XC6SLX25-3FGG484C - 24,051-Cell Spartan-6 FPGA | AMD
Référence : XC6SLX25-3FGG484C ✓ ActifXC6SLX25-3FGG484C Présentation
An FPGA is a semiconductor whose digital logic is configured after manufacture. Within the product hierarchy, the XC6SLX25-3FGG484C is a Spartan-6 LX FPGA, a programmable-logic device, and an integrated circuit. This classification places it between fixed-function logic and software-driven processors: parallel processing elements can execute filtering, control, protocol, and interface tasks concurrently after the device is programmed.
The principal device-level characteristics are 24,051 logic cells, 266 user I/O, 45 nm CMOS fabrication, and a 1.2 V core supply. Its integrated system integration features allow a compact implementation to combine multiple digital functions without requiring separate logic devices. Block RAM supports data buffering and storage, while DSP resources accelerate arithmetic-heavy signal-processing pipelines. The broad I/O count also makes the device suitable for designs requiring substantial external connectivity.
Spartan-6 devices use selectable I/O standards and programmable logic resources to balance performance, power, and cost. The -3 grade is intended for designs that prioritize operating speed over the lower-speed family members. Because the exact I/O-standard list, memory quantities, DSP-slice counts, differential-I/O limits, and performance timing values are not established by the product listing, engineers should confirm those details against the Spartan-6 family documentation before finalizing a high-speed or I/O-intensive design.
Typical uses include industrial control, video and image processing, communications infrastructure, instrumentation, embedded signal processing, and general-purpose digital logic consolidation. The device is especially useful when parallel throughput, deterministic hardware implementation, and flexible I/O assignment matter more than software flexibility. Its 484-pin FBGA package requires careful PCB escape-routing and multilayer assembly planning.
Design around the 1.2 V core supply with separate, properly decoupled rails for all specified supply domains. Follow the Spartan-6 package pinout file for ball assignments and verify every high-speed interface against the published I/O and timing constraints. Programming should use a compatible configuration interface and supported device-support flow, with configuration storage, clocking, and reset arranged to avoid contention during startup.
This product record combines the exact device identity, core specifications, sourcing links, same-footprint alternatives, and application-focused design guidance. It supports initial device selection while directing detailed I/O, timing, power, and PCB decisions to the manufacturer documentation.
Alternatives de remplacement direct pour XC6SLX25-3FGG484C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX25-3FGG484C (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Logic Cells, Device Type.
XC6SLX25-2FGG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25-3FGG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25-2FG484C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX100-3FGG484C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25T-3FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-3FGG484C Valeurs maximales et caractéristiques électriques
| Manufacturer | AMD / Xilinx |
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cell Count | 24,051 cells |
| User I/O Count | 266 I/O |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Boîtier | 484-pin FBGA |
| Package Type | FBGA |
| Number of Package Balls or Pins | 484 |
| Programmable Logic Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Speed Grade | -3 |
| Type de montage | Surface mount |
| Device Category | Programmable logic device |
| Statut RoHS | RoHS compliant |
| Lead-Free Status | Lead free |
Guide de configuration des broches du XC6SLX25-3FGG484C 484
Configuration des broches du XC6SLX25-3FGG484C (boîtier 484). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX25-3FGG484C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX25-3FGG484C convient pour 6 applications: Industrial Control and Automation, Video and Image Processing, Communications and Protocol Consolidation, Digital Signal Processing, Test and Measurement Instrumentation, Embedded Networking and IoT Gateways.
Industrial Control and Automation
The XC6SLX25-3FGG484C fits industrial controllers that combine deterministic parallel logic with numerous external connections. Its 24,051 logic cells can host state machines, sequencing logic, counters, fault handling, and communication interfaces, while 266 user I/O support sensors, actuators, and field-bus transceivers. The -3 speed grade provides the higher-performance Spartan-6 LX option identified in the family documentation. A designer would typically partition control and datapath logic into clocked domains, then use dedicated clock-management resources and disciplined I/O timing. The 1.2 V core supply requires close decoupling and a carefully planned multilayer power distribution network. Before schematic release, verify that every external signal standard, differential-I/O limit, and timing path satisfies the exact device constraints and the industrial environmental requirements of the finished system.
Recommandé
Video and Image Processing
The XC6SLX25-3FGG484C is appropriate for parallel video pipelines where pixel throughput and deterministic latency matter. Its 24,051 logic cells can implement timing controllers, color conversion, thresholding, filtering, and interface bridges, while its 266 user I/O provide connectivity for image sensors, memory devices, and display interfaces. The -3 speed grade favors timing-critical paths when paired with suitable external memory and video standards. In a typical design, acquisition logic captures parallel data into block RAM, processing engines operate in parallel, and a second interface presents the result. Package escape routing, simultaneous-switching noise, and high-speed clock integrity require careful PCB planning. Validate the selected video interface and memory interface against the device's published I/O standards and timing limits before committing to the BGA layout.
Recommandé
Communications and Protocol Consolidation
The XC6SLX25-3FGG484C can consolidate several communication functions into one configurable Spartan-6 LX device. The 24,051-cell fabric is suitable for parallel framing, FIFO control, checksums, filtering, and protocol state machines, and 266 I/O offer substantial connectivity to transceivers and backplane devices. The higher -3 speed grade is useful where parallel bus timing or throughput is restrictive. Engineers can implement independent clock domains for receive, transmit, and system control, using the device's programmable logic and block RAM instead of several fixed-function interface devices. The principal engineering tradeoffs are package-routing complexity, power integrity for 1.2 V operation, and the need to constrain every external interface. Confirm supported I/O standards, clock topology, and timing budgets against the family documentation for the final system.
Recommandé
Digital Signal Processing
The XC6SLX25-3FGG484C is suitable for fixed-function signal-processing accelerators that benefit from parallel hardware execution. Its programmable logic can implement filters, correlation, modulation, and data-format conversion, while dedicated DSP resources can accelerate multiply-accumulate operations when the design uses them. With 24,051 logic cells and 266 user I/O, the device can combine a processing pipeline with control logic and external data interfaces. The -3 speed grade can improve timing margin for demanding datapaths. In implementation, split the architecture into streaming input, DSP or logic processing, buffering, and output stages, then constrain clock-crossing paths carefully. The exact number of DSP slices and block RAM blocks must be checked before architecture allocation, and the PCB must support clean power delivery, controlled impedance, and short return paths for high-speed signals.
Recommandé
Test and Measurement Instrumentation
The XC6SLX25-3FGG484C can implement acquisition, timing, pattern generation, and control functions within a compact instrumentation platform. Its 24,051 logic cells support parallel datapaths, while 266 I/O provide access to converters, memory, trigger logic, and communication interfaces. The -3 grade is attractive for designs requiring more timing margin than the -2 options. A practical architecture can dedicate logic to sampling control, use block RAM for capture windows, and isolate high-speed analog interfaces behind clocking and termination schemes. Engineers should use the exact FGG484 pinout file, maintain continuous ground planes, and plan the 1.2 V core rail with local bulk and high-frequency decoupling. Final selection requires checking acquisition rates, supported I/O standards, and timing constraints against the target instrumentation specification.
Recommandé
Embedded Networking and IoT Gateways
The XC6SLX25-3FGG484C fits network-edge gateways that must translate between multiple physical interfaces while executing protocol logic concurrently. Its 24,051 logic cells can support packet framing, queues, security preprocessing, and management functions, and 266 user I/O allow direct connection to Ethernet, serial, storage, and control components. The -3 speed grade supports timing-sensitive parallel paths. A typical design separates ingress and egress traffic into independent clock domains and uses block RAM for buffering before a hardware pipeline processes the payload. Because the device uses a 484-pin FBGA, power and signal-integrity planning are critical: use multilayer construction, uninterrupted return planes, and placement that minimizes high-speed trace length. Validate all network interfaces, supported I/O standards, and timing requirements for the exact operating conditions before release.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX25-3FGG484C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX25-2FGG484I | XC6SLX25-3FGG484I | XC6SLX25-2FG484C | XC6SLX100-3FGG484C | XC6SLX25T-3FGG484C |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA - same package | 484-pin FBGA - same package | 484-pin FBGA - same package | 484-pin FBGA - same package | 484-pin FBGA - same package |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT |
| Speed Grade | -3 | -2 | -3 | -2 | -3 | -3 |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Temperature Suffix | C | I | I | C | C | C |
Principaux différenciateurs
- Combines 24,051 logic cells with 266 user I/O (vs XC6SLX25T-3FGG484C)
- Uses the -3 performance grade within the 24K Spartan-6 LX density (vs XC6SLX25-2FGG484I)
- Maintains the exact LX density class while changing package format (vs XC6SLX100-3FGG484C)
Notes de conception
Use the AMD Spartan-6 FGG484 package-device pinout file as the controlling assignment reference. Route every power and ground ball directly into continuous planes, place local bulk and high-frequency decoupling beside the associated supply balls, and avoid splits beneath the BGA. The device uses a 1.2 V core supply, so return-path continuity and supply-noise control are central to reliable operation. Validate escape routing, via current capacity, and assembly constraints with the board stack-up before release.
Separate the FPGA's specified supply domains rather than assuming a single regulator can serve every rail. Follow the family documentation for sequencing, voltage tolerance, and startup behavior. Confirm decoupling values and rail tolerances against the exact device revision and operating conditions. When substituting another FGG484 MPN, recheck the power requirements rather than assuming that matching the package also guarantees identical electrical or configuration behavior.
Constrain all external interfaces and clock paths with the device-specific timing tools and I/O standards. Route clocks over continuous reference planes, control impedance according to the selected PCB stack-up, and minimize stubs on high-speed nets. The target offers 266 user I/O, but package escape-routing density can make simultaneous switching noise a significant concern; use assigned power and ground balls strategically and review worst-case current patterns during layout.
Do not treat a matching 484-pin package as proof that every alternative is functionally interchangeable. The XC6SLX25-2FGG484I changes speed and temperature grade, the XC6SLX25T-3FGG484C changes from LX to LXT, and the XC6SLX100-3FGG484C changes the density class. Confirm the bitstream target, device ID, package pinout, timing grade, temperature range, and resource allocation before approving a substitution.
Informations de conformité
The FGG484 device is identified as lead free and RoHS compliant. AEC-Q100 status, REACH status, halogen-free status, and conflict-minerals status were not established for the exact target ordering code.