset issue: leaving the device in low-power standby for >1 s may trigger a flag in the RGM block, requiring firmware to clear it before resume. Always include a watchdog refresh in the early boot path.
Informations de conformité
Distributors (DigiKey, Mouser, Partstack) list the part as industrial-grade with Gull-Wing lead-free termination and RoHS compliance per the NXP product page. AEC-Q100 status varies by specific lot and customer agreement; check the latest NXP material declaration if automobile qualification is required.
