TPS53315 - 12A D-CAP Sync Buck Regulator | Texas Instruments
MPN: TPS53315 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.88 | $48.80 |
| 100 | $4.35 | $435.00 |
| 500 | $3.91 | $1,955.00 |
| 1,000 | $3.52 | $3,520.00 |
TPS53315 Overview
A DC-DC switching regulator (specifically a synchronous buck converter) steps a higher input voltage down to a regulated lower output voltage using integrated power MOSFETs and an external inductor. The D-CAP control topology uses an internally compensated, constant-on-time architecture that eliminates complex external compensation networks and delivers excellent load transient response, placing the TPS53315 high in the power management IC hierarchy: buck converter -> switching regulator -> DC-DC converter -> PMIC.
Key features include up to 12 A of continuous output current, one 19-mOhm high-side and one 7-mOhm low-side integrated MOSFET, an accurate 1% 0.6-V voltage reference, and an integrated boost switch for the high-side gate drive. The conversion input voltage range spans 3 V to 15 V, while the supply voltage (VDD) range is 4.5 V to 25 V, allowing a single rail to power both control and conversion stages in many systems.
Architecturally, the D-CAP constant-on-time scheme provides near-constant switching frequency with fast transient response and low output ripple, requiring only a small set of external components: input/output capacitors, an inductor, and a feedback divider. This minimizes BOM cost and PCB area compared to traditional voltage-mode controllers with external FETs.
Typical applications include point-of-load power for DSPs, FPGAs, and ASICs in networking, telecom, industrial, and computing equipment, where multi-amp core or I/O rails must be generated efficiently from a 5 V or 12 V intermediate bus. It also suits distributed power architectures and dense server memory rails.
Design consideration: with 12 A output in a compact VQFN-40 package, PCB thermal design is critical - use generous copper pour on the exposed pad and follow the TI datasheet layout guidelines for the power stage loop to minimize EMI and voltage spikes.
Drop-in alternatives for TPS53315 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TPS53315 (same form factor and footprint) — differing in Operating Temperature Range, Output Voltage Range, Package, Topology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TPS53314RGFR
✅ Drop-In📋 Reference alternative (not in catalog)
TPS53319RGFR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TPS53318RGFR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TPS53315 Maximum Ratings & Electrical Characteristics
| Topology | Synchronous step-down (buck), D-CAP mode |
| Maximum Output Current | 12 A |
| Output Voltage Range | 0.6 V to 5.5 V (adjustable) |
| Conversion Input Voltage Range | 3 V to 15 V |
| Supply Voltage (VDD) Range | 4.5 V to 25 V |
| Voltage Reference | 0.6 V, 1% accuracy |
| High-Side MOSFET On-Resistance | 19 mOhm (integrated) |
| Low-Side MOSFET On-Resistance | 7 mOhm (integrated) |
| Control Topology | D-CAP constant-on-time, internally compensated |
| Number of Outputs | 1 |
| Integrated Boost Switch | Yes |
| Single-Rail Input Support | Yes |
| Operating Temperature Range | -40C to +85C |
| Package | 40-VQFN exposed pad, 5 mm x 7 mm (RGF) |
| Mounting Type | Surface Mount |
| Regulator Type | Positive adjustable buck switching regulator |
TPS53315 40-vqfn exposed pad, 5 mm x 7 mm (rgf) Pin Configuration Guide
Pin configuration for TPS53315 (40-vqfn exposed pad, 5 mm x 7 mm (rgf) package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for TPS53315.
Refer to the datasheet for full pin configuration.
Typical Applications
TPS53315 is suitable for 6 applications: FPGA/DSP Core Power, Networking and Telecom Equipment, Server Memory Rail Power, Industrial Point-of-Load, Test and Measurement Instrumentation, Distributed Power Architecture Bricks.
FPGA/DSP Core Power
The TPS53315 generates 0.9 V to 1.2 V core rails at up to 12 A for FPGAs and DSPs from a 5 V or 12 V intermediate bus. Its D-CAP constant-on-time control provides fast load transient response, which is essential when FPGA fabric currents step by several amps in nanoseconds during logic switching. The 1% 0.6-V reference keeps the tight core-voltage window within specification.
Recommended
Networking and Telecom Equipment
In switches, routers, and baseband cards, the TPS53315 efficiently converts a 12 V distributed bus into low-voltage ASIC and PHY rails. Single-rail input support (VDD up to 25 V) removes the need for a separate control-supply rail, and the integrated 19/7-mOhm MOSFETs shrink the power stage to one inductor plus capacitors, fitting dense line-card layouts.
Recommended
Server Memory Rail Power
DDR3L/DDR4 memory rails (1.35 V, 1.2 V) draw multi-amp aggregate current in servers. The TPS53315 supplies these rails with low output ripple thanks to D-CAP control, and its adjustable output down to 0.6 V covers VDDQ and termination-style rails. The compact 5 mm x 7 mm VQFN conserves board area around dense DIMM routing.
Recommended
Industrial Point-of-Load
Industrial automation controllers and motor-drive logic boards use the TPS53315 to step 12 V or 15 V rails down to 3.3 V or 5 V I/O power at high current. The -40C to +85C operating range suits factory-floor temperature conditions, and the internally compensated D-CAP topology simplifies qualification by minimizing external component count and tuning effort.
Recommended
Test and Measurement Instrumentation
Bench instruments and modular test systems need clean, stable multi-amp digital rails for processors and FPGAs. The TPS53315's fast transient response limits rail droop during sudden processing bursts, and its 12 A capacity covers processor core loads. Low external BOM count aids modular power-carrier designs where board space and serviceability matter.
Recommended
Distributed Power Architecture Bricks
Downstream of an isolated 12 V brick, multiple TPS53315 devices create distributed point-of-load rails across a backplane card. Using one device per rail simplifies current sharing design versus a single multiphase stage, and the constant-on-time scheme keeps switching behavior stable across the 3 V to 15 V conversion input range with modest ceramic output capacitance.
Recommended
Recommended Products Summary
Engineering reference data for TPS53315 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TPS53314RGFR | TPS53319RGFR | TPS53318RGFR |
|---|---|---|---|---|
| Package | 40-VQFN (RGF) 5x7 mm | 40-VQFN (RGF) 5x7 mm - same | 40-VQFN (RGF) 5x7 mm - same | 40-VQFN (RGF) 5x7 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Control Topology | D-CAP constant-on-time | D-CAP constant-on-time | D-CAP constant-on-time | D-CAP family |
Key Differentiators
- Higher 12 A output capacity (vs TPS53314RGFR)
- Integrated MOSFETs and boost switch (vs external-FET controllers)
- Internally compensated D-CAP control (vs voltage-mode controllers)
Design Notes
At 12 A output in a 5 mm x 7 mm VQFN-40, conduction losses in the integrated 19-mOhm high-side and 7-mOhm low-side MOSFETs can raise junction temperature significantly at high duty cycles. Maximize copper area under the exposed pad - at least 2 oz copper with multiple thermal vias to inner planes - and verify junction temperature stays within the -40C to +85C specification at worst-case load and ambient.
Minimize the power loop: place the input capacitors, the TPS53315 VIN/GND pins, and the inductor as close together as possible to reduce parasitic inductance and switching spikes. Follow the TI datasheet layout example: wide short traces for SW, solid ground plane under the power stage, and sensitive analog pins (VFB, EN) routed away from the switch node.
The D-CAP topology requires sufficient output capacitor ESR stability criteria - follow the datasheet recommended output capacitance range for the chosen output voltage; too little capacitance or pure low-ESR ceramics without the recommended network can cause instability at light load. Also ensure VDD stays within 4.5 V to 25 V and the boost (BST) capacitor is properly connected for high-side drive.
Compliance Information
RoHS/lead-free indicated by TI product data. REACH, halogen-free, and conflict minerals status should be confirmed via TI official environmental documentation.
