XC3090L-8TQ144I - 6K-Gate CMOS FPGA, 80 MHz, 144-TQFP | Xilinx
Référence : XC3090L-8TQ144I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $63.85 | $6 385,00 |
| 500 | $57.4 | $28 700,00 |
| 1 000 | $51.95 | $51 950,00 |
XC3090L-8TQ144I Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of an array of programmable logic blocks interconnected by a configurable routing matrix. FPGAs sit within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits. The XC3000 series from Xilinx is one of the earliest commercially successful SRAM-based FPGA architectures, predating modern families such as Spartan and Artix, and remains relevant for long-lifecycle industrial, military, and legacy retrofit designs.
Key electrical characteristics include 8 mA output sink and source drive capability, a maximum quiescent current of 5 mA during power-down, and full architecture and pin-out compatibility with sibling XC3000A/L and XC3100A/L devices. The 'L' suffix denotes a low-voltage 3.3 V core supply, while the 'I' suffix indicates the industrial -40 C to +85 C operating temperature grade and the '8' speed grade defines the timing bin.
Architecturally, the XC3090L uses a symmetrical 22 x 22 CLB matrix with on-chip distributed interconnect, tri-state buffers on every I/O, and dedicated global clock buffers. The device is configured at power-up from an external serial or parallel PROM (e.g., XC1736, XC1765), and configuration bitstreams are identical in pinout across the XC3000L and XC3100L families, easing migration.
Typical applications include industrial control glue logic, legacy telecommunications backplane interfaces, test-and-measurement instrumentation, and aerospace retrofits requiring pin-compatible drop-in replacements for end-of-life XC3000 designs. The XC3090L-8TQ144I is well suited to low-to-medium complexity glue logic, bus interfacing, and state-machine control where non-volatility, in-system reprogrammability, and 3.3 V operation are required.
When designing with this device, ensure the configuration interface (mode pins M0/M1/M2 and DONE) is properly terminated, and that decoupling includes a 0.1 uF and 10 uF capacitor pair adjacent to every VCC/ground pair. Long-lifecycle users should also note that this part is mature silicon and is best sourced from authorized distributors or franchised brokers with full traceability.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone.
Alternatives de remplacement direct pour XC3090L-8TQ144I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3090L-8TQ144I (même facteur de forme et même empreinte) — différant par Family, Package, Mounting Type, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3090L-8TQ144C
✅ Remplacement direct✓ En stock
$25 / unité
Voir la fiche technique →XC3090L-7TQ176I
✅ Remplacement direct✓ En stock
$55.2 / unité
Voir la fiche technique →XC3195A-8TQ144C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3090L-8TQ144I Valeurs maximales et caractéristiques électriques
| Family | XC3000L |
| Device Type | Field Programmable Gate Array (FPGA) |
| Number of CLBs | 320 |
| Maximum Usable Gates | 6000 |
| Nominal Equivalent Gate Count | 5000 |
| System Clock Rate | 50 to 85 MHz |
| Flip-Flop Toggle Rate | 190 to 370 MHz |
| Logic Delay | 1.55 to 4.1 ns |
| Tension d'alimentation | 3.3 V |
| Output Sink Current | 8 mA |
| Output Source Current | 8 mA |
| Quiescent / Power-Down Current (max) | 5 mA |
| Operating Temperature Grade | Industrial (-40 C to +85 C) |
| Boîtier | TQFP-144 (TQ144, LFQFP, gull-wing) |
| Process Technology | CMOS, SRAM-based configuration |
| Configuration Interface | Serial/parallel master/slave modes via external PROM |
| Architecture Compatibility | XC3000A, XC3000L, XC3100A, XC3100L families |
| Type de montage | Surface Mount (gull-wing) |
Configuration des broches de XC3090L-8TQ144I
| Broche 1 | I/O — User I/O pin |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | M1 — Configuration mode select 1 |
| Broche 14 | GND — Ground |
| Broche 15 | M0 — Configuration mode select 0 |
| Broche 16 | M2 — Configuration mode select 2 |
| Broche 17 | VCC — +3.3 V supply |
| Broche 18 | DONE — Configuration complete indicator (open-drain) |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | I/O — User I/O pin |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | GND — Ground |
| Broche 32 | VCC — +3.3 V supply |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | GCK — Global clock input |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | VCC — +3.3 V supply |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | I/O — User I/O pin |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | VCC — +3.3 V supply |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | I/O — User I/O pin |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | I/O — User I/O pin |
| Broche 112 | I/O — User I/O pin |
| Broche 113 | I/O — User I/O pin |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | I/O — User I/O pin |
| Broche 116 | I/O — User I/O pin |
| Broche 117 | I/O — User I/O pin |
| Broche 118 | I/O — User I/O pin |
| Broche 119 | I/O — User I/O pin |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O pin |
| Broche 122 | I/O — User I/O pin |
| Broche 123 | I/O — User I/O pin |
| Broche 124 | I/O — User I/O pin |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | I/O — User I/O pin |
| Broche 128 | I/O — User I/O pin |
| Broche 129 | I/O — User I/O pin |
| Broche 130 | I/O — User I/O pin |
| Broche 131 | I/O — User I/O pin |
| Broche 132 | I/O — User I/O pin |
| Broche 133 | I/O — User I/O pin |
| Broche 134 | I/O — User I/O pin |
| Broche 135 | I/O — User I/O pin |
| Broche 136 | I/O — User I/O pin |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | INIT — Configuration initialization (open-drain) |
| Broche 142 | VCC — +3.3 V supply |
| Broche 143 | RESET — Configuration reset (active-low) |
| Broche 144 | CCLK — Configuration clock input |
Applications typiques
XC3090L-8TQ144I convient pour 7 applications: Industrial Glue Logic Replacement, Legacy Telecommunications Backplane Interface, Test and Measurement Instrumentation, Aerospace and Defense Retrofit Designs, Custom VLSI Prototyping and Emulation, Industrial Bus Interface Bridges, Long-Lifecycle Medical Device Controllers.
Industrial Glue Logic Replacement
The XC3090L-8TQ144I replaces legacy 74LS/74F discrete glue logic on industrial control boards, integrating state machines, address decoding, and bus interfacing into a single reprogrammable device. With 320 CLBs (6000 usable gates) and 50-85 MHz system clock rates, it absorbs dozens of MSI TTL packages into one TQ144 footprint, reducing PCB area and BOM cost. Industrial -40 C to +85 C grade supports factory-floor deployment. Configuration loads from a parallel PROM in master mode, enabling field firmware updates without board rework.
Recommandé
Legacy Telecommunications Backplane Interface
Telecommunications backplanes built in the late 1990s and early 2000s use XC3000L-series FPGAs for TDM bus multiplexing, framing, and line-interface glue. The XC3090L-8TQ144I is a direct long-lifecycle replacement, with the 3.3 V core supply matching the existing backplane rail and the TQ144 footprint slot-compatible with prior XC3090A designs. 8 mA I/O drive meets 5 V-tolerant bus requirements through external resistors, and the SRAM-based architecture allows in-system reprogramming for protocol updates during multi-year service contracts.
Recommandé
Test and Measurement Instrumentation
The XC3090L-8TQ144I serves as reconfigurable timing logic, trigger sequencer, or custom pattern generator inside test-and-measurement instruments such as oscilloscopes, logic analyzers, and bench-top signal sources. Its 1.55-4.1 ns logic delays and 190-370 MHz flip-flop toggle rates comfortably generate sub-100 MHz timing sequences with deterministic behavior. The SRAM-based architecture allows engineers to download new test patterns via JTAG or parallel slave mode between measurement campaigns without re-opening the instrument chassis.
Recommandé
Aerospace and Defense Retrofit Designs
Many aerospace platforms designed in the late 1990s use XC3000A/L-series FPGAs and require ongoing production support for spares and obsolescence management. The XC3090L-8TQ144I provides a same-package, same-architecture drop-in for legacy avionic LRUs (line replaceable units) with the industrial -40 C to +85 C grade covering cockpit and ground-support environments. Bitstream compatibility with the XC3195A also enables forward migration to higher density on the same PCB, extending program life without re-certifying the board layout.
Recommandé
Custom VLSI Prototyping and Emulation
Universities and ASIC prototyping labs use XC3090L-8TQ144I devices as pre-silicon verification platforms for medium-complexity custom logic. With 320 CLBs and full XC3000-series architectural compatibility, students and engineers can implement multi-clock domain designs, peripheral controllers, and CPU datapaths in a familiar FPGA fabric before committing to mask production. The TQ144 package supports standard 0.5 mm-pitch breakout boards and educational FPGA development kits.
Recommandé
Industrial Bus Interface Bridges
The XC3090L-8TQ144I bridges legacy industrial buses such as ISA, VME, and parallel I/O channels to modern microcontrollers and SoCs, where the 3.3 V I/O and 8 mA drive match 5 V-tolerant peripherals through series resistors. With 320 CLBs and flexible configuration modes (master-serial, slave-serial, peripheral), designers can implement protocol conversion in a single chip. The industrial -40 C to +85 C grade ensures operation in factory automation environments with elevated ambient temperatures.
Recommandé
Long-Lifecycle Medical Device Controllers
Medical device manufacturers building controllers for infusion pumps, blood analyzers, and patient monitors on 15-20 year product cycles use the XC3090L-8TQ144I as a stable, mature FPGA platform. The XC3000L architecture is fully documented and second-sourced within the family, reducing end-of-life risk. The TQ144 footprint and 3.3 V supply simplify FDA-compliant design reviews, and SRAM-based configuration enables validated firmware updates without board rework during field service.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3090L-8TQ144I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3090L-8TQ144C | XC3090L-7TQ176I | XC3195A-8TQ144C |
|---|---|---|---|---|
| Package | TQFP-144 (TQ144) | TQFP-144 (TQ144) - same | TQFP-176 (TQ176) | TQFP-144 (TQ144) - same |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx |
| Family | XC3000L | XC3000L | XC3000L | XC3100A |
| Number of CLBs | 320 | 320 | 320 | 484 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 5 V |
| Operating Temperature | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Industrial -40 C to +85 C operating grade in same TQ144 package (vs XC3090L-8TQ144C)
- Drop-in compatible with higher-density XC3195A on same TQ144 PCB (vs XC3195A-8TQ144C)
- Mature 3.3 V SRAM-based FPGA with full second-source within XC3000 family (vs EPM9560RC208-15)
Notes de conception
The XC3090L-8TQ144I core operates from 3.3 V (VCCINT pins 17, 32, 60, 96, 142). Place one 0.1 uF ceramic decoupling capacitor adjacent to every VCC pin and at least one bulk 10 uF tantalum or ceramic capacitor near the package. Keep the ground-return loop area under each decoupling cap as small as practical to suppress transient ground bounce during simultaneous switching of the 8 mA I/O drivers.
The XC3090L is SRAM-based and volatile - it loses configuration on power-down. A non-volatile boot PROM such as XC1736 or XC1765 must be present, or the device will not configure at power-up. The DONE pin (pin 18) is open-drain and requires an external pull-up to VCC. Mode pins M0/M1/M2 (15/16/13) must be tied to defined logic levels through 4.7 kohm resistors, not left floating.
Route the global clock pin (GCK, pin 45) as a short, impedance-controlled trace with a guard ground on both sides to limit jitter. Place the configuration clock (CCLK, pin 144) on a separate signal layer from user I/O to avoid coupling during the configuration window. Maintain 0.5 mm-pitch TQ144 breakout with via-in-pad only if the PCB fab supports it; otherwise fan out on inner layers to reduce package stress.
Informations de conformité
Compliance status not explicitly stated in the verified web data. XC3090L family dates from the late 1990s; lead-free and RoHS variants are typically marked with a 'Pb-free' suffix or supplied via RoHS-compliant assembly houses. Confirm with the supplier before volume purchase.
