ATSAME70Q21B-CFN - ARM Cortex-M7 MCU 300MHz 2MB Flash 144-UFBGA | Microchip
MPN: ATSAME70Q21B-CFN ✓ פעילATSAME70Q21B-CFN סקירה
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, working memory, and a range of on-chip peripherals. ARM Cortex-M7 is a high-end Cortex-M core featuring superscalar pipelining, tightly-coupled memories (TCM), branch prediction, and an optional FPU optimized for DSP-style algorithms; the SAM E70 specifically adds DSP extensions, MPU, and a deterministic cache architecture. Within the broader taxonomy, ATSAME70Q21B-CFN sits under Microcontrollers -> Integrated Circuits -> Semiconductors, serving as the central compute element in motor control, industrial automation, and audio/graphics subsystems.
Key differentiating features include 2 MB dual-bank Flash allowing live firmware updates without downtime, 384 KB SRAM arranged as 256 KB system + 128 KB for tightly-coupled data access, an integrated 480 Mbps High-Speed USB PHY (Device/Host/OTG), an integrated 10/100 Ethernet MAC with 1588 precision time stamping, dual CAN-FD controllers, a 12-bit 2 Msps ADC with up to 24 channels, and hardware crypto accelerators for AES, TRNG, and SHA. The Cortex-M7 DSP extensions (single-precision MAC and SIMD) deliver sustained DSP throughput that is competitive with low-end DSP parts.
Architecturally, the SAM E70 uses Microchip's Event System, parallel capture peripherals, and a 16-channel Peripheral DMA controller to keep I/O offload efficient. Voltage is supplied via a built-in LDO and on-chip buck-capable regulator chain, supporting 3.3 V single-supply operation with internal core regulation. The 300 MHz core, combined with 16 KB I-cache and 16 KB D-cache, makes the device effective for high-rate signal chains and HMI applications.
Typical applications include industrial drives and motor control (Field-Oriented Control of PMSM/BLDC), automotive CAN-FD body controllers, building automation gateways, point-of-sale terminals, audio amplifiers and DSP front-ends, robotics controllers, and connected IoT edge nodes with Ethernet or USB. The part is well-suited to graphical HMI panels that pair the MCU with an external display via the 16-bit HSIF.
When designing with the ATSAME70Q21B-CFN, pay attention to the UFBGA-144 6x6 mm land pattern and provide adequate via-in-pad thermal dissipation; the 300 MHz core draws significant dynamic current, so a 4-layer PCB with a continuous GND plane is recommended for signal integrity and EMI. Use Microchip's MPLAB Harmony 3 framework and the SAME70 Xplained Ultra board for rapid prototyping.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical layout notes that go beyond the manufacturer datasheet, giving engineers a single decision-ready reference.
חלופות תחליף ישיר עבור ATSAME70Q21B-CFN — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם ATSAME70Q21B-CFN (אותו גורם צורה וטביעת רגל) — שונים ב Ethernet, Package, SRAM, USB, CAN.
ATSAME70Q21B-CFNT
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME70Q21B-CN
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME70Q20B-CFN
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME70N21B-CFN
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ATSAMS70N21B-CFN
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ATSAME70Q21B-CFN דירוגים מרביים ומאפיינים חשמליים
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum Core Clock | 300 MHz |
| Flash Memory | 2 MB (dual-bank) |
| SRAM | 384 KB |
| מארז | 144-UFBGA (6x6 mm) |
| USB | USB 2.0 High-Speed with on-chip PHY (Device/Host/OTG) |
| CAN | 2x CAN-FD |
| Ethernet | 10/100 MAC with 1588 PTP hardware assist |
| Crypto Accelerator | AES, TRNG, SHA |
| External Bus Interface | 16-bit HSIF (up to 133 MHz) for SRAM/FPGA |
| DMA | 16-channel Peripheral DMA + Event System |
| DSP Extensions | Single-precision MAC, SIMD instructions |
מדריך תצורת פינים של ATSAME70Q21B-CFN 144-ufbga (6x6 mm)
תצורת פינים עבור ATSAME70Q21B-CFN (מארזת 144-ufbga (6x6 mm)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור ATSAME70Q21B-CFN.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
ATSAME70Q21B-CFN מתאים עבור 6 יישוםs: Field-Oriented Control of PMSM and BLDC Motors, Industrial CAN-FD Gateway and Body Controller, Audio DSP Front-End and Amplifier Controller, USB 2.0 High-Speed Data Acquisition and Streaming, Connected IoT Edge Node with Ethernet and TLS, Robotics Controller and Human-Machine Interface.
Field-Oriented Control of PMSM and BLDC Motors
The ATSAME70Q21B-CFN's 300 MHz Cortex-M7 with FPU and DSP extensions executes Park/Clarke transforms and PI current loops in single-digit microseconds, making it a strong fit for Field-Oriented Control (FOC) of PMSM and BLDC motors in industrial drives, drones, and e-mobility. On-chip peripherals include 16-bit PWM with complementary outputs and dead-time insertion, a 12-bit 2 Msps ADC with up to 24 channels for phase current sensing, and quadrature-decoder interfaces for incremental encoders. The 384 KB SRAM fits sensorless observers and field-weakening tables without external memory, and the dual-bank 2 MB Flash enables live OTA tuning of motor parameters. Designers typically pair it with a high-side gate driver like the Microchip MCP8026 and a 3-phase inverter using six 40 V MOSFETs; the chip can sustain 20 kHz PWM without leaving CPU headroom for housekeeping tasks.
מומלץ
Industrial CAN-FD Gateway and Body Controller
Dual integrated CAN-FD controllers on the ATSAME70Q21B-CFN make it a natural choice for industrial CAN-FD gateways that bridge classical CAN 2.0B traffic with high-bandwidth CAN-FD segments at up to 5 Mbps. The Cortex-M7 core parses CAN-FD frames in real time and routes them to Ethernet via the integrated 10/100 MAC with 1588 PTP hardware assist, enabling sub-millisecond timestamping for synchronized drive systems. The 2 MB dual-bank Flash lets gateway firmware be updated in the field without downtime, while the 384 KB SRAM holds multiple protocol stacks (CANopen, J1939, or CAN-FD profiles) concurrently. A typical design uses a TJA1044GT CAN transceiver, an Ethernet transformer, and the HS USB port as a service/diagnostic channel; the part runs the gateway stack from open-source libsockets or a commercial CANopen library without external memory.
מומלץ
Audio DSP Front-End and Amplifier Controller
Audio products that need high-rate signal processing - such as active speakers, smart amplifiers, and automotive headrest audio - benefit from the ATSAME70Q21B-CFN's Cortex-M7 DSP extensions (single-precision MAC and SIMD) running at 300 MHz. The part can sustain multi-channel EQ, compression, and active-noise-cancellation algorithms in real time, while the 384 KB SRAM holds 50-100 ms of audio buffers per channel at 48 kHz without external memory. The 16-bit HSIF external bus interface connects to a dedicated audio DAC like the Microchip MCP4728 or an external SRAM for buffer expansion in higher-channel-count designs. A typical 4-channel Class-D amplifier board pairs the SAM E70 with four gate drivers and uses I2S inputs from a Bluetooth audio SoC; the chip can apply loudness compensation and dynamic EQ with zero audible latency.
מומלץ
USB 2.0 High-Speed Data Acquisition and Streaming
The integrated USB 2.0 High-Speed PHY on the ATSAME70Q21B-CFN eliminates the ULPI bridge chip typically required for HS USB on Cortex-M parts, reducing BOM cost and freeing board space in data-acquisition and streaming designs. The part can sustain 480 Mbps USB throughput into an external 16 MB SRAM buffer via HSIF while the Cortex-M7 performs 12-bit ADC captures at up to 2 Msps across multiple channels. This makes it well suited to USB oscilloscope probes, USB spectrum analyzers, and USB streaming audio interfaces where the device appears to the host as a high-speed audio or vendor-class endpoint. A practical implementation uses the Microchip USB stack from MPLAB Harmony and a USB-C connector with USB Power Delivery negotiation handled by an external FUSB302 chip; the SAM E70 manages the application layer and the bulk transfers.
מומלץ
Connected IoT Edge Node with Ethernet and TLS
The ATSAME70Q21B-CFN targets connected IoT edge nodes that require Ethernet for wired backhaul plus hardware cryptography for TLS 1.3 handshakes. The integrated 10/100 Ethernet MAC with 1588 PTP, paired with an external PHY, delivers deterministic latency on industrial Ethernet networks such as PROFINET or EtherCAT (with software stack), while the on-chip AES, TRNG, and SHA accelerators offload the cryptographic heavy-lifting that would otherwise stall the Cortex-M7. The 384 KB SRAM fits an MQTT-SN or OPC-UA stack plus TLS buffers, and the 2 MB dual-bank Flash hosts the application firmware with OTA updates. A typical industrial sensor hub design uses a 4-pin RJ45 with integrated magnetics, an external PHY, and a backup CAN-FD link for redundancy; the chip can sustain hundreds of TLS sessions per minute without measurable CPU saturation.
מומלץ
Robotics Controller and Human-Machine Interface
Robotics applications need deterministic, multi-axis motor control plus a high-bandwidth link to sensors, actuators, and a graphical HMI panel. The ATSAME70Q21B-CFN drives up to six axes of servo control via its PWM and ADC peripherals while reserving CPU headroom to drive an external LCD over the 16-bit HSIF bus, a 10/100 Ethernet link to the supervisory PLC, and dual CAN-FD channels to safety or expansion modules. The 2 MB Flash accommodates real-time operating systems such as FreeRTOS with FAT file system plus bootloader and application slots, and the 384 KB SRAM fits a multi-tasking kernel plus graphics buffers. Designers typically pair it with a 4.3-inch TFT display, a 6-axis IMU over SPI, and CAN-FD motor controllers in each joint; the chip can refresh the HMI at 60 Hz while maintaining 1 kHz servo update rates without jitter.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור ATSAME70Q21B-CFN — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | ATSAME70Q21B-CFNT | ATSAME70Q20B-CFN | ATSAME70N21B-CFN |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-UFBGA (6x6 mm) | 144-UFBGA (6x6 mm) - same | 144-UFBGA (6x6 mm) - same | 144-UFBGA (6x6 mm) - same |
| Core | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz |
| Flash | 2 MB dual-bank | 2 MB dual-bank | 1 MB (-50%) | 2 MB dual-bank |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | Yes (10/100 with 1588) | Yes | Yes | No |
| USB HS | On-chip HS PHY | On-chip HS PHY | On-chip HS PHY | On-chip HS PHY |
| CAN-FD | 2x | 2x | 2x | 2x |
| Crypto Accelerator | AES, TRNG, SHA | AES, TRNG, SHA | AES, TRNG, SHA | AES, TRNG, SHA |
| 1-piece Price (USD) | $28.50 | $28.50 (T&R) | $24.20 (est. -15%) | $26.10 (est. -8%) |
מבדילים עיקריים
- Highest-density Flash and dual-bank OTA in this UFBGA-144 footprint (לעומתATSAME70Q20B-CFN)
- Dual CAN-FD plus integrated 10/100 Ethernet MAC in one chip (לעומתATSAME70N21B-CFN)
- On-chip USB 2.0 High-Speed PHY eliminates external ULPI bridge (לעומתSTM32F746IGT6)
- AES, TRNG, and SHA hardware crypto on-chip (לעומתSTM32F746IGT6)
הערות תכנון
The 144-UFBGA 6x6 mm package requires via-in-pad PCB technology for reliable assembly and thermal dissipation. Use 0.3 mm ball pitch with 0.4 mm drilled micro-vias and a 4-layer stack-up: top signal + GND + power + bottom signal. The exposed die pad under the UFBGA must be soldered to a continuous ground plane for heat spreading; an interrupted ground plane will raise junction temperature and reduce reliability. Estimated: a typical 144-UFBGA 6x6 mm PCB layout with via-in-pad and a 1 oz copper ground plane yields theta_JA around 25-30 C/W, sufficient for industrial applications. Use ENIG surface finish and HASL is NOT recommended for fine-pitch BGA assembly.
Estimated: at 300 MHz active core and full peripheral set, the ATSAME70Q21B-CFN draws approximately 120-150 mA from a 3.3 V supply, requiring a regulator capable of delivering at least 200 mA with adequate headroom. Use a low-noise LDO such as the Microchip MCP1703 or a small buck regulator ahead of the VDD pin; place the bulk 10 uF ceramic + 0.1 uF decoupling pair within 5 mm of each power pin pair. The internal core regulator chain (LDO + main regulator) must have a 4.7 uF capacitor on VDDCORE and a 1 uF on VDDPLL to maintain phase margin per the datasheet's power-supply sequencing diagram.
A common pitfall is treating the UFBGA-144 footprint as a drop-in for a different MCU family such as STM32F746 in LQFP-176 - they are NOT pin-compatible and require a new PCB. Another common pitfall is leaving the on-chip USB HS PHY unpowered while toggling USB-related GPIO pins, which can back-power the transceiver through ESD diodes; always strap VDDUTMI to 3.3 V before any USB activity. When migrating from ATSAME70Q21A to the Q21B revision, confirm the errata list - the B revision typically fixes USB suspend behavior but introduces a new note on DMA descriptor alignment that must be observed in custom drivers.
Estimated: route the 16-bit HSIF external memory bus with impedance-controlled traces (typically 50 ohm single-ended with 100 ohm differential clocks) and length-match data, address, and clock within 25 ps to avoid capture-clock skew. Keep the analog VDDA and VDDANA pins separated from the digital 3.3 V plane by a 2 mm moat or a ferrite bead, and place the AVSS analog ground pin directly under the 12-bit ADC traces for noise immunity. The 12 MHz crystal pads should have guard rings to GND and the load capacitors should be NPO/C0G to minimize temperature drift of the USB 480 MHz PLL multiplication.
מידע על תאימות
RoHS compliance and lead-free termination confirmed per Microchip product page; REACH and halogen-free status not explicitly stated in provided data and marked unknown.
