EP1SGX25DF672I7 - Stratix GX FPGA 25K LE | Intel / Altera
MPN: EP1SGX25DF672I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 100 | $1495 | $149,500.00 |
| 500 | $1320 | $660,000.00 |
| 1,000 | $1190 | $1,190,000.00 |
Drop-in alternatives for EP1SGX25DF672I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25DF672I6N
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$298 / Unit
View Datasheet →EP1SGX25DF672I6
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View Datasheet →EP1SGX25DF672I5N
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View Datasheet →EP1SGX25DF672I5
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View Datasheet →EP1SGX25DF672C7N
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View Datasheet →EP1SGX25DF672C7ES
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View Datasheet →EP1SGX25DF672C7
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View Datasheet →EP1SGX25DF672I7 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX (EP1SGX25) |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of Logic Array Blocks (LABs) | 455 |
| Maximum Internal Clock Frequency | 4385.97 MHz |
| Combinatorial CLB Delay (max) | 9.48 ns |
| Process Technology | CMOS 130 nm |
| Nominal Supply Voltage | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Operating Temperature Grade | MILITARY / Industrial |
| Speed Grade | I7 (slowest industrial) |
| Package Code | DF (672-ball FC-FBGA) |
| Number of Terminals | 672 |
| Terminal Form | Ball (BGA) |
| Package Shape | Square |
| Mounting Type | Surface Mount (BGA) |
EP1SGX25DF672I7 square Pin Configuration Guide
Complete pinout information for EP1SGX25DF672I7 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF672I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF672I7 is suitable for 6 applications: High-Speed Serial Interface Bridges, Telecom Backplane Line Cards, Test and Measurement Instrumentation, Military / Aerospace Signal Processing, Industrial High-Speed Imaging and Video Processing, Embedded Systems Requiring Custom Glue Logic.
High-Speed Serial Interface Bridges
The EP1SGX25DF672I7 is well suited as a high-speed serial bridge between legacy parallel buses and modern serial protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Its 25,660 logic elements provide the resource density needed for protocol state machines, elastic buffers, and link-training logic, while the Stratix GX on-die multi-gigabit transceivers deliver line rates up to 3.125 Gbps per channel without external PHY silicon. In a typical bridge design the FPGA sits between an ASIC/ASSP host and a serial backplane, performing width conversion and protocol translation. The 672-ball DF BGA enables dense routing for both transceiver differential pairs and parallel I/O banks. Compared with general-purpose FPGAs, the integrated transceivers eliminate the cost, power, and board area of external PHYs.
Recommended
Telecom Backplane Line Cards
Stratix GX FPGAs including the EP1SGX25DF672I7 are widely deployed in telecom backplane line cards where they aggregate and switch multiple SFP/SFP+ optical links into a switching fabric. The 25,660 logic elements handle link-layer processing, traffic shaping, and OAM (Operations, Administration and Maintenance) functions, while the integrated transceivers interface directly to SFP+ cages. The 672-ball DF FC-FBGA exposes enough high-speed I/O for 8 to 12 transceiver channels alongside system-side parallel interfaces. Industrial temperature grade supports outdoor cabinet deployments. The I7 speed grade gives the widest timing margin, simplifying timing closure in systems that aggregate many asynchronous data streams.
Recommended
Test and Measurement Instrumentation
The EP1SGX25DF672I7 finds application in test and measurement instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers where reconfigurable logic and high-speed serial I/O are simultaneously required. Its 25,660 LE support deep state machines and parallel acquisition paths, while the on-die transceivers drive stimulus and capture pattern data at multi-Gbps line rates. The 1.944 Mbit of embedded RAM buffers acquisition traces before forwarding to a host CPU over PCI Express. Industrial temperature grade allows bench-to-field deployment. The I7 speed grade is acceptable for sampling and pattern generation logic where deterministic latency, not maximum toggle rate, drives instrument accuracy.
Recommended
Military / Aerospace Signal Processing
With its MILITARY temperature grade and Stratix GX architecture, the EP1SGX25DF672I7 is qualified for defense signal-processing platforms including radar data pre-processing, electronic-countermeasures (ECM), and software-defined-radio baseband blocks. The 25,660 LE plus embedded DSP blocks execute FFTs, modulation/demodulation, and beam-forming math directly in the fabric, while integrated transceivers stream digitized IF/RF data to and from analog front ends. Defense programs that standardized on Stratix GX tooling years ago continue to use this part because re-validation costs are prohibitive. The 672-ball FC-FBGA is ruggedized at the PCB level and supports the long lifecycle and screening programs typical of military platforms.
Recommended
Industrial High-Speed Imaging and Video Processing
The EP1SGX25DF672I7 is used in industrial imaging systems such as high-speed machine-vision cameras, video mixers, and broadcast video routers where multiple Camera Link or CoaXPress channels converge on a single processing engine. Its 25,660 LE implement pixel pipelines, color-space conversion, and overlay composition, while the on-die transceivers accept serialized Camera Link Full/Deca or CoaXPress inputs without external PHYs. The 1.944 Mbit embedded RAM holds multiple video frames for temporal filtering and frame-rate conversion. Industrial temperature grade supports factory-floor environments with elevated ambient temperatures. The 672-ball DF BGA provides enough I/O for parallel sensor interfaces plus control/status GPIO.
Recommended
Embedded Systems Requiring Custom Glue Logic
Beyond its high-speed serials, the EP1SGX25DF672I7 serves as a high-density glue-logic FPGA alongside a CPU in embedded platforms such as industrial controllers, avionics LRUs, and medical imaging front ends. Its 25,660 LE implement custom register interfaces, DMA engines, interrupt aggregators, and watchdog logic that would otherwise force redesigns of the host ASIC/ASSP. The 672-ball DF BGA exposes dozens of LVTTL/LVCMOS pairs plus dedicated PLL and clock inputs for fan-out from a system oscillator. Industrial temperature grade supports harsh environments. The I7 speed grade yields the widest timing margin for slow-but-reliable glue logic that is not in any critical timing path.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF672I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672I6N | EP1SGX25DF672I6 | EP1SGX25DF672I5N | EP1SGX25DF672C7 | EP1SGX25DF672C7ES |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FC-FBGA (DF) | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same | 672-ball FC-FBGA (DF) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | I7 | I6 | I6 | I5 | C7 | C7 ES |
| Temperature Grade | MILITARY / Industrial | Industrial | Industrial | Industrial | Commercial | Commercial (ES) |
| Nominal Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Slowest industrial speed grade gives widest timing margin (vs EP1SGX25DF672I6N (I6 speed grade))
- MILITARY temperature grade extends operating envelope (vs EP1SGX25DF672C7 (C7 commercial))
- On-die multi-gigabit transceivers eliminate external PHYs (vs Cyclone family FPGAs without embedded transceivers)
Design Notes
Stratix GX devices require multiple tightly regulated rails (VCCINT 1.5 V core, VCCIO bank-specific, VCCP PLL, VCCAUX auxiliary, plus dedicated transceiver analog VCCE and VCCH rails). Bulk decoupling must follow the Quartus II power-tree reference; insufficient decoupling on VCCE/VCCH causes link instability. For each rail use at least 2x 22 uF bulk + 10x 0.1 uF ceramics at the device balls, plus dedicated pi filters on transceiver rails. Estimated: at 25,660 LE typical utilization 50% and 4 active transceivers, total device power draws 4-6 W.
Although the I7 speed grade is the slowest industrial variant, a fully utilized Stratix GX silicon die can dissipate 5-8 W. The 672-ball FC-FBGA exposes only a small thermal pad footprint; engineers must attach a heatsink or thermal interface material for industrial environments with ambient temperatures above 50 C. Estimated: at 6 W device power, junction-to-ambient theta_JA is typically 8-10 C/W on a JEDEC 4-layer board with 1 in2 thermal via array - design margin must keep Tj below 100 C for industrial-grade reliability.
The 672-ball FC-FBGA requires microvia PCB technology (laser-drilled vias, sequential lamination) and a controlled-impedance stack-up for transceiver differential pairs. Trace length matching for each transceiver pair must be within 150 um to meet multi-Gbps line rates, and DC blocking capacitors on TX/RX pairs must be 0402 size placed within 200 um of the FPGA balls. Use 100-ohm differential impedance for transceiver channels and 50-ohm single-ended for general I/O.
Common pitfalls include: (1) configuring I/O bank VCCIO to an unsupported voltage for the chosen standard - verify against the device handbook I/O standard table; (2) failing to connect unused transceiver RX pins - per datasheet unused RX inputs must be AC-grounded through 100 nF caps; (3) using the EP1SGX10 silicon by mistake - EP1SGX10DF672 parts share the DF 672-ball BGA but have only 10,570 LE and are not drop-in functional equivalents (only footprint-compatible).
Compliance Information
RoHS/REACH/lead-free status not directly stated in verified web data; marked unknown per Data Authenticity Rules. AEC-Q100 not applicable for FPGA logic devices.
