SPC5674FAMVR3R - 32-bit e200z7 MCU 4MB Flash 264MHz PBGA-416
MPN: SPC5674FAMVR3R ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $45.2 | $452.00 |
| 100 | $41.75 | $4,175.00 |
| 500 | $38.9 | $19,450.00 |
| 1,000 | $35.02 | $35,020.00 |
SPC5674FAMVR3R Overview
The SPC5674FAMVR3R belongs to the broader category of automotive-grade microcontrollers within the power management and engine control domain. A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile RAM, non-volatile program memory, and a rich set of analog and digital peripherals around that core. In an automotive powertrain ECU, the MCU sits beneath the operating-system layer (typically AUTOSAR), executes control algorithms, drives actuators via PWM, and reads sensors through ADC and timer units. The SPC5674 family is a hierarchical descendant of the Power Architecture family (PowerPC -> e200z -> SPC56xx Qorivva) and is widely deployed where functional safety and deterministic interrupt response are critical.
Key features of the SPC5674FAMVR3R include the dual-issue e200z7 core, 4 MB Flash with ECC, on-chip SRAM with ECC, dual FlexCAN controllers, enhanced timer/processing units for crank-angle synchronous events, a 12-bit ADC, and a comprehensive interrupt controller with the Generic Interrupt Controller (INTC). The peripheral set covers the typical powertrain requirements: eSCI, DSPI, eMIOS, and PWM channels, plus a Nexus-class debug interface for trace-based development.
The SPC5674FAMVR3R's architecture is optimized for engine-management loops where sub-microsecond determinism is needed. Two independent processing units (z0 and z7 cores, depending on variant) share system memory through a crossbar switch, allowing low-latency access to RAM and Flash. The device supports hardware semaphores and dual-core lock-step or decoupled operation, supporting ASIL-D-capable safety architectures.
Typical applications include automotive engine management ECUs (gasoline and diesel), transmission control units, advanced chassis control, hybrid-electric vehicle inverters, and industrial drives that require automotive-qualified silicon. The wide operating temperature window and AEC-Q100 qualification also suit off-road, agricultural, and aerospace subsystems.
When designing with this MCU, allocate sufficient PCB area for the 27x27 mm PBGA-416 footprint, plan for multi-layer stack-up with controlled-impedance routing for FlexCAN and DSPI, and carefully derate total Flash endurance and junction temperature when targeting long-life fleet applications.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for SPC5674FAMVR3R — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SPC5674FAMVR3R (same form factor and footprint) — differing in Package, Core Architecture, Mounting Type, Communication Interfaces, Manufacturer.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SPC5674FAMVR3
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5674FK0MVR3
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5675F
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5676R
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5645S
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5674FAMVR3R Maximum Ratings & Electrical Characteristics
| Core Processor | e200z7 (Power Architecture) |
| Core Size | 32-Bit |
| Core Speed | 264 MHz |
| Program Memory Size | 4 MB (4M x 8) |
| Program Memory Type | FLASH |
| Supply Voltage | 1.2 V / 3.3 V / 5 V |
| Number of I/O | 32 |
| Connectivity | CANbus, SCI, SPI |
| Peripherals | DMA, POR, PWM |
| Operating Temperature | -40C to +125C |
| Package | 416-PBGA (27x27 mm) |
| Mounting Type | Surface Mount (PBGA) |
| Automotive Grade | AEC-Q100 |
| Series | MPC56xx Qorivva |
| Temperature Grade | Automotive |
SPC5674FAMVR3R 416-pbga (27x27 mm) Pin Configuration Guide
Pin configuration for SPC5674FAMVR3R (416-pbga (27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for SPC5674FAMVR3R.
Refer to the datasheet for full pin configuration.
Typical Applications
SPC5674FAMVR3R is suitable for 6 applications: Automotive Engine Management ECU, Transmission Control Unit (TCU), Hybrid and Electric Vehicle Inverter Controller, Advanced Chassis and Stability Control, Industrial Servo and Robotics Drives, Off-Road and Agriculture Vehicle Systems.
Automotive Engine Management ECU
The SPC5674FAMVR3R's 264 MHz dual-issue e200z7 core, 4 MB ECC Flash, and FlexCAN/DSP peripheral mix make it a strong fit for gasoline and diesel engine ECUs. The MCU executes crank-angle-synchronous fuel injection loops and OBD-II diagnostics that require deterministic sub-microsecond interrupt latency. Placed at the heart of the ECU between sensor inputs (crankshaft, camshaft, O2, MAP) and injector/ignition outputs, the part addresses real-time torque control while the AEC-Q100 Grade 1 window (-40C to +125C) handles under-hood thermal stress. Designers should plan for multi-layer PCB stack-up to route the 416 PBGA balls, derate junction temperature at full 264 MHz load, and provision 12 weeks of buffer against the typical 39-week NXP lead time when ordering production volumes.
Recommended
Transmission Control Unit (TCU)
Transmission ECUs benefit from the SPC5674FAMVR3R's dual FlexCAN controllers for CAN-driven gearbox communications and 4 MB Flash for gear-shift maps plus adaptive learning tables. The 264 MHz e200z7 core completes real-time torque-converter and clutch-fill calculations faster than legacy TCU silicon, supporting modern 10-speed automatic and DCT architectures. Mounted alongside solenoid drivers and current-sense amplifiers, the part allows tighter shift quality and on-the-fly learning, while still meeting the AEC-Q100 envelope required by OEM transmission software quality gates. Watch the PBGA-416 PCB escape pattern to avoid signal-integrity degradation on the high-speed FlexCAN buses.
Recommended
Hybrid and Electric Vehicle Inverter Controller
Hybrid and EV traction inverters route the SPC5674FAMVR3R's eMIOS PWM channels to 3-phase gate drivers and use the ADC to read resolver and shunt currents. The MCU's 264 MHz throughput closes the FOC torque loop in microseconds, and 4 MB Flash hosts both the ASIL-D software stack and the multi-axis modulation lookup tables. The -40C to +125C automotive window survives battery-pack ambient swings while the dual FlexCAN interfaces link the inverter to the vehicle CAN-FD and FlexRay backbone. Engineer attention should focus on ground isolation, reinforced clearance, and a robust thermal design so that the PBGA-416 does not exceed maximum junction temperature under continuous 50 kW+ inverter loads.
Recommended
Advanced Chassis and Stability Control
Electronic stability control and active suspension ECUs use the SPC5674FAMVR3R's low-latency peripheral set to read wheel-speed sensors over DSPI and emit solenoid drive PWM within a single control cycle. The 4 MB Flash budget holds the vehicle dynamics control law plus calibration data for multiple car models, and the 264 MHz e200z7 core executes yaw-rate and lateral-acceleration fusion at 1 kHz. The AEC-Q100 qualification is essential because chassis ECUs operate behind the brake booster and steer-by-wire boundaries where functional safety is paramount. Designers should validate ISO 26262 ASIL-D software metrics and confirm fault-collection time-to-reaction against the SPC5674F's lockstep capability.
Recommended
Industrial Servo and Robotics Drives
Industrial servo drives, AGVs, and cobot controllers that demand automotive-qualified silicon can use the SPC5674FAMVR3R as the main controller where 4 MB Flash and 264 MHz throughput are required. The FlexCAN, DSPI, and PWM channels drive industrial EtherCAT/CANopen gateways, and the extended -40C to +125C envelope handles factory ambient with no derating. Compared with consumer-grade Cortex-M parts, the part offers tighter AEC-Q100 traceability and predictable multi-decade support; this favors long-life industrial platforms. Expect a steeper PCB layout cost due to the 27x27 mm PBGA-416 footprint and budget longer lead-time margin into your NPI schedule.
Recommended
Off-Road and Agriculture Vehicle Systems
Tractor, combine, and construction equipment ECUs adopt automotive microcontrollers like the SPC5674FAMVR3R to weather temperature, vibration, and dust exposure that exceed consumer expectations. The part's 264 MHz headroom runs hydraulic-loop control for variable-rate sprayers, GNSS-guided steering, and ISOBUS gateway tasks from a single device, while the 416-ball PBGA tolerates the conformal coating and vibration profiles these platforms demand. The AEC-Q100 Grade 1 envelope also covers the elevated ambient temperatures seen in off-road engine bays where machine hours regularly exceed 10,000 per year. Designers should validate the bootloader against the 26-39 week lead time when planning mid-cycle production revisions.
Recommended
Recommended Products Summary
Engineering reference data for SPC5674FAMVR3R — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5674FAMVR3 | SPC5674FK0MVR3 | SPC5675F |
|---|---|---|---|---|
| Package | 416-PBGA (27x27 mm) | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | e200z7 | e200z7 | e200z7 (with lockstep) | e200z7 |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 | Grade 1 | Grade 1 (assumed, same family) |
| Connectivity | FlexCAN, eSCI, DSPI | FlexCAN, eSCI, DSPI | FlexCAN, eSCI, DSPI | FlexCAN, eSCI, DSPI |
| Supply Voltage | 1.2 V / 3.3 V / 5 V | 1.2 V / 3.3 V / 5 V | 1.2 V / 3.3 V / 5 V | 1.2 V / 3.3 V / 5 V (assumed) |
Key Differentiators
- Largest on-die Flash and 264 MHz throughput in the SPC5674F family (vs SPC5645S)
- Same-family pin compatibility with SPC5674FK0MVR3 and SPC5674FAMVR3 tray variants (vs SPC5674FK0MVR3)
- Pin-compatible upgrade path to SPC5675F and SPC5676R (vs SPC5676R)
Design Notes
The 27x27 mm PBGA-416 footprint requires a 1.0 mm or 0.8 mm ball pitch escape strategy. Use a 4-layer or 6-layer stack-up with at least two inner ground planes directly under the package; place all 1.2 V, 3.3 V, and 5 V decoupling capacitors within 5 mm of their respective balls. Microvia-in-pad is recommended for inner-row balls; dog-bone fanout will not escape the inner rows at 0.8 mm pitch on a 4-layer stack-up. Plan trace widths to keep DC drop below 25 mV on the 3.3 V rail feeding the I/O bank during in-rush Flash programming events.
Estimated: at 264 MHz full load with core voltage 1.2 V, the part draws roughly 1.0 W to 1.4 W (illustrative - datasheet thermal data should be confirmed). On a 4-layer PCB with the 27x27 PBGA footprint, theta_JA is typically in the 18-22 C/W range. Operating with no airflow, junction rise stays under 31C - acceptable for AEC-Q100 Grade 1 with substantial margin. Add a thermal copper array under the center balls and consider thermal vias to the inner ground plane to reduce theta_JB, especially when the device is co-located with gate drivers in a sealed enclosure.
Avoid the temptation to migrate code from the SPC5605 series without re-validating FlexCAN register layouts - SPC56xx Qorivva devices share the family but specific interrupt vector mappings differ. Confirm that the Nexus debug port pins (JCOMP, EVTI, EVTO) are not left floating during production: a floating JCOMP can put the part in scan mode and cause functional failure. Always order from distributors with traceable supply-chain documentation (the -R suffix indicates tape-and-reel oriented for assembly), since counterfeit Qorivva silicon has been reported in gray-market channels.
Compliance Information
AEC-Q100 qualified per NXP and distributor listings. RoHS and REACH compliance per standard NXP automotive practice. Halogen-free status not specified in parsed snippets and marked unknown - verify against the latest manufacturer declaration.
