XC6SLX25T-2FG484C - Spartan-6 LXT 24K FPGA | AMD
Référence : XC6SLX25T-2FG484C ✓ ActifXC6SLX25T-2FG484C Présentation
An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, memory resources, and input/output blocks. This device belongs to the hierarchy FPGA, programmable logic device, digital semiconductor, and integrated circuit. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for logic, control, signal processing, communications, or embedded systems, making it useful when product requirements evolve late in development.
The Spartan-6 LXT family combines a 45 nm process with configurable logic, block RAM, digital signal processing resources, and high-speed serial transceivers. The XC6SLX25T provides 24,051 logic cells and a listed internal frequency of 500 MHz. Its 484-pin FBGA package supports dense PCB routing, while the lead-free package configuration supports RoHS-oriented product development. The commercial operating-temperature range is 0 to 85 C.
The -2 performance grade provides a balanced operating point for designs requiring more timing margin than the -1 grade but not the highest performance of the -3 grade. This distinction matters in clocked interfaces, DSP pipelines, and control systems: designers should use the published timing constraints and speed-grade-specific characteristics when defining clock periods, I/O standards, and implementation targets rather than assuming identical timing across grades.
Typical uses include industrial automation, video and image processing, communications infrastructure, instrumentation, embedded control, and parallel data acquisition. The combination of 24,051 logic cells and dedicated FPGA resources allows designers to implement multiple control channels, protocol interfaces, filtering, and state machines in one device. A high-speed serial transceiver is particularly useful where the design must connect to serial links rather than only conventional parallel I/O.
PCB implementation requires careful power planning, decoupling, clocking, and signal-integrity control. Follow the AMD Spartan-6 package pinout files and device documentation when assigning every 484 ball, especially power, ground, configuration, clock, and transceiver pins. Validate the selected I/O standard, voltage, pull-up or pull-down requirement, bank voltage, and external component recommendations before releasing the layout.
This page combines package, logic-cell, speed, temperature, and interface information with practical selection guidance. It also distinguishes speed-grade and temperature-grade alternatives that share the target footprint, helping engineers identify a valid replacement without confusing package identity, performance class, or device functionality.
Alternatives de remplacement direct pour XC6SLX25T-2FG484C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX25T-2FG484C (même facteur de forme et même empreinte) — différant par Device Type, Speed Grade, Package, Package Dimensions, Temperature Grade.
XC6SLX25T-2FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25T-3FG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25T-2FG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25T-3FG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25T-2FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25T-2FG484C Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LXT |
| Logic Cells | 24,051 cells |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -2 |
| Boîtier | 484-pin FBGA |
| Package Dimensions | 15 x 15 mm |
| Package Pitch | 0.80 mm |
| Lead-Free Package | Yes |
| Température de fonctionnement | 0 C to +85 C |
| Type de montage | Surface Mount |
Guide de configuration des broches du XC6SLX25T-2FG484C yes
Configuration des broches du XC6SLX25T-2FG484C (boîtier yes). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX25T-2FG484C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX25T-2FG484C convient pour 6 applications: Industrial Automation and PLC Control, Video and Image Preprocessing, Communications and Protocol Bridging, Digital Signal Processing, Test and Measurement Instrumentation, Embedded Control and Sensor Aggregation.
Industrial Automation and PLC Control
The XC6SLX25T-2FG484C fits industrial machine-control logic where parallel I/O, deterministic sequencing, and reconfigurable logic are more valuable than a fixed controller. Its 24,051 logic cells can support state machines, counters, interlocks, motor-command logic, and multiple communication adapters in one 45 nm CMOS FPGA. The listed 500 MHz internal frequency gives designers substantial timing headroom for pipelined control paths, while the -2 grade provides a defined performance class for timing analysis. The commercial 0 to 85 C range covers many factory environments. Designers should use the AMD package pinout to connect isolated field inputs, relay drivers, encoders, and safety-related interlocks, and should verify every I/O voltage, bank constraint, and external isolation requirement before hardware release.
Recommandé
Video and Image Preprocessing
The XC6SLX25T-2FG484C is suitable for pixel-stream conditioning, frame timing, color processing, and sensor-interface logic in compact vision systems. Its 24,051 logic cells allow parallel pipelines to be built without relying on a separate processor for every timing function, and the listed 500 MHz internal frequency supports registered stages operating above typical video pixel-clock rates. Engineers can implement line and frame counters, thresholding, filtering, and data-format conversion around a camera or image sensor. The 484-BBGA package also provides a dense footprint for high fan-out connectivity, although it requires careful escape routing and power planning. Use the manufacturer package files to assign high-speed transceiver and parallel I/O resources, and validate timing at the -2 speed grade with the exact external-interface constraints.
Recommandé
Communications and Protocol Bridging
The XC6SLX25T-2FG484C can serve as a configurable protocol bridge or interface controller in communications equipment. Its programmable logic supports parallel-to-serial adaptation, packet framing, CRC generation, buffering, and device-specific I/O mappings, while the Spartan-6 LXT family provides high-speed serial transceiver resources. The 24,051 logic cells are useful for implementing complete control paths beside the physical layer, and the 484-pin package offers extensive I/O for multiple channels and management interfaces. Engineers should select this device only after confirming that the required transceivers, reference clocks, supported standards, and timing constraints fit the selected configuration. Keep channel routing away from sensitive control paths, provide compliant clocking and decoupling, and use static timing analysis for every enabled high-speed interface.
Recommandé
Digital Signal Processing
The XC6SLX25T-2FG484C is appropriate for fixed digital filters, FFT-related pipelines, modulation functions, and sampling-control logic when the design needs parallel programmable throughput. Its 24,051 logic cells can accommodate pipeline registers, arithmetic control, buffering, and data-format conversion, while the listed 500 MHz internal frequency supports clocked processing stages. The -2 speed grade must be used with its specific timing data so pipeline retiming is not based on -3 performance. In a typical instrument, the FPGA can accept parallel ADC data, apply multiplication and accumulation functions, and pass processed data to a host interface. External converter and memory interfaces remain critical engineering points: constrain input and output delays, confirm supported I/O standards, and separate analog-sensitive routing from high-current FPGA outputs.
Recommandé
Test and Measurement Instrumentation
The XC6SLX25T-2FG484C fits modular test equipment that combines acquisition control, sequencing, pattern generation, and data formatting. Its programmable architecture permits field-selectable logic and reusable hardware across instrument families, reducing dependence on fixed-function silicon. The 24,051 logic cells support timing generators, counter arrays, status machines, and interface adapters, while the 500 MHz listed internal frequency allows deeply pipelined data movement. The dense 484-BBGA package is appropriate for boards needing many connections, although BGA escape routing, via-in-pad construction, and power-plane transitions require careful review. Designers should separate analog input conditioning from digital routing, maintain defined reference-clock topology, and validate every acquisition, trigger, and serial interface against the selected I/O resources and timing constraints.
Recommandé
Embedded Control and Sensor Aggregation
The XC6SLX25T-2FG484C can consolidate control logic and sensor aggregation in compact embedded systems. Its 24,051 logic cells allow multiple digital sensors, switches, encoders, and actuators to be managed through programmable acquisition and decision logic without requiring a separate processor for each channel. The device is particularly useful when filtering, calibration tables, event sequencing, and local fault handling must be updated independently of fixed hardware. The commercial-grade 0 to 85 C specification covers many indoor and controlled industrial installations, but enclosure heating, cooling, and temperature rise can affect margin. Follow the AMD pinout for power, configuration, clock, and I/O assignment, use continuous grounding where appropriate, and confirm wake, startup, and reset behavior for the intended system architecture.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX25T-2FG484C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX25T-2FGG484C | XC6SLX25T-3FG484C | XC6SLX25T-2FG484I | XC6SLX25T-3FG484I | XC6SLX25T-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Speed Grade | -2 | -2 | -3 | -2 | -3 | -2 |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Industrial (I) | Industrial (I) | Industrial (I) |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
Principaux différenciateurs
- Defined -2 performance grade with substantial internal timing capability (vs XC6SLX25T-3FG484C)
- Commercial-temperature configuration for controlled environments (vs XC6SLX25T-2FG484I)
- Lead-free 484-BBGA package maintains dense board integration (vs M7AGL600-FFG484)
Notes de conception
Treat the 484-BBGA as a high-density routing problem. Assign every ball from the AMD Spartan-6 package pinout, provide all designated power and ground connections, and preserve the manufacturer-recommended layer stack and via arrangement. Use a continuous reference plane where the design guidance permits it, and route high-speed clocks and serial interfaces over controlled reference planes. Do not derive ball assignments from a similar-looking BGA package.
Plan separate distribution for the 1.2 V core rail and any other device supply domains, then follow the published decoupling and power-sequence requirements. Place decoupling capacitance directly at the relevant package balls rather than at the board edge, and keep high-current return paths short. Before power-up, verify that external regulators can source the required transient current and that the selected -2 speed grade and configuration method are compatible with the power-up sequence.
Apply I/O-standard and bank-specific constraints for every external signal, including voltage, drive strength, pull-up or pull-down behavior, and permitted clock sources. Maintain return paths beneath high-speed lanes, control reference-clock jitter and skew, and avoid routing memory or serial interfaces across plane splits. The 500 MHz value is an internal frequency listing; actual interface limits depend on the selected I/O standard, package connections, clocking, and timing constraints.
A matching package suffix alone does not prove interchangeability. The -2 and -3 parts have different timing characteristics, C and I indicate different temperature grades, and green-package coding changes the finish designation. Confirm the exact ordering code, operating-temperature requirement, speed-grade timing report, configuration method, and package drawing before releasing a substitution into production.
Estimate junction temperature from total FPGA power, ambient temperature, package thermal characteristics, and the actual PCB copper and via configuration rather than relying on a generic package rating. Keep high-current paths and switching logic distributed where practical, and monitor temperature in industrial enclosures. Actual thermal limits must come from the selected device documentation; a design that relies on the -3 grade's behavior should be re-evaluated when using the -2 grade.
Informations de conformité
The device listing identifies the package as lead-free. Specific RoHS, REACH, halogen-free, and conflict-minerals declarations were not identified, so those fields remain unknown. AEC-Q100 is not applicable because the C suffix identifies the commercial-temperature family variant rather than an automotive-qualified variant.