XC7S50-2CSGA324C - Spartan-7 FPGA, 52K Logic Cells | AMD | BGA-324
부품 번호: XC7S50-2CSGA324C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $169 | $169.00 |
| 10 | $152.1 | $1,521.00 |
| 100 | $135.36 | $13,536.00 |
| 500 | $121.68 | $60,840.00 |
| 1,000 | $110.85 | $110,850.00 |
XC7S50-2CSGA324C 개요
FPGAs (Field Programmable Gate Arrays) are a class of programmable logic devices (PLDs) that allow designers to configure digital logic after manufacture using a hardware description language (HDL) and a toolchain. In the broader integrated circuit taxonomy, FPGAs sit within the semiconductor > programmable logic > PLD hierarchy and are widely used for parallel processing, custom I/O protocols, hardware prototyping, and glue logic. The Spartan-7 family is positioned by AMD for cost-sensitive, low-to-mid-density applications with an emphasis on low static and dynamic power versus older Spartan-6 parts.
Key features of the XC7S50-2CSGA324C include 2.76 M equivalent system gates, 4,075 CLBs, 2,160 Kbits of block RAM, 60 DSP48 slices (for fixed/floating-point arithmetic), a -2 speed grade, and 4.6 Mbits of distributed RAM. Integrated peripherals include a 10/100/1000 Mb/s tri-speed Ethernet MAC, a USB 2.0 HS/FS/OTG controller, up to 1.2 Gb/s LVDS transceivers (SelectIO-based), and a hardened memory controller block. The 324-ball CSGA package provides a small footprint (~15x15 mm) suitable for space-constrained industrial designs while exposing 210 user I/Os.
Architecturally, the Spartan-7 device is built on a 28 nm HPL (HPL = High Performance Low power) process node, leveraging hardened IP cores (PCIE Gen2, GbE MAC, memory controller) to deliver DSP capability while keeping power below 1 W in typical configurations. The LUT-based fabric runs on a separate analog supply (VCCAUX/VCCINT) with dedicated high-range and low-range I/O banks (HR/HP) supporting voltage standards from 1.2 V to 3.3 V.
Typical applications include industrial motor control and factory automation, machine vision camera interfaces, low-cost PCIe endpoint cards, embedded vision, custom serial protocol bridging (UART/SPI/I2C to LVDS), and educational FPGA boards such as the Urbana Spartan-7 platform.
For thermal management, ensure the PCB layout provides adequate copper pour on VCCINT/VCCAUX planes to dissipate the 0.5-1.0 W typical core power. SelectIO banks should each be properly decoupled with 0.1 uF + 10 uF capacitors placed close to the supply balls.
This page synthesizes authorized distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, helping engineers select and source the XC7S50-2CSGA324C with confidence.
드롭인 대체품: XC7S50-2CSGA324C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7S50-2CSGA324C (동일 폼 팩터 및 풋프린트) — 차이점: DSP Slices, Package, Mounting Type, Speed Grade, Clock Management Tiles (CMTs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7S50-2CSGA324I
✅ 드롭인✓ 재고 있음
$43.1 / 개
데이터시트 보기 →XC7S50-1CSGA324C
✅ 드롭인✓ 재고 있음
$36.14 / 개
데이터시트 보기 →XC7S50-2CSGA324I
✅ 드롭인✓ 재고 있음
$43.1 / 개
데이터시트 보기 →XC7S50-2CSGA324C 최대 정격 & 전기적 특성
| Series | Spartan-7 |
| Family | Spartan-7 FPGA |
| Logic Cells | 52,160 |
| Equivalent System Gates | 2,764,800 |
| Configurable Logic Blocks (CLBs) | 4,075 |
| Number of User I/Os | 210 |
| Block RAM | 2,700 Kb (270 x 36 Kb blocks, per ds0017 Spartan-7 datasheet) |
| Distributed RAM | 4.6 Mbit |
| DSP Slices | 60 (DSP48A1) |
| Speed Grade | -2 |
| 동작 온도 범위 | 0 C to +85 C (C suffix = commercial) |
| 패키지 | 324-ball CSBGA / CSPBGA (CSGA324) |
| Process Node | 28 nm HPL |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Hardened IP | 10/100/1000 Mb/s Ethernet MAC, USB 2.0 HS/FS/OTG, Memory Controller |
| SelectIO Banks | High-Range (HR) and High-Performance (HP), supporting 1.2 V to 3.3 V I/O standards |
XC7S50-2CSGA324C 324-ball csbga / cspbga (csga324) 핀 구성 가이드
XC7S50-2CSGA324C(324-ball csbga / cspbga (csga324) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7S50-2CSGA324C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7S50-2CSGA324C 적합 용도: 6 애플리케이션s: Industrial Motor Control and Factory Automation, Machine Vision Camera Interfaces, Low-Cost PCIe Endpoint Cards, Custom Serial Protocol Bridging, Educational and Development FPGA Boards, Embedded Sensor Fusion and IoT Edge Gateways.
Industrial Motor Control and Factory Automation
The XC7S50-2CSGA324C is well suited for industrial motor control and factory automation with 60 DSP48 slices capable of executing field-oriented control (FOC) math and 210 user I/Os for encoder feedback, gate-driver PWM, and digital I/O. Its 0 C to +85 C commercial temperature range covers most factory-floor enclosures, while hardened SelectIO banks support 3.3 V TTL for legacy industrial buses. The integrated 1 Gb/s Ethernet MAC enables real-time industrial Ethernet (EtherCAT, PROFINET) bridging when paired with an external PHY.
추천
Machine Vision Camera Interfaces
With up to 1.2 Gb/s SelectIO-based LVDS performance and 210 I/Os, the XC7S50-2CSGA324C can ingest MIPI CSI-2 or LVDS image-sensor data and process it through fabric-based ISP pipelines. The 4.6 Mbit distributed RAM provides frame-line buffering, while the 60 DSP48 slices accelerate Bayer demosaicing and color-space conversion. Designers pair the FPGA with external DDR3 via the hardened memory controller for multi-megapixel frame buffering.
추천
Low-Cost PCIe Endpoint Cards
The XC7S50-2CSGA324C includes a hardened PCIe Gen2 x1 endpoint block enabling single-lane PCI Express connectivity without consuming fabric logic, ideal for low-cost FPGA accelerator cards. The 52K logic cells implement protocol acceleration, custom DMA engines, or preprocessing for data-acquisition applications. Designers route the 100 MHz PCIe reference clock into the FPGA and supply the 100 MHz system clock via MMCM/PLL.
추천
Custom Serial Protocol Bridging
With 210 SelectIO pins and flexible HR/HP I/O banks, the XC7S50-2CSGA324C bridges between industrial serial protocols such as UART, SPI, I2C, RS-485, CAN-FD, and high-speed LVDS in custom logic. The 4,075 CLBs accommodate 32+ soft UART channels plus protocol conversion glue logic. Industrial-grade parts (XC7S50-2CSGA324I) extend the operating range to -40C for outdoor deployments.
추천
Educational and Development FPGA Boards
The XC7S50-2CSGA324C powers low-cost FPGA education boards (for example, the Urbana Spartan-7 platform, list price $169) targeting university digital-logic labs and hobbyist Vivado workflows. Its 52K logic cells give students enough headroom for full RISC-V soft cores plus peripheral IP, and the integrated USB 2.0 controller enables USB JTAG programming without external bridge chips. The 324-ball CSPBGA package keeps the board under 10x10 cm.
추천
Embedded Sensor Fusion and IoT Edge Gateways
The XC7S50-2CSGA324C's low-power 28 nm HPL process and 60 DSP48 slices enable edge-sensor fusion at sub-Watt power consumption, suitable for industrial IoT gateways aggregating CAN, RS-485, and I2C sensors onto Ethernet. The GbE MAC provides backbone uplink without an external switch, while the 324-ball CSPBGA exposes enough I/O for multi-protocol bus pinouts. Vivado's IP catalog accelerates integration of FreeRTOS-capable MicroBlaze soft cores for protocol orchestration.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7S50-2CSGA324C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7S50-2CSGA324I | XC7S50-1CSGA324C | LFE5U-45F-6BG256C |
|---|---|---|---|---|
| Brand | AMD (formerly Xilinx) | AMD | AMD | Lattice Semiconductor |
| Package | 324-ball CSPBGA (CSGA324) | 324-ball CSPBGA - same | 324-ball CSPBGA - same | 256-ball caBGA - DIFFERENT |
| Logic Cells / LUTs | 52,160 | 52,160 | 52,160 | ~45,000 |
| Speed Grade | -2 | -2 | -1 (slower) | LFE5U-45F |
| Hardened Ethernet MAC | 10/100/1000 tri-speed | 10/100/1000 tri-speed | 10/100/1000 tri-speed | Soft IP / no hardened MAC |
주요 차별점
- Hardened GbE MAC and PCIe Gen2 x1 endpoint block (vs LFE5U-45F-6BG256C)
- Higher logic-cell density at competitive price point (vs XC7S25 (same Spartan-7 family))
- Integrated USB 2.0 controller simplifies configuration download (vs XC7A25T-1CPG238C)
설계 노트
The 324-ball CSPBGA (CSGA324) has 0.5 mm ball pitch requiring 4-layer PCB minimum with microvia HDI stackup for breakout routing. Place 0.1 uF + 10 uF decoupling capacitors within 5 mm of each power-supply ball cluster (VCCINT, VCCAUX, VCCO per bank), and stitch ground vias around the BGA perimeter for return-path integrity.
Estimated: at typical Spartan-7 utilization (~70% LUTs, 50% DSP, 1.5 GHz internal fabric activity), core power is roughly 0.8 W dissipating into the PCB thermal pad. The CSGA324 package requires a minimum 4-layer PCB with continuous VCCINT ground pour to keep junction-to-ambient thermal resistance below 25 C/W. Add a small heatsink for closed enclosure designs above +70 C ambient.
Route SelectIO pairs as length-matched differential pairs (within 5 ps) for LVDS-25 or higher data rates. SelectIO banks should each have their own VCCO rail; do not share VCCO between HR banks running different I/O standards. Place differential-pair impedance at 100 ohm differential +/-10% for LVDS signaling.
Configuration mode matters: the CSGA324 supports JTAG, SPI x1/x2/x4, and BPI modes. Do not leave PROG floating - tie to VCCO_0 via a 4.7 kohm pull-up. Ensure DONE pin has a 4.7 kohm pull-up to VCCO_0 to avoid configuration stall. Initialize VCCINT (1.0 V) before VCCAUX/VCCO per AMD power-on sequencing guidelines.
규정 준수 정보
RoHS and REACH compliant per DigiKey and Abacus Technologies listings. Not AEC-Q100 qualified (FPGAs are not automotive-grade silicon by default). Lead-free packaging confirmed.
