XC7S50-1CSGA324C - Spartan-7 FPGA 52K Logic Cells, 324-BGA | AMD
MPN: XC7S50-1CSGA324C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $57.84 | $57.84 |
| 10 | $52.06 | $520.60 |
| 100 | $46.27 | $4,627.00 |
| 500 | $40.49 | $20,245.00 |
| 1,000 | $36.14 | $36,140.00 |
XC7S50-1CSGA324C Overview
A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic function is configured by the end user after manufacturing, hence "field-programmable." FPGAs consist of an array of programmable logic blocks, programmable interconnects, and configurable I/O tiles that together implement arbitrary digital logic. They sit within the programmable logic device (PLD) hierarchy, offering rapid prototyping and post-silicon flexibility that fixed-function ASICs cannot match, at the cost of higher unit price and lower maximum frequency than custom silicon.
Key features of the XC7S50-1CSGA324C include 52,160 logic cells, 8 DSP slices for hardware-accelerated arithmetic, 2,764,800 bits of dual-port block RAM with built-in FIFO logic, 4 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and support for memory interfaces including DDR3. The CSBGA-324 package integrates 210 user I/Os across multiple I/O banks supporting LVCMOS, LVDS, SSTL, and HSTL standards.
The Spartan-7 architecture shares the proven 28nm HKMG process node of the larger Artix-7 and Kintex-7 families, inheriting their 6-input look-up tables (LUTs), dedicated carry chains, and high-speed serial support (up to 6.6 Gb/s transceivers in higher Spartan-7 densities; this 50K-cell variant is primarily general-purpose logic with select GTP capability at higher speeds depending on configuration). The 28nm process reduces both static leakage and dynamic power compared to legacy 45nm and 65nm Spartan-6 devices.
Typical applications include industrial motor control, factory automation controllers, medical imaging front-ends, video processing pipelines, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. Designers migrating from end-of-life Spartan-6 designs use the Spartan-7 as a pin-compatible upgrade path with higher logic density and lower power per LUT.
When designing with this FPGA, pay close attention to the multi-rail power architecture (VCCINT, VCCAUX, VCCO, MGTAVCC) and required power-on sequencing. Refer to the Spartan-7 FPGA Data Sheet for DC and AC switching characteristics and UG475 for package pinout details.
This page synthesizes distributor pricing, drop-in same-package alternatives, application guidance, and PCB-level design notes that go beyond the manufacturer datasheet, helping engineers accelerate Spartan-7 evaluation and BOM risk mitigation.
Drop-in alternatives for XC7S50-1CSGA324C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC7S50-1CSGA324C (same form factor and footprint) — differing in Block RAM, DSP Slices, Package, Logic Cells, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7S75-1CSGA324C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7S100-1CSGA324C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7S50-2CSGA324C
✅ Drop-In✓ In Stock
$110.85 / Unit
View Datasheet →XA7S25-1CSGA324I
✅ Drop-In✓ In Stock
$33.5 / Unit
View Datasheet →XC7S50-1CSGA324C Maximum Ratings & Electrical Characteristics
| Family | Spartan-7 |
| Logic Cells | 52,160 |
| Block RAM (bits) | 2,764,800 |
| DSP Slices | 90 |
| User I/O Pins | 210 |
| Process Technology | 28nm HKMG |
| Core Voltage (VCCINT) | 1.0 V |
| Package | CSBGA-324 (CSPBGA), 15x15 mm |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | -1 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Clock Management Tiles (CMTs) | 4 |
XC7S50-1CSGA324C csbga-324 (cspbga), 15x15 mm Pin Configuration Guide
Pin configuration for XC7S50-1CSGA324C (csbga-324 (cspbga), 15x15 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC7S50-1CSGA324C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC7S50-1CSGA324C is suitable for 7 applications: Industrial Motor Control, Factory Automation Controllers, Medical Imaging Front-End, Video Processing Pipelines, Software-Defined Radio (SDR) Baseband, Low-Cost ASIC Prototyping, Automotive Infotainment & ADAS Pre-Processing.
Industrial Motor Control
The AMD XC7S50-1CSGA324C is well-suited for industrial motor control and drive inverters where deterministic, low-latency feedback loops are required. Its 90 dedicated DSP slices accelerate field-oriented control (FOC), space-vector PWM, and Clarke/Park transforms for three-phase AC motors at switching frequencies of 10-20 kHz. The 52,160 logic cells comfortably host the encoder interface (QEP, SSI, EnDat), isolated gate-driver sequencing, and protection state machines within a single device, while the 210 user I/Os interface to multi-axis current/voltage ADCs and digital isolators. The 28nm HKMG process holds junction temperature low enough for fanless IP65 enclosures operating up to +85C ambient, and the CSBGA-324 package fits inside compact drive PCBAs under 100x80 mm.
Recommended
Factory Automation Controllers
The XC7S50-1CSGA324C targets programmable logic controllers (PLCs) and remote I/O gateways that aggregate multiple fieldbus protocols (EtherCAT, PROFINET, Modbus TCP, IO-Link) in a single FPGA. Its 2,764,800 bits of dual-port block RAM buffer protocol stacks, while the 4 clock management tiles (CMTs) synchronize to industrial Ethernet PHYs at 100 Mbit/s and gigabit rates. The CSBGA-324 package with 210 user I/Os interfaces to multi-port PHYs, RS-485 transceivers, and digital I/O modules. Compared with discrete MCU + ASSP designs, a single Spartan-7 consolidates the CPU fabric, deterministic I/O scanning, and safety logic (SIL-2/SIL-3 capable via software) into one device, reducing BOM count and improving mean time to repair for rack-mounted controllers.
Recommended
Medical Imaging Front-End
The AMD XC7S50-1CSGA324C supports medical imaging front-end preprocessing, including ultrasound beamforming, endoscopy video pipelines, and patient monitor signal acquisition. The 90 DSP slices perform finite-impulse-response (FIR) filtering and Hilbert transforms required for beamformed ultrasound channels, while the abundant block RAM holds scan conversion LUTs. The CSBGA-324 footprint is suitable for portable cart-based imaging systems and bedside monitors where board space is constrained. The 28nm HKMG process minimizes power dissipation, supporting battery-powered handheld probes that must run below 5W total system power. The commercial 0C to +85C temperature range meets typical medical equipment operating environments with adequate thermal headroom.
Recommended
Video Processing Pipelines
The XC7S50-1CSGA324C integrates HDMI/DVI input pre-processing, color space conversion, scaling, and overlay generation for surveillance DVRs, video walls, and machine-vision controllers. Its 52,160 logic cells implement multi-tap video scaling filters and frame-rate conversion pipelines at 1080p60, while the 210 I/Os accommodate 24-bit RGB, BT.656/1120, and MIPI-CSI2 bridges. The DDR3 memory controller IP (available free in Vivado) interfaces to external SDRAM at 800 MT/s for frame buffering, and the 28nm HKMG process keeps dynamic power low for always-on video appliances. The CSBGA-324 package with 15x15 mm area fits densely populated carrier-grade video processing cards.
Recommended
Software-Defined Radio (SDR) Baseband
The AMD XC7S50-1CSGA324C handles digital baseband processing for software-defined radios, including digital down-conversion (DDC), digital up-conversion (DUC), channelization, and demodulation for narrowband and wideband waveforms. Its 90 DSP slices accelerate complex multiply-accumulate operations needed for FFT-based channelizers at sample rates up to 100 MSPS, while the dual-port block RAM holds coefficient tables and decimation filters. For radio configurations with GTP transceivers, designers select Spartan-7 XC7S75/XC7S100 variants that expose high-speed serial interfaces; the XC7S50 is typically paired with a companion ADC/DAC and external transceiver ASIC. The CSBGA-324 footprint suits compact SDR modules in tactical and commercial wireless infrastructure.
Recommended
Low-Cost ASIC Prototyping
The XC7S50-1CSGA324C serves as an affordable pre-silicon validation platform for ASIC and SoC designs targeting mid-range complexity. Engineers use the 52,160 logic cells to map RTL blocks, the abundant block RAM to emulate SRAM/ROM macros, and the 210 user I/Os to prototype memory buses and peripheral interfaces well before tape-out. The Vivado Design Suite Webpack edition is free and supports the full Spartan-7 family, making the platform attractive for university labs and startup IC development teams. The CSBGA-324 commercial-grade package is suitable for benchtop prototype boards, and the part shares footprint with the higher-density XC7S75/XC7S100, enabling rapid scalability as designs grow during validation cycles.
Recommended
Automotive Infotainment & ADAS Pre-Processing
The AMD XC7S50-1CSGA324C is used in pre-production automotive infotainment heads and ADAS sensor-fusion pre-processors where commercial-grade silicon suffices for engineering development and reference designs. For production automotive deployments, designers migrate to the XA7S25/XA7S50 XA family which is AEC-Q100 qualified. The 52,160 logic cells implement multi-camera stitching, surround-view composition, and driver-monitoring CV pipelines at pre-production volumes. The CSBGA-324 package and 1.0V core voltage simplify power-tree design versus the 1.5/1.8V core rails of older Spartan-6 generations, and the 28nm HKMG process keeps junction temperatures manageable behind dashboard-mounted electronics enclosures.
Recommended
Recommended Products Summary
Engineering reference data for XC7S50-1CSGA324C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7S75-1CSGA324C | XC7S100-1CSGA324C | XC7S50-2CSGA324C | XA7S25-1CSGA324I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | CSBGA-324 (CSPBGA), 15x15 mm | CSBGA-324 (CSPBGA), 15x15 mm - same | CSBGA-324 (CSPBGA), 15x15 mm - same | CSBGA-324 (CSPBGA), 15x15 mm - same | CSBGA-324 (CSPBGA), 15x15 mm - same |
| Logic Cells | 52,160 | 76,800 | 102,400 | 52,160 | 23,360 |
| Speed Grade | -1 | -1 | -1 | -2 | -1 |
| User I/O Pins | 210 | 210 | 210 | 210 | 210 |
| Block RAM (bits) | 2,764,800 | 3,240,000 | 4,320,000 | 2,764,800 | 1,620,000 |
| DSP Slices | 90 | 120 | 160 | 90 | 45 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (XA industrial) |
Key Differentiators
- Lowest-density drop-in in CSBGA-324 for the Spartan-7 family (vs XC7S75-1CSGA324C)
- Commercial grade vs XA (automotive) temperature range (vs XA7S25-1CSGA324I)
- Lower dynamic power than legacy Spartan-6 at equivalent utilization (vs XC6SLX45-2FGG484C)
Design Notes
The AMD XC7S50-1CSGA324C requires four distinct power rails: VCCINT (1.0V core), VCCAUX (1.8V auxiliary), VCCO (1.2-3.3V I/O bank, varies per bank), and VCCBRAM (1.0V block RAM). Power-on sequencing is mandatory - VCCINT must precede VCCAUX and VCCO. Reference Monolithic Power's Spartan-7 PMIC reference designs for cost-optimized 4-16V input sequencing solutions that pass AMD's Power Manager validation checklist.
Estimated: At full utilization (~70% LUTs, ~80% DSP, 200 MHz toggle) on the CSBGA-324 with theta_JA around 28 C/W (4-layer PCB, 0 airflow), junction-to-ambient rise is approximately 21C above ambient, so the device is safe in sealed industrial enclosures to ~70C ambient. For commercial-grade (0C to +85C) operation, derate by 15-20% if dynamic power exceeds 3W or the enclosure provides no airflow path.
Use a 4-layer PCB with continuous GND plane directly beneath the CSBGA-324 footprint and 1-2 oz copper on inner layers. Place all decoupling capacitors (100 nF + 4.7 uF per VCCINT/VCCO pin group) within 5 mm of the BGA balls. BGA escape routing requires 0.4 mm trace width and 0.2 mm via pad - confirm with the AMD Spartan-7 package files published under UG475. Impedance-controlled 50 ohm microstrip on the top layer for high-speed GTP/GTX signals (when used with adjacent Spartan-7 transceiver parts).
Do not assume CSBGA-324 (CSPBGA, this Spartan-7) is pin-compatible with CSG324 / FG(G)324 (Artix-7, Kintex-7) - ball maps differ even though pin count matches. Confirm pinout against the AMD Spartan-7 specific package file before reusing Artix-7 footprints. Also note that commercial-grade -1/-2 speed grades are NOT AEC-Q100 qualified; for automotive deployments select XA7S25/XA7S50 XA variants that share the CSBGA-324 footprint.
Compliance Information
RoHS compliant and REACH SVHC compliant per AMD product environmental documentation. The XC7S50-1CSGA324C is commercial grade (0C to +85C) and is NOT AEC-Q100 qualified; for AEC-Q100 select the XA7S25/XA7S50 XA family which shares the CSBGA-324 footprint. Halogen-free status marked unknown - request AMD material declaration for full compliance audits.
