EP1SGX25DF672I7 - Stratix GX FPGA 25K LE | Intel / Altera
MPN: EP1SGX25DF672I7 ✗ סוף ייצורEP1SGX25DF672I7 סקירה
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O resources can be reconfigured after manufacture by the user via a hardware description language and a vendor toolchain. Stratix GX sits inside Intel/Altera's high-end FPGA hierarchy: FPGA -> programmable logic device -> high-density FPGA -> Stratix family -> Stratix GX (transceiver-rich variant). This taxonomy matters because the GX sub-family uniquely integrates multi-gigabit transceivers, making Stratix GX a drop-in technology choice for serial connectivity and high-bandwidth signal processing rather than a generic logic replacement.
Key features include 25,660 logic elements, 2,566 CLBs, 1,944,576 bits of embedded memory (455 logic-array blocks / M512/M4K/M-RAM blocks per the Stratix GX architecture), CMOS 130 nm process technology, and a maximum internal clock frequency near 4385 MHz (4385.97 MHz per third-party data). The combinatorial CLB delay is rated at a maximum of 9.48 ns, and the device is graded for MILITARY / industrial-grade thermal operation. The 672-ball FC-FBGA is a fine-pitch wire-bond BGA that requires careful PCB stack-up and microvia routing.
The 130 nm CMOS architecture pairs a 4-input LUT-based logic fabric with dedicated memory blocks, DSP blocks, and embedded transceiver circuitry for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links up to multi-Gbps line rates. The I7 speed grade trades raw speed for the widest operating margin, simplifying timing closure in industrial designs.
Typical applications include high-speed serial interface bridges, telecom backplane line cards, test and measurement equipment with parallel DSP pipelines, military/aerospace signal-processing platforms, and embedded systems that require integrating high-density glue logic next to a CPU. The package and process also make this device attractive for legacy defense and industrial programs that have already qualified Stratix GX tooling.
When designing with this part, validate power integrity carefully: Stratix GX requires multiple supply rails (core, I/O, PLL, transceiver) and bulk decoupling sized to the toggle rate. Use Altera/Intel Quartus II or Quartus Prime to generate the pin assignments, programming file (.sof/.pof), and IBIS models for SI simulation.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet.
חלופות תחליף ישיר עבור EP1SGX25DF672I7 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP1SGX25DF672I7 (אותו גורם צורה וטביעת רגל) — שונים ב Operating Temperature, Package, Process Technology, Lead Free / RoHS, Speed Grade.
EP1SGX25DF672I6N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DF672I6
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DF672I5N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DF672I5
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DF672C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DF672C7ES
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DF672C7
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1SGX25DF672I7 דירוגים מרביים ומאפיינים חשמליים
| Series | Stratix GX |
| Family | Stratix GX (EP1SGX25) |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of Logic Array Blocks (LABs) | 455 |
| Maximum Internal Clock Frequency | 4385.97 MHz |
| Combinatorial CLB Delay (max) | 9.48 ns |
| Process Technology | CMOS 130 nm |
| Nominal Supply Voltage | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Operating Temperature Grade | MILITARY / Industrial |
| Speed Grade | I7 (slowest industrial) |
| Package Code | DF (672-ball FC-FBGA) |
| Number of Terminals | 672 |
| Terminal Form | Ball (BGA) |
| Package Shape | Square |
| סוג הרכבה | Surface Mount (BGA) |
מדריך תצורת פינים של EP1SGX25DF672I7 square
תצורת פינים עבור EP1SGX25DF672I7 (מארזת square). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP1SGX25DF672I7.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP1SGX25DF672I7 מתאים עבור 6 יישוםs: High-Speed Serial Interface Bridges, Telecom Backplane Line Cards, Test and Measurement Instrumentation, Military / Aerospace Signal Processing, Industrial High-Speed Imaging and Video Processing, Embedded Systems Requiring Custom Glue Logic.
High-Speed Serial Interface Bridges
The EP1SGX25DF672I7 is well suited as a high-speed serial bridge between legacy parallel buses and modern serial protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Its 25,660 logic elements provide the resource density needed for protocol state machines, elastic buffers, and link-training logic, while the Stratix GX on-die multi-gigabit transceivers deliver line rates up to 3.125 Gbps per channel without external PHY silicon. In a typical bridge design the FPGA sits between an ASIC/ASSP host and a serial backplane, performing width conversion and protocol translation. The 672-ball DF BGA enables dense routing for both transceiver differential pairs and parallel I/O banks. Compared with general-purpose FPGAs, the integrated transceivers eliminate the cost, power, and board area of external PHYs.
מומלץ
Telecom Backplane Line Cards
Stratix GX FPGAs including the EP1SGX25DF672I7 are widely deployed in telecom backplane line cards where they aggregate and switch multiple SFP/SFP+ optical links into a switching fabric. The 25,660 logic elements handle link-layer processing, traffic shaping, and OAM (Operations, Administration and Maintenance) functions, while the integrated transceivers interface directly to SFP+ cages. The 672-ball DF FC-FBGA exposes enough high-speed I/O for 8 to 12 transceiver channels alongside system-side parallel interfaces. Industrial temperature grade supports outdoor cabinet deployments. The I7 speed grade gives the widest timing margin, simplifying timing closure in systems that aggregate many asynchronous data streams.
מומלץ
Test and Measurement Instrumentation
The EP1SGX25DF672I7 finds application in test and measurement instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers where reconfigurable logic and high-speed serial I/O are simultaneously required. Its 25,660 LE support deep state machines and parallel acquisition paths, while the on-die transceivers drive stimulus and capture pattern data at multi-Gbps line rates. The 1.944 Mbit of embedded RAM buffers acquisition traces before forwarding to a host CPU over PCI Express. Industrial temperature grade allows bench-to-field deployment. The I7 speed grade is acceptable for sampling and pattern generation logic where deterministic latency, not maximum toggle rate, drives instrument accuracy.
מומלץ
Military / Aerospace Signal Processing
With its MILITARY temperature grade and Stratix GX architecture, the EP1SGX25DF672I7 is qualified for defense signal-processing platforms including radar data pre-processing, electronic-countermeasures (ECM), and software-defined-radio baseband blocks. The 25,660 LE plus embedded DSP blocks execute FFTs, modulation/demodulation, and beam-forming math directly in the fabric, while integrated transceivers stream digitized IF/RF data to and from analog front ends. Defense programs that standardized on Stratix GX tooling years ago continue to use this part because re-validation costs are prohibitive. The 672-ball FC-FBGA is ruggedized at the PCB level and supports the long lifecycle and screening programs typical of military platforms.
מומלץ
Industrial High-Speed Imaging and Video Processing
The EP1SGX25DF672I7 is used in industrial imaging systems such as high-speed machine-vision cameras, video mixers, and broadcast video routers where multiple Camera Link or CoaXPress channels converge on a single processing engine. Its 25,660 LE implement pixel pipelines, color-space conversion, and overlay composition, while the on-die transceivers accept serialized Camera Link Full/Deca or CoaXPress inputs without external PHYs. The 1.944 Mbit embedded RAM holds multiple video frames for temporal filtering and frame-rate conversion. Industrial temperature grade supports factory-floor environments with elevated ambient temperatures. The 672-ball DF BGA provides enough I/O for parallel sensor interfaces plus control/status GPIO.
מומלץ
Embedded Systems Requiring Custom Glue Logic
Beyond its high-speed serials, the EP1SGX25DF672I7 serves as a high-density glue-logic FPGA alongside a CPU in embedded platforms such as industrial controllers, avionics LRUs, and medical imaging front ends. Its 25,660 LE implement custom register interfaces, DMA engines, interrupt aggregators, and watchdog logic that would otherwise force redesigns of the host ASIC/ASSP. The 672-ball DF BGA exposes dozens of LVTTL/LVCMOS pairs plus dedicated PLL and clock inputs for fan-out from a system oscillator. Industrial temperature grade supports harsh environments. The I7 speed grade yields the widest timing margin for slow-but-reliable glue logic that is not in any critical timing path.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP1SGX25DF672I7 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP1SGX25DF672I6N | EP1SGX25DF672I6 | EP1SGX25DF672I5N | EP1SGX25DF672C7 | EP1SGX25DF672C7ES |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA (DF) | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | I7 | I6 | I6 | I5 | C7 | C7 ES |
| Temperature Grade | MILITARY / Industrial | Industrial | Industrial | Industrial | Commercial | Commercial (ES) |
| Nominal Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
מבדילים עיקריים
- Slowest industrial speed grade gives widest timing margin (לעומתEP1SGX25DF672I6N (I6 speed grade))
- MILITARY temperature grade extends operating envelope (לעומתEP1SGX25DF672C7 (C7 commercial))
- On-die multi-gigabit transceivers eliminate external PHYs (לעומתCyclone family FPGAs without embedded transceivers)
הערות תכנון
Stratix GX devices require multiple tightly regulated rails (VCCINT 1.5 V core, VCCIO bank-specific, VCCP PLL, VCCAUX auxiliary, plus dedicated transceiver analog VCCE and VCCH rails). Bulk decoupling must follow the Quartus II power-tree reference; insufficient decoupling on VCCE/VCCH causes link instability. For each rail use at least 2x 22 uF bulk + 10x 0.1 uF ceramics at the device balls, plus dedicated pi filters on transceiver rails. Estimated: at 25,660 LE typical utilization 50% and 4 active transceivers, total device power draws 4-6 W.
Although the I7 speed grade is the slowest industrial variant, a fully utilized Stratix GX silicon die can dissipate 5-8 W. The 672-ball FC-FBGA exposes only a small thermal pad footprint; engineers must attach a heatsink or thermal interface material for industrial environments with ambient temperatures above 50 C. Estimated: at 6 W device power, junction-to-ambient theta_JA is typically 8-10 C/W on a JEDEC 4-layer board with 1 in2 thermal via array - design margin must keep Tj below 100 C for industrial-grade reliability.
The 672-ball FC-FBGA requires microvia PCB technology (laser-drilled vias, sequential lamination) and a controlled-impedance stack-up for transceiver differential pairs. Trace length matching for each transceiver pair must be within 150 um to meet multi-Gbps line rates, and DC blocking capacitors on TX/RX pairs must be 0402 size placed within 200 um of the FPGA balls. Use 100-ohm differential impedance for transceiver channels and 50-ohm single-ended for general I/O.
Common pitfalls include: (1) configuring I/O bank VCCIO to an unsupported voltage for the chosen standard - verify against the device handbook I/O standard table; (2) failing to connect unused transceiver RX pins - per datasheet unused RX inputs must be AC-grounded through 100 nF caps; (3) using the EP1SGX10 silicon by mistake - EP1SGX10DF672 parts share the DF 672-ball BGA but have only 10,570 LE and are not drop-in functional equivalents (only footprint-compatible).
מידע על תאימות
RoHS/REACH/lead-free status not directly stated in verified web data; marked unknown per Data Authenticity Rules. AEC-Q100 not applicable for FPGA logic devices.
