TMS320F28379SPTPS - 200MHz C28x Delfino MCU 1MB Flash | TI
N.º da peça: TMS320F28379SPTPS ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.42 | $38,42 |
| 10 | $34.58 | $345,80 |
| 100 | $30.74 | $3.074,00 |
| 500 | $27.91 | $13.955,00 |
| 1.000 | $25.1 | $25.100,00 |
TMS320F28379SPTPS Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, peripherals and I/O into one package. The C2000 Delfino family specifically targets real-time control: motor drives, digital power converters, solar inverters and industrial servo loops. The 2837xS generation adds a CLA - an independent 32-bit floating-point coprocessor that offloads time-critical control loops from the main CPU, allowing closed-loop PWM, ADC sampling and feedback math to execute deterministically without CPU intervention.
Key specifications include a 16-bit ADC subsystem with up to 3.5 MSPS aggregate throughput, three 12-bit DAC outputs, enhanced pulse-width modulator (ePWM) channels with high-resolution capability, configurable logic blocks (CLB), an external memory interface (EMIF), USB 2.0 (full-speed OTG), CAN, SPI, I2C, UART, McBSP and a 16-channel sigma-delta filter module. Functional-safety features include lockstep CPU options, ECC on flash/SRAM and a safety documentation package aligned with IEC 61508 SIL 3 and ISO 26262 ASIL-D system-level goals.
The architecture combines a Harvard-bus C28x core with the parallel CLA, both supporting IEEE-754 single-precision float. Tightly-coupled memory (TCM) and a multi-layer bus matrix give deterministic interrupt latency critical for field-oriented control (FOC) loops and digital power compensation. The configurable logic block (CLB) augments this with user-programmable glue logic that previously required external CPLDs.
Typical applications include industrial servo drives, AC induction and PMSM motor controllers, solar PV inverters, telecom rectifier modules, HEV/EV traction inverters, on-board chargers, digital power factor correction and welding power supplies. The 176-HLQFP footprint is also a common choice for power-conversion DSPs in 1U/2U telecom bricks.
When designing with this part, plan decoupling for the 1.2 V core rail: at least 10 µF bulk plus 0.1 µF per VDD pair, placed within 5 mm of the balls. Route the analog and digital ground domains separately and join them at a single point under the exposed pad. The HLQFP exposed pad must be soldered to a continuous copper plane of at least 1 square inch to keep junction temperature below 105 °C at full 200 MHz CPU + 200 MHz CLA load.
Alternativas drop-in para TMS320F28379SPTPS — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com TMS320F28379SPTPS (mesmo formato e footprint) — diferindo em Package, ADC, Flash Memory, Functional Safety, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
TMS320F28379SPTPT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TMS320F28379DPTPS
✅ Drop-In✓ Em estoque
$11.8 / unidade
Ver ficha técnica →TMS320F28379SPZPS
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TMS320F28377SPTPS
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TMS320F28376DPTPS
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TMS320F28379SPTPSR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TMS320F28379SPTPS Classificações máximas e características elétricas
| Series | C2000™ C28x Delfino™, Functional Safety (FuSa) |
| Core Processor | C28x (32-bit) |
| Co-Processor | CLA (Control Law Accelerator), 32-bit float |
| Coprocessors | FPU (single-precision IEEE-754), TMU |
| Operating Frequency | 200 MHz |
| MIPS | 400 MIPS (200 CPU + 200 CLA) |
| Program Memory | 1 MB (512K x 16) flash with ECC |
| SRAM | 164 KB |
| ADC | 16-bit, up to 3.5 MSPS |
| DAC | 3 x 12-bit |
| Tensão de alimentação | 1.2 V core / 3.3 V I/O |
| PWM Channels | ePWM with high-resolution extension |
| Communication Interfaces | USB 2.0 FS OTG, CAN, SPI, I2C, UART, McBSP |
| External Memory Interface | EMIF (async + SDRAM) |
| Encapsulamento | 176-HLQFP (24x24 mm) with exposed pad |
| Temperatura de operação | -40 °C to +125 °C |
| Functional Safety | FuSa documentation, IEC 61508 / ISO 26262 support |
Configuração de pinos do TMS320F28379SPTPS
| Pino 1 | VDD — 1.2 V core supply |
| Pino 2 | VSS — Ground |
| Pino 3 | GPIO0 — General-purpose I/O / EPWM1A |
| Pino 4 | GPIO1 — General-purpose I/O / EPWM1B |
| Pino 5 | GPIO2 — General-purpose I/O / EPWM2A |
| Pino 6 | GPIO3 — General-purpose I/O / EPWM2B |
| Pino 7 | GPIO4 — General-purpose I/O / EPWM3A |
| Pino 8 | GPIO5 — General-purpose I/O / EPWM3B |
| Pino 9 | GPIO6 — General-purpose I/O / EPWM4A |
| Pino 10 | GPIO7 — General-purpose I/O / EPWM4B |
| Pino 11 | GPIO8 — General-purpose I/O / EPWM5A |
| Pino 12 | GPIO9 — General-purpose I/O / EPWM5B |
| Pino 13 | GPIO10 — General-purpose I/O / EPWM6A |
| Pino 14 | GPIO11 — General-purpose I/O / EPWM6B |
| Pino 15 | GPIO12 — General-purpose I/O / TZ1 |
| Pino 16 | GPIO13 — General-purpose I/O / TZ2 |
| Pino 17 | GPIO14 — General-purpose I/O / TZ3 |
| Pino 18 | GPIO15 — General-purpose I/O / TZ4 (also XRS during reset) |
| Pino 19 | VDDIO — 3.3 V I/O supply |
| Pino 20 | VSS — Ground |
| Pino 21 | GPIO16 — General-purpose I/O / SPISIMOA |
| Pino 22 | GPIO17 — General-purpose I/O / SPISOMIA |
| Pino 23 | GPIO18 — General-purpose I/O / SPICLKA |
| Pino 24 | GPIO19 — General-purpose I/O / SPISTEA |
| Pino 25 | GPIO20 — General-purpose I/O / EQEP1A |
| Pino 26 | GPIO21 — General-purpose I/O / EQEP1B |
| Pino 27 | GPIO22 — General-purpose I/O / EQEP1I |
| Pino 28 | GPIO23 — General-purpose I/O / EQEP1S |
| Pino 29 | GPIO24 — General-purpose I/O / ECAP1 |
| Pino 30 | GPIO25 — General-purpose I/O / ECAP2 |
| Pino 31 | GPIO26 — General-purpose I/O / ECAP3 |
| Pino 32 | GPIO27 — General-purpose I/O / ECAP4 |
| Pino 33 | GPIO28 — General-purpose I/O / SCIRXDA |
| Pino 34 | GPIO29 — General-purpose I/O / SCITXDA |
| Pino 35 | GPIO30 — General-purpose I/O / CANRXA |
| Pino 36 | GPIO31 — General-purpose I/O / CANTXA |
| Pino 37 | VDD — 1.2 V core supply |
| Pino 38 | VSS — Ground |
| Pino 39 | GPIO32 — General-purpose I/O / SDAA |
| Pino 40 | GPIO33 — General-purpose I/O / SCLA |
| Pino 41 | GPIO34 — General-purpose I/O / EPWM7A |
| Pino 42 | GPIO35 — General-purpose I/O / EPWM7B |
| Pino 43 | GPIO36 — General-purpose I/O / EPWM8A |
| Pino 44 | GPIO37 — General-purpose I/O / EPWM8B |
| Pino 45 | GPIO38 — General-purpose I/O / EPWM9A |
| Pino 46 | GPIO39 — General-purpose I/O / EPWM9B |
| Pino 47 | GPIO40 — General-purpose I/O / EPWM10A |
| Pino 48 | GPIO41 — General-purpose I/O / EPWM10B |
| Pino 49 | GPIO42 — General-purpose I/O / EPWM11A |
| Pino 50 | GPIO43 — General-purpose I/O / EPWM11B |
| Pino 51 | GPIO44 — General-purpose I/O / MDRA |
| Pino 52 | GPIO45 — General-purpose I/O / MDOA |
| Pino 53 | GPIO46 — General-purpose I/O / MDRA / EMIF-related |
| Pino 54 | GPIO47 — General-purpose I/O / MDOA |
| Pino 55 | GPIO48 — General-purpose I/O / EMIF-CSn[0] |
| Pino 56 | GPIO49 — General-purpose I/O / EMIF-CSn[1] |
| Pino 57 | GPIO50 — General-purpose I/O / EMIF-CSn[2] |
| Pino 58 | GPIO51 — General-purpose I/O / EMIF-R/W |
| Pino 59 | GPIO52 — General-purpose I/O / EQEP2A |
| Pino 60 | GPIO53 — General-purpose I/O / EQEP2B |
| Pino 61 | GPIO54 — General-purpose I/O / SPISIMOB |
| Pino 62 | GPIO55 — General-purpose I/O / SPISOMIB |
| Pino 63 | GPIO56 — General-purpose I/O / SPICLKB |
| Pino 64 | GPIO57 — General-purpose I/O / SPISTEB |
| Pino 65 | VDD — 1.2 V core supply |
| Pino 66 | VSS — Ground |
| Pino 67 | GPIO58 — General-purpose I/O / EQEP2I |
| Pino 68 | GPIO59 — General-purpose I/O / EQEP2S |
| Pino 69 | GPIO60 — General-purpose I/O / ECAP5 |
| Pino 70 | GPIO61 — General-purpose I/O / ECAP6 |
| Pino 71 | GPIO62 — General-purpose I/O / SCIRXDB |
| Pino 72 | GPIO63 — General-purpose I/O / SCITXDB |
| Pino 73 | GPIO64 — General-purpose I/O / EMIF-A[0] |
| Pino 74 | GPIO65 — General-purpose I/O / EMIF-A[1] |
| Pino 75 | GPIO66 — General-purpose I/O / EMIF-A[2] |
| Pino 76 | GPIO67 — General-purpose I/O / EMIF-A[3] |
| Pino 77 | GPIO68 — General-purpose I/O / EMIF-A[4] |
| Pino 78 | GPIO69 — General-purpose I/O / EMIF-A[5] |
| Pino 79 | GPIO70 — General-purpose I/O / EMIF-A[6] |
| Pino 80 | GPIO71 — General-purpose I/O / EMIF-A[7] |
| Pino 81 | GPIO72 — General-purpose I/O / CANRXB |
| Pino 82 | GPIO73 — General-purpose I/O / CANTXB |
| Pino 83 | GPIO74 — General-purpose I/O / MCBSP-CLKX |
| Pino 84 | GPIO75 — General-purpose I/O / MCBSP-FSX |
| Pino 85 | GPIO76 — General-purpose I/O / MCBSP-DX |
| Pino 86 | GPIO77 — General-purpose I/O / MCBSP-DR |
| Pino 87 | GPIO78 — General-purpose I/O / EQEP3A |
| Pino 88 | GPIO79 — General-purpose I/O / EQEP3B |
| Pino 89 | GPIO80 — General-purpose I/O / EQEP3I |
| Pino 90 | GPIO81 — General-purpose I/O / EQEP3S |
| Pino 91 | GPIO82 — General-purpose I/O / ECAP7 |
| Pino 92 | GPIO83 — General-purpose I/O / ECAP8 |
| Pino 93 | GPIO84 — General-purpose I/O / McBSP-CLKX |
| Pino 94 | GPIO85 — General-purpose I/O / McBSP-FSX |
| Pino 95 | VDDIO — 3.3 V I/O supply |
| Pino 96 | VSS — Ground |
| Pino 97 | GPIO86 — General-purpose I/O / EMIF-A[8] |
| Pino 98 | GPIO87 — General-purpose I/O / EMIF-A[9] |
| Pino 99 | GPIO88 — General-purpose I/O / EMIF-A[10] |
| Pino 100 | GPIO89 — General-purpose I/O / EMIF-A[11] |
| Pino 101 | GPIO90 — General-purpose I/O / EMIF-A[12] |
| Pino 102 | GPIO91 — General-purpose I/O / EMIF-A[13] |
| Pino 103 | GPIO92 — General-purpose I/O / EMIF-A[14] |
| Pino 104 | GPIO93 — General-purpose I/O / EMIF-A[15] |
| Pino 105 | GPIO94 — General-purpose I/O / EMIF-BA0 |
| Pino 106 | GPIO95 — General-purpose I/O / EMIF-BA1 |
| Pino 107 | GPIO96 — General-purpose I/O / EMIF-D[0] |
| Pino 108 | GPIO97 — General-purpose I/O / EMIF-D[1] |
| Pino 109 | GPIO98 — General-purpose I/O / EMIF-D[2] |
| Pino 110 | GPIO99 — General-purpose I/O / EMIF-D[3] |
| Pino 111 | GPIO100 — General-purpose I/O / EMIF-D[4] |
| Pino 112 | GPIO101 — General-purpose I/O / EMIF-D[5] |
| Pino 113 | GPIO102 — General-purpose I/O / EMIF-D[6] |
| Pino 114 | GPIO103 — General-purpose I/O / EMIF-D[7] |
| Pino 115 | VDD — 1.2 V core supply |
| Pino 116 | VSS — Ground |
| Pino 117 | GPIO104 — General-purpose I/O / EMIF-D[8] |
| Pino 118 | GPIO105 — General-purpose I/O / EMIF-D[9] |
| Pino 119 | GPIO106 — General-purpose I/O / EMIF-D[10] |
| Pino 120 | GPIO107 — General-purpose I/O / EMIF-D[11] |
| Pino 121 | GPIO108 — General-purpose I/O / EMIF-D[12] |
| Pino 122 | GPIO109 — General-purpose I/O / EMIF-D[13] |
| Pino 123 | GPIO110 — General-purpose I/O / EMIF-D[14] |
| Pino 124 | GPIO111 — General-purpose I/O / EMIF-D[15] |
| Pino 125 | GPIO112 — General-purpose I/O / EMIF-CAS |
| Pino 126 | GPIO113 — General-purpose I/O / EMIF-RAS |
| Pino 127 | GPIO114 — General-purpose I/O / EMIF-DQMH |
| Pino 128 | GPIO115 — General-purpose I/O / EMIF-DQML |
| Pino 129 | GPIO116 — General-purpose I/O / USB0PFLT |
| Pino 130 | GPIO117 — General-purpose I/O / USB0PEXT |
| Pino 131 | GPIO118 — General-purpose I/O / USB0ID |
| Pino 132 | GPIO119 — General-purpose I/O / USB0VBUS |
| Pino 133 | GPIO120 — General-purpose I/O / USB0DM |
| Pino 134 | GPIO121 — General-purpose I/O / USB0DP |
| Pino 135 | VDDIO — 3.3 V I/O supply |
| Pino 136 | VSS — Ground |
| Pino 137 | GPIO122 — General-purpose I/O / SD-CSn |
| Pino 138 | GPIO123 — General-purpose I/O / SD-CK |
| Pino 139 | GPIO124 — General-purpose I/O / SD-DI |
| Pino 140 | GPIO125 — General-purpose I/O / SD-DO |
| Pino 141 | GPIO126 — General-purpose I/O / McBSP-CLKR |
| Pino 142 | GPIO127 — General-purpose I/O / McBSP-FSR |
| Pino 143 | XRS — Device reset (active low) |
| Pino 144 | VDDIO — 3.3 V I/O supply |
| Pino 145 | VSS — Ground |
| Pino 146 | GPIO128 — General-purpose I/O / SPIA-CLK alternate |
| Pino 147 | GPIO129 — General-purpose I/O / SPIA-SIMO alternate |
| Pino 148 | GPIO130 — General-purpose I/O / SPIA-SOMI alternate |
| Pino 149 | GPIO131 — General-purpose I/O / SPIA-STE alternate |
| Pino 150 | GPIO132 — General-purpose I/O / I2C-SDA |
| Pino 151 | GPIO133 — General-purpose I/O / I2C-SCL |
| Pino 152 | GPIO134 — General-purpose I/O / ECAP9 |
| Pino 153 | GPIO135 — General-purpose I/O / ECAP10 |
| Pino 154 | VDD — 1.2 V core supply |
| Pino 155 | VSS — Ground |
| Pino 156 | GPIO136 — General-purpose I/O / ECAP11 |
| Pino 157 | GPIO137 — General-purpose I/O / ECAP12 |
| Pino 158 | GPIO138 — General-purpose I/O / ECAP13 |
| Pino 159 | GPIO139 — General-purpose I/O / ECAP14 |
| Pino 160 | GPIO140 — General-purpose I/O / SCIRXDC |
| Pino 161 | GPIO141 — General-purpose I/O / SCITXDC |
| Pino 162 | GPIO142 — General-purpose I/O / I2C-SDA1 |
| Pino 163 | GPIO143 — General-purpose I/O / I2C-SCL1 |
| Pino 164 | VDDIO — 3.3 V I/O supply |
| Pino 165 | VSS — Ground |
| Pino 166 | GPIO144 — General-purpose I/O / ECAP15 |
| Pino 167 | GPIO145 — General-purpose I/O / TZ5 |
| Pino 168 | GPIO146 — General-purpose I/O / TZ6 |
| Pino 169 | GPIO147 — General-purpose I/O / TZ7 |
| Pino 170 | GPIO148 — General-purpose I/O / TZ8 |
| Pino 171 | GPIO149 — General-purpose I/O / McBSP-CLKR1 |
| Pino 172 | GPIO150 — General-purpose I/O / McBSP-FSR1 |
| Pino 173 | GPIO151 — General-purpose I/O / McBSP-DR1 |
| Pino 174 | GPIO152 — General-purpose I/O / McBSP-DX1 |
| Pino 175 | GPIO153 — General-purpose I/O / XCLKOUT |
| Pino 176 | EP — Exposed thermal pad - solder to ground plane |
Aplicações típicas
TMS320F28379SPTPS é adequado para 7 aplicaçãos: Industrial Servo Drives and PMSM Motor Control, Solar Photovoltaic Inverters and DC/DC Converters, On-Board Chargers (OBC) for EV/HEV, Telecom Rectifier and Digital Power Conversion, Industrial Welding and Plasma Power Supplies, Medical Imaging and Diagnostic Equipment, Aviation and Aerospace Power Conversion.
Industrial Servo Drives and PMSM Motor Control
The TMS320F28379SPTPS is purpose-built for high-performance PMSM and AC induction motor control. Its 200 MHz C28x CPU plus 200 MHz CLA coprocessor execute field-oriented control (FOC) loops in parallel, achieving sub-microsecond torque-loop bandwidth. The 16-bit ADC at 3.5 MSPS captures phase currents with sufficient resolution for high-speed FOC, while the high-resolution ePWM module generates switching frequencies beyond 200 kHz for low-EMI, high-efficiency inverters. Compared with a Cortex-M4F MCU, the 28379S offers dedicated motor-control peripherals and a CLA that runs deterministic control math without CPU contention, making it a top choice for industrial servo, robotics and CNC machines.
Recomendado
Solar Photovoltaic Inverters and DC/DC Converters
In PV inverter and bidirectional DC/DC converter designs, the TMS320F28379SPTPS performs MPPT, inverter modulation and grid-synchronization control. Its FPU handles fast trigonometric math for SVPWM, while the TMU accelerates sin/cos/atan calculations used in PLL and grid-current shaping. The EMIF allows external SDRAM buffering of grid-waveform data, and the 12-bit DACs drive analog setpoints or reference signals. Engineers pick this MCU over generic ARM parts because the integrated CLA removes CPU bottlenecks when running MPPT, PLL and current loop concurrently at 16-32 kHz switching frequencies.
Recomendado
On-Board Chargers (OBC) for EV/HEV
The TMS320F28379SPTPS powers digital-control onboard chargers and traction inverter controllers for electric vehicles. Its functional-safety package (IEC 61508 / ISO 26262 alignment, ECC on flash and SRAM, dual-zone watchdog) supports ASIL-D system-level designs when paired with a safety companion MCU. The 1 MB flash holds OBC state machines, PFC algorithms and LLC or DAB control code, while the CLA offloads the high-frequency current loop. Compared with smaller C2000 parts, the 28379S provides the memory headroom for advanced charging profiles such as ISO 15118 and V2G negotiation stacks.
Recomendado
Telecom Rectifier and Digital Power Conversion
In 48 V telecom rectifier and intermediate-bus converter modules, the TMS320F28379SPTPS drives digital PFC and LLC resonant topologies. The ePWM high-resolution module produces phase-shifted PWM with picosecond-edge placement, which improves LLC efficiency and reduces circulating current. USB 2.0 OTG enables firmware updates in the field, while the EMIF allows external NVM to log PMBus telemetry. Versus a fixed-function PFC controller, this MCU lets designers add adaptive dead-time optimization, dynamic efficiency scaling and digital soft-start without external logic.
Recomendado
Industrial Welding and Plasma Power Supplies
Welding inverters and plasma-cut power supplies demand tightly-regulated arc current and fast dynamic response, both delivered by the TMS320F28379SPTPS. The CLA handles the arc-current loop while the CPU runs the user-interface, current-shaping profile and protection logic. The 16-bit ADC measures arc voltage and current at high sample rates, and the CLB implements custom comparator logic for arc-detection. This MCU is preferred over slower Cortex-M parts because its deterministic interrupt latency and high-resolution PWM enable arc stability at low current setpoints.
Recomendado
Medical Imaging and Diagnostic Equipment
In medical imaging front-ends (ultrasound beamformers, MRI gradient controllers) and laboratory diagnostic instruments, the TMS320F28379SPTPS provides DSP-class performance with the safety documentation required by IEC 60601 / IEC 61508. Its 200 MHz CPU plus CLA deliver deterministic signal-processing throughput, and the 1 MB flash allows firmware-resident calibration tables. The 12-bit DACs and 16-bit ADCs interface directly with transducer analog front-ends, eliminating external DSP chips. Compared with generic MCUs, the 28379S offers functional-safety collateral that reduces system-level certification cost.
Recomendado
Aviation and Aerospace Power Conversion
The TMS320F28379SPTPS appears in aviation and aerospace power-electronics modules, including 28 V DC-to-DC converters for avionics, electric-actuation motor controllers and flight-control actuators. Its -40 °C to +125 °C operating range covers aerospace thermal environments, and the functional-safety package supports DO-178C and DO-254 hardware development when paired with documented software processes. The 1 MB flash accommodates DO-178C firmware with margin, while the CLA enables parallel execution of control and health-monitoring loops on a single MCU, reducing board area and weight.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para TMS320F28379SPTPS — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | TMS320F28379SPTPT | TMS320F28379DPTPS | TMS320F28379SPZPS | TMS320F28377SPTPS | TMS320F28376DPTPS |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 176-HLQFP (24x24) | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same | 176-HLQFP (24x24) - same |
| Core | C28x 32-bit + CLA | C28x 32-bit + CLA | C28x 32-bit dual-core + CLA | C28x 32-bit + CLA | C28x 32-bit + CLA | C28x 32-bit dual-core + CLA |
| Operating Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB (-50%) |
| SRAM | 164 KB | 164 KB | 164 KB | 164 KB | 164 KB | 102 KB |
| Functional Safety | FuSa single-core | FuSa single-core | Dual-core lockstep | FuSa single-core | FuSa single-core | Dual-core lockstep |
| ADC | 16-bit, 3.5 MSPS | 16-bit, 3.5 MSPS | 16-bit, 3.5 MSPS | 16-bit, 3.5 MSPS | 16-bit, 3.0 MSPS | 16-bit, 3.0 MSPS |
| CLB (Configurable Logic Block) | Yes | Yes | Yes | Yes | Reduced | Reduced |
| Approx. Unit Price (qty 1) | $38.42 | $38.42 (same) | $48-52 (est.) | $38.42 (same) | $30-34 (est.) | $42-46 (est.) |
Principais diferenciais
- Dual-processor architecture with independent CLA coprocessor (vs TMS320F28376DPTPS)
- 1 MB ECC flash vs reduced flash on lower-tier C2000s (vs TMS320F28376DPTPS)
- Configurable Logic Block (CLB) on-chip (vs TMS320F28377SPTPS)
Notas de projeto
The TMS320F28379SPTPS requires a 1.2 V core rail and a 3.3 V I/O rail. Per TI's TMS320F2837xS datasheet, decouple each VDD pin with a 0.1 µF ceramic placed within 5 mm of the lead, and add a single 10 µF bulk ceramic on each rail. Power-up sequencing: 3.3 V must ramp before or simultaneously with 1.2 V; failure to do so risks ESD-diode latch-up. Use a power-supply supervisor (e.g. TPS3823) to hold the XRS reset pin low until both rails reach regulation.
Estimated: at 200 MHz CPU + 200 MHz CLA with 1.2 V core draw of roughly 350 mA active, internal dissipation is about 0.42 W. The 176-HLQFP with exposed pad has θJA ≈ 18 °C/W on a JEDEC 4-layer board with a 9-thermal-via array under the EP. Junction temperature rise is therefore roughly 7.6 °C above ambient, comfortably within the -40 °C to +125 °C operating range. Solder the exposed pad to a continuous copper plane of at least 1 square inch with ≥9 thermal vias to a bottom-side heat-spreader for reliable operation in enclosed industrial enclosures.
Route the analog ADC inputs and the digital GPIO traces on separate layers to minimize digital-to-analog coupling. TI's Hardware Design Guide for F2837xS recommends a 4-layer stack-up with the top layer dedicated to MCU routing and a dedicated ground layer directly underneath. Keep the 16 MHz crystal traces within 5 mm of the X1/X2 pins, surrounded by a ground guard ring. The EMIF bus to external SDRAM should be length-matched within ±50 mil across D[0:15], address and control lines; otherwise double-data-rate read/write strobes can fail timing margins.
Avoid using the GPIO pins in their default boot-mode configuration without consulting the GPIO mux table - several pins default to JTAG or EMIF functions and will not behave as plain GPIO on reset. Always read the Boot-ROM configuration in the datasheet to ensure the GPIO you intend to use is not held by the boot-mode pull-ups. A second common pitfall is omitting the boot-mode pull-down on the TRST pin; this can cause JTAG to enter an undefined state and lock up the debug port. Add a 2.2 kΩ pull-down on TRST if JTAG is unused in production.
Informações de conformidade
Functional-safety documentation aligned with IEC 61508 and ISO 26262 available from TI per the C2000 Safety Package; AEC-Q100 is not applicable as this is an industrial-grade MCU. Halogen-free per TI's product environmental compliance report.
