XC7A50T-1CSG324I - Artix-7 FPGA, 52K Logic Cells | AMD
Référence : XC7A50T-1CSG324I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $82.3 | $823,00 |
| 100 | $74.1 | $7 410,00 |
| 500 | $66.8 | $33 400,00 |
| 1 000 | $60.2 | $60 200,00 |
XC7A50T-1CSG324I Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and reconfigurable interconnects, allowing them to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are themselves a subset of integrated circuits. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring field upgrades.
Key features of the XC7A50T-1CSG324I include 52,160 logic cells, 2,764,800 bits of block RAM, 120 DSP slices, and 5 clock management tiles (CMTs) each containing a mixed-mode clock manager (MMCM) and a phase-locked loop (PLL). The device supports a wide range of I/O standards including LVCMOS, LVDS, and HSTL, and features high-speed serial transceivers for gigabit connectivity. The 28nm process technology balances performance with power efficiency.
Architecturally, the Artix-7 family is built on AMD's 28nm high-performance, low-power (HPL) process. The device integrates hardened memory controllers, supporting DDR3 and DDR3L, and includes dedicated blocks for PCIe and Ethernet. The configurable logic blocks (CLBs) contain look-up tables (LUTs) and flip-flops, while the DSP48E1 slices enable high-speed arithmetic operations. The device is programmed via SRAM-based configuration, requiring an external configuration source such as a flash memory or a microprocessor.
Typical applications include industrial motor control, medical imaging, software-defined radio, and video processing. The 210 user I/Os and 324-pin package make it suitable for board designs where space is at a premium. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this FPGA, careful attention must be paid to power supply decoupling and configuration bitstream storage. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a configuration source. Proper PCB layout, including impedance-controlled traces for high-speed signals, is essential for reliable operation.
Alternatives de remplacement direct pour XC7A50T-1CSG324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A50T-1CSG324I (même facteur de forme et même empreinte) — différant par Package, DSP Slices, Speed Grade, Block RAM, Logic Cells.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A50T-2CSG324I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$25.4545 / unité
Voir la fiche technique →XC7A50T-1CSG324C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A100T-1CSG324C
✅ Remplacement direct✓ En stock
$59.9 / unité
Voir la fiche technique →XC7A35T-2CSG325C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A100T-2CSG324I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$105 / unité
Voir la fiche technique →XC7A50T-1CSG324I Valeurs maximales et caractéristiques électriques
| Family | Artix-7 |
| Logic Cells | 52,160 |
| Block RAM | 2,764,800 bits |
| DSP Slices | 120 |
| User I/Os | 210 |
| Boîtier | 324-LFBGA, CSPBGA (15x15 mm) |
| Technology | 28nm |
| Core Voltage | 1V |
| Température de fonctionnement | -40°C to +100°C (industrial) |
| Speed Grade | -1 |
| Configuration | SRAM-based |
| Clock Management | 5 CMTs (MMCM + PLL) |
| Total RAM | 2,764,800 bits |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de XC7A50T-1CSG324I
| Broche A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Broche A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Broche B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Broche B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Broche C1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Broche C2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Broche D1 | VCCINT — Internal core voltage 1V |
| Broche D2 | GND — Ground |
| Broche E1 | VCCAUX — Auxiliary voltage 1.8V |
| Broche E2 | GND — Ground |
| Broche F1 | VCCO_0 — I/O bank 0 supply voltage |
| Broche F2 | GND — Ground |
Applications typiques
XC7A50T-1CSG324I convient pour 6 applications: Industrial Motor Control, Medical Imaging, Software-Defined Radio, Video Processing, Aerospace and Defense, IoT Edge Computing.
Industrial Motor Control
The XC7A50T-1CSG324I is ideal for industrial motor control applications due to its 120 DSP slices and 210 user I/Os, which enable high-speed PWM generation and encoder feedback processing. The industrial temperature grade (-40°C to +100°C) ensures reliable operation in factory environments. The FPGA's low power consumption and 28nm process make it suitable for compact drives. With 2,764,800 bits of block RAM, it can store complex control algorithms and lookup tables for field-oriented control (FOC). The device's high-speed transceivers allow for real-time communication with host controllers via EtherCAT or PROFINET.
Recommandé
Medical Imaging
The XC7A50T-1CSG324I is well-suited for medical imaging systems such as ultrasound and X-ray machines, where high-speed data acquisition and processing are critical. Its 52,160 logic cells and 120 DSP slices enable real-time image filtering and enhancement algorithms. The 210 user I/Os support interfacing with high-speed ADCs and image sensors. The device's low power consumption is beneficial for portable medical devices. The industrial temperature grade ensures reliable operation in clinical environments. The FPGA's reconfigurability allows for firmware updates to improve imaging algorithms without hardware changes.
Recommandé
Software-Defined Radio
The XC7A50T-1CSG324I is an excellent choice for software-defined radio (SDR) applications, offering 120 DSP slices for digital down-conversion and filtering. Its 210 user I/Os can interface with high-speed ADCs and DACs, while the 2,764,800 bits of block RAM support large FFT buffers. The device's low power consumption is critical for battery-powered portable radios. The industrial temperature grade allows deployment in outdoor communication equipment. The FPGA's reconfigurability enables support for multiple wireless standards (e.g., LTE, Wi-Fi) in a single hardware platform.
Recommandé
Video Processing
The XC7A50T-1CSG324I is well-suited for video processing applications such as surveillance cameras and video conferencing systems. Its 52,160 logic cells can implement video scalers, color space converters, and compression algorithms. The 210 user I/Os support interfacing with HDMI, MIPI, and LVDS video interfaces. The device's block RAM can store multiple video lines for processing. The industrial temperature grade is suitable for outdoor surveillance cameras. The FPGA's parallel processing capability enables real-time video analytics at high resolutions.
Recommandé
Aerospace and Defense
The XC7A50T-1CSG324I is suitable for aerospace and defense applications such as avionics displays and radar signal processing. Its industrial temperature grade (-40°C to +100°C) meets the requirements for harsh environments. The 120 DSP slices enable high-speed signal processing for radar and communication systems. The 210 user I/Os support interfacing with various sensors and actuators. The device's low power consumption is critical for airborne systems. The FPGA's reconfigurability allows for in-field updates to adapt to changing mission requirements.
Recommandé
IoT Edge Computing
The XC7A50T-1CSG324I is ideal for IoT edge computing devices that require low power and high performance. Its 52,160 logic cells can implement machine learning inference engines for anomaly detection. The 210 user I/Os support interfacing with various sensors and communication modules. The device's low power consumption enables battery-powered operation. The industrial temperature grade is suitable for industrial IoT applications. The FPGA's reconfigurability allows for over-the-air updates to improve algorithms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A50T-1CSG324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A50T-2CSG324I | XC7A50T-1CSG324C | XC7A100T-1CSG324C | XC7A35T-2CSG325C |
|---|---|---|---|---|---|
| Package | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA - same | 324-LFBGA, CSPBGA - same | 324-LFBGA, CSPBGA - same | 324-LFBGA, CSPBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 52,160 | 52,160 | 52,160 | 101,440 | 33,280 |
| Block RAM | 2,764,800 bits | 2,764,800 bits | 2,764,800 bits | 4,861,440 bits | 1,857,600 bits |
| DSP Slices | 120 | 120 | 120 | 240 | 90 |
| User I/Os | 210 | 210 | 210 | 210 | 210 |
| Temperature Grade | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Commercial (0°C to +85°C) | Commercial (0°C to +85°C) |
| Speed Grade | -1 | -2 | -1 | -1 | -2 |
Principaux différenciateurs
- Industrial temperature grade (vs XC7A50T-1CSG324C)
- Cost-effective logic density (vs XC7A100T-1CSG324C)
- Balanced speed grade (vs XC7A50T-2CSG324I)
Notes de conception
The XC7A50T-1CSG324I requires multiple power supply rails: VCCINT (1.0V core), VCCAUX (1.8V auxiliary), and VCCO (I/O bank voltage, typically 1.8V, 2.5V, or 3.3V). Use low-dropout regulators or switching regulators with proper decoupling. Place 100nF ceramic capacitors close to each power pin and bulk capacitors (10uF) at the power entry points. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.
For the 324-pin CSPBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (50 ohm single-ended, 100 ohm differential). Ensure the thermal pad is properly connected to the ground plane for heat dissipation. Follow AMD's PCB design guidelines in UG583 for layout recommendations.
Ensure the configuration bitstream is stored in a compatible flash device (e.g., SPI flash) and that the configuration mode pins are set correctly. Do not leave unused I/O pins floating; configure them as inputs with pull-ups or drive them to a defined state. Verify that all power supply rails are within specification before programming the device.
Informations de conformité
RoHS compliance indicated by distributor listings. AEC-Q100 not applicable for FPGA. Other compliance data not specified in provided sources.
