XC7S50-2CSGA324C - Spartan-7 FPGA, 52K Logic Cells | AMD | BGA-324
N.º da peça: XC7S50-2CSGA324C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $169 | $169,00 |
| 10 | $152.1 | $1.521,00 |
| 100 | $135.36 | $13.536,00 |
| 500 | $121.68 | $60.840,00 |
| 1.000 | $110.85 | $110.850,00 |
XC7S50-2CSGA324C Visão geral
FPGAs (Field Programmable Gate Arrays) are a class of programmable logic devices (PLDs) that allow designers to configure digital logic after manufacture using a hardware description language (HDL) and a toolchain. In the broader integrated circuit taxonomy, FPGAs sit within the semiconductor > programmable logic > PLD hierarchy and are widely used for parallel processing, custom I/O protocols, hardware prototyping, and glue logic. The Spartan-7 family is positioned by AMD for cost-sensitive, low-to-mid-density applications with an emphasis on low static and dynamic power versus older Spartan-6 parts.
Key features of the XC7S50-2CSGA324C include 2.76 M equivalent system gates, 4,075 CLBs, 2,160 Kbits of block RAM, 60 DSP48 slices (for fixed/floating-point arithmetic), a -2 speed grade, and 4.6 Mbits of distributed RAM. Integrated peripherals include a 10/100/1000 Mb/s tri-speed Ethernet MAC, a USB 2.0 HS/FS/OTG controller, up to 1.2 Gb/s LVDS transceivers (SelectIO-based), and a hardened memory controller block. The 324-ball CSGA package provides a small footprint (~15x15 mm) suitable for space-constrained industrial designs while exposing 210 user I/Os.
Architecturally, the Spartan-7 device is built on a 28 nm HPL (HPL = High Performance Low power) process node, leveraging hardened IP cores (PCIE Gen2, GbE MAC, memory controller) to deliver DSP capability while keeping power below 1 W in typical configurations. The LUT-based fabric runs on a separate analog supply (VCCAUX/VCCINT) with dedicated high-range and low-range I/O banks (HR/HP) supporting voltage standards from 1.2 V to 3.3 V.
Typical applications include industrial motor control and factory automation, machine vision camera interfaces, low-cost PCIe endpoint cards, embedded vision, custom serial protocol bridging (UART/SPI/I2C to LVDS), and educational FPGA boards such as the Urbana Spartan-7 platform.
For thermal management, ensure the PCB layout provides adequate copper pour on VCCINT/VCCAUX planes to dissipate the 0.5-1.0 W typical core power. SelectIO banks should each be properly decoupled with 0.1 uF + 10 uF capacitors placed close to the supply balls.
This page synthesizes authorized distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, helping engineers select and source the XC7S50-2CSGA324C with confidence.
Alternativas drop-in para XC7S50-2CSGA324C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7S50-2CSGA324C (mesmo formato e footprint) — diferindo em DSP Slices, Package, Mounting Type, Speed Grade, Clock Management Tiles (CMTs).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7S50-2CSGA324I
✅ Drop-In✓ Em estoque
$43.1 / unidade
Ver ficha técnica →XC7S50-1CSGA324C
✅ Drop-In✓ Em estoque
$36.14 / unidade
Ver ficha técnica →XC7S50-2CSGA324I
✅ Drop-In✓ Em estoque
$43.1 / unidade
Ver ficha técnica →XC7S50-2CSGA324C Classificações máximas e características elétricas
| Series | Spartan-7 |
| Family | Spartan-7 FPGA |
| Logic Cells | 52,160 |
| Equivalent System Gates | 2,764,800 |
| Configurable Logic Blocks (CLBs) | 4,075 |
| Number of User I/Os | 210 |
| Block RAM | 2,700 Kb (270 x 36 Kb blocks, per ds0017 Spartan-7 datasheet) |
| Distributed RAM | 4.6 Mbit |
| DSP Slices | 60 (DSP48A1) |
| Speed Grade | -2 |
| Faixa de temperatura de operação | 0 C to +85 C (C suffix = commercial) |
| Encapsulamento | 324-ball CSBGA / CSPBGA (CSGA324) |
| Process Node | 28 nm HPL |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Hardened IP | 10/100/1000 Mb/s Ethernet MAC, USB 2.0 HS/FS/OTG, Memory Controller |
| SelectIO Banks | High-Range (HR) and High-Performance (HP), supporting 1.2 V to 3.3 V I/O standards |
Guia de Configuração de Pinos do XC7S50-2CSGA324C 324-ball csbga / cspbga (csga324)
Configuração de pinos para XC7S50-2CSGA324C (pacote 324-ball csbga / cspbga (csga324)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC7S50-2CSGA324C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC7S50-2CSGA324C é adequado para 6 aplicaçãos: Industrial Motor Control and Factory Automation, Machine Vision Camera Interfaces, Low-Cost PCIe Endpoint Cards, Custom Serial Protocol Bridging, Educational and Development FPGA Boards, Embedded Sensor Fusion and IoT Edge Gateways.
Industrial Motor Control and Factory Automation
The XC7S50-2CSGA324C is well suited for industrial motor control and factory automation with 60 DSP48 slices capable of executing field-oriented control (FOC) math and 210 user I/Os for encoder feedback, gate-driver PWM, and digital I/O. Its 0 C to +85 C commercial temperature range covers most factory-floor enclosures, while hardened SelectIO banks support 3.3 V TTL for legacy industrial buses. The integrated 1 Gb/s Ethernet MAC enables real-time industrial Ethernet (EtherCAT, PROFINET) bridging when paired with an external PHY.
Recomendado
Machine Vision Camera Interfaces
With up to 1.2 Gb/s SelectIO-based LVDS performance and 210 I/Os, the XC7S50-2CSGA324C can ingest MIPI CSI-2 or LVDS image-sensor data and process it through fabric-based ISP pipelines. The 4.6 Mbit distributed RAM provides frame-line buffering, while the 60 DSP48 slices accelerate Bayer demosaicing and color-space conversion. Designers pair the FPGA with external DDR3 via the hardened memory controller for multi-megapixel frame buffering.
Recomendado
Low-Cost PCIe Endpoint Cards
The XC7S50-2CSGA324C includes a hardened PCIe Gen2 x1 endpoint block enabling single-lane PCI Express connectivity without consuming fabric logic, ideal for low-cost FPGA accelerator cards. The 52K logic cells implement protocol acceleration, custom DMA engines, or preprocessing for data-acquisition applications. Designers route the 100 MHz PCIe reference clock into the FPGA and supply the 100 MHz system clock via MMCM/PLL.
Recomendado
Custom Serial Protocol Bridging
With 210 SelectIO pins and flexible HR/HP I/O banks, the XC7S50-2CSGA324C bridges between industrial serial protocols such as UART, SPI, I2C, RS-485, CAN-FD, and high-speed LVDS in custom logic. The 4,075 CLBs accommodate 32+ soft UART channels plus protocol conversion glue logic. Industrial-grade parts (XC7S50-2CSGA324I) extend the operating range to -40C for outdoor deployments.
Recomendado
Educational and Development FPGA Boards
The XC7S50-2CSGA324C powers low-cost FPGA education boards (for example, the Urbana Spartan-7 platform, list price $169) targeting university digital-logic labs and hobbyist Vivado workflows. Its 52K logic cells give students enough headroom for full RISC-V soft cores plus peripheral IP, and the integrated USB 2.0 controller enables USB JTAG programming without external bridge chips. The 324-ball CSPBGA package keeps the board under 10x10 cm.
Recomendado
Embedded Sensor Fusion and IoT Edge Gateways
The XC7S50-2CSGA324C's low-power 28 nm HPL process and 60 DSP48 slices enable edge-sensor fusion at sub-Watt power consumption, suitable for industrial IoT gateways aggregating CAN, RS-485, and I2C sensors onto Ethernet. The GbE MAC provides backbone uplink without an external switch, while the 324-ball CSPBGA exposes enough I/O for multi-protocol bus pinouts. Vivado's IP catalog accelerates integration of FreeRTOS-capable MicroBlaze soft cores for protocol orchestration.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7S50-2CSGA324C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7S50-2CSGA324I | XC7S50-1CSGA324C | LFE5U-45F-6BG256C |
|---|---|---|---|---|
| Brand | AMD (formerly Xilinx) | AMD | AMD | Lattice Semiconductor |
| Package | 324-ball CSPBGA (CSGA324) | 324-ball CSPBGA - same | 324-ball CSPBGA - same | 256-ball caBGA - DIFFERENT |
| Logic Cells / LUTs | 52,160 | 52,160 | 52,160 | ~45,000 |
| Speed Grade | -2 | -2 | -1 (slower) | LFE5U-45F |
| Hardened Ethernet MAC | 10/100/1000 tri-speed | 10/100/1000 tri-speed | 10/100/1000 tri-speed | Soft IP / no hardened MAC |
Principais diferenciais
- Hardened GbE MAC and PCIe Gen2 x1 endpoint block (vs LFE5U-45F-6BG256C)
- Higher logic-cell density at competitive price point (vs XC7S25 (same Spartan-7 family))
- Integrated USB 2.0 controller simplifies configuration download (vs XC7A25T-1CPG238C)
Notas de projeto
The 324-ball CSPBGA (CSGA324) has 0.5 mm ball pitch requiring 4-layer PCB minimum with microvia HDI stackup for breakout routing. Place 0.1 uF + 10 uF decoupling capacitors within 5 mm of each power-supply ball cluster (VCCINT, VCCAUX, VCCO per bank), and stitch ground vias around the BGA perimeter for return-path integrity.
Estimated: at typical Spartan-7 utilization (~70% LUTs, 50% DSP, 1.5 GHz internal fabric activity), core power is roughly 0.8 W dissipating into the PCB thermal pad. The CSGA324 package requires a minimum 4-layer PCB with continuous VCCINT ground pour to keep junction-to-ambient thermal resistance below 25 C/W. Add a small heatsink for closed enclosure designs above +70 C ambient.
Route SelectIO pairs as length-matched differential pairs (within 5 ps) for LVDS-25 or higher data rates. SelectIO banks should each have their own VCCO rail; do not share VCCO between HR banks running different I/O standards. Place differential-pair impedance at 100 ohm differential +/-10% for LVDS signaling.
Configuration mode matters: the CSGA324 supports JTAG, SPI x1/x2/x4, and BPI modes. Do not leave PROG floating - tie to VCCO_0 via a 4.7 kohm pull-up. Ensure DONE pin has a 4.7 kohm pull-up to VCCO_0 to avoid configuration stall. Initialize VCCINT (1.0 V) before VCCAUX/VCCO per AMD power-on sequencing guidelines.
Informações de conformidade
RoHS and REACH compliant per DigiKey and Abacus Technologies listings. Not AEC-Q100 qualified (FPGAs are not automotive-grade silicon by default). Lead-free packaging confirmed.
