XC6SLX150-3FGG676C - Spartan-6 LX FPGA 147K LE | AMD Xilinx
Référence : XC6SLX150-3FGG676C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $72.18 | $72,18 |
| 10 | $70.5 | $705,00 |
| 50 | $67.2 | $3 360,00 |
| 100 | $64.1 | $6 410,00 |
| 500 | $58.4 | $29 200,00 |
| 1 000 | $53.75 | $53 750,00 |
XC6SLX150-3FGG676C Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines logic gates, multipliers, embedded memory, and high-speed transceivers into a configurable fabric. FPGA sits in the hierarchy of programmable logic -> programmable logic device -> semiconductor -> integrated circuit. The Spartan-6 LX family targets high-volume cost-sensitive applications that demand high logic density, abundant block RAM, and integrated DSP slices without the power overhead of Virtex-class devices. By programming the LUTs, routing, and IP cores via the ISE Design Suite, engineers create custom accelerators, glue logic, video pipelines, and connectivity subsystems on a single chip.
Key features of the XC6SLX150-3FGG676C include 135 Kbit distributed RAM, 4.8 Mbit block RAM, 180 DSP48A1 slices, four clock management tiles with PLL, and 498 SelectIO signals supporting LVCMOS, LVDS, and LVTTL standards. The device integrates PCI Express Endpoint blocks, GTP transceivers are NOT present on this LX variant, and supports DDR, DDR2, DDR3, and QDRII+ memory interfaces through dedicated hardware controllers. Configuration is via SPI, BPI, JTAG, or Platform Flash XCF, enabling flexible in-system reprogrammability for field upgrades.
From a system-architecture perspective, the Spartan-6 LX uses a 45 nm copper CMOS process backed by an optimized core voltage of 1.14 to 1.26 V and auxiliary supply of 2.5 / 3.3 V for I/O banks. The 676-BGA package exposes 26 user I/O banks so designers can support mixed-voltage interfaces (1.2 V to 3.3 V) on a single die, ideal for bridging legacy and modern logic families in industrial control or motor-drive boards.
Typical applications include industrial motor control and factory automation backbones, video surveillance processing pipelines, medical imaging front-end buffers, automotive driver-assistance pre-processing prototypes, and avionics display controllers. The combination of abundant I/O and large block RAM makes the LX150 particularly attractive for high-channel-count data acquisition and parallel sensor aggregation.
When designing with this part, validate that the 676-BGA layout supports at least four routing layers with laser-drilled microvias, since 1.0 mm pitch BGA escape routes demand controlled-impedance planning. Also confirm that the ISE WebPACK license covers all required IP cores for development.
This page synthesizes distributor availability, drop-in Spartan-6 family alternatives, and practical layout notes not bundled into the manufacturer datasheet.
Alternatives de remplacement direct pour XC6SLX150-3FGG676C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC6SLX150-2FGG676C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150T-3FGG676C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150-3FGG676I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150-4FGG676C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC6SLX100-3FGG676C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX150-N3FGG676C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC6SLX150-3FGG676C Valeurs maximales et caractéristiques électriques
| Family | Spartan-6 LX |
| Device | XC6SLX150 |
| Speed Grade | -3 (commercial) |
| Boîtier | FGG676 (676-ball FBGA, 27 x 27 mm, 1.0 mm pitch) |
| Logic Cells | 147,443 |
| System Gates | 4,939,776 |
| Adaptive Logic Modules (ALMs) | 23,038 |
| CLBs | 11,519 |
| DSP Slices | 180 (DSP48A1) |
| Maximum User I/O | 498 |
| Maximum Core Clock | 862 MHz |
| Core Voltage | 1.14 V to 1.26 V |
| Auxiliary Voltage | 2.5 V / 3.3 V |
| Transceivers | None (LX variant; GTP transceivers not integrated) |
| Configuration Modes | SPI, BPI, JTAG, Platform Flash |
| Plage de température de fonctionnement | 0C to +85C (commercial, suffix C) |
| Process Node | 45 nm CMOS |
Guide de configuration des broches du XC6SLX150-3FGG676C fgg676 (676-ball fbga, 27 x 27 mm, 1.0 mm pitch)
Configuration des broches du XC6SLX150-3FGG676C (boîtier fgg676 (676-ball fbga, 27 x 27 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX150-3FGG676C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX150-3FGG676C convient pour 7 applications: Industrial Motor Control and Factory Automation, Video Surveillance Image Pipeline, Medical Imaging Front-End Buffer, Automotive Driver-Assistance Prototype ECU, Avionics Display and Control Backbone, High-Channel Data Acquisition System, Telecom Line Card Glue Logic.
Industrial Motor Control and Factory Automation
The XC6SLX150-3FGG676C fits motor-control backplanes because it integrates 180 DSP48A1 slices at 25 x 18-bit multipliers running roughly 250 MHz, enough to execute four simultaneous Field-Oriented Control (FOC) loops for permanent-magnet motors. The 498 user I/Os accept encoder, Hall-sensor, and resolver feedback without external multiplexing, while the dedicated DDR2 controller handles shared variable buffers across multiple axes. In practice, designers place this part between the 24 V backplane and the IGBT gate-driver stage, leveraging its 0C to +85C commercial range to suit indoor cabinets. The trade-off versus a discrete DSP is flexibility: you can reprogram the safety-logic and commutation algorithm in the field via JTAG, and at roughly 72 USD per unit the LX150 is considerably cheaper than two separate MCU + CPLD pairs in volume.
Recommandé
Video Surveillance Image Pipeline
Mid-resolution security cameras benefit from the XC6SLX150-3FGG676C's 4.8 Mbit block RAM for line buffers and 180 DSP slices for Sobel / motion-vector preprocessing before compression. A 1920 x 1080 at 30 fps YCbCr 4:2:2 stream at roughly 124 MHz pixel rate fits inside the 498 I/O budget with LVDS or sub-LVDS signaling to the image sensor. The -3 speed grade comfortably meets a 148.5 MHz internal throughput target for deinterlacing and noise reduction. For IP-camera designs, the FPGA sits downstream of the sensor AFE and feeds an external H.264 SoC, reducing load on the encoder by up to 40 percent. The LX150 achieves this at roughly 72 USD, materially cheaper than DSP + external SRAM architectures.
Recommandé
Medical Imaging Front-End Buffer
Ultrasound front-end and endoscopy pre-processing benefit from the LX150's 147K logic cells plus 180 DSP48A1 slices, which deliver roughly 45 GMAC/s of fixed-point throughput for beamforming and decimation filtering on 16 to 64 channels. The 4 Mbit+ block RAM provides per-channel ping-pong buffers at 40 MSPS ADC rates without external SRAM in many designs, simplifying the medical IEC 60601 BOM. The 676-BGA package's 498 I/Os accept LVDS pairs from multi-channel ADCs, while the JTAG port supports field firmware updates required for regulatory re-validation. Designers typically pair the LX150 with the STM32H7 safety-MCU which handles housekeeping and watchdog logic. Compared to ASIC implementations, design iteration cost drops by roughly an order of magnitude at 72 USD per unit for low-volume diagnostic OEMs.
Recommandé
Automotive Driver-Assistance Prototype ECU
Prototype ADAS ECUs use the XC6SLX150-3FGG676C to fuse front-camera, lidar, and radar streams into a unified object list before handoff to the production ECU. The 180 DSP48A1 slices enable real-time FFT on radar returns and 5x5 convolution on camera frames in parallel, while the 498 user I/Os interface to FPD-Link III deserializers and CAN-FD transceivers. Designers wire the LX150 to a TMS320F28379D DSP for the high-level sensor-fusion algorithm during pre-silicon development. The commercial temperature range (0C to +85C) suits in-cabin prototypes; for in-engine-compartment deployment, the LX150-3FGG676I industrial variant should be selected. At 72 USD prototype qty-1 pricing, the LX150 is widely used in Tier-1 lab validation where reprogrammability outweighs AEC-Q100 certification.
Recommandé
Avionics Display and Control Backbone
Avionics display controllers deploy the LX150 to drive multi-channel LVDS panels, ARINC 429 bus monitoring, and MIL-STD-1553 bridging on a single chip. The 23,038 ALMs implement dual-redundant protocol stacks with sub-microsecond interrupt latency, while the 498 I/Os expose 8 LVDS pairs plus 28 differential general-purpose channels. The 676-BGA package, when paired with conformal coating, meets RTCA DO-254 DAL-C design assurance flow. Designers use the LX150 alongside the TMS5701224CPGEQQ1 lockstep MCU for safety-critical command paths, partitioning the FPGA as a DAL-B / DAL-C mixed-criticality subsystem. Compared to legacy ASIC implementations, the LX150's in-system reprogrammability enables late-stage I/O requirement changes during flight-test cycles.
Recommandé
High-Channel Data Acquisition System
Test and measurement DAQ systems leverage the LX150's 498 user I/Os to capture 16+ simultaneous analog inputs (after an external MUX), while 180 DSP48A1 slices execute real-time FIR / FFT preprocessing at up to roughly 200 MHz. The DDR2 controller handles deep capture buffers at 800 MHz, and the 4 Mbit block RAM provides per-channel overlap-save regions for stage filtering. Engineers pair the LX150 with a precision 18-bit ADC like the AD7606 family and stream results via USB 3.0 to a host PC. The -3 speed grade allows comfortably hitting the 30+ MSPS aggregate throughput on a single LX150. At about 72 USD per FPGA, an 8-channel 1 MSPS DAQ builds at under 500 USD total silicon cost, materially cheaper than dedicated DSP + large SRAM architectures.
Recommandé
Telecom Line Card Glue Logic
Legacy telecom line cards deploy the LX150 as glue logic between TDM switches, framer ICs, and Ethernet MACs. The 147,443 logic cells implement HDLC controllers, ATM SAR, and per-channel timeslot crossbars with hardware-checked subtending devices. Designers use the dedicated Memory Controller Blocks to drive QDRII+ SRAM for packet buffers at 200 MHz, while the 498 I/Os simplify backplane bus interfacing. The LX150 is also a popular debugging accessory in lab environments, where it sits between production ASIC and the host processor to capture protocol traces. The lower unit cost relative to mid-range Spartan-6 LXT parts makes the LX150 ideal for new-designs that do not need the extra transceiver blocks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX150-3FGG676C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX150-2FGG676C | XC6SLX150T-3FGG676C | XC6SLX150-3FGG676I | XC6SLX100-3FGG676C |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | FGG676 (676-BGA) | FGG676 (676-BGA) - same | FGG676 (676-BGA) - same | FGG676 (676-BGA) - same | FGG676 (676-BGA) - same |
| Logic Cells | 147,443 | 147,443 | 147,443 | 147,443 | ~100,000 |
| Speed Grade | -3 | -2 (slower) | -3 (same) | -3 (same) | -3 (same) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Transceivers | None (LX variant) | None | 4 GTP 3.2 Gbps | None | None |
| DSP Slices | 180 (DSP48A1) | 180 | 180 | 180 | ~120 |
| User I/Os | 498 | 498 | 498 | 498 | 498 |
| Approximate Unit Price (1+ qty) | $72.18 | $58 (lower speed) | $82 (adds transceivers) | $85 (industrial) | $45 (lower density) |
Principaux différenciateurs
- Largest FGG676 logic density in Spartan-6 LX family (vs XC6SLX100-3FGG676C)
- Transceiver-free variant vs LXT superset (vs XC6SLX150T-3FGG676C)
- Commercial temperature grade for indoor cabinets (vs XC6SLX150-3FGG676I)
- -3 speed grade at common Spartan-6 mid-tier (vs XC6SLX150-2FGG676C)
Notes de conception
Estimated: the FGG676 package has 1.0 mm ball pitch on a 27 x 27 mm body. Routing escape requires at minimum four PCB layers with 0.1 mm laser-drilled microvias. Allow continuous ground planes under the BGA to maintain reference for the high-speed LVDS pairs, and verify paste-mask aperture ratio of 1:1 against ball size. Dielectric thickness between the top signal layer and first ground plane should target 0.1 mm for 50 ohm single-ended impedance, per IPC-2141 controlled-impedance guidelines. Design teams often overlook the JTAG chain impedance; keep TDI/TDO 100 ohm differential if the JTAG path exceeds 50 mm.
Use a TPS54560QDDAQ1 or similar 5 A buck regulator to derive VCCINT 1.2 V from the 5 V rail, and a separate 2.5 V / 3.3 V LDO for VCCO banks. Decoupling must include 100 nF X7R capacitors under the FGG676 footprint at every power pin (estimated 22 capacitors), plus four 10 uF bulk capacitors at each PCB corner. Apply the AMD XAPP158 power-distribution network guidance: target less than 5 mV peak-to-peak ripple on VCCINT even during logic-element block-switching transients. A soft-start ramp of 1 ms minimum prevents inrush latch-up on the 45 nm core.
The XC6SLX150-3FGG676C dissipates 2 to 4 W typical in industrial workloads per the AMD Spartan-6 datasheet power estimator. Estimated: at worst case utilization (98% LUT, 90% DSP), junction temperature rise with no airflow is roughly 35 to 45 C above ambient. Recommend a 100 x 100 mm thermal copper pour on the top layer connected to GND for heat-spreading, and pair with a 200 LFM airflow for cabinet-mounted designs. For sealed enclosures, derate to industrial temperature grade (LX150-3FGG676I) or add a heatsink bonded with a 0.1 mm thermal pad.
Do not connect VCCINT (1.2 V) and VCCAUX (2.5 V) to a shared rail. Per AMD Spartan-6 hardware checklist UG366, VCCAUX must power up before VCCINT or simultaneously within 1 ms; sequencing mistakes cause latch-up on the configuration logic. Similarly, the JTAG TDI pin needs a 4.7 kohm pull-up at the FPGA end if driving through isolation. Avoid tying DONE and INIT_B together; they must be separate signals per the AMD configuration user guide UG380. Always include a 100 ohm series resistor on high-speed LVDS TX outputs to damp reflections on long backplane traces.
Match the LVDS pair trace lengths to within 0.1 mm (about 6 ps skew) per LVDS standard, and keep an unbroken reference plane below the pair for the full route. For DDR3 interfaces routed to the dedicated Memory Controller Blocks, follow the AMD Memory Interface Generator (MIG) pinout constraints and apply write-leveling read calibration across PVT corners. Place configuration flash W25Q128FWPIG within 25 mm of the FGG676 configuration pins to meet the SPI read-window budget. Route CCLK and configuration-related pins as a separate bus from user I/O to avoid crosstalk during multi-frame configuration.
Informations de conformité
RoHS compliant and lead-free FGG676 balls per AMD material declaration. Not AEC-Q100 qualified; for AEC-Q100 automotive use, a separate automotive-grade Spartan-6A variant must be considered. REACH SVHC compliance per AMD policy.
