XC7Z045-1FFG900I - Zynq-7000 SoC, 350K Logic Cells | AMD
MPN: XC7Z045-1FFG900I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $187.07 | $187.07 |
| 10 | $175 | $1,750.00 |
| 100 | $160 | $16,000.00 |
| 500 | $145 | $72,500.00 |
| 1,000 | $130 | $130,000.00 |
Drop-in alternatives for XC7Z045-1FFG900I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7Z045-1FFG900C
β Drop-Inπ Reference alternative (not in catalog)
XC7Z045-1FFG900CES
β Drop-Inπ Reference alternative (not in catalog)
XC7Z045-L2FFG900I
β Drop-Inπ Reference alternative (not in catalog)
JYX4S045
β Drop-Inπ Reference alternative (not in catalog)
XC7Z045-1FFG900I Maximum Ratings & Electrical Characteristics
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Primary Clock Speed | 667 MHz |
| Logic Cells | 350K |
| Package | 900-FCBGA (31x31 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | Industrial (-40C to +100C) |
| Speed Grade | -1 |
| FPGA Family | Kintex-7 |
| Process Technology | 28 nm |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| Block RAM | [DATA_NEEDED: Block RAM] |
| DSP Slices | [DATA_NEEDED: DSP Slices] |
| RoHS Status | Compliant |
| Supply Voltage | 1.0V (core) |
| Product Status | Active |
XC7Z045-1FFG900I Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCINT β Internal core voltage (1.0V) |
| Pin A3 | IO_L1P_T0 β User I/O bank 0 |
| Pin B1 | VCCAUX β Auxiliary voltage (1.8V) |
| Pin B2 | IO_L1N_T0 β User I/O bank 0 |
| Pin C1 | VCCO_0 β I/O bank 0 supply voltage |
| Pin C2 | IO_L2P_T0 β User I/O bank 0 |
| Pin D1 | IO_L2N_T0 β User I/O bank 0 |
| Pin E1 | DDR_A0 β DDR memory address |
| Pin E2 | DDR_A1 β DDR memory address |
| Pin F1 | DDR_DQ0 β DDR memory data |
| Pin F2 | DDR_DQ1 β DDR memory data |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7Z045-1FFG900I is suitable for 6 applications: Software-Defined Radio, Industrial Motor Control, Medical Imaging, Aerospace and Defense, High-Performance Computing, Test and Measurement.
Software-Defined Radio
The XC7Z045-1FFG900I is ideal for software-defined radio (SDR) systems. Its 350K logic cells can implement complex digital signal processing (DSP) chains, including filters, FFTs, and modulation/demodulation. The dual-core ARM Cortex-A9 at 667 MHz handles control, protocol stack, and network interfaces. The high-speed transceivers support ADC/DAC data transfer. The industrial temperature grade ensures reliable operation in field-deployed SDR units. The programmable logic allows for flexible waveform generation and processing, making it a versatile platform for military and commercial SDR applications.
Recommended
Industrial Motor Control
The XC7Z045-1FFG900I excels in industrial motor control applications. The FPGA fabric can implement multiple PWM channels, encoder interfaces, and high-speed current/voltage sensing with low latency. The ARM cores run complex control algorithms like field-oriented control (FOC) and communication protocols (EtherCAT, PROFINET). The 28nm process and industrial temperature grade ensure reliable operation in factory environments. The high logic density allows for multi-axis control in a single device, reducing system cost and complexity. The AXI interfaces provide high-bandwidth data transfer between the PS and PL for real-time control loops.
Recommended
Medical Imaging
The XC7Z045-1FFG900I is well-suited for medical imaging systems such as ultrasound and CT scanners. The FPGA fabric can perform real-time image processing, including filtering, enhancement, and beamforming. The ARM cores handle system control, user interface, and data storage. The high-speed transceivers interface with image sensors and display controllers. The industrial temperature grade ensures reliable operation in clinical environments. The 350K logic cells provide ample resources for complex algorithms, while the 667 MHz ARM cores offer sufficient processing power for control tasks. The Zynq-7000 architecture enables a compact, low-power design compared to discrete processor-plus-FPGA solutions.
Recommended
Aerospace and Defense
The XC7Z045-1FFG900I is a preferred choice for aerospace and defense applications due to its high performance and industrial temperature grade. It can be used in radar, electronic warfare, and secure communication systems. The FPGA fabric implements high-speed signal processing, encryption, and beamforming. The ARM cores handle mission control, data logging, and network interfaces. The 28nm process offers a good balance of performance and power, which is critical for airborne and space-borne systems. The device's reliability and long-term availability make it suitable for defense programs with extended lifecycles. AMD provides extensive documentation and qualification data for these applications.
Recommended
High-Performance Computing
The XC7Z045-1FFG900I can be used in high-performance computing (HPC) applications such as financial modeling, scientific simulation, and data analytics. The FPGA fabric can accelerate compute-intensive algorithms, while the ARM cores manage data flow and system control. The high-speed transceivers enable fast data transfer between the SoC and other compute nodes. The 350K logic cells and DSP slices provide significant parallel processing capability. The Zynq-7000 architecture allows for a tightly coupled processor-FPGA system, reducing latency compared to discrete solutions. This makes it suitable for edge computing and real-time analytics in data centers and research facilities.
Recommended
Test and Measurement
The XC7Z045-1FFG900I is ideal for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. The FPGA fabric can implement high-speed data acquisition, triggering, and signal processing. The ARM cores handle user interface, data storage, and remote control via Ethernet or USB. The high-speed transceivers interface with ADCs and DACs. The industrial temperature grade ensures accurate operation in various environments. The 350K logic cells provide ample resources for complex measurement algorithms, while the 667 MHz ARM cores offer sufficient processing power for real-time analysis. This SoC enables a compact, portable design for benchtop and field instruments.
Recommended
Recommended Products Summary
Engineering reference data for XC7Z045-1FFG900I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7Z045-2FFG900I | XC7Z045-1FFG900C | XC7Z045-1FFG900CES | XC7Z045-L2FFG900I | JYX4S045 |
|---|---|---|---|---|---|---|
| Package | 900-FCBGA (31x31) | 900-FCBGA (31x31) - same | 900-FCBGA (31x31) - same | 900-FCBGA (31x31) - same | 900-FCBGA (31x31) - same | PBGA900 - same |
| Brand | AMD | AMD | AMD | AMD | AMD | CETC58 |
| Speed Grade | -1 (667 MHz) | -2 (higher) | -1 (667 MHz) | -1 (667 MHz) | -L2 (low power) | [DATA_NEEDED] |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Wider temp range |
| Logic Cells | 350K | 350K | 350K | 350K | 350K | 350K |
| Core Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Price (1 pc, as of 2026-08-20) | $187.07 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 30% lower cost |
Key Differentiators
- Industrial temperature grade (vs XC7Z045-1FFG900C)
- Balanced speed grade (vs XC7Z045-2FFG900I)
- Cross-brand availability (vs JYX4S045)
Design Notes
The XC7Z045-1FFG900I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO for each I/O bank. Proper power supply sequencing is critical to prevent damage. Use a dedicated power management IC or a sequencer to ensure VCCINT ramps up before VCCAUX and VCCO. Decouple each rail with a combination of bulk and ceramic capacitors placed close to the BGA pins. Refer to the ZC706 evaluation board design for a proven power tree.
The 900-ball FCBGA package requires a multi-layer PCB with at least 8-10 layers for proper routing and power integrity. Use controlled impedance traces for high-speed signals like DDR and transceivers. Place decoupling capacitors on the bottom side of the board, directly under the BGA, to minimize inductance. Follow AMD's PCB design guidelines for BGA escape routing and via placement. A high-quality PCB is essential for reliable operation at 667 MHz.
The XC7Z045-1FFG900I can dissipate significant power, especially when the FPGA fabric is fully utilized. Use a heatsink or active cooling solution to keep the junction temperature within the industrial range (-40C to +100C). The FCBGA package has a thermal pad on the top for heatsink attachment. Perform thermal simulation or use the ZC706 board's thermal solution as a reference. Ensure adequate airflow in the final enclosure.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for this SoC.
