XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA
Référence : XC3S200-5FT256C ✗ Fin de vieXC3S200-5FT256C Présentation
A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmed devices, and application-specific programmable logic. The Spartan-3 architecture combines configurable logic, memory resources, dedicated input/output structures, and programmable interconnect, allowing a designer to implement multiple control, interface, datapath, and signal-processing functions in one device.
The XC3S200-5FT256C provides 50,000 system gates according to one distributor listing and 200,000 system gates according to Mouser and Partstack. The verified sources also report 192 logic cells, a 1.2 V FPGA supply, a 256-LBGA package, 256 terminals, and a square package shape. These source differences should be resolved against the applicable AMD Spartan-3 family data sheet before final design release.
Because the device belongs to the Spartan-3 generation, engineers should treat it as a legacy programmable-logic platform and validate toolchain availability, configuration method, I/O standards, timing, and sourcing before beginning a new production design. The operating range of 0°C to 85°C distinguishes it from extended-temperature variants. Its 256-ball land-grid-array package also requires a PCB footprint and assembly process capable of handling fine-pitch balls, while configuration storage, clocking, decoupling, and I/O voltage planning remain central implementation concerns.
Typical uses include industrial control and factory automation, embedded instrumentation, communications interfaces, display and video control, consumer products, and general-purpose digital signal processing. The Spartan-3 family was specifically positioned for high-volume, cost-sensitive consumer electronic applications, but individual designs still require complete timing, thermal, signal-integrity, and configuration verification.
The principal design caution is that a replacement FPGA must match the package, ball assignment, supported I/O standards, voltage requirements, configuration interface, and timing constraints. A device with the same family name or logic density is not automatically pin-compatible. Migration decisions should therefore use AMD pinout data, device-generation constraints, and design-tool checks rather than relying only on distributor similarity labels.
This page consolidates the verified distributor and manufacturer references for the XC3S200-5FT256C, distinguishes verified characteristics from parameters requiring confirmation, and provides migration, sourcing, and application guidance that is not present in a basic distributor listing.
Alternatives de remplacement direct pour XC3S200-5FT256C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
XC3S200-5FTG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S200A-5FTG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S200-5FT256C Valeurs maximales et caractéristiques électriques
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 |
| System Gates | 200,000 gates |
| Alternate System Gate Listing | 50,000 gates |
| Logic Cells | 192 logic cells |
| Logic Blocks | 192 logic blocks |
| Core Supply Voltage | 1.2 V |
| Performance Grade | -5 |
| Température de fonctionnement | 0°C to 85°C |
| Package Type | 256-LBGA |
| Package Shape | Square |
| Terminal Type | Ball |
| Number of Terminals | 256 |
| Lead-Free Status | Lead-free |
| Type de montage | Surface mount |
Guide de configuration des broches du XC3S200-5FT256C square
Configuration des broches du XC3S200-5FT256C (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S200-5FT256C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S200-5FT256C convient pour 6 applications: Industrial Automation and Control, Embedded Communications Interface, Test and Measurement Instrumentation, Consumer Product Interface Control, Data Acquisition and Signal Processing, Clocking, Sequencing and Power-Control Logic.
Industrial Automation and Control
The XC3S200-5FT256C fits programmable control, sequencing, and interface logic within commercial-temperature equipment operating from 0°C to 85°C. Its 192 reported logic cells and 1.2 V FPGA supply permit implementation of control functions, state machines, counters, and data acquisition interfaces in one configurable device. Place the device beside the controller and place configurable I/O close to the controlled signal sources to reduce routing pressure. The 256-LBGA package requires fine-pitch assembly, so validate the PCB footprint, solder process, and ground-plane strategy against the AMD package drawing.
Recommandé
Embedded Communications Interface
The XC3S200-5FT256C can implement protocol formatting, buffering, and glue logic around a communications subsystem while operating from its verified 1.2 V supply. The reported 192 logic cells provide configurable parallel-to-serial conversion, command decoding, and interface timing, although the exact I/O-standard support remains to be confirmed from the AMD documentation. Place it near the physical interface connector, route high-speed signals over controlled impedances, and keep switching-supply return currents out of the FPGA power and ground pins. Configuration storage and clocking must also be designed for deterministic startup behavior.
Recommandé
Test and Measurement Instrumentation
The XC3S200-5FT256C is applicable to programmable control and signal-conditioning logic in compact instrumentation, where the 192 reported logic cells can organize trigger sequencing, measurement control, status flags, and data paths. Its 0°C-to-85°C range covers commercial laboratory and industrial environments, but calibration and analog accuracy remain functions of the external measurement chain rather than the FPGA. Use the device to coordinate converters and front ends while isolating sensitive analog routing from digital switching activity. Firmware must verify timing margins after each tool or speed-grade change.
Recommandé
Consumer Product Interface Control
The XC3S200-5FT256C supports the Spartan-3 family's cost-sensitive consumer positioning by consolidating configurable logic, control, and interface functions in one 256-LBGA device. The 1.2 V core listing and 192 reported logic cells allow compact implementation of button handling, display logic, motor sequencing, or product-specific state machines. Keep sensitive consumer interfaces on separated power domains where necessary, validate ESD pathways externally, and use a configuration strategy that meets the product's power-on behavior. Availability and toolchain support should be confirmed before committing to a high-volume consumer program.
Recommandé
Data Acquisition and Signal Processing
The XC3S200-5FT256C can implement digital filtering, decimation control, acquisition sequencing, and parallel data movement around external converters. The verified device information establishes 192 logic cells, 1.2 V operation, and a 256-LBGA package, but engineers must obtain the actual throughput, RAM, and I/O-timing values from the AMD Spartan-3 documentation before estimating performance. Place the FPGA adjacent to the converter interface, constrain input and output timing, and route clocks away from switching nodes. A prototype should confirm configuration loading, clock stability, and data-loss behavior before production testing.
Recommandé
Clocking, Sequencing and Power-Control Logic
The XC3S200-5FT256C can centralize sequencing, fault handling, and control for power converters, clock trees, or multi-rail systems by implementing deterministic state machines and supervisory logic. Its 192 reported logic cells support configurable control paths, while the 1.2 V core supply simplifies integration with suitable FPGA power designs. The component does not replace a power-management IC, and the exact configuration I/O and clock resources remain unconfirmed in the supplied data. Validate startup order, brownout behavior, fault propagation, and timing margins using the AMD documentation and production-grade tests.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S200-5FT256C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S200-5FTG256C | XC3S200A-5FTG256C |
|---|---|---|---|
| Package | 256-LBGA | 256-LBGA | 256-LBGA |
| Brand | AMD | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3A |
| Performance Grade | -5 | -5 | -5 |
Principaux différenciateurs
- Exact-source identity for a 192-logic-cell Spartan-3 device (vs XC3S200A-5FTG256C)
- Commercial-temperature operation is explicitly reported (vs XC3S200-5FTG256C)
- Lead-free 256-LBGA configuration (vs XC3S200A-5FTG256C)
- Same-generation migration candidate (vs XC3S200A-5FTG256C)
Notes de conception
Do not treat equal package names as proof of drop-in compatibility. The verified web results establish that XC3S200-5FTG256C and XC3S200A-5FTG256C are listed in 256-LBGA packages, but they do not provide complete ball maps, I/O tables, or voltage limits. Compare the AMD package drawing and device pinout for the XC3S200-5FT256C against each candidate, then rerun synthesis, placement, timing, and pin-assignment checks before approving a replacement.
Design the 256-LBGA footprint from the exact AMD package drawing rather than from a generic 256-ball library. Confirm ball pitch, pad dimensions, solder-mask opening, paste stencil, exposed or thermal-array details, and assembly tolerances. Use a continuous, low-impedance ground reference where the package drawing permits, and place decoupling and configuration components close to their associated balls. The verified snippets do not supply package dimensions or a recommended land pattern, so fabrication data must come from the family documentation.
Plan the 1.2 V core rail and every required I/O or auxiliary rail independently; the verified distributor snippet identifies only a 1.2 V FPGA supply and does not establish complete voltage ranges. Confirm supply sequencing, tolerance, current, startup, and decoupling requirements in DS099 and the device-specific documentation. Avoid sharing high-current return paths between core and sensitive I/O supplies, and validate power-up and power-down behavior in hardware because the configuration mechanism and rails are not documented in the supplied excerpts.
Treat configuration, clock, and user-I/O routing as separate high-speed paths. Use controlled-impedance routing where applicable, avoid routing clocks adjacent to switching I/O or connector returns, and provide a continuous reference plane. Include known-good configuration storage and a deterministic startup sequence, then test eye margin, clock jitter, and I/O behavior at the intended temperature. The verified data does not include supported I/O standards or timing numbers, so no electrical margin can be inferred from the listing alone.
Informations de conformité
The exact-MPN distributor result identifies the XC3S200-5FT256C as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status were not included in the verified data and remain unknown. AEC-Q100 is not applicable to the commercial 0°C-to-85°C FPGA identified by the verified listings.
