MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112
Référence : MC9S12DT256CPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.2 | $292,00 |
| 100 | $26.15 | $2 615,00 |
| 500 | $23.4 | $11 700,00 |
| 1 000 | $20.85 | $20 850,00 |
MC9S12DT256CPVE Présentation
An HCS12 microcontroller is a member of the Freescale/NXP 16-bit MCU family built on the CPU12 core, combining a CISC instruction set with on-chip peripherals such as timers, ADC, PWM, and multiple serial interfaces. In the broader hierarchy, HCS12 sits between classic HC11/HC12 8-bit/16-bit microcontrollers and modern 32-bit ARM Cortex-M devices - the HCS12 family targets automotive multiplexing, body and chassis ECUs, and industrial control applications that need deterministic interrupt response and large on-chip memory. The DT256 sub-family is fully pin-compatible with the wider S12D family, letting designers scale memory and peripherals without re-laying out the PCB.
The MC9S12DT256CPVE integrates 2x SCI (UART), SPI, I2C, CAN, an 8-channel 10-bit ADC, an 8-channel enhanced capture timer, an 8-channel PWM, and 91 discrete digital I/O lines. Its supply voltage spans 2.35V to 2.75V core (with 5V-tolerant I/O typical of S12 designs). BDM (Background Debug Mode) and on-chip COP watchdog support automotive-grade development flows.
The device uses the HCS12 CPU12 core with a 25MHz bus, executing CISC instructions and supporting up to 4KB EEPROM and 256KB Flash for application code plus 12KB RAM for variables. The integrated CAN, SCI, and SPI controllers enable automotive multiplexing and industrial networking, while the 8-channel PWM and 10-bit ADC provide mixed-signal I/O for sensor and actuator interfaces.
Typical applications include automotive body controllers, CAN/J1939 nodes, HVAC modules, industrial PLCs, and 16-bit replacement of older HC11/HC12 designs. It is widely used where 5V I/O tolerance and deterministic CAN messaging are mandatory.
Designers should budget PCB space for the LQFP-112 footprint, use external decoupling on VDD/VSSX pairs, and follow NXP's EMC/ESD layout guidelines. The 'CPVE' suffix denotes the 112-pin LQFP commercial grade (0-70C) vs. MPVE -85C; verify temperature grade before layout.
This page synthesizes distributor pricing, drop-in pin-compatible S12 family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S12DT256CPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DT256CPVE (même facteur de forme et même empreinte) — différant par ADC, PWM Channels, Operating Temperature, Package, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DT256MPVE
✅ Remplacement direct✓ En stock
$14.36 / unité
Voir la fiche technique →MC9S12DJ256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256BVPV
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →MC9S12DP512CPVE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12DT128MPVE
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →MC9S12DT256CPVE Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 (CPU12 CISC) |
| Core Size | 16-bit |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB |
| Largeur du bus de données | 16-bit |
| Tension d'alimentation | 2.35 V to 2.75 V (core), 5 V I/O tolerant typical |
| Number of I/O Pins | 91 |
| ADC | 2x 8-channel, 10-bit |
| PWM Channels | 8 channels |
| Connectivity | CAN, I2C, SCI (UART), SPI |
| Timers | 8-channel Enhanced Capture Timer (ECT) |
| Boîtier | 112-pin LQFP (20x20 mm) |
| Température de fonctionnement | -40C to +85C (industrial, per 'P' suffix family) |
| Type de montage | Surface Mount |
| Debug Interface | BDM (Background Debug Mode) |
| Watchdog | COP (Computer Operating Properly) watchdog |
Guide de configuration des broches du MC9S12DT256CPVE 112-pin lqfp (20x20 mm)
Configuration des broches du MC9S12DT256CPVE (boîtier 112-pin lqfp (20x20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12DT256CPVE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12DT256CPVE convient pour 6 applications: Automotive Body Control Module (BCM), CAN/J1939 Network Node, HVAC Climate Control Module, Industrial PLC / Sensor Hub, Instrument Cluster Driver, HC11/HC12 Legacy Replacement.
Automotive Body Control Module (BCM)
The MC9S12DT256CPVE is widely used in body control modules that manage lighting, central locking, wipers, and interior accessories. Its 256KB Flash comfortably holds BCM application code plus bootloader, while 12KB RAM supports CAN/J1939 stacks. The integrated CAN module plus 91 GPIO simplify connections to discrete relays, MOSFET drivers, and LIN slaves typical of BCM designs. Eight PWM channels drive LED dimming and motor speed control, and two 8-channel 10-bit ADCs read multiplexed switch and sensor inputs. The HCS12's deterministic interrupt latency makes it well suited for time-critical body functions where missed interrupts could leave a vehicle in an undefined state.
Recommandé
CAN/J1939 Network Node
The MC9S12DT256CPVE's on-chip CAN 2.0A/B controller makes it a drop-in node controller for CAN and higher-layer J1939 networks in trucks, off-highway equipment, and industrial vehicles. Its 25MHz CPU12 core can manage a J1939 transport protocol stack alongside application code in the 256KB Flash. Multiple SCI and SPI ports allow the MCU to also drive a secondary LIN sub-network or interface external RF transceivers. The HCS12's COP watchdog and BDM debug simplify OEM end-of-line validation. For higher-load gateway nodes the pin-compatible MC9S12DP512CPVE offers the same CAN plus additional RAM for buffering transport-layer messages.
Recommandé
HVAC Climate Control Module
HVAC modules in mid-size vehicles typically run closed-loop temperature control, blend/stepper motor actuation, and CAN communication with the BCM - all tasks that fit comfortably within the MC9S12DT256CPVE's feature set. The 8-channel PWM drives blower speed control in software, while two 8-channel 10-bit ADCs read NTC temperature sensors and potentiometer inputs. With 91 discrete I/O, the MCU can simultaneously drive multiple stepper motors, multiplex LEDs, and arbitrate CAN messages. The HCS12 timer system also supports precision PWM frequencies for variable-fan-speed control without CPU overhead.
Recommandé
Industrial PLC / Sensor Hub
Industrial sensor hubs and small-format PLCs benefit from the MC9S12DT256CPVE's robust peripheral set and 5V-tolerant I/O. Its two ADCs handle analog sensor aggregation, the 8 PWM channels drive proportional valves or motor speed commands, and SCI plus SPI extend connectivity to remote I/O slices. The 256KB Flash holds ladder-logic interpreters or application-specific control firmware, while the 4KB EEPROM stores calibration and configuration data in non-volatile form. With 91 I/O pins the MCU consolidates what would otherwise require multiple 8-bit microcontrollers into a single chip, reducing BOM cost and PCB area.
Recommandé
Instrument Cluster Driver
Simple instrument clusters that read speed, RPM, fuel level, and temperature can run on the MC9S12DT256CPVE, leveraging its dual 8-channel 10-bit ADCs to sample multiple analog sensors with minimal external circuitry. The 8 PWM channels drive gauge backlight dimming and indicator LEDs, while the integrated CAN module retrieves vehicle-speed and engine data from the powertrain bus. 12KB RAM holds display refresh buffers and CAN receive queues, and the 256KB Flash accommodates graphics rendering, gauge-sweep animation, and diagnostics routines. SPI interfaces with external stepper-motor drivers for needle actuation.
Recommandé
HC11/HC12 Legacy Replacement
Designers maintaining existing HC11 or HC12 designs can migrate to the MC9S12DT256CPVE as a pin-compatible 16-bit upgrade path while retaining toolchain familiarity. The HCS12's instruction set is largely source-compatible with the older HC12, easing software port. The 256KB Flash dwarfs typical HC12 part sizes (typically 32-128KB), enabling modern feature additions on the same board. With on-chip CAN, dual ADC, and PWM, the DT256 brings peripherals HC11/HC12 designs previously required external chips to achieve, simplifying BOM while extending product life.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DT256CPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DT256MPVE | MC9S12DJ256CPVE | MC9S12DG256CPVE | MC9S12DG256BVPV | MC9S12DP512CPVE | MC9S12DT128MPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20mm) | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 128 KB |
| RAM Size | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 29 KB | 8 KB |
| EEPROM Size | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB |
| Maximum Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Temperature | 0C to +70C (CPVE commercial) | -40C to +125C (automotive) | 0C to +70C | 0C to +70C | -40C to +105C (industrial) | 0C to +70C | -40C to +125C (automotive) |
| CAN Module | Yes (msCAN, CAN 2.0A/B) | Yes | Yes (with J1850) | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Pin-compatible scalability across full S12D family (vs MC9S12DP512CPVE / MC9S12DT128MPVE)
- Dual 8-channel 10-bit ADC for analog sensor aggregation (vs MC9S12DG256CPVE)
- 256KB Flash with on-chip CAN, SPI, SCI, I2C (vs MC9S12DG256CPVE)
- Cost-effective 256KB Flash in commercial grade (CPVE) (vs MC9S12DT256MPVE)
Notes de conception
The MC9S12DT256CPVE uses a 2.35V to 2.75V core supply with multiple VDD/VSSX power pins that must each be decoupled individually. Place a 100nF X7R ceramic as close as possible to every VDD pin and a bulk 10uF tantalum or ceramic at the regulator output. The MCU's analog supply (VDDA/VSSA) should be filtered from the digital supply with a ferrite bead or 10-ohm resistor to keep ADC noise low; share a common ground plane with vias stitching the LQFP-112 thermal pad to ground.
Although the MC9S12DT256CPVE is rated for commercial 0C to +70C operation, internal power dissipation under full peripheral load (CAN + dual ADC + 8 PWM) can approach 0.5W. The LQFP-112 thermal pad (exposed pad underneath) must be soldered to a copper area of at least 1 square inch for adequate cooling, particularly when the MCU operates in enclosed automotive enclosures. If your target environment exceeds 70C (underhood, engine bay), step up to the MC9S12DT256MPVE automotive grade rather than rely on derating alone.
Do not assume the BDM (Background Debug Mode) pins are reserved only for debug - on the S12 family, MODC, BKGD, and RESET must be correctly pulled at reset or the MCU can enter special modes or fail to start. Use a 4.7k-10k pull-up on RESET per NXP reference designs and follow the BDM connector pinout exactly. Also, the PLL filter network on XFC/VDDPLL/VSSPLL needs its own LC filter components; omit these and the PLL will not lock reliably above 16MHz.
Informations de conformité
AEC-Q100 not qualified; CPVE suffix denotes commercial 0-70C temperature grade. Reach and lead-free confirmations inferred from NXP corporate policy. RoHS and halogen-free status not explicitly given in retrieved data - marked [DATA_NEEDED].
