XC7VX415T-2FF1157I - Virtex-7 XT FPGA 412K Logic Cells | AMD
Référence : XC7VX415T-2FF1157I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2495 | $2 495,00 |
| 10 | $2350 | $23 500,00 |
| 100 | $2200 | $220 000,00 |
| 500 | $2100 | $1 050 000,00 |
| 1 000 | $1995 | $1 995 000,00 |
XC7VX415T-2FF1157I Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates. The Virtex-7 XT family is optimized for high-bandwidth applications such as data center acceleration, wired communications, and advanced signal processing.
Key features of the XC7VX415T-2FF1157I include 32,200 CLBs (configurable logic blocks), 600 user I/O pins, and 32,440,320 bits of block RAM. The device also integrates DSP slices for high-speed arithmetic operations, making it suitable for digital signal processing (DSP) tasks. The -2 speed grade indicates a balanced performance level, while the I suffix denotes an industrial temperature range (-40°C to +100°C). The FF1157 package provides a 1156-ball FCBGA footprint with a 35mm x 35mm body size.
Architecturally, the Virtex-7 XT family leverages AMD's advanced 28nm HPL (high-performance, low-power) process, balancing performance with power efficiency. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and high-speed transceivers, enabling flexible system integration. The embedded block RAM and DSP48E1 slices allow efficient implementation of complex algorithms, from FFTs to FIR filters, without external components.
Typical applications include wired communications (e.g., 100G/400G line cards), data center acceleration (e.g., smart NICs, storage controllers), and high-performance computing (HPC) for scientific simulations. The industrial temperature grade makes it suitable for rugged environments such as aerospace, defense, and industrial automation.
When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network (PDN) to ensure reliable operation at high clock frequencies. Use the AMD Vivado Design Suite for configuration and implementation.
Alternatives de remplacement direct pour XC7VX415T-2FF1157I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7VX415T-2FFG1157I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7VX415T-1FF1157I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7VX415T-2FFG1157C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7VX415T-3FF1157I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX415T-2FF1157C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX415T-2FF1157I Valeurs maximales et caractéristiques électriques
| Family | Virtex-7 XT |
| Logic Cells | 412160 |
| CLBs (Configurable Logic Blocks) | 32200 |
| Total RAM Bits | 32440320 |
| Number of I/O | 600 |
| Number of LABs/CLBs | 32200 |
| Boîtier | 1156-BBGA, FCBGA (FF1157) |
| Technology | 28nm |
| Operating Voltage | 1V |
| Température de fonctionnement | -40°C to +100°C (industrial) |
| Speed Grade | -2 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Nombre de broches | 1157 |
| Tension d'alimentation | 1V |
Configuration des broches de XC7VX415T-2FF1157I
| Broche A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Broche A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Broche B1 | VCCINT — Internal core voltage 1V |
| Broche B2 | GND — Ground |
| Broche C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Broche C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Broche D1 | VCCAUX — Auxiliary voltage 1.8V |
| Broche D2 | GND — Ground |
| Broche E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Broche E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Broche F1 | VCCO_0 — I/O bank 0 supply voltage |
| Broche F2 | GND — Ground |
Applications typiques
XC7VX415T-2FF1157I convient pour 6 applications: Data Center Acceleration, Wired Communications, High-Performance Computing (HPC), Aerospace and Defense, Industrial Automation, Medical Imaging.
Data Center Acceleration
The XC7VX415T-2FF1157I excels in data center acceleration with 412,160 logic cells and 32.4 Mb of block RAM, enabling smart NICs, storage controllers, and custom accelerators. Its 600 I/O pins support high-speed interfaces like PCIe and 100G Ethernet, delivering low-latency packet processing and offload. The industrial temperature grade ensures reliable operation in server environments. Use the Vivado Design Suite to implement custom data paths that offload CPU tasks, improving throughput and reducing power consumption compared to software-only solutions.
Recommandé
Wired Communications
For wired communications, the XC7VX415T-2FF1157I provides the logic density and I/O bandwidth needed for 100G/400G line cards and switches. Its 600 I/O pins support high-speed transceivers and parallel buses, while the 32.4 Mb block RAM enables deep packet buffering. The 28nm process balances speed and power, making it suitable for power-constrained telecom equipment. Designers can implement complex packet processing, traffic management, and forwarding logic in a single device, reducing system cost and latency.
Recommandé
High-Performance Computing (HPC)
In HPC, the XC7VX415T-2FF1157I accelerates scientific simulations and AI inference with its 412,160 logic cells and DSP slices. The device can implement custom floating-point units, FFT engines, and matrix multipliers, achieving higher throughput than general-purpose CPUs. Its 600 I/O pins connect to high-bandwidth memory and interconnects, enabling scalable multi-FPGA systems. The industrial temperature grade supports deployment in harsh computing environments, and the 28nm process provides a good balance of performance and power efficiency.
Recommandé
Aerospace and Defense
The XC7VX415T-2FF1157I is ideal for aerospace and defense applications due to its industrial temperature range (-40°C to +100°C) and high reliability. It can implement radar signal processing, secure communications, and electronic warfare systems with its 412,160 logic cells and DSP slices. The 600 I/O pins support a wide range of sensors and interfaces, while the 32.4 Mb block RAM enables real-time data processing. The 28nm process offers a good balance of performance and power, critical for mission-critical systems.
Recommandé
Industrial Automation
For industrial automation, the XC7VX415T-2FF1157I provides the logic capacity for advanced motor control, robotics, and machine vision. Its 600 I/O pins interface with encoders, cameras, and fieldbuses, while the 32.4 Mb block RAM supports real-time image processing. The industrial temperature grade ensures operation in factory environments, and the 28nm process delivers reliable performance. Designers can implement custom control loops and vision algorithms in hardware, achieving deterministic latency and high throughput.
Recommandé
Medical Imaging
The XC7VX415T-2FF1157I is well-suited for medical imaging systems such as ultrasound, CT, and MRI, where high-speed signal processing is critical. Its 412,160 logic cells and DSP slices enable real-time beamforming, image reconstruction, and filtering. The 600 I/O pins connect to high-speed ADCs and DACs, while the 32.4 Mb block RAM buffers large image frames. The industrial temperature grade supports reliable operation in clinical environments, and the 28nm process balances performance and power for portable devices.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7VX415T-2FF1157I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7VX415T-2FFG1157I | XC7VX415T-1FF1157I | XC7VX415T-2FFG1157C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (FF1157) | 1156-BBGA, FCBGA (FF1157) - same | 1156-BBGA, FCBGA (FF1157) - same | 1156-BBGA, FCBGA (FF1157) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 412160 | 412160 | 412160 | 412160 |
| Total RAM Bits | 32440320 | 32440320 | 32440320 | 32440320 |
| Number of I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -2 | -1 | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) |
| RoHS | Compliant | Compliant (lead-free) | Compliant | Compliant (lead-free) |
Principaux différenciateurs
- Industrial temperature grade (vs XC7VX415T-2FFG1157C)
- Higher speed grade (vs XC7VX415T-1FF1157I)
- Standard lead finish (vs XC7VX415T-2FFG1157I)
Notes de conception
The XC7VX415T-2FF1157I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for each I/O bank. Use a robust power distribution network (PDN) with low-impedance decoupling capacitors (e.g., 100nF and 10uF) placed close to the FPGA pins. Follow AMD's power integrity guidelines to minimize voltage ripple and ensure reliable operation at high clock frequencies.
The XC7VX415T-2FF1157I can dissipate significant power (10-30W) depending on utilization. Use a heatsink and forced airflow for high-performance designs. The industrial temperature grade allows operation up to +100°C junction temperature, but ensure adequate thermal management to stay within limits. Use AMD's Power Estimator to calculate expected power and design the cooling solution accordingly.
For the 1156-ball FCBGA package, use a high-layer-count PCB (e.g., 16-20 layers) with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize via stubs. Follow AMD's PCB design guidelines for the Virtex-7 family, including proper decoupling and signal integrity practices. Use the package pinout files to ensure correct ball assignment.
Informations de conformité
RoHS compliance inferred from distributor listings. Lead-free status not explicitly stated for this variant; the -2FFG1157I is the lead-free version.
