XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD
Référence : XC3S400-4FT256C ✗ Fin de vieXC3S400-4FT256C Présentation
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated hard multipliers, and clock-management resources. This makes the Spartan-3 family useful when engineers need hardware-level parallelism, rapid design changes, or compact implementation of complex digital systems without committing to a custom application-specific integrated circuit.
The verified listing identifies 400,000 system gates and 8,064 logic cells for the XC3S400 device. It provides 173 I/O in a 256-LBGA package and uses a 1.2 V core voltage. Related Spartan-3 data identifies 90 nm fabrication technology and a 630 MHz figure for the XC3S400-4FTG256C comparison variant; those values should not be transferred to XC3S400-4FT256C without confirmation from its own manufacturer datasheet.
The device is suitable for parallel data processing, custom interface control, embedded signal processing, communications infrastructure, test equipment, and industrial control systems. Its 173 I/O permit substantial board-level connectivity, while the 8,064-cell logic resource supports parallel datapaths and state machines. The FT256 package can also simplify component density compared with larger leaded packages, but it requires careful PCB layout, thermal analysis, and BGA assembly capability.
The commercial -4 grade is intended for cost-optimized designs rather than the extreme operating range implied by an industrial temperature suffix. Before releasing a design, engineers should verify the exact I/O standards, supported memory interfaces, configuration requirements, power-up behavior, and package pinout against the manufacturer documentation for XC3S400-4FT256C.
A critical design consideration is that the FT256 package requires exact land-pattern, solder-mask, paste, via, and assembly-process control. Power rails and decoupling should be implemented according to the manufacturer's guidance, while configuration and programming interfaces should be checked for signal-integrity and termination requirements before layout signoff.
This page consolidates verified distributor pricing, same-footprint Spartan-3 alternatives, application guidance, and design cautions that are not presented together on a manufacturer product page. It also distinguishes confirmed target-device facts from parameters that remain unavailable in the supplied source data.
Alternatives de remplacement direct pour XC3S400-4FT256C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S400-4FT256C (même facteur de forme et même empreinte) — différant par Mounting Type, Package, System Gates.
XC3S400-4FTG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S400-4FTG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S400A-4FT256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S400A-4FTG256C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC3S500E-4FTG256C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S400-4FT256C Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) IC |
| System Gates | 400,000 gates |
| Configurable Logic Cells | 8,064 cells |
| User I/O | 173 I/O |
| Core Voltage | 1.2 V |
| Performance Grade | -4 speed grade |
| Temperature Grade | Commercial |
| Boîtier | 256-LBGA |
| Package Type | FTBGA-256 |
| Type de montage | Surface Mount |
| Terminal Type | Ball |
| Terminal Count | 256 balls |
| Logic Family | Spartan-3 |
| Statut RoHS | Compliant |
Guide de configuration des broches du XC3S400-4FT256C ftbga-256
Configuration des broches du XC3S400-4FT256C (boîtier ftbga-256). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S400-4FT256C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S400-4FT256C convient pour 6 applications: Industrial Parallel Data Acquisition, Communications Interface Controller, Test and Measurement Instrumentation, Embedded Signal Processing, Industrial Control and Automation, Programmable Interface Consolidation.
Industrial Parallel Data Acquisition
The XC3S400-4FT256C fits parallel acquisition and control systems that require deterministic digital logic rather than a microcontroller executing sequential instructions. Its reported 8,064 configurable logic cells can implement sampling pipelines, filters, packetizers, and interface state machines, while 173 I/O provide connections to sensors, converters, and test equipment. The -4 grade supplies a defined performance class for timing closure, although the unavailable maximum-frequency specification must be confirmed for the selected clock. In a board design, engineers should use the exact manufacturer FT256 land pattern, isolate noisy inputs from sensitive routing, and validate every voltage domain against the device's supported I/O standards.
Recommandé
Communications Interface Controller
The XC3S400-4FT256C can serve as a programmable communications interface when a design needs custom framing, buffering, timing, or protocol conversion. The reported 400,000 system gates and 8,064 logic cells are well suited to parallel datapaths and multiple clock domains, while 173 I/O offer substantial connectivity to transceivers and supporting controllers. Engineers should not infer protocol support solely from the gate count; instead, they should confirm clock-management resources, I/O standards, and maximum operating frequency from the manufacturer documentation. PCB planning should reserve clean routing for clocks, controlled impedance for high-speed links, and an unambiguous configuration path for reliable field programming.
Recommandé
Test and Measurement Instrumentation
The XC3S400-4FT256C is appropriate for programmable test equipment requiring flexible timing, pattern generation, measurement control, and data formatting. Its reported 8,064 configurable logic cells and 173 I/O permit concurrent channels, state machines, counters, and instrument-bus interfaces, while the -4 performance grade provides a consistent timing target. The design must be constrained and timed for the intended clock because the supplied records do not provide a maximum operating frequency. Engineers should separate analog and high-impedance inputs from digital routing, provide deterministic clocking, and follow the manufacturer's power and decoupling guidance to avoid measurement errors caused by supply disturbance.
Recommandé
Embedded Signal Processing
The XC3S400-4FT256C can implement parallel filtering, correlation, error correction, and real-time signal-processing pipelines in programmable logic. The reported 400,000 system gates provide substantially more parallel logic capacity than a small microcontroller, and the dedicated architecture can avoid iterative software bottlenecks. Resource allocation must be checked against the exact number of block RAM blocks, multipliers, clock domains, and I/O standards, none of which are quantified in the supplied source data. Designers should use synchronous design practices, constrain all clocks and I/O timing, and analyze worst-case routing delay before treating the -4 grade as sufficient for a production timing closure.
Recommandé
Industrial Control and Automation
The XC3S400-4FT256C is suitable for machine-control logic that combines parallel I/O, sequencing, communications, and deterministic hardware timing. Its 173 reported I/O support connections among sensors, actuators, safety-adjacent controls, and industrial communications, while the 8,064-cell logic fabric can implement multiple control tasks concurrently. Because this is a commercial-grade -4 part, engineers must verify the exact operating-temperature requirements of the machine environment and use an industrial-grade alternative if the published limits are insufficient. Layout should include careful power planning, grounded return paths, isolation boundaries for external wiring, and tested configuration recovery procedures.
Recommandé
Programmable Interface Consolidation
The XC3S400-4FT256C can consolidate several legacy parallel interfaces into a single programmable-logic device when a board needs custom routing, buffering, or protocol adaptation. The reported 173 I/O and 8,064 configurable logic cells are suitable for moderate-width data buses and asynchronous state-machine control, while the 256-LBGA package minimizes board area. Pin compatibility with a specific external component cannot be assumed; engineers must build a complete I/O mapping and check voltage domains, drive strength, timing, and supported standards. The layout should reserve BGA escape routes and test access, and the FPGA design should include initialization and fault handling for any interface that affects system safety.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S400-4FT256C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S400-4FTG256C | XC3S400-4FTG256I | XC3S400A-4FT256C | XC3S400A-4FTG256C | XC3S500E-4FTG256C |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FT256) | 256-LBGA (FT256) | 256-LBGA (FT256) | 256-LBGA (FT256) | 256-LBGA (FT256) | 256-LBGA (FT256) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3A | Spartan-3A | Spartan-3E |
| Performance Grade | -4 speed grade | -4 speed grade | -4 speed grade | -4 speed grade | -4 speed grade | -4 speed grade |
Principaux différenciateurs
- Closest reported resource match in the same FT256 footprint (vs XC3S400-4FTG256C)
- Commercial target with an industrial same-footprint option (vs XC3S400-4FTG256I)
- Direct 256-LBGA ordering configuration (vs XC3S400A-4FT256C)
- Lower-capacity target allows upgrade-path assessment without a larger package (vs XC3S500E-4FTG256C)
Notes de conception
Use the official XC3S400 FT256 package drawing to control pad, solder-mask, paste, and via geometry. A 256-BGA design demands an escape strategy for configuration, clocks, power, and high-fanout I/O; power and ground balls should be connected through the shortest practical via arrays. PCB fabrication and assembly capability should be qualified before layout release because the verified distributor records identify the target as a 256-LBGA rather than a leaded package.
The verified Mouser listing identifies a 1.2 V core for the XC3S400-4FT256C. Follow the manufacturer power-distribution and decoupling requirements rather than deriving the network from this page, because I/O voltage domains, auxiliary rails, sequencing, and current limits are not included in the supplied records. Validate the assembled board across startup, load, and temperature, and monitor the 1.2 V rail for excessive transient impedance or ground bounce.
Do not treat the FT256 package designation as proof that every Spartan-3 alternative is electrically interchangeable. Before replacing XC3S400-4FT256C, compare configuration pins, I/O standards, voltage tolerances, clock resources, memory and multiplier availability, timing, and bitstream support. In particular, the XC3S400-4FTG256C comparison source states that some electrical characteristics differ, so an engineering change should include schematic review, timing recompilation, and hardware regression tests.
Keep clock distribution, configuration signals, and sensitive high-speed interfaces away from noisy switching nodes and switching-power supply loops. Use continuous return paths, controlled-impedance routing where required, and defined test points for configuration and clock debugging. Because the supplied records do not include the official pinout, engineers must not assign ball locations from general FT256 conventions; all routing must be checked against the exact XC3S400-4FT256C package table.
Informations de conformité
The verified LCSC product record marks XC3S400-4FT256C as RoHS compliant. The supplied records do not establish REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification status.
