XC7S50-2CSGA324C - Spartan-7 FPGA, 52K Logic Cells | AMD | BGA-324
Référence : XC7S50-2CSGA324C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $169 | $169,00 |
| 10 | $152.1 | $1 521,00 |
| 100 | $135.36 | $13 536,00 |
| 500 | $121.68 | $60 840,00 |
| 1 000 | $110.85 | $110 850,00 |
XC7S50-2CSGA324C Présentation
FPGAs (Field Programmable Gate Arrays) are a class of programmable logic devices (PLDs) that allow designers to configure digital logic after manufacture using a hardware description language (HDL) and a toolchain. In the broader integrated circuit taxonomy, FPGAs sit within the semiconductor > programmable logic > PLD hierarchy and are widely used for parallel processing, custom I/O protocols, hardware prototyping, and glue logic. The Spartan-7 family is positioned by AMD for cost-sensitive, low-to-mid-density applications with an emphasis on low static and dynamic power versus older Spartan-6 parts.
Key features of the XC7S50-2CSGA324C include 2.76 M equivalent system gates, 4,075 CLBs, 2,160 Kbits of block RAM, 60 DSP48 slices (for fixed/floating-point arithmetic), a -2 speed grade, and 4.6 Mbits of distributed RAM. Integrated peripherals include a 10/100/1000 Mb/s tri-speed Ethernet MAC, a USB 2.0 HS/FS/OTG controller, up to 1.2 Gb/s LVDS transceivers (SelectIO-based), and a hardened memory controller block. The 324-ball CSGA package provides a small footprint (~15x15 mm) suitable for space-constrained industrial designs while exposing 210 user I/Os.
Architecturally, the Spartan-7 device is built on a 28 nm HPL (HPL = High Performance Low power) process node, leveraging hardened IP cores (PCIE Gen2, GbE MAC, memory controller) to deliver DSP capability while keeping power below 1 W in typical configurations. The LUT-based fabric runs on a separate analog supply (VCCAUX/VCCINT) with dedicated high-range and low-range I/O banks (HR/HP) supporting voltage standards from 1.2 V to 3.3 V.
Typical applications include industrial motor control and factory automation, machine vision camera interfaces, low-cost PCIe endpoint cards, embedded vision, custom serial protocol bridging (UART/SPI/I2C to LVDS), and educational FPGA boards such as the Urbana Spartan-7 platform.
For thermal management, ensure the PCB layout provides adequate copper pour on VCCINT/VCCAUX planes to dissipate the 0.5-1.0 W typical core power. SelectIO banks should each be properly decoupled with 0.1 uF + 10 uF capacitors placed close to the supply balls.
This page synthesizes authorized distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, helping engineers select and source the XC7S50-2CSGA324C with confidence.
Alternatives de remplacement direct pour XC7S50-2CSGA324C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7S50-2CSGA324C (même facteur de forme et même empreinte) — différant par DSP Slices, Package, Mounting Type, Speed Grade, Clock Management Tiles (CMTs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7S50-2CSGA324I
✅ Remplacement direct✓ En stock
$43.1 / unité
Voir la fiche technique →XC7S50-1CSGA324C
✅ Remplacement direct✓ En stock
$36.14 / unité
Voir la fiche technique →XC7S50-2CSGA324I
✅ Remplacement direct✓ En stock
$43.1 / unité
Voir la fiche technique →XC7S50-2CSGA324C Valeurs maximales et caractéristiques électriques
| Series | Spartan-7 |
| Family | Spartan-7 FPGA |
| Logic Cells | 52,160 |
| Equivalent System Gates | 2,764,800 |
| Configurable Logic Blocks (CLBs) | 4,075 |
| Number of User I/Os | 210 |
| Block RAM | 2,700 Kb (270 x 36 Kb blocks, per ds0017 Spartan-7 datasheet) |
| Distributed RAM | 4.6 Mbit |
| DSP Slices | 60 (DSP48A1) |
| Speed Grade | -2 |
| Plage de température de fonctionnement | 0 C to +85 C (C suffix = commercial) |
| Boîtier | 324-ball CSBGA / CSPBGA (CSGA324) |
| Process Node | 28 nm HPL |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Hardened IP | 10/100/1000 Mb/s Ethernet MAC, USB 2.0 HS/FS/OTG, Memory Controller |
| SelectIO Banks | High-Range (HR) and High-Performance (HP), supporting 1.2 V to 3.3 V I/O standards |
Guide de configuration des broches du XC7S50-2CSGA324C 324-ball csbga / cspbga (csga324)
Configuration des broches du XC7S50-2CSGA324C (boîtier 324-ball csbga / cspbga (csga324)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7S50-2CSGA324C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7S50-2CSGA324C convient pour 6 applications: Industrial Motor Control and Factory Automation, Machine Vision Camera Interfaces, Low-Cost PCIe Endpoint Cards, Custom Serial Protocol Bridging, Educational and Development FPGA Boards, Embedded Sensor Fusion and IoT Edge Gateways.
Industrial Motor Control and Factory Automation
The XC7S50-2CSGA324C is well suited for industrial motor control and factory automation with 60 DSP48 slices capable of executing field-oriented control (FOC) math and 210 user I/Os for encoder feedback, gate-driver PWM, and digital I/O. Its 0 C to +85 C commercial temperature range covers most factory-floor enclosures, while hardened SelectIO banks support 3.3 V TTL for legacy industrial buses. The integrated 1 Gb/s Ethernet MAC enables real-time industrial Ethernet (EtherCAT, PROFINET) bridging when paired with an external PHY.
Recommandé
Machine Vision Camera Interfaces
With up to 1.2 Gb/s SelectIO-based LVDS performance and 210 I/Os, the XC7S50-2CSGA324C can ingest MIPI CSI-2 or LVDS image-sensor data and process it through fabric-based ISP pipelines. The 4.6 Mbit distributed RAM provides frame-line buffering, while the 60 DSP48 slices accelerate Bayer demosaicing and color-space conversion. Designers pair the FPGA with external DDR3 via the hardened memory controller for multi-megapixel frame buffering.
Recommandé
Low-Cost PCIe Endpoint Cards
The XC7S50-2CSGA324C includes a hardened PCIe Gen2 x1 endpoint block enabling single-lane PCI Express connectivity without consuming fabric logic, ideal for low-cost FPGA accelerator cards. The 52K logic cells implement protocol acceleration, custom DMA engines, or preprocessing for data-acquisition applications. Designers route the 100 MHz PCIe reference clock into the FPGA and supply the 100 MHz system clock via MMCM/PLL.
Recommandé
Custom Serial Protocol Bridging
With 210 SelectIO pins and flexible HR/HP I/O banks, the XC7S50-2CSGA324C bridges between industrial serial protocols such as UART, SPI, I2C, RS-485, CAN-FD, and high-speed LVDS in custom logic. The 4,075 CLBs accommodate 32+ soft UART channels plus protocol conversion glue logic. Industrial-grade parts (XC7S50-2CSGA324I) extend the operating range to -40C for outdoor deployments.
Recommandé
Educational and Development FPGA Boards
The XC7S50-2CSGA324C powers low-cost FPGA education boards (for example, the Urbana Spartan-7 platform, list price $169) targeting university digital-logic labs and hobbyist Vivado workflows. Its 52K logic cells give students enough headroom for full RISC-V soft cores plus peripheral IP, and the integrated USB 2.0 controller enables USB JTAG programming without external bridge chips. The 324-ball CSPBGA package keeps the board under 10x10 cm.
Recommandé
Embedded Sensor Fusion and IoT Edge Gateways
The XC7S50-2CSGA324C's low-power 28 nm HPL process and 60 DSP48 slices enable edge-sensor fusion at sub-Watt power consumption, suitable for industrial IoT gateways aggregating CAN, RS-485, and I2C sensors onto Ethernet. The GbE MAC provides backbone uplink without an external switch, while the 324-ball CSPBGA exposes enough I/O for multi-protocol bus pinouts. Vivado's IP catalog accelerates integration of FreeRTOS-capable MicroBlaze soft cores for protocol orchestration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7S50-2CSGA324C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7S50-2CSGA324I | XC7S50-1CSGA324C | LFE5U-45F-6BG256C |
|---|---|---|---|---|
| Brand | AMD (formerly Xilinx) | AMD | AMD | Lattice Semiconductor |
| Package | 324-ball CSPBGA (CSGA324) | 324-ball CSPBGA - same | 324-ball CSPBGA - same | 256-ball caBGA - DIFFERENT |
| Logic Cells / LUTs | 52,160 | 52,160 | 52,160 | ~45,000 |
| Speed Grade | -2 | -2 | -1 (slower) | LFE5U-45F |
| Hardened Ethernet MAC | 10/100/1000 tri-speed | 10/100/1000 tri-speed | 10/100/1000 tri-speed | Soft IP / no hardened MAC |
Principaux différenciateurs
- Hardened GbE MAC and PCIe Gen2 x1 endpoint block (vs LFE5U-45F-6BG256C)
- Higher logic-cell density at competitive price point (vs XC7S25 (same Spartan-7 family))
- Integrated USB 2.0 controller simplifies configuration download (vs XC7A25T-1CPG238C)
Notes de conception
The 324-ball CSPBGA (CSGA324) has 0.5 mm ball pitch requiring 4-layer PCB minimum with microvia HDI stackup for breakout routing. Place 0.1 uF + 10 uF decoupling capacitors within 5 mm of each power-supply ball cluster (VCCINT, VCCAUX, VCCO per bank), and stitch ground vias around the BGA perimeter for return-path integrity.
Estimated: at typical Spartan-7 utilization (~70% LUTs, 50% DSP, 1.5 GHz internal fabric activity), core power is roughly 0.8 W dissipating into the PCB thermal pad. The CSGA324 package requires a minimum 4-layer PCB with continuous VCCINT ground pour to keep junction-to-ambient thermal resistance below 25 C/W. Add a small heatsink for closed enclosure designs above +70 C ambient.
Route SelectIO pairs as length-matched differential pairs (within 5 ps) for LVDS-25 or higher data rates. SelectIO banks should each have their own VCCO rail; do not share VCCO between HR banks running different I/O standards. Place differential-pair impedance at 100 ohm differential +/-10% for LVDS signaling.
Configuration mode matters: the CSGA324 supports JTAG, SPI x1/x2/x4, and BPI modes. Do not leave PROG floating - tie to VCCO_0 via a 4.7 kohm pull-up. Ensure DONE pin has a 4.7 kohm pull-up to VCCO_0 to avoid configuration stall. Initialize VCCINT (1.0 V) before VCCAUX/VCCO per AMD power-on sequencing guidelines.
Informations de conformité
RoHS and REACH compliant per DigiKey and Abacus Technologies listings. Not AEC-Q100 qualified (FPGAs are not automotive-grade silicon by default). Lead-free packaging confirmed.
