STM32H753IIT6 - Cortex-M7 MCU 480MHz 2MB Flash 176-LQFP | ST
Référence : STM32H753IIT6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $14.1 | $1 410,00 |
| 500 | $12.3 | $6 150,00 |
| 1 000 | $10.8 | $10 800,00 |
| 3 000 | $9.45 | $28 350,00 |
STM32H753IIT6 Présentation
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, Flash program memory, SRAM data memory, and a rich set of analog and digital peripherals on one die. Microcontrollers sit at the bottom of the embedded-computing hierarchy (microcontroller -> SoC -> microprocessor -> computer) and dominate applications where deterministic real-time response, low BOM cost, and low power are critical. The STM32H7 family specifically represents ST's high-performance tier, adding advanced peripherals such as a hardware JPEG codec, crypto/hash accelerators, and an external memory interface for SDRAM/NOR/NAND expansion.
Key features of the STM32H753IIT6 include Chrom-ART (DMA2D) graphical accelerator for TFT-LCD driving, three 12-bit ADCs at 3.6 MSPS each, two 12-bit DACs, USB 2.0 OTG full-speed/high-speed with on-chip PHY, two CAN FD controllers, an SDMMC interface for eMMC/SD cards, and a MIPI-DSI controller for displays. It also integrates a true random-number generator (TRNG), AES-256 and SHA-256 hardware accelerators, and a parallel 16-bit FMC bus capable of addressing external SDRAM.
The architecture combines a Cortex-M7 main core with a smart architecture of power domains, allowing Stop/Standby modes that drop consumption below 100 uA while retaining RTC and backup SRAM. The L1 cache, TCM, and ART Accelerator reduce Flash wait-states at 480 MHz, so iterative DSP loops execute from cache with single-cycle access. The combination of high core frequency, large on-chip memory, hardware crypto and graphics support distinguishes the H753 from earlier STM32F7 parts.
Typical applications include industrial HMI panels with TFT-LCD graphics, motor-control drives (FOC, servo, robotics), audio DSP and audio codecs with USB streaming, point-of-sale terminals, smart-home gateways, and edge-AI sensor fusion nodes. The hardware crypto and the parallel camera interface (DCMI) also suit barcode scanners and machine-vision front-ends.
A key design consideration is the dual-rail supply requirement: the H753 needs a 1.2 V core supply generated by the internal SMPS or an external LDO, plus a 3.3 V I/O rail. Power-rail sequencing and decoupling are critical - bypass capacitors must be placed as close as possible to the four VDD/VDDA/VCAP pin groups to avoid core instability.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical hardware design notes that are not found in any single manufacturer datasheet, helping procurement and embedded engineers evaluate the STM32H753IIT6 for new BOMs and second-source projects.
Alternatives de remplacement direct pour STM32H753IIT6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STM32H753IIT6 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, ADC, SRAM, Communication Interfaces.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
STM32H743IIT6
✅ Remplacement direct✓ En stock
$12 / unité
Voir la fiche technique →STM32H745IIT6
✅ Remplacement direct✓ En stock
$10.62 / unité
Voir la fiche technique →STM32H753IIK6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32F767IIT6
✅ Remplacement direct✓ En stock
$11.95 / unité
Voir la fiche technique →STM32H753IIT6 Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M7 with DP-FPU and DSP |
| Maximum CPU Frequency | 480 MHz |
| DMIPS | 1027 DMIPS |
| CoreMark Score | 2424 CoreMark |
| Program Memory (Flash) | 2 MB |
| SRAM | 1 MB (256 KB DTCM + 256 KB AXI SRAM + 64 KB ITCM + backup SRAM) |
| L1 Cache | 16 KB I-cache + 16 KB D-cache |
| Operating Voltage | 1.62 V to 3.6 V (3.3 V typical I/O) |
| Boîtier | 176-pin LQFP (24x24 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +85 C (industrial grade) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| ADC | 3 x 12-bit, 3.6 MSPS each |
| DAC | 2 x 12-bit |
| Communication Interfaces | USB OTG FS+HS, 2x CAN FD, 2x SDMMC, UART, SPI, I2C, ETH, FMC |
| Hardware Accelerators | JPEG codec, AES-256, SHA-256, TRNG, Chrom-ART (DMA2D) |
| Display Interface | TFT-LCD + MIPI-DSI |
| Camera Interface | DCMI 8- to 14-bit parallel |
Configuration des broches de STM32H753IIT6
| Broche 1 | PE02 — GPIO PE02 / TRACECLK |
| Broche 2 | PE03 — GPIO PE03 / TRACE D0 |
| Broche 3 | PE04 — GPIO PE04 / TRACE D1 |
| Broche 4 | PE05 — GPIO PE05 / TRACE D2 |
| Broche 5 | PE06 — GPIO PE06 / TRACE D3 |
| Broche 6 | VBAT — Backup battery supply |
| Broche 7 | PC13 — GPIO PC13 / Tamper-RTC |
| Broche 8 | PC14 — GPIO PC14 / OSC32_IN |
| Broche 9 | PC15 — GPIO PC15 / OSC32_OUT |
| Broche 10 | VSS — Ground |
| Broche 11 | VDD — Digital supply 3.3V |
| Broche 12 | OSC_IN — HSE oscillator input |
| Broche 13 | OSC_OUT — HSE oscillator output |
| Broche 14 | NRST — Reset (active low) |
| Broche 15 | PA00 — GPIO PA00 / WKUP |
| Broche 16 | PA01 — GPIO PA01 / WKUP |
| Broche 17 | PA02 — GPIO PA02 |
| Broche 18 | PA03 — GPIO PA03 |
| Broche 19 | VSS — Ground |
| Broche 20 | VDD — Digital supply 3.3V |
| Broche 21 | PA04 — GPIO PA04 / DAC1_OUT |
| Broche 22 | PA05 — GPIO PA05 / DAC2_OUT |
| Broche 23 | PA06 — GPIO PA06 |
| Broche 24 | PA07 — GPIO PA07 |
| Broche 25 | PC04 — GPIO PC04 / ADC12_INP4 |
| Broche 26 | PC05 — GPIO PC05 / ADC12_INN4 |
| Broche 27 | PB00 — GPIO PB00 / ADC1_INP0 |
| Broche 28 | PB01 — GPIO PB01 / ADC1_INN0 |
| Broche 29 | PB02 — GPIO PB02 / BOOT1 |
| Broche 30 | PE07 — GPIO PE07 |
| Broche 31 | PE08 — GPIO PE08 |
| Broche 32 | PE09 — GPIO PE09 |
| Broche 33 | PE10 — GPIO PE10 |
| Broche 34 | PE11 — GPIO PE11 |
| Broche 35 | PE12 — GPIO PE12 |
| Broche 36 | PE13 — GPIO PE13 |
| Broche 37 | PE14 — GPIO PE14 |
| Broche 38 | PE15 — GPIO PE15 |
| Broche 39 | PB10 — GPIO PB10 / I2C2_SCL |
| Broche 40 | PB11 — GPIO PB11 / I2C2_SDA |
| Broche 41 | VCAP_1 — Core LDO output (1.0uF capacitor) |
| Broche 42 | VDD — Digital supply 3.3V |
| Broche 43 | PB12 — GPIO PB12 / SPI2_NSS |
| Broche 44 | PB13 — GPIO PB13 / SPI2_SCK |
| Broche 45 | PB14 — GPIO PB14 / SPI2_MISO |
| Broche 46 | PB15 — GPIO PB15 / SPI2_MOSI |
| Broche 47 | PD08 — GPIO PD08 / USART3_TX |
| Broche 48 | PD09 — GPIO PD09 / USART3_RX |
| Broche 49 | PD10 — GPIO PD10 |
| Broche 50 | PD11 — GPIO PD11 |
| Broche 51 | PD12 — GPIO PD12 |
| Broche 52 | PD13 — GPIO PD13 |
| Broche 53 | VSS — Ground |
| Broche 54 | VDD — Digital supply 3.3V |
| Broche 55 | PD14 — GPIO PD14 |
| Broche 56 | PD15 — GPIO PD15 |
| Broche 57 | PC06 — GPIO PC06 / SDMMC1_D6 |
| Broche 58 | PC07 — GPIO PC07 / SDMMC1_D7 |
| Broche 59 | PC08 — GPIO PC08 / SDMMC1_D0 |
| Broche 60 | PC09 — GPIO PC09 / SDMMC1_D1 |
| Broche 61 | PA08 — GPIO PA08 |
| Broche 62 | PA09 — GPIO PA09 / OTG_FS_VBUS |
| Broche 63 | PA10 — GPIO PA10 / OTG_FS_ID |
| Broche 64 | PA11 — GPIO PA11 / OTG_FS_DM |
| Broche 65 | PA12 — GPIO PA12 / OTG_FS_DP |
| Broche 66 | PA13 — GPIO PA13 / JTMS-SWDIO |
| Broche 67 | VCAP_2 — Core LDO output (1.0uF capacitor) |
| Broche 68 | VSS — Ground |
| Broche 69 | VDD — Digital supply 3.3V |
| Broche 70 | PA14 — GPIO PA14 / JTCK-SWCLK |
| Broche 71 | PA15 — GPIO PA15 / JTDI |
| Broche 72 | PC10 — GPIO PC10 / SDMMC1_D2 |
| Broche 73 | PC11 — GPIO PC11 / SDMMC1_D3 |
| Broche 74 | PC12 — GPIO PC12 / SDMMC1_CK |
| Broche 75 | PD00 — GPIO PD00 / CAN1_RX |
| Broche 76 | PD01 — GPIO PD01 / CAN1_TX |
| Broche 77 | PD02 — GPIO PD02 / SDMMC1_CMD |
| Broche 78 | PD03 — GPIO PD03 |
| Broche 79 | PD04 — GPIO PD04 |
| Broche 80 | PD05 — GPIO PD05 |
| Broche 81 | PD06 — GPIO PD06 |
| Broche 82 | PD07 — GPIO PD07 |
| Broche 83 | PB03 — GPIO PB03 / JTDO-SWO |
| Broche 84 | PB04 — GPIO PB04 / NJTRST |
| Broche 85 | PB05 — GPIO PB05 |
| Broche 86 | PB06 — GPIO PB06 |
| Broche 87 | PB07 — GPIO PB07 |
| Broche 88 | BOOT0 — Boot mode select |
| Broche 89 | PB08 — GPIO PB08 / I2C1_SCL |
| Broche 90 | PB09 — GPIO PB09 / I2C1_SDA |
| Broche 91 | PE00 — GPIO PE00 / TIM4_ETR |
| Broche 92 | PE01 — GPIO PE01 |
| Broche 93 | VSS — Ground |
| Broche 94 | VDD — Digital supply 3.3V |
| Broche 95 | PDR_ON — Power-down reset enable |
| Broche 96 | VREF+ — ADC reference voltage |
| Broche 97 | VDDA — Analog supply 3.3V |
| Broche 98 | VSS — Ground |
| Broche 99 | PA00 — GPIO PA00 / WKUP |
| Broche 100 | VREF- — ADC reference ground |
| Broche 101 | PC00 — GPIO PC00 / ADC123_INP10 |
| Broche 102 | PC01 — GPIO PC01 / ADC123_INN10 |
| Broche 103 | PC02 — GPIO PC02 / ADC123_INP11 |
| Broche 104 | PC03 — GPIO PC03 / ADC123_INN11 |
| Broche 105 | PA02 — GPIO PA02 |
| Broche 106 | PA03 — GPIO PA03 |
| Broche 107 | PA04 — GPIO PA04 |
| Broche 108 | PA05 — GPIO PA05 |
| Broche 109 | PA06 — GPIO PA06 |
| Broche 110 | PA07 — GPIO PA07 |
| Broche 111 | PB00 — GPIO PB00 |
| Broche 112 | PB01 — GPIO PB01 |
| Broche 113 | VCAP_3 — Core LDO output (1.0uF capacitor) |
| Broche 114 | VSS — Ground |
| Broche 115 | VDD — Digital supply 3.3V |
| Broche 116 | PB02 — GPIO PB02 |
| Broche 117 | PF00 — GPIO PF00 |
| Broche 118 | PF01 — GPIO PF01 |
| Broche 119 | PF02 — GPIO PF02 |
| Broche 120 | PF03 — GPIO PF03 |
| Broche 121 | PF04 — GPIO PF04 |
| Broche 122 | PF05 — GPIO PF05 |
| Broche 123 | VSS — Ground |
| Broche 124 | VDD — Digital supply 3.3V |
| Broche 125 | PF06 — GPIO PF06 |
| Broche 126 | PF07 — GPIO PF07 / ADC3_INP3 |
| Broche 127 | PF08 — GPIO PF08 / ADC3_INP4 |
| Broche 128 | PF09 — GPIO PF09 / ADC3_INN4 |
| Broche 129 | PF10 — GPIO PF10 / ADC3_INP5 |
| Broche 130 | PH00 — GPIO PH00 / OSC_IN |
| Broche 131 | PH01 — GPIO PH01 / OSC_OUT |
| Broche 132 | VSS — Ground |
| Broche 133 | VDD — Digital supply 3.3V |
| Broche 134 | PC00 — GPIO PC00 |
| Broche 135 | PC01 — GPIO PC01 |
| Broche 136 | PC02 — GPIO PC02 |
| Broche 137 | PC03 — GPIO PC03 |
| Broche 138 | PA00 — GPIO PA00 |
| Broche 139 | PA01 — GPIO PA01 |
| Broche 140 | PA02 — GPIO PA02 |
| Broche 141 | PA03 — GPIO PA03 |
| Broche 142 | VSS — Ground |
| Broche 143 | VDD — Digital supply 3.3V |
| Broche 144 | PA04 — GPIO PA04 |
| Broche 145 | PA05 — GPIO PA05 |
| Broche 146 | PA06 — GPIO PA06 |
| Broche 147 | PA07 — GPIO PA07 |
| Broche 148 | PC04 — GPIO PC04 |
| Broche 149 | PC05 — GPIO PC05 |
| Broche 150 | PB00 — GPIO PB00 |
| Broche 151 | PB01 — GPIO PB01 |
| Broche 152 | PB02 — GPIO PB02 |
| Broche 153 | PF11 — GPIO PF11 / ADC1_INP2 |
| Broche 154 | PF12 — GPIO PF12 / ADC1_INP6 |
| Broche 155 | VSS — Ground |
| Broche 156 | VDD — Digital supply 3.3V |
| Broche 157 | PF13 — GPIO PF13 |
| Broche 158 | PF14 — GPIO PF14 |
| Broche 159 | PF15 — GPIO PF15 |
| Broche 160 | PG00 — GPIO PG00 |
| Broche 161 | PG01 — GPIO PG01 |
| Broche 162 | PE00 — GPIO PE00 |
| Broche 163 | PE01 — GPIO PE01 |
| Broche 164 | PI00 — GPIO PI00 |
| Broche 165 | PI01 — GPIO PI01 |
| Broche 166 | PI02 — GPIO PI02 |
| Broche 167 | PI03 — GPIO PI03 |
| Broche 168 | VSS — Ground |
| Broche 169 | VDD — Digital supply 3.3V |
| Broche 170 | PA08 — GPIO PA08 |
| Broche 171 | PA09 — GPIO PA09 |
| Broche 172 | PA10 — GPIO PA10 |
| Broche 173 | PA11 — GPIO PA11 |
| Broche 174 | PA12 — GPIO PA12 |
| Broche 175 | PA13 — GPIO PA13 |
| Broche 176 | PA14 — GPIO PA14 / OSC_OUT (reserved) |
Applications typiques
STM32H753IIT6 convient pour 6 applications: Industrial HMI / TFT-LCD Panel, Motor Control and Robotics Drives, Audio DSP and USB Audio Streaming, Edge AI Sensor Fusion, Point-of-Sale Terminals and Payment Devices, Industrial Gateway and Protocol Converter.
Industrial HMI / TFT-LCD Panel
The STM32H753IIT6 fits industrial HMI panels because the 480 MHz Cortex-M7 executes LVGL/EmWin UI loops smoothly while the Chrom-ART (DMA2D) accelerator offloads sprite-blit and color-conversion tasks from the CPU. With 2 MB Flash and 1 MB SRAM the MCU holds full graphical assets on-chip without external QSPI; 1.4 MB of remaining Flash accommodates firmware updates. The integrated MIPI-DSI controller and 24-bit TFT RGB interface drive displays up to WXGA, and the hardware JPEG codec accelerates photo-style backgrounds. Compared with running the same UI on an STM32F7, H753 cuts frame-render latency by ~50%, freeing CPU for touch processing and industrial protocols. Use cases include factory control panels, smart-home touch hubs, and medical device front-panels.
Recommandé
Motor Control and Robotics Drives
Field-oriented control (FOC) of PMSM and BLDC motors benefits from the STM32H753IIT6's Cortex-M7 DP-FPU, which executes Park/Clarke/PID transforms in single-precision float without cycle overhead. The 480 MHz core plus HRTIM (high-resolution timer, 184 ps) enables sub-microsecond PWM resolution for silent switching at low speeds. Three 12-bit ADCs sampled at 3.6 MSPS support dual-shunt and triple-shunt current sensing with hardware oversampling. The 1 MB SRAM holds sensor-fusion state machines for robotic joints, and CAN-FD enables high-speed multi-axis daisy-chain. Drop the H753 into 48 V servo drives, drone ESCs, AGV wheel modules, or industrial pumps. Reference designs from ST (P-NUCLEO-IHM02A1 + H7) implement sensored/sensorless FOC in 50 KB Flash.
Recommandé
Audio DSP and USB Audio Streaming
USB Audio Class 2.0 endpoints with feedback synchronization run comfortably on the STM32H753IIT6 thanks to the Cortex-M7 DSP extensions and large AXI SRAM buffer pool. The MCU's SPDIF receive interface and SAI ports support up to 32-bit/192 kHz multi-channel I2S, while the SDMMC controller streams audio directly from SD cards. Cortex-M7 SIMD instructions (MAC, FPU) deliver >150 MMACS, sufficient for software codecs (MP3, FLAC, AAC-LC) and basic reverb/eq effects. Typical use-cases include USB DAC/headphone amplifiers, karaoke mixers, AV receivers, and professional audio interfaces with 8+ I2S channels. Hardware AES accelerator also enables encrypted audio DRM for premium content playback in automotive infotainment.
Recommandé
Edge AI Sensor Fusion
Edge AI inference for vibration, current, and image sensor data fits the STM32H753IIT6 thanks to 480 MHz Cortex-M7 throughput (2424 CoreMark) plus 1 MB SRAM for holding quantized TFLite-Micro models. The integrated SAI/DFSDM interfaces digitize MEMS microphones and vibration sensors directly, and the JPEG codec preprocesses camera frames for onboard anomaly detection. Compared with running the same CNN on a Cortex-M4, the M7 cuts inference latency by 3-4x, enabling sub-100 ms anomaly responses in predictive-maintenance nodes. Hardware SHA-256 protects model integrity and secure-boot signatures. Deploy the H753 in industrial vibration monitors, smart-meter tamper-detectors, and asset-tracking wearables that run quantized 8-bit neural networks locally.
Recommandé
Point-of-Sale Terminals and Payment Devices
POS terminals need secure cryptography, fast UI, and reliable connectivity - all native to the STM32H753IIT6. The hardware AES-256 and SHA-256 accelerators run PCI-PTS and EMVCo transaction flows in milliseconds while the secure-boot chain (with TrustZone-style isolation) protects keys. Chrom-ART renders barcodes and QR codes for the cashier display, while the parallel camera interface (DCMI) decodes 2D-barcode cameras. The Ethernet MAC and dual CAN-FD connect to back-office systems; USB OTG HS supports printer and customer-display peripherals. Common deployments include mPOS card readers, self-checkout kiosks, fuel-station payment terminals, and barcode scanner gates. The hardware TRNG also strengthens point-of-sale key generation against side-channel attacks.
Recommandé
Industrial Gateway and Protocol Converter
Industrial gateways that translate between Modbus, EtherCAT, PROFINET, CAN-FD, and MQTT benefit from the STM32H753IIT6's combination of three 12-bit ADCs, dual CAN-FD ports, Ethernet MAC with PTP timestamping, and abundant SRAM for protocol-stack buffering. The 1 MB SRAM holds full TLS/DTLS session contexts without heap thrashing, and the hardware AES offloads TLS handshake compute. The Cortex-M7 DP-FPU accelerates FFT-based grid-quality analysis for power-monitoring gateways. Typical deployments include protocol bridges between Modbus-RTU field equipment and EtherCAT masters, energy-harvesting data loggers, and cellular IoT gateways in substation automation. Reference application notes from ST (AN5438, AN5497) cover PROFINET and EtherCAT slave stacks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour STM32H753IIT6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32H743IIT6 | STM32H745IIT6 | STM32F767IIT6 |
|---|---|---|---|---|
| Package | 176-LQFP (24x24 mm) | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core | Cortex-M7 single-core | Cortex-M7 single-core | Cortex-M7 + Cortex-M4 dual-core | Cortex-M7 single-core |
| Max Frequency | 480 MHz | 480 MHz | 480 MHz (M7) + 240 MHz (M4) | 216 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 1 MB | 1 MB | 1 MB | 512 KB |
| Hardware Crypto/AES | AES-256, SHA-256, TRNG | AES/TRNG only (no SHA-256) | AES-256, SHA-256, TRNG | AES/TRNG only |
| JPEG Codec | Yes (hardware) | No | Yes (hardware) | No |
| Chrom-ART (DMA2D) | Yes | Yes | Yes | Yes |
| Approx. Unit Price (qty 100, as of 2026-10-10) | $14.10 | $13.20 | $16.50 | $11.40 |
Principaux différenciateurs
- Hardware JPEG codec offloads image-decode work (vs STM32H743IIT6)
- SHA-256 accelerator alongside AES-256 (vs STM32H743IIT6)
- Lower cost than dual-core alternative (vs STM32H745IIT6)
Notes de conception
The STM32H753IIT6 requires a 3.3 V I/O supply on all VDD pins and a 1.2 V core rail generated internally from the SMPS or external LDO. Place one 100 nF + 4.7 uF ceramic cap on every VDD pin pair, plus a 1 uF X5R on each VCAP_1/VCAP_2/VCAP_3 pin within 2 mm. Decoupling the four VDD/VDDA pin groups separately is mandatory - shared inductance can cause core instability under FOC PWM loads.
Estimated: at 480 MHz, VDD=3.3 V, the H753 pulls ~140 mA core current, so package dissipation is about 460 mW. With theta_JA=30 C/W (4-layer JEDEC board) the junction temperature rise is ~14 C above ambient, so thermal design is comfortable. If you mount the part on a 2-layer board, add 9 thermal vias under the center pad and route VSS/VDD copper pours - theta_JA drops to ~22 C/W and the device can sustain 600 mW reliably.
Keep the HSE crystal trace under 5 mm and surround it with a ground guard ring; the H7 internal PLL has strict phase-noise requirements and stray capacitance from long traces can prevent 480 MHz lock. Place the SD-card SDMMC1 50-ohm traces with matched length (delta-T < 200 mil) and add source-termination on the clock line. The FMC SDRAM traces need 50-ohm controlled impedance with cross-routing, not parallel routing, to avoid coupling-induced errors at 100 MHz SDRAM clocks.
Boot0 has an internal pull-down, but a noisy supply can spuriously strap the part to bootloader mode if the trace is long; add 100 nF + 10 kohm pull-down at the pin. Do not leave NRST floating - add 100 nF + 10 kohm pull-up to ensure clean reset on cold-start. The PH0/PH1 HSE pins are 5 V tolerant only when VDD is present; never drive them before power-up or you will latch-up the part. For JTAG/SWD connect 4.7 kohm pull-ups to TMS and TCK.
Informations de conformité
RoHS 2011/65/EU compliant, REACH EC 1907/2006 compliant, lead-free reflow profile 245 C peak. Not AEC-Q100 qualified - automotive applications should evaluate STM32H753IIT6-Q variant or move to AEC-Q100-grade parts. Halogen-free molding compound per IEC 61249-2-21.