XC7K410T-1FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD
Référence : XC7K410T-1FFG900I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1495 | $1 495,00 |
| 10 | $1345 | $13 450,00 |
| 100 | $1195 | $119 500,00 |
| 500 | $1045 | $522 500,00 |
| 1 000 | $895 | $895 000,00 |
XC7K410T-1FFG900I Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the designer after manufacturing, allowing custom digital logic implementations. FPGAs sit within the broader hierarchy of programmable logic devices, offering reconfigurability that bridges the gap between fixed-function ASICs and software-programmable processors. The Kintex-7 family is positioned as a mid-range, high-performance FPGA family within the AMD/Xilinx 7 series, balancing logic capacity, transceiver speed, and power efficiency.
Key features of the XC7K410T-1FFG900I include 500 user I/Os supporting various I/O standards, 29,306,880 bits of block RAM for on-chip data storage, and 1,540 DSP slices for high-throughput signal processing. The device also integrates 16 GTX transceivers capable of up to 12.5 Gb/s, enabling high-speed serial communication. The -1 speed grade offers a balanced performance point, while the industrial (I) temperature grade supports operation from -40°C to +100°C.
Architecturally, the Kintex-7 FPGA is built on a 28nm high-k metal gate (HKMG) process, providing a favorable performance-per-watt ratio. The device includes hardened memory controllers, PCIe blocks, and mixed-mode clock managers (MMCMs) and PLLs for robust clock generation. This integration reduces external component count and simplifies board design.
Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The combination of high logic density, DSP resources, and high-speed transceivers makes it suitable for software-defined radio, radar processing, and video processing systems.
When designing with this device, careful attention to power supply decoupling and thermal management is essential. The 1V core supply requires a clean, low-impedance power plane, and the FCBGA package's thermal pad should be connected to a solid ground plane with adequate vias for heat dissipation.
Alternatives de remplacement direct pour XC7K410T-1FFG900I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7K410T-1FFG900I (même facteur de forme et même empreinte) — différant par Package, Process Technology, Block RAM, Logic Cells, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7K410T-2FFG900I
✅ Remplacement direct✓ En stock
$920 / unité
Voir la fiche technique →XC7K410T-L2FFG900I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7K325T-2FFG900I
⚡ Même boîtier ⚠️ Spécifications non vérifiées✓ En stock
$65 / unité
Voir la fiche technique →XC7K480T-2FFG900I
⚡ Même boîtier ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7K410T-1FFG900I Valeurs maximales et caractéristiques électriques
| Family | Kintex-7 |
| Logic Cells | 406720 |
| Block RAM | 29306880 bits |
| DSP Slices | 1540 |
| User I/O | 500 |
| I/O Standards | LVCMOS, LVDS, HSTL, SSTL (up to 1.8V) |
| GTX Transceivers | 16 (up to 12.5 Gb/s) |
| Core Voltage (VCCINT) | 1.0 V |
| Speed Grade | -1 |
| Temperature Grade | Industrial (I): -40C to +100C |
| Boîtier | 900-FCBGA (31x31 mm) |
| Type de montage | Surface Mount |
| Process Technology | 28nm HKMG |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de XC7K410T-1FFG900I
| Broche A1 | GND — Ground |
| Broche A2 | VCCINT — Core voltage 1.0V |
| Broche A3 | IO_L1P_T0 — User I/O bank 0 |
| Broche B1 | VCCAUX — Auxiliary voltage 1.8V |
| Broche B2 | IO_L2N_T0 — User I/O bank 0 |
| Broche C1 | GND — Ground |
| Broche C2 | IO_L3P_T0 — User I/O bank 0 |
| Broche D1 | VCCINT — Core voltage 1.0V |
| Broche D2 | IO_L4N_T0 — User I/O bank 0 |
| Broche E1 | GND — Ground |
| Broche E2 | IO_L5P_T0 — User I/O bank 0 |
| Broche F1 | VCCAUX — Auxiliary voltage 1.8V |
Applications typiques
XC7K410T-1FFG900I convient pour 6 applications: High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Software-Defined Radio, Video Processing.
High-Performance Computing
The XC7K410T-1FFG900I excels in high-performance computing (HPC) applications such as data acceleration and scientific simulation. With 406,720 logic cells and 1,540 DSP slices, it can implement complex arithmetic pipelines for financial modeling, genomics, and physics simulations. The 500 user I/Os enable high-bandwidth interfaces to external memory and accelerators, while the 16 GTX transceivers support high-speed interconnects like PCIe and Ethernet. The 28nm process provides a balance of performance and power, making it suitable for rack-mounted servers where thermal density is a concern. Designers can leverage the FPGA's reconfigurability to optimize algorithms for specific workloads, achieving higher throughput than general-purpose CPUs.
Recommandé
Wired Communications
In wired communications, the XC7K410T-1FFG900I is ideal for line cards, switches, and routers. Its 16 GTX transceivers support up to 12.5 Gb/s each, enabling 100G Ethernet and other high-speed serial protocols. The 500 user I/Os can interface with PHYs, MACs, and network processors, while the block RAM (29,306,880 bits) buffers packets and manages queues. The FPGA's DSP slices handle packet processing, traffic shaping, and error correction. The industrial temperature grade ensures reliable operation in central office environments. Designers can implement flexible, upgradeable data paths that adapt to evolving standards without hardware redesign, reducing time-to-market for new networking equipment.
Recommandé
Aerospace and Defense
The XC7K410T-1FFG900I is well-suited for aerospace and defense systems, including radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to +100°C) and 28nm process ensure reliable operation in harsh environments. The high logic density supports complex signal processing algorithms, while the DSP slices accelerate FFTs and filters. The 500 I/Os interface with sensors, ADCs, and DACs, and the GTX transceivers enable high-speed data links. AMD's long-term supply commitment and traceability options, as highlighted by FPGAX, make it suitable for defense programs requiring extended lifecycle support. Designers can implement reconfigurable processing chains that adapt to mission requirements.
Recommandé
Medical Imaging
The XC7K410T-1FFG900I is used in medical imaging systems like CT scanners, MRI, and ultrasound. Its 406,720 logic cells and 1,540 DSP slices enable real-time image reconstruction, filtering, and enhancement. The 500 user I/Os interface with high-speed ADCs and image sensors, while the block RAM stores intermediate image data. The GTX transceivers support high-speed data transfer to host processors. The industrial temperature grade ensures stable operation in clinical environments. The FPGA's reconfigurability allows algorithm updates without hardware changes, extending the life of medical equipment. Designers can achieve the low latency required for real-time imaging, improving diagnostic accuracy.
Recommandé
Software-Defined Radio
The XC7K410T-1FFG900I is a strong choice for software-defined radio (SDR) systems. Its DSP slices and logic cells implement modulation, demodulation, and channel coding for various waveforms. The 16 GTX transceivers connect to RF front-ends and high-speed ADCs/DACs, while the 500 I/Os provide flexible control interfaces. The block RAM buffers samples and supports polyphase filter banks. The industrial temperature grade supports deployment in field environments. Designers can reconfigure the FPGA to support multiple communication standards (e.g., LTE, 5G, military waveforms) on a single platform, reducing hardware costs and enabling rapid upgrades.
Recommandé
Video Processing
The XC7K410T-1FFG900I is used in video processing systems for broadcasting, surveillance, and medical displays. Its logic cells and DSP slices implement video codecs, scaling, and color space conversion. The 500 user I/Os interface with HDMI, DisplayPort, and SDI transceivers, while the block RAM stores video lines and frames. The GTX transceivers support high-bandwidth video streams. The industrial temperature grade ensures reliable operation in 24/7 environments. Designers can implement low-latency video pipelines for real-time applications, and the FPGA's reconfigurability allows support for new video standards without hardware changes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7K410T-1FFG900I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7K410T-2FFG900I | XC7K410T-L2FFG900I | XC7K325T-2FFG900I | XC7K480T-2FFG900I |
|---|---|---|---|---|---|
| Package | 900-FCBGA | 900-FCBGA | 900-FCBGA | 900-FCBGA | 900-FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 406720 | 406720 | 406720 | 326080 | 477760 |
| Block RAM (bits) | 29306880 | 29306880 | 29306880 | 16025600 | 38246400 |
| DSP Slices | 1540 | 1540 | 1540 | 840 | 1920 |
| User I/O | 500 | 500 | 500 | 500 | 500 |
| GTX Transceivers | 16 | 16 | 16 | 16 | 16 |
| Speed Grade | -1 | -2 | -2L | -2 | -2 |
Principaux différenciateurs
- Higher logic density than XC7K325T (vs XC7K325T-2FFG900I)
- Lower power than XC7K480T (vs XC7K480T-2FFG900I)
- Cost-effective performance (vs XC7K480T-2FFG900I)
Notes de conception
The XC7K410T-1FFG900I requires a clean 1.0V core supply (VCCINT) and a 1.8V auxiliary supply (VCCAUX). Use low-impedance power planes and place decoupling capacitors (100nF and 10uF) close to the FPGA pins. Follow AMD's power distribution network (PDN) guidelines in UG583 to minimize voltage ripple and ensure reliable operation at high toggle rates.
The 900-FCBGA package has a thermal pad that must be soldered to a solid ground plane with multiple vias for heat dissipation. For high utilization designs, use a heatsink or forced airflow to keep junction temperature below 100°C. Calculate power dissipation using AMD's Power Estimator tool and verify thermal performance with a thermal simulation.
Route high-speed GTX transceivers with controlled impedance (e.g., 100 ohm differential) and minimize trace length. Use ground vias around differential pairs to reduce crosstalk. For the 500 user I/Os, follow AMD's pinout guidelines in UG475 to avoid simultaneous switching output (SSO) issues. Place I/O banks according to the voltage standards used.
Informations de conformité
RoHS compliant and lead-free per IC-Components data. AEC-Q100 not applicable for FPGA. REACH and conflict minerals status not specified in provided data.
