XC7VX415T-2FF1157I - Virtex-7 XT FPGA 412K Logic Cells | AMD
MPN: XC7VX415T-2FF1157I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2495 | $2,495.00 |
| 10 | $2350 | $23,500.00 |
| 100 | $2200 | $220,000.00 |
| 500 | $2100 | $1,050,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
Drop-in alternatives for XC7VX415T-2FF1157I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VX415T-2FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX415T-1FF1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX415T-2FFG1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX415T-3FF1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX415T-2FF1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX415T-2FF1157I Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 XT |
| Logic Cells | 412160 |
| CLBs (Configurable Logic Blocks) | 32200 |
| Total RAM Bits | 32440320 |
| Number of I/O | 600 |
| Number of LABs/CLBs | 32200 |
| Package | 1156-BBGA, FCBGA (FF1157) |
| Technology | 28nm |
| Operating Voltage | 1V |
| Operating Temperature | -40Β°C to +100Β°C (industrial) |
| Speed Grade | -2 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Number of Pins | 1157 |
| Supply Voltage | 1V |
XC7VX415T-2FF1157I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | VCCINT β Internal core voltage 1V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin F1 | VCCO_0 β I/O bank 0 supply voltage |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX415T-2FF1157I is suitable for 6 applications: Data Center Acceleration, Wired Communications, High-Performance Computing (HPC), Aerospace and Defense, Industrial Automation, Medical Imaging.
Data Center Acceleration
The XC7VX415T-2FF1157I excels in data center acceleration with 412,160 logic cells and 32.4 Mb of block RAM, enabling smart NICs, storage controllers, and custom accelerators. Its 600 I/O pins support high-speed interfaces like PCIe and 100G Ethernet, delivering low-latency packet processing and offload. The industrial temperature grade ensures reliable operation in server environments. Use the Vivado Design Suite to implement custom data paths that offload CPU tasks, improving throughput and reducing power consumption compared to software-only solutions.
Recommended
Wired Communications
For wired communications, the XC7VX415T-2FF1157I provides the logic density and I/O bandwidth needed for 100G/400G line cards and switches. Its 600 I/O pins support high-speed transceivers and parallel buses, while the 32.4 Mb block RAM enables deep packet buffering. The 28nm process balances speed and power, making it suitable for power-constrained telecom equipment. Designers can implement complex packet processing, traffic management, and forwarding logic in a single device, reducing system cost and latency.
Recommended
High-Performance Computing (HPC)
In HPC, the XC7VX415T-2FF1157I accelerates scientific simulations and AI inference with its 412,160 logic cells and DSP slices. The device can implement custom floating-point units, FFT engines, and matrix multipliers, achieving higher throughput than general-purpose CPUs. Its 600 I/O pins connect to high-bandwidth memory and interconnects, enabling scalable multi-FPGA systems. The industrial temperature grade supports deployment in harsh computing environments, and the 28nm process provides a good balance of performance and power efficiency.
Recommended
Aerospace and Defense
The XC7VX415T-2FF1157I is ideal for aerospace and defense applications due to its industrial temperature range (-40Β°C to +100Β°C) and high reliability. It can implement radar signal processing, secure communications, and electronic warfare systems with its 412,160 logic cells and DSP slices. The 600 I/O pins support a wide range of sensors and interfaces, while the 32.4 Mb block RAM enables real-time data processing. The 28nm process offers a good balance of performance and power, critical for mission-critical systems.
Recommended
Industrial Automation
For industrial automation, the XC7VX415T-2FF1157I provides the logic capacity for advanced motor control, robotics, and machine vision. Its 600 I/O pins interface with encoders, cameras, and fieldbuses, while the 32.4 Mb block RAM supports real-time image processing. The industrial temperature grade ensures operation in factory environments, and the 28nm process delivers reliable performance. Designers can implement custom control loops and vision algorithms in hardware, achieving deterministic latency and high throughput.
Recommended
Medical Imaging
The XC7VX415T-2FF1157I is well-suited for medical imaging systems such as ultrasound, CT, and MRI, where high-speed signal processing is critical. Its 412,160 logic cells and DSP slices enable real-time beamforming, image reconstruction, and filtering. The 600 I/O pins connect to high-speed ADCs and DACs, while the 32.4 Mb block RAM buffers large image frames. The industrial temperature grade supports reliable operation in clinical environments, and the 28nm process balances performance and power for portable devices.
Recommended
Recommended Products Summary
Engineering reference data for XC7VX415T-2FF1157I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX415T-2FFG1157I | XC7VX415T-1FF1157I | XC7VX415T-2FFG1157C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (FF1157) | 1156-BBGA, FCBGA (FF1157) - same | 1156-BBGA, FCBGA (FF1157) - same | 1156-BBGA, FCBGA (FF1157) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 412160 | 412160 | 412160 | 412160 |
| Total RAM Bits | 32440320 | 32440320 | 32440320 | 32440320 |
| Number of I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -2 | -1 | -2 |
| Temperature Grade | Industrial (-40Β°C to +100Β°C) | Industrial (-40Β°C to +100Β°C) | Industrial (-40Β°C to +100Β°C) | Commercial (0Β°C to +85Β°C) |
| RoHS | Compliant | Compliant (lead-free) | Compliant | Compliant (lead-free) |
Key Differentiators
- Industrial temperature grade (vs XC7VX415T-2FFG1157C)
- Higher speed grade (vs XC7VX415T-1FF1157I)
- Standard lead finish (vs XC7VX415T-2FFG1157I)
Design Notes
The XC7VX415T-2FF1157I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for each I/O bank. Use a robust power distribution network (PDN) with low-impedance decoupling capacitors (e.g., 100nF and 10uF) placed close to the FPGA pins. Follow AMD's power integrity guidelines to minimize voltage ripple and ensure reliable operation at high clock frequencies.
The XC7VX415T-2FF1157I can dissipate significant power (10-30W) depending on utilization. Use a heatsink and forced airflow for high-performance designs. The industrial temperature grade allows operation up to +100Β°C junction temperature, but ensure adequate thermal management to stay within limits. Use AMD's Power Estimator to calculate expected power and design the cooling solution accordingly.
For the 1156-ball FCBGA package, use a high-layer-count PCB (e.g., 16-20 layers) with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize via stubs. Follow AMD's PCB design guidelines for the Virtex-7 family, including proper decoupling and signal integrity practices. Use the package pinout files to ensure correct ball assignment.
Compliance Information
RoHS compliance inferred from distributor listings. Lead-free status not explicitly stated for this variant; the -2FFG1157I is the lead-free version.
