TPS53315 - 12A D-CAP Sync Buck Regulator | Texas Instruments
Teilenummer: TPS53315 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.88 | $48,80 |
| 100 | $4.35 | $435,00 |
| 500 | $3.91 | $1.955,00 |
| 1.000 | $3.52 | $3.520,00 |
TPS53315 Übersicht
A DC-DC switching regulator (specifically a synchronous buck converter) steps a higher input voltage down to a regulated lower output voltage using integrated power MOSFETs and an external inductor. The D-CAP control topology uses an internally compensated, constant-on-time architecture that eliminates complex external compensation networks and delivers excellent load transient response, placing the TPS53315 high in the power management IC hierarchy: buck converter -> switching regulator -> DC-DC converter -> PMIC.
Key features include up to 12 A of continuous output current, one 19-mOhm high-side and one 7-mOhm low-side integrated MOSFET, an accurate 1% 0.6-V voltage reference, and an integrated boost switch for the high-side gate drive. The conversion input voltage range spans 3 V to 15 V, while the supply voltage (VDD) range is 4.5 V to 25 V, allowing a single rail to power both control and conversion stages in many systems.
Architecturally, the D-CAP constant-on-time scheme provides near-constant switching frequency with fast transient response and low output ripple, requiring only a small set of external components: input/output capacitors, an inductor, and a feedback divider. This minimizes BOM cost and PCB area compared to traditional voltage-mode controllers with external FETs.
Typical applications include point-of-load power for DSPs, FPGAs, and ASICs in networking, telecom, industrial, and computing equipment, where multi-amp core or I/O rails must be generated efficiently from a 5 V or 12 V intermediate bus. It also suits distributed power architectures and dense server memory rails.
Design consideration: with 12 A output in a compact VQFN-40 package, PCB thermal design is critical - use generous copper pour on the exposed pad and follow the TI datasheet layout guidelines for the power stage loop to minimize EMI and voltage spikes.
Drop-in-Alternativen für TPS53315 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit TPS53315 (gleiche Bauform und Footprint) – abweichend in Operating Temperature Range, Output Voltage Range, Package, Topology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TPS53314RGFR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TPS53319RGFR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TPS53318RGFR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TPS53315 Grenzwerte & elektrische Eigenschaften
| Topologie | Synchronous step-down (buck), D-CAP mode |
| Maximaler Ausgangsstrom | 12 A |
| Ausgangsspannungsbereich | 0.6 V to 5.5 V (adjustable) |
| Conversion Input Voltage Range | 3 V to 15 V |
| Supply Voltage (VDD) Range | 4.5 V to 25 V |
| Voltage Reference | 0.6 V, 1% accuracy |
| Einschaltwiderstand des High-Side-MOSFET | 19 mOhm (integrated) |
| Einschaltwiderstand des Low-Side-MOSFET | 7 mOhm (integrated) |
| Control Topology | D-CAP constant-on-time, internally compensated |
| Anzahl der Ausgänge | 1 |
| Integrated Boost Switch | Yes |
| Single-Rail Input Support | Yes |
| Betriebstemperaturbereich | -40C to +85C |
| Gehäuse | 40-VQFN exposed pad, 5 mm x 7 mm (RGF) |
| Montageart | Surface Mount |
| Regulator Type | Positive adjustable buck switching regulator |
TPS53315 40-vqfn exposed pad, 5 mm x 7 mm (rgf) Pinbelegungsleitfaden
Pinbelegung für TPS53315 (40-vqfn exposed pad, 5 mm x 7 mm (rgf)-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für TPS53315.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TPS53315 ist geeignet für 6 Anwendungs: FPGA/DSP Core Power, Networking and Telecom Equipment, Server Memory Rail Power, Industrial Point-of-Load, Test and Measurement Instrumentation, Distributed Power Architecture Bricks.
FPGA/DSP Core Power
The TPS53315 generates 0.9 V to 1.2 V core rails at up to 12 A for FPGAs and DSPs from a 5 V or 12 V intermediate bus. Its D-CAP constant-on-time control provides fast load transient response, which is essential when FPGA fabric currents step by several amps in nanoseconds during logic switching. The 1% 0.6-V reference keeps the tight core-voltage window within specification.
Empfohlen
Networking and Telecom Equipment
In switches, routers, and baseband cards, the TPS53315 efficiently converts a 12 V distributed bus into low-voltage ASIC and PHY rails. Single-rail input support (VDD up to 25 V) removes the need for a separate control-supply rail, and the integrated 19/7-mOhm MOSFETs shrink the power stage to one inductor plus capacitors, fitting dense line-card layouts.
Empfohlen
Server Memory Rail Power
DDR3L/DDR4 memory rails (1.35 V, 1.2 V) draw multi-amp aggregate current in servers. The TPS53315 supplies these rails with low output ripple thanks to D-CAP control, and its adjustable output down to 0.6 V covers VDDQ and termination-style rails. The compact 5 mm x 7 mm VQFN conserves board area around dense DIMM routing.
Empfohlen
Industrial Point-of-Load
Industrial automation controllers and motor-drive logic boards use the TPS53315 to step 12 V or 15 V rails down to 3.3 V or 5 V I/O power at high current. The -40C to +85C operating range suits factory-floor temperature conditions, and the internally compensated D-CAP topology simplifies qualification by minimizing external component count and tuning effort.
Empfohlen
Test and Measurement Instrumentation
Bench instruments and modular test systems need clean, stable multi-amp digital rails for processors and FPGAs. The TPS53315's fast transient response limits rail droop during sudden processing bursts, and its 12 A capacity covers processor core loads. Low external BOM count aids modular power-carrier designs where board space and serviceability matter.
Empfohlen
Distributed Power Architecture Bricks
Downstream of an isolated 12 V brick, multiple TPS53315 devices create distributed point-of-load rails across a backplane card. Using one device per rail simplifies current sharing design versus a single multiphase stage, and the constant-on-time scheme keeps switching behavior stable across the 3 V to 15 V conversion input range with modest ceramic output capacitance.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TPS53315 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TPS53314RGFR | TPS53319RGFR | TPS53318RGFR |
|---|---|---|---|---|
| Package | 40-VQFN (RGF) 5x7 mm | 40-VQFN (RGF) 5x7 mm - same | 40-VQFN (RGF) 5x7 mm - same | 40-VQFN (RGF) 5x7 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Control Topology | D-CAP constant-on-time | D-CAP constant-on-time | D-CAP constant-on-time | D-CAP family |
Wichtigste Unterscheidungsmerkmale
- Higher 12 A output capacity (vs. TPS53314RGFR)
- Integrated MOSFETs and boost switch (vs. external-FET controllers)
- Internally compensated D-CAP control (vs. voltage-mode controllers)
Designhinweise
At 12 A output in a 5 mm x 7 mm VQFN-40, conduction losses in the integrated 19-mOhm high-side and 7-mOhm low-side MOSFETs can raise junction temperature significantly at high duty cycles. Maximize copper area under the exposed pad - at least 2 oz copper with multiple thermal vias to inner planes - and verify junction temperature stays within the -40C to +85C specification at worst-case load and ambient.
Minimize the power loop: place the input capacitors, the TPS53315 VIN/GND pins, and the inductor as close together as possible to reduce parasitic inductance and switching spikes. Follow the TI datasheet layout example: wide short traces for SW, solid ground plane under the power stage, and sensitive analog pins (VFB, EN) routed away from the switch node.
The D-CAP topology requires sufficient output capacitor ESR stability criteria - follow the datasheet recommended output capacitance range for the chosen output voltage; too little capacitance or pure low-ESR ceramics without the recommended network can cause instability at light load. Also ensure VDD stays within 4.5 V to 25 V and the boost (BST) capacitor is properly connected for high-side drive.
Compliance-Informationen
RoHS/lead-free indicated by TI product data. REACH, halogen-free, and conflict minerals status should be confirmed via TI official environmental documentation.
