EP3SE80F1152C4L - Stratix III E FPGA 80K LE, 1152-FCBGA | Altera
MPN: EP3SE80F1152C4L ✗ סוף ייצורEP3SE80F1152C4L סקירה
An FPGA (Field Programmable Gate Array) is a programmable logic class of integrated circuit that allows designers to implement arbitrary digital logic through configuration of an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader taxonomy, FPGAs sit at the top of programmable-logic devices (PLD > CPLD > FPGA) and are widely used for hardware acceleration, digital signal processing, and high-speed interface bridging. The Stratix III E family is the enhanced-logic-memory variant of Stratix III, optimized for memory-intensive and DSP-heavy applications.
Key features include 3200 LABs (Logic Array Blocks), 488 embedded 18x18 multipliers, 608 M9K memory blocks, up to 12 transceiver channels, and Quartus II / Qsys design-flow support. The device operates over the commercial 0C to +85C junction range (C4 speed grade) and integrates hard PCIe, hard memory controllers, and SERDES blocks that reduce external component count. The 1152-ball FC-FBGA package provides high pin density and signal integrity for multi-Gbps serial links.
Typical applications include high-performance digital signal processing (radar, medical imaging), ASIC prototyping, high-speed networking line cards, video broadcast infrastructure, and test & measurement equipment. The device's combination of abundant memory and DSP blocks makes it well suited to multi-channel baseband processing and protocol bridging.
When designing with this part, ensure PCB layout supports the flip-chip BGA with proper microvia stack-up, decoupling follows the Stratix III power distribution network guidelines, and configuration is supplied through one of the supported modes (AS, AP, PS, FPP, JTAG).
חלופות תחליף ישיר עבור EP3SE80F1152C4L — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP3SE80F1152C4L (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
EP3SE80F1152C4
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE80F1152C3N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE80F1152C3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE80F1152C2N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE80F1152C2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE110F1152C4L
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE80F1152C4L דירוגים מרביים ומאפיינים חשמליים
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Total Memory Bits | 6,843,392 bits |
| Number of LABs | 3200 |
| User I/Os | 744 |
| Operating Frequency (max) | 375 MHz |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| מארז | 1152-BBGA, FC-FBGA |
| סוג הרכבה | Surface Mount |
| Speed Grade | C4 |
| Temperature Grade | Commercial (0C to +85C) |
מדריך תצורת פינים של EP3SE80F1152C4L 1152-bbga, fc-fbga
תצורת פינים עבור EP3SE80F1152C4L (מארזת 1152-bbga, fc-fbga). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP3SE80F1152C4L.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP3SE80F1152C4L מתאים עבור 6 יישוםs: High-Performance Digital Signal Processing, ASIC Prototyping and Verification, High-Speed Networking Infrastructure, Video Broadcast and Imaging Systems, Test and Measurement Equipment, Military and Aerospace Avionics.
High-Performance Digital Signal Processing
The EP3SE80F1152C4L is well suited for multi-channel DSP workloads such as radar baseband processing, software-defined radio front-ends, and medical imaging reconstruction. Its 488 embedded 18x18 multipliers combined with 6,843,392 bits of on-chip memory enable FIR/FFT pipelines that previously required multiple DSP chips. With up to 12 high-speed transceiver channels and 744 user I/Os, the device can ingest and process wide-bandwidth data streams while exporting results through DDR3/QDR memory controllers.
מומלץ
ASIC Prototyping and Verification
With 80,000 logic elements and 6.8 Mbits of memory, the EP3SE80F1152C4L provides ample capacity to prototype mid-complexity ASICs before tape-out. The Quartus II design flow supports incremental compilation and partitioning, allowing multiple engineers to develop and integrate IP blocks in parallel. The 1152-ball FCBGA package supports high-performance I/O for connecting to standard ASIC validation environments.
מומלץ
High-Speed Networking Infrastructure
The EP3SE80F1152C4L's integrated multi-gigabit transceivers and hard PCIe/PCI Express Gen1/Gen2 endpoints make it ideal for high-speed line cards, protocol bridges, and network appliances. The 744 user I/Os support multiple SFP+/10 GbE interfaces plus DDR3 external memory for packet buffering, while 488 DSP blocks accelerate packet classification and traffic management algorithms at line rate.
מומלץ
Video Broadcast and Imaging Systems
The EP3SE80F1152C4L is widely used in broadcast video routers, format converters, and multi-channel image processing systems. Its abundant memory bandwidth and 488 multipliers support real-time 4K/8K video processing, color-space conversion, and compression pipelines. The DDR3 controller hard IP eliminates the need for external memory controller logic, simplifying the design while delivering deterministic memory access latency for frame buffers.
מומלץ
Test and Measurement Equipment
Engineers use the EP3SE80F1152C4L in high-speed logic analyzers, protocol testers, and arbitrary waveform generators where flexible I/O and DSP performance are both required. The 80K logic elements implement custom protocol stacks while 488 multipliers accelerate signal conditioning math. The 1152-ball FCBGA package offers extensive high-speed serial connectivity for parallel multi-channel test setups.
מומלץ
Military and Aerospace Avionics
Although the C4L speed grade is commercial temperature, the underlying Stratix III E silicon platform is also offered in industrial and military temperature grades with the same 1152-ball FCBGA footprint. Avionics subsystems use the device for radar signal processing, electronic warfare, and secure communications. Designers should verify the appropriate temperature-grade variant from the Altera datasheet ordering information for flight-qualified applications.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP3SE80F1152C4L — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP3SE80F1152C4 | EP3SE80F1152C3N | EP3SE80F1152C3 | EP3SE80F1152C2N | EP3SE80F1152C2 | EP3SE110F1152C4L |
|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 |
| Speed Grade | C4L | C4 | C3 | C3 | C2 | C2 | C4L |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
מבדילים עיקריים
- Highest-density pin-compatible sibling (לעומתEP3SE80F1152C4N)
- Direct upsize option in identical package (לעומתEP3SE110F1152C4L)
- Multiple speed-grade options in same package (לעומתEP3SE80F1152C3N)
הערות תכנון
The 1152-ball FC-FBGA package requires a high-density PCB stack-up with microvia (laser-drilled) technology to fan out signals from the inner ball grid. Designers should follow the Altera Stratix III device family pin connection guidelines and use at least 8 PCB layers with dedicated power and ground planes to ensure signal integrity for multi-Gbps SERDES channels.
Stratix III E FPGAs require multiple supply rails (VCCINT, VCCA, VCCIO, VCCD_PLL, VCCPT, etc.) with strict sequencing and ramp-rate requirements per the Stratix III family datasheet. Estimated: at 80K LE utilization, the device can draw 5-15 W depending on toggle rate. A multi-phase VRM solution is recommended to meet transient response, and decoupling must follow the Altera reference design PDN guidelines within 100 mils of each ball.
The 1152-ball FC-FBGA package exposes a thermal pad that must be soldered to the PCB for heat dissipation. Designers should provide sufficient copper thermal vias (estimated 25-40 vias in the thermal pad array, 0.3 mm drill) to the opposite PCB layer and possibly use a heatsink for high-utilization designs where junction temperature could exceed 85C. Thermal resistance theta_JA depends on PCB stack-up and airflow.
Multi-gigabit transceiver channels require controlled-impedance routing (100 ohm differential for SERDES, 50 ohm single-ended for general-purpose I/O) and length matching within tight tolerances. DDR3 interfaces need read/write deskew calibration in the Quartus II IP core. Signal integrity simulations with the Altera Early Power Estimator and IBIS models are recommended before PCB fabrication.
מידע על תאימות
Compliance data not present in verified web data; refer to Altera/Intel FPGA product declaration for the specific date code. AEC-Q100 is not applicable to FPGAs.
