XC7Z045-1FFG900I - Zynq-7000 SoC, 350K Logic Cells | AMD
Référence : XC7Z045-1FFG900I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $187.0711 | $187,07 |
XC7Z045-1FFG900I Présentation
A System-on-Chip (SoC) FPGA combines a hard processor subsystem with programmable logic on one die. The Zynq-7000 family, introduced by Xilinx (now AMD) in 2012, is a leading example of this architecture. It allows designers to implement complex systems where the ARM cores handle control and communication tasks, while the FPGA fabric accelerates data-intensive algorithms. This integration reduces board space, power, and latency compared to discrete processor-plus-FPGA designs.
Key features of the XC7Z045-1FFG900I include 350K logic cells, 667 MHz dual-core ARM Cortex-A9 processing, and a 900-ball FCBGA package. The device supports a wide range of I/O standards and includes high-speed serial transceivers. The 'I' suffix indicates an industrial temperature grade, suitable for harsh environments. The '1' speed grade offers a balance between performance and power consumption.
The Zynq-7000 architecture provides a high-bandwidth connection between the PS and PL through AXI interfaces, enabling efficient data movement. The PL is based on the 7-series FPGA fabric, which includes configurable logic blocks, block RAM, and DSP slices. This allows for the implementation of custom accelerators, soft processors, and high-speed I/O interfaces. The PS includes memory controllers for DDR3/DDR3L, as well as a rich set of peripherals such as Gigabit Ethernet, USB, and SPI.
Typical applications for the XC7Z045-1FFG900I include software-defined radio, industrial motor control, medical imaging, and aerospace and defense systems. Its combination of processing power and programmable logic makes it ideal for applications requiring real-time signal processing, high-speed data acquisition, and flexible I/O. The industrial temperature grade ensures reliable operation in demanding environments.
When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails, and proper sequencing is critical to prevent damage. Additionally, the high-density BGA package requires a multi-layer PCB with controlled impedance traces for high-speed signals. AMD provides comprehensive reference designs and documentation to assist with these challenges.
Alternatives de remplacement direct pour XC7Z045-1FFG900I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7Z045-1FFG900I (même facteur de forme et même empreinte).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7Z045-2FFG900I
✅ Remplacement direct✓ En stock
$149.6613 / unité
XC7Z045-1FFG900C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7Z045-1FFG900CES
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7Z045-L2FFG900I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
JYX4S045
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7Z045-1FFG900I Valeurs maximales et caractéristiques électriques
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Primary Clock Speed | 667 MHz |
| Logic Cells | 350K |
| Boîtier | 900-FCBGA (31x31 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | Industrial (-40C to +100C) |
| Speed Grade | -1 |
| FPGA Family | Kintex-7 |
| Process Technology | 28 nm |
| Statut RoHS | Compliant |
| Tension d'alimentation | 1.0V (core) |
| Product Status | Active |
Configuration des broches de XC7Z045-1FFG900I
| Broche A1 | GND — Ground |
| Broche A2 | VCCINT — Internal core voltage (1.0V) |
| Broche A3 | IO_L1P_T0 — User I/O bank 0 |
| Broche B1 | VCCAUX — Auxiliary voltage (1.8V) |
| Broche B2 | IO_L1N_T0 — User I/O bank 0 |
| Broche C1 | VCCO_0 — I/O bank 0 supply voltage |
| Broche C2 | IO_L2P_T0 — User I/O bank 0 |
| Broche D1 | IO_L2N_T0 — User I/O bank 0 |
| Broche E1 | DDR_A0 — DDR memory address |
| Broche E2 | DDR_A1 — DDR memory address |
| Broche F1 | DDR_DQ0 — DDR memory data |
| Broche F2 | DDR_DQ1 — DDR memory data |
Applications typiques
XC7Z045-1FFG900I convient pour 6 applications: Software-Defined Radio, Industrial Motor Control, Medical Imaging, Aerospace and Defense, High-Performance Computing, Test and Measurement.
Software-Defined Radio
The XC7Z045-1FFG900I is ideal for software-defined radio (SDR) systems. Its 350K logic cells can implement complex digital signal processing (DSP) chains, including filters, FFTs, and modulation/demodulation. The dual-core ARM Cortex-A9 at 667 MHz handles control, protocol stack, and network interfaces. The high-speed transceivers support ADC/DAC data transfer. The industrial temperature grade ensures reliable operation in field-deployed SDR units. The programmable logic allows for flexible waveform generation and processing, making it a versatile platform for military and commercial SDR applications.
Recommandé
Industrial Motor Control
The XC7Z045-1FFG900I excels in industrial motor control applications. The FPGA fabric can implement multiple PWM channels, encoder interfaces, and high-speed current/voltage sensing with low latency. The ARM cores run complex control algorithms like field-oriented control (FOC) and communication protocols (EtherCAT, PROFINET). The 28nm process and industrial temperature grade ensure reliable operation in factory environments. The high logic density allows for multi-axis control in a single device, reducing system cost and complexity. The AXI interfaces provide high-bandwidth data transfer between the PS and PL for real-time control loops.
Recommandé
Medical Imaging
The XC7Z045-1FFG900I is well-suited for medical imaging systems such as ultrasound and CT scanners. The FPGA fabric can perform real-time image processing, including filtering, enhancement, and beamforming. The ARM cores handle system control, user interface, and data storage. The high-speed transceivers interface with image sensors and display controllers. The industrial temperature grade ensures reliable operation in clinical environments. The 350K logic cells provide ample resources for complex algorithms, while the 667 MHz ARM cores offer sufficient processing power for control tasks. The Zynq-7000 architecture enables a compact, low-power design compared to discrete processor-plus-FPGA solutions.
Recommandé
Aerospace and Defense
The XC7Z045-1FFG900I is a preferred choice for aerospace and defense applications due to its high performance and industrial temperature grade. It can be used in radar, electronic warfare, and secure communication systems. The FPGA fabric implements high-speed signal processing, encryption, and beamforming. The ARM cores handle mission control, data logging, and network interfaces. The 28nm process offers a good balance of performance and power, which is critical for airborne and space-borne systems. The device's reliability and long-term availability make it suitable for defense programs with extended lifecycles. AMD provides extensive documentation and qualification data for these applications.
Recommandé
High-Performance Computing
The XC7Z045-1FFG900I can be used in high-performance computing (HPC) applications such as financial modeling, scientific simulation, and data analytics. The FPGA fabric can accelerate compute-intensive algorithms, while the ARM cores manage data flow and system control. The high-speed transceivers enable fast data transfer between the SoC and other compute nodes. The 350K logic cells and DSP slices provide significant parallel processing capability. The Zynq-7000 architecture allows for a tightly coupled processor-FPGA system, reducing latency compared to discrete solutions. This makes it suitable for edge computing and real-time analytics in data centers and research facilities.
Recommandé
Test and Measurement
The XC7Z045-1FFG900I is ideal for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. The FPGA fabric can implement high-speed data acquisition, triggering, and signal processing. The ARM cores handle user interface, data storage, and remote control via Ethernet or USB. The high-speed transceivers interface with ADCs and DACs. The industrial temperature grade ensures accurate operation in various environments. The 350K logic cells provide ample resources for complex measurement algorithms, while the 667 MHz ARM cores offer sufficient processing power for real-time analysis. This SoC enables a compact, portable design for benchtop and field instruments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7Z045-1FFG900I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7Z045-2FFG900I | XC7Z045-1FFG900C | XC7Z045-1FFG900CES | XC7Z045-L2FFG900I | JYX4S045 |
|---|---|---|---|---|---|---|
| Package | 900-FCBGA (31x31) | 900-FCBGA (31x31) - same | 900-FCBGA (31x31) - same | 900-FCBGA (31x31) - same | 900-FCBGA (31x31) - same | PBGA900 - same |
| Brand | AMD | AMD | AMD | AMD | AMD | CETC58 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Wider temp range |
| Logic Cells | 350K | 350K | 350K | 350K | 350K | 350K |
| Core Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
Principaux différenciateurs
- Industrial temperature grade (vs XC7Z045-1FFG900C)
- Balanced speed grade (vs XC7Z045-2FFG900I)
- Cross-brand availability (vs JYX4S045)
Notes de conception
The XC7Z045-1FFG900I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO for each I/O bank. Proper power supply sequencing is critical to prevent damage. Use a dedicated power management IC or a sequencer to ensure VCCINT ramps up before VCCAUX and VCCO. Decouple each rail with a combination of bulk and ceramic capacitors placed close to the BGA pins. Refer to the ZC706 evaluation board design for a proven power tree.
The 900-ball FCBGA package requires a multi-layer PCB with at least 8-10 layers for proper routing and power integrity. Use controlled impedance traces for high-speed signals like DDR and transceivers. Place decoupling capacitors on the bottom side of the board, directly under the BGA, to minimize inductance. Follow AMD's PCB design guidelines for BGA escape routing and via placement. A high-quality PCB is essential for reliable operation at 667 MHz.
The XC7Z045-1FFG900I can dissipate significant power, especially when the FPGA fabric is fully utilized. Use a heatsink or active cooling solution to keep the junction temperature within the industrial range (-40C to +100C). The FCBGA package has a thermal pad on the top for heatsink attachment. Perform thermal simulation or use the ZC706 board's thermal solution as a reference. Ensure adequate airflow in the final enclosure.
Informations de conformité
RoHS compliant per distributor listings. AEC-Q100 not applicable for this SoC.
