TPS53315 - 12A D-CAP Sync Buck Regulator | Texas Instruments
Référence : TPS53315 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.88 | $48,80 |
| 100 | $4.35 | $435,00 |
| 500 | $3.91 | $1 955,00 |
| 1 000 | $3.52 | $3 520,00 |
TPS53315 Présentation
A DC-DC switching regulator (specifically a synchronous buck converter) steps a higher input voltage down to a regulated lower output voltage using integrated power MOSFETs and an external inductor. The D-CAP control topology uses an internally compensated, constant-on-time architecture that eliminates complex external compensation networks and delivers excellent load transient response, placing the TPS53315 high in the power management IC hierarchy: buck converter -> switching regulator -> DC-DC converter -> PMIC.
Key features include up to 12 A of continuous output current, one 19-mOhm high-side and one 7-mOhm low-side integrated MOSFET, an accurate 1% 0.6-V voltage reference, and an integrated boost switch for the high-side gate drive. The conversion input voltage range spans 3 V to 15 V, while the supply voltage (VDD) range is 4.5 V to 25 V, allowing a single rail to power both control and conversion stages in many systems.
Architecturally, the D-CAP constant-on-time scheme provides near-constant switching frequency with fast transient response and low output ripple, requiring only a small set of external components: input/output capacitors, an inductor, and a feedback divider. This minimizes BOM cost and PCB area compared to traditional voltage-mode controllers with external FETs.
Typical applications include point-of-load power for DSPs, FPGAs, and ASICs in networking, telecom, industrial, and computing equipment, where multi-amp core or I/O rails must be generated efficiently from a 5 V or 12 V intermediate bus. It also suits distributed power architectures and dense server memory rails.
Design consideration: with 12 A output in a compact VQFN-40 package, PCB thermal design is critical - use generous copper pour on the exposed pad and follow the TI datasheet layout guidelines for the power stage loop to minimize EMI and voltage spikes.
Alternatives de remplacement direct pour TPS53315 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TPS53315 (même facteur de forme et même empreinte) — différant par Operating Temperature Range, Output Voltage Range, Package, Topology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TPS53314RGFR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS53319RGFR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TPS53318RGFR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TPS53315 Valeurs maximales et caractéristiques électriques
| Topologie | Synchronous step-down (buck), D-CAP mode |
| Courant de sortie maximal | 12 A |
| Plage de tension de sortie | 0.6 V to 5.5 V (adjustable) |
| Conversion Input Voltage Range | 3 V to 15 V |
| Supply Voltage (VDD) Range | 4.5 V to 25 V |
| Voltage Reference | 0.6 V, 1% accuracy |
| Résistance à l'état passant du MOSFET côté haut | 19 mOhm (integrated) |
| Résistance à l'état passant du MOSFET côté bas | 7 mOhm (integrated) |
| Control Topology | D-CAP constant-on-time, internally compensated |
| Nombre de sorties | 1 |
| Integrated Boost Switch | Yes |
| Single-Rail Input Support | Yes |
| Plage de température de fonctionnement | -40C to +85C |
| Boîtier | 40-VQFN exposed pad, 5 mm x 7 mm (RGF) |
| Type de montage | Surface Mount |
| Regulator Type | Positive adjustable buck switching regulator |
Guide de configuration des broches du TPS53315 40-vqfn exposed pad, 5 mm x 7 mm (rgf)
Configuration des broches du TPS53315 (boîtier 40-vqfn exposed pad, 5 mm x 7 mm (rgf)). Ce composant de puissance comporte des bornes de grille, de drain et de source. Pour les boîtiers non polarisés, consultez la fiche technique du fabricant pour l'orientation exacte de la broche 1 et les détails de l'empreinte. Les applications courantes incluent la conception d'alimentations, la commande de moteurs et la commutation de charges.
Aucune donnée de brochage détaillée disponible pour TPS53315.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
TPS53315 convient pour 6 applications: FPGA/DSP Core Power, Networking and Telecom Equipment, Server Memory Rail Power, Industrial Point-of-Load, Test and Measurement Instrumentation, Distributed Power Architecture Bricks.
FPGA/DSP Core Power
The TPS53315 generates 0.9 V to 1.2 V core rails at up to 12 A for FPGAs and DSPs from a 5 V or 12 V intermediate bus. Its D-CAP constant-on-time control provides fast load transient response, which is essential when FPGA fabric currents step by several amps in nanoseconds during logic switching. The 1% 0.6-V reference keeps the tight core-voltage window within specification.
Recommandé
Networking and Telecom Equipment
In switches, routers, and baseband cards, the TPS53315 efficiently converts a 12 V distributed bus into low-voltage ASIC and PHY rails. Single-rail input support (VDD up to 25 V) removes the need for a separate control-supply rail, and the integrated 19/7-mOhm MOSFETs shrink the power stage to one inductor plus capacitors, fitting dense line-card layouts.
Recommandé
Server Memory Rail Power
DDR3L/DDR4 memory rails (1.35 V, 1.2 V) draw multi-amp aggregate current in servers. The TPS53315 supplies these rails with low output ripple thanks to D-CAP control, and its adjustable output down to 0.6 V covers VDDQ and termination-style rails. The compact 5 mm x 7 mm VQFN conserves board area around dense DIMM routing.
Recommandé
Industrial Point-of-Load
Industrial automation controllers and motor-drive logic boards use the TPS53315 to step 12 V or 15 V rails down to 3.3 V or 5 V I/O power at high current. The -40C to +85C operating range suits factory-floor temperature conditions, and the internally compensated D-CAP topology simplifies qualification by minimizing external component count and tuning effort.
Recommandé
Test and Measurement Instrumentation
Bench instruments and modular test systems need clean, stable multi-amp digital rails for processors and FPGAs. The TPS53315's fast transient response limits rail droop during sudden processing bursts, and its 12 A capacity covers processor core loads. Low external BOM count aids modular power-carrier designs where board space and serviceability matter.
Recommandé
Distributed Power Architecture Bricks
Downstream of an isolated 12 V brick, multiple TPS53315 devices create distributed point-of-load rails across a backplane card. Using one device per rail simplifies current sharing design versus a single multiphase stage, and the constant-on-time scheme keeps switching behavior stable across the 3 V to 15 V conversion input range with modest ceramic output capacitance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TPS53315 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TPS53314RGFR | TPS53319RGFR | TPS53318RGFR |
|---|---|---|---|---|
| Package | 40-VQFN (RGF) 5x7 mm | 40-VQFN (RGF) 5x7 mm - same | 40-VQFN (RGF) 5x7 mm - same | 40-VQFN (RGF) 5x7 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Control Topology | D-CAP constant-on-time | D-CAP constant-on-time | D-CAP constant-on-time | D-CAP family |
Principaux différenciateurs
- Higher 12 A output capacity (vs TPS53314RGFR)
- Integrated MOSFETs and boost switch (vs external-FET controllers)
- Internally compensated D-CAP control (vs voltage-mode controllers)
Notes de conception
At 12 A output in a 5 mm x 7 mm VQFN-40, conduction losses in the integrated 19-mOhm high-side and 7-mOhm low-side MOSFETs can raise junction temperature significantly at high duty cycles. Maximize copper area under the exposed pad - at least 2 oz copper with multiple thermal vias to inner planes - and verify junction temperature stays within the -40C to +85C specification at worst-case load and ambient.
Minimize the power loop: place the input capacitors, the TPS53315 VIN/GND pins, and the inductor as close together as possible to reduce parasitic inductance and switching spikes. Follow the TI datasheet layout example: wide short traces for SW, solid ground plane under the power stage, and sensitive analog pins (VFB, EN) routed away from the switch node.
The D-CAP topology requires sufficient output capacitor ESR stability criteria - follow the datasheet recommended output capacitance range for the chosen output voltage; too little capacitance or pure low-ESR ceramics without the recommended network can cause instability at light load. Also ensure VDD stays within 4.5 V to 25 V and the boost (BST) capacitor is properly connected for high-side drive.
Informations de conformité
RoHS/lead-free indicated by TI product data. REACH, halogen-free, and conflict minerals status should be confirmed via TI official environmental documentation.
