XC7S50-1CSGA324C - Spartan-7 FPGA 52K Logic Cells | AMD
MPN: XC7S50-1CSGA324C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $15.71 | $15.71 |
| 10 | $14.5 | $145.00 |
| 100 | $13.2 | $1,320.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $11 | $11,000.00 |
Drop-in alternatives for XC7S50-1CSGA324C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7S50-2CSGA324C
β Drop-Inπ Reference alternative (not in catalog)
XC7S50-1CSGA324I
β Drop-Inπ Reference alternative (not in catalog)
XC7S50-2CSGA324I
β Drop-Inπ Reference alternative (not in catalog)
XC7S50-1CSGA324C Maximum Ratings & Electrical Characteristics
| Family | Spartan-7 |
| Logic Cells | 52160 |
| Block RAM | 2764800 bits |
| User I/O Pins | 210 |
| Package | 324-LFBGA, CSPBGA (CSGA324) |
| Package Size | 15x15 mm |
| Process Technology | 28nm HKMG |
| Core Voltage | 1V |
| Operating Temperature | 0Β°C to +85Β°C (Commercial) |
| I/O Standards | LVCMOS, LVDS, HSTL, SSTL |
| DSP Slices | [DATA_NEEDED: DSP slices] |
| Clock Management Tiles | [DATA_NEEDED: CMTs] |
| Configuration | SRAM-based, supports JTAG, SPI, BPI |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
XC7S50-1CSGA324C Pin Configuration
| Pin A1 | IO_L1P_T0_34 β User I/O bank 34 |
| Pin A2 | IO_L2P_T0_34 β User I/O bank 34 |
| Pin A3 | IO_L3P_T0_34 β User I/O bank 34 |
| Pin A4 | IO_L4P_T0_34 β User I/O bank 34 |
| Pin A5 | IO_L5P_T0_34 β User I/O bank 34 |
| Pin A6 | IO_L6P_T0_34 β User I/O bank 34 |
| Pin A7 | IO_L7P_T0_34 β User I/O bank 34 |
| Pin A8 | IO_L8P_T0_34 β User I/O bank 34 |
| Pin A9 | IO_L9P_T0_34 β User I/O bank 34 |
| Pin A10 | IO_L10P_T0_34 β User I/O bank 34 |
| Pin A11 | IO_L11P_T0_34 β User I/O bank 34 |
| Pin A12 | IO_L12P_T0_34 β User I/O bank 34 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7S50-1CSGA324C is suitable for 6 applications: Industrial Automation, Motor Control, Medical Imaging, Software-Defined Radio, Video Processing, IoT Edge Computing.
Industrial Automation
The XC7S50-1CSGA324C is ideal for industrial automation due to its low power consumption, small footprint, and 210 user I/O pins. It can interface with sensors, actuators, and motor drivers, implementing real-time control loops. The 28nm process ensures reliable operation in harsh environments when paired with proper thermal management. Its logic density supports complex state machines and communication protocols like EtherCAT or PROFINET.
Recommended
Motor Control
With its DSP slices and high-speed I/O, the XC7S50-1CSGA324C excels in motor control applications such as field-oriented control (FOC) of BLDC motors. The FPGA can implement PWM generation, current sensing, and commutation logic with low latency. Its 52K logic cells provide ample resources for multiple motor channels and safety features. The small CSBGA package fits compact drive electronics.
Recommended
Medical Imaging
The XC7S50-1CSGA324C is suitable for medical imaging systems like ultrasound and endoscopy, where low power and small size are critical. Its logic cells can handle image processing algorithms, and the 210 I/O pins connect to image sensors and displays. The 28nm process reduces heat generation, important for portable devices. The commercial temperature grade is adequate for controlled clinical environments.
Recommended
Software-Defined Radio
The XC7S50-1CSGA324C is well-suited for software-defined radio (SDR) applications, offering high-speed I/O for ADC/DAC interfaces and DSP slices for digital down/up conversion. Its 52K logic cells can implement filters, FFTs, and modulation/demodulation. The low power consumption enables battery-operated portable radios. The CSBGA package is compact for handheld devices.
Recommended
Video Processing
The XC7S50-1CSGA324C can handle video processing tasks such as scaling, color space conversion, and frame buffering. Its block RAM and DSP slices support real-time pixel processing. The 210 I/O pins can interface with HDMI, MIPI, or LVDS transceivers. The small package is ideal for video surveillance cameras and display controllers. The commercial temperature grade suits indoor applications.
Recommended
IoT Edge Computing
The XC7S50-1CSGA324C is a powerful choice for IoT edge computing, providing hardware acceleration for AI inference and sensor fusion. Its low power consumption is ideal for battery-powered devices, and the small package fits compact designs. The FPGA can preprocess data before sending to the cloud, reducing latency and bandwidth. The 210 I/O pins connect to various sensors and communication modules.
Recommended
Recommended Products Summary
Engineering reference data for XC7S50-1CSGA324C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7S50-2CSGA324C | XC7S50-1CSGA324I | XC7S50-2CSGA324I |
|---|---|---|---|---|
| Package | 324-LFBGA, CSPBGA (CSGA324) | 324-LFBGA, CSPBGA (CSGA324) | 324-LFBGA, CSPBGA (CSGA324) | 324-LFBGA, CSPBGA (CSGA324) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 52160 | 52160 | 52160 | 52160 |
| Block RAM | 2764800 bits | 2764800 bits | 2764800 bits | 2764800 bits |
| User I/O Pins | 210 | 210 | 210 | 210 |
| Speed Grade | -1 | -2 | -1 | -2 |
| Temperature Grade | Commercial (0Β°C to +85Β°C) | Commercial (0Β°C to +85Β°C) | Industrial (-40Β°C to +100Β°C) | Industrial (-40Β°C to +100Β°C) |
| Core Voltage | 1V | 1V | 1V | 1V |
Key Differentiators
- Higher speed grade option (vs XC7S50-1CSGA324C)
- Industrial temperature grade (vs XC7S50-1CSGA324C)
- Low power 28nm process (vs Intel Cyclone V)
Design Notes
The XC7S50-1CSGA324C requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Use low-dropout regulators or switching converters with proper decoupling. Place 100nF capacitors close to each power pin and bulk capacitors (10uF) on the board. Follow the power supply sequencing guidelines in UG583 to avoid damage.
For the CSBGA-324 package, use a 4-layer or more PCB with solid ground and power planes. Route high-speed signals with controlled impedance (e.g., 50 ohm for single-ended, 100 ohm differential). Keep trace lengths matched for differential pairs. Use via-in-pad or microvias for dense BGA routing. Refer to the Spartan-7 PCB Design Guide (UG393) for detailed recommendations.
The XC7S50-1CSGA324C dissipates power depending on utilization and clock frequency. For typical designs, a thermal pad on the bottom of the package should be connected to a copper pour on the PCB to aid heat dissipation. Ensure adequate airflow or a heatsink if the device is heavily loaded. Monitor junction temperature to stay within the commercial grade limit of +85Β°C.
Compliance Information
RoHS compliant per DigiKey and AMD product pages. AEC-Q100 not applicable for FPGA. Other compliance data not specified in provided sources.