EP3SE110F780I3 - 107.5K LE Stratix III E FPGA, 488 I/O | Intel
MPN: EP3SE110F780I3 ✓ פעילEP3SE110F780I3 סקירה
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital design hierarchy between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and reconfigurability for prototyping, low-volume production, and time-to-market-critical designs. The Stratix III E family is positioned in the high-performance segment, originally engineered for ASIC prototyping, high-throughput signal processing, and high-bandwidth telecommunications infrastructure.
Key features of the EP3SE110F780I3 include 107500 logic elements, 4 partitions of memory totaling 8936448 bits, a maximum operating frequency of 500 MHz, 488 dedicated user I/Os, and integrated high-speed serial transceiver capability. The device is housed in a 780-ball fine-pitch FC-FBGA (Fine-pitch Chip-scale Ball Grid Array, also called FineLine BGA) package and supports vertical migration within the same package footprint to other Stratix III densities.
Architecturally, the Stratix III E device combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and up to 12.5 Gbps transceivers (model-dependent). It uses a 1.1 V core supply on a 65 nm process, giving the EP3SE110F780I3 a favorable logic-element-per-watt ratio for its era. Configuration is supported via JTAG, Active Serial, Active Parallel, Fast Passive Parallel, and Passive Serial modes through the dedicated configuration pins.
Typical applications include ASIC prototyping, high-performance DSP pipelines, broadcast video processing, high-speed serial backplane interfacing, military and aerospace signal processing, and high-end test and measurement equipment. When designing with the EP3SE110F780I3, ensure the Quartus II design tool version supports this specific device ID and observe the recommended power sequencing order across VCC, VCCPD, VCCPGM, and transceiver supply rails.
חלופות תחליף ישיר עבור EP3SE110F780I3 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP3SE110F780I3 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
EP3SE110F780I2N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE110F780C4N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE110F780C3N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE110F780C3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SL110F780I3N
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
EP3CLS200F780I7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE110F780I3 דירוגים מרביים ומאפיינים חשמליים
| Family | Stratix III E |
| Logic Elements | 107500 |
| Number of LABs/CLBs | 4300 |
| Number of Logic Elements/Cells | 107500 |
| Total RAM Bits | 8936448 |
| Number of I/O | 488 |
| Voltage - Supply | 1.1 V core |
| Process Technology | 65 nm |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | -40C to +100C (industrial) |
| מארז / Case | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | 780-FBGA |
| סטטוס RoHS | unknown |
| רמת רגישות ללחות (MSL) | unknown |
| Grade | Industrial |
מדריך תצורת פינים של EP3SE110F780I3 780-fbga
תצורת פינים עבור EP3SE110F780I3 (מארזת 780-fbga). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP3SE110F780I3.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP3SE110F780I3 מתאים עבור 6 יישוםs: ASIC Prototyping, High-Performance DSP Pipelines, Broadcast Video Processing, High-Speed Serial Backplane Interfaces, Military & Aerospace Signal Processing, Test & Measurement Instrumentation.
ASIC Prototyping
The EP3SE110F780I3's 107500 logic elements and 8.9 Mbits of embedded memory make it a strong fit for ASIC prototyping where engineers need to validate register-transfer level (RTL) designs before tap-out. Per Stratix III datasheet benchmarks, the device delivers multi-MHz performance on datapath-heavy ASIC blocks and supports rapid design iteration through Quartus II incremental compilation. The 488 I/O pins accommodate wide bus interfaces to the target ASIC's external memory and peripherals, and the 780-FBGA footprint provides generous escape routing for high-pin-count ASIC designs. Trade-off: the E family consumes more static power than the L variant, so a thermal budget is required for high-utilization designs.
מומלץ
High-Performance DSP Pipelines
The Stratix III E family's dedicated DSP blocks support 18x18 and 36x36 multipliers with high parallelism, which aligns with the EP3SE110F780I3's role in FFT, FIR, and matrix-multiply pipelines. Per the Stratix III datasheet, each DSP block can run above 300 MHz, and the device's 8.9 Mbits of TriMatrix memory aggregate bandwidth to feed multiple DSP blocks per clock. The 488 user I/Os provide ample LVDS pairs for ADC/DAC interfacing, and the 1.1 V core keeps dynamic power manageable. Engineers should budget for 65 nm leakage current at high junction temperatures and use PowerPlay early-estimation tools.
מומלץ
Broadcast Video Processing
Broadcast video systems such as SD/HD/3G-SDI routers, frame synchronizers, and color-space converters benefit from the EP3SE110F780I3's 107500 logic elements and 8.9 Mbits of on-chip buffering. Per Stratix III documentation, the device supports SDI PHY interfaces through dedicated LVDS-capable I/O and provides ample internal line-store memory to handle horizontal/vertical blanking intervals. The 780-FBGA package's 488 I/Os accommodate multiple SDI data streams plus GPIO for control and housekeeping. Designers should verify that the chosen speed grade (I3 vs I4) meets the pixel-clock rate of the highest-resolution stream being processed.
מומלץ
High-Speed Serial Backplane Interfaces
The Stratix III E family supports multi-gigabit transceivers suitable for serial backplane links such as Aurora, PCIe Gen1/Gen2, Serial RapidIO, and proprietary SERDES protocols. The EP3SE110F780I3's transceiver count and 1.1 V core combine to deliver line rates up to several Gbps per channel while sustaining signal integrity over backplane channels. The 780-FBGA package exposes enough transceiver pins for 4-12 lanes depending on channel-bonding configuration. Engineers must apply reference-clock jitter budgets and follow Intel's Stratix III transceiver PCB layout guidelines for 100-ohm differential routing.
מומלץ
Military & Aerospace Signal Processing
The EP3SE110F780I3 industrial temperature grade (-40C to +100C) and high logic density position it for signal-processing payloads in military and aerospace platforms such as radar front-ends, electronic warfare subsystems, and telemetry recorders. Per the Stratix III datasheet, the device's TriMatrix memory supports large windowing buffers for radar pulse compression, and its 488 I/Os accommodate LVDS connections to RF ADCs and DACs. Designers in this space typically pair the FPGA with industrial-grade SRAM, flash, and voltage regulators qualified to MIL-STD or DO-160. Long-term obsolescence management is critical because Stratix III is not a current-generation part.
מומלץ
Test & Measurement Instrumentation
High-end test and measurement equipment - logic analyzers, protocol testers, and arbitrary waveform generators - uses the EP3SE110F780I3's 107500 logic elements to implement deep acquisition memory, parallel stimulus generation, and protocol decoding in a single device. Per Stratix III documentation, the 8.9 Mbits of TriMatrix memory serve as deep sample buffers, while the 488 I/Os support multi-channel acquisition at rates up to LVDS-grade speeds. The 780-FBGA package offers thermal headroom for sustained full-load operation. Trade-off: design teams should plan a clear migration path to newer FPGA families since Stratix III is no longer a current-generation device.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP3SE110F780I3 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP3SE110F780I2N | EP3SE110F780C4N | EP3SE110F780C3N | EP3SE110F780C3 | EP3SL110F780I3N | EP3CLS200F780I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (FineLine BGA) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L (low power) | Cyclone III LS |
| Logic Elements | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 | 198464 |
| Embedded Memory (bits) | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 7304832 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 429 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Industrial | Industrial |
| Speed Grade | I3 | I2 (slower) | C4 (faster commercial) | C3 (commercial) | C3 (commercial) | I3 (low-power family) | I7 |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.2 V |
מבדילים עיקריים
- Identical 780-FBGA footprint enables vertical migration across densities (לעומתEP3SE110F780C3N)
- Higher DSP and transceiver count than the L variant (לעומתEP3SL110F780I3N)
- 8.9 Mbits of embedded memory via TriMatrix architecture (לעומתEP3CLS200F780I7N)
- Slower speed grade enables lower dynamic power (לעומתEP3SE110F780C4N)
הערות תכנון
The Stratix III E family has multiple power rails: VCC (1.1 V core), VCCPD (3.0/2.5 V pre-driver), VCCPGM (1.8/2.5/3.0 V configuration), and per-bank VCCIO. Per Intel's Stratix III device family datasheet, power sequencing must hold VCC before VCCPD to prevent I/O latch-up. Estimated: at full 107500-LE utilization with 488 LVDS pairs toggling, total power may reach 8-12 W; use a 4-layer PCB with at least 1 oz copper and a synchronous buck regulator per rail.
The 780-FBGA package has a thermal resistance (theta_JA) of approximately 15-20 C/W with 4-layer PCB and sufficient thermal vias under the package center pad, per typical Stratix III FBGA thermal data. Estimated: at 10 W total dissipation, junction temperature rise is 150-200C above ambient, requiring active airflow or a heatsink for industrial temperature operation. Use the Quartus II PowerPlay Power Analyzer tool for early thermal budgeting.
PCB layout for the 780-FBGA requires microvia technology or 0.4 mm pitch escape routing. Per Stratix III hardware design guidelines, BGA breakout should use via-in-pad with filled-and-capped vias for clean return paths, and the high-speed transceiver lanes must maintain 100-ohm differential impedance over the entire route. Decoupling capacitors must be placed within 100 mils of every VCC/VCCPD/VCCPGM ball pair.
Common Stratix III design pitfalls include (1) forgetting to configure MSEL[3:0] pins correctly for the desired configuration mode, (2) using the wrong JTAG chain ordering when multiple devices share TCK/TMS, (3) under-estimating configuration time for large bitstreams (EP3SE110 can exceed 25 Mbits, requiring Active Parallel flash for fast boot), and (4) ignoring AS/PS configuration mode strap pins at power-up. Reference the Stratix III Configuration Handbook for the complete checklist.
מידע על תאימות
RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the verified distributor data; designers should confirm compliance with the manufacturer datasheet or contact Intel/Altera sales for the specific lot.