EP3SE80F1152C4L - Stratix III E FPGA 80K LE, 1152-FCBGA | Altera
부품 번호: EP3SE80F1152C4L ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2938.24 | $2,938.24 |
| 10 | $2820.5 | $28,205.00 |
| 100 | $2640 | $264,000.00 |
| 500 | $2450 | $1,225,000.00 |
| 1,000 | $2280 | $2,280,000.00 |
EP3SE80F1152C4L 개요
An FPGA (Field Programmable Gate Array) is a programmable logic class of integrated circuit that allows designers to implement arbitrary digital logic through configuration of an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader taxonomy, FPGAs sit at the top of programmable-logic devices (PLD > CPLD > FPGA) and are widely used for hardware acceleration, digital signal processing, and high-speed interface bridging. The Stratix III E family is the enhanced-logic-memory variant of Stratix III, optimized for memory-intensive and DSP-heavy applications.
Key features include 3200 LABs (Logic Array Blocks), 488 embedded 18x18 multipliers, 608 M9K memory blocks, up to 12 transceiver channels, and Quartus II / Qsys design-flow support. The device operates over the commercial 0C to +85C junction range (C4 speed grade) and integrates hard PCIe, hard memory controllers, and SERDES blocks that reduce external component count. The 1152-ball FC-FBGA package provides high pin density and signal integrity for multi-Gbps serial links.
Typical applications include high-performance digital signal processing (radar, medical imaging), ASIC prototyping, high-speed networking line cards, video broadcast infrastructure, and test & measurement equipment. The device's combination of abundant memory and DSP blocks makes it well suited to multi-channel baseband processing and protocol bridging.
When designing with this part, ensure PCB layout supports the flip-chip BGA with proper microvia stack-up, decoupling follows the Stratix III power distribution network guidelines, and configuration is supplied through one of the supported modes (AS, AP, PS, FPP, JTAG).
드롭인 대체품: EP3SE80F1152C4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE80F1152C4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE80F1152C4
✅ 드롭인✓ 재고 있음
$895 / 개
데이터시트 보기 →EP3SE80F1152C3N
✅ 드롭인✓ 재고 있음
$1690 / 개
데이터시트 보기 →EP3SE80F1152C3
✅ 드롭인✓ 재고 있음
$1880 / 개
데이터시트 보기 →EP3SE80F1152C2N
✅ 드롭인✓ 재고 있음
$2685 / 개
데이터시트 보기 →EP3SE80F1152C2
✅ 드롭인✓ 재고 있음
$1325 / 개
데이터시트 보기 →EP3SE110F1152C4L
✅ 드롭인✓ 재고 있음
$3372.13 / 개
데이터시트 보기 →EP3SE80F1152C4L 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Total Memory Bits | 6,843,392 bits |
| Number of LABs | 3200 |
| User I/Os | 744 |
| Operating Frequency (max) | 375 MHz |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1152-BBGA, FC-FBGA |
| 실장 유형 | Surface Mount |
| Speed Grade | C4 |
| Temperature Grade | Commercial (0C to +85C) |
EP3SE80F1152C4L 1152-bbga, fc-fbga 핀 구성 가이드
EP3SE80F1152C4L(1152-bbga, fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE80F1152C4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE80F1152C4L 적합 용도: 6 애플리케이션s: High-Performance Digital Signal Processing, ASIC Prototyping and Verification, High-Speed Networking Infrastructure, Video Broadcast and Imaging Systems, Test and Measurement Equipment, Military and Aerospace Avionics.
High-Performance Digital Signal Processing
The EP3SE80F1152C4L is well suited for multi-channel DSP workloads such as radar baseband processing, software-defined radio front-ends, and medical imaging reconstruction. Its 488 embedded 18x18 multipliers combined with 6,843,392 bits of on-chip memory enable FIR/FFT pipelines that previously required multiple DSP chips. With up to 12 high-speed transceiver channels and 744 user I/Os, the device can ingest and process wide-bandwidth data streams while exporting results through DDR3/QDR memory controllers.
추천
ASIC Prototyping and Verification
With 80,000 logic elements and 6.8 Mbits of memory, the EP3SE80F1152C4L provides ample capacity to prototype mid-complexity ASICs before tape-out. The Quartus II design flow supports incremental compilation and partitioning, allowing multiple engineers to develop and integrate IP blocks in parallel. The 1152-ball FCBGA package supports high-performance I/O for connecting to standard ASIC validation environments.
추천
High-Speed Networking Infrastructure
The EP3SE80F1152C4L's integrated multi-gigabit transceivers and hard PCIe/PCI Express Gen1/Gen2 endpoints make it ideal for high-speed line cards, protocol bridges, and network appliances. The 744 user I/Os support multiple SFP+/10 GbE interfaces plus DDR3 external memory for packet buffering, while 488 DSP blocks accelerate packet classification and traffic management algorithms at line rate.
추천
Video Broadcast and Imaging Systems
The EP3SE80F1152C4L is widely used in broadcast video routers, format converters, and multi-channel image processing systems. Its abundant memory bandwidth and 488 multipliers support real-time 4K/8K video processing, color-space conversion, and compression pipelines. The DDR3 controller hard IP eliminates the need for external memory controller logic, simplifying the design while delivering deterministic memory access latency for frame buffers.
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Test and Measurement Equipment
Engineers use the EP3SE80F1152C4L in high-speed logic analyzers, protocol testers, and arbitrary waveform generators where flexible I/O and DSP performance are both required. The 80K logic elements implement custom protocol stacks while 488 multipliers accelerate signal conditioning math. The 1152-ball FCBGA package offers extensive high-speed serial connectivity for parallel multi-channel test setups.
추천
Military and Aerospace Avionics
Although the C4L speed grade is commercial temperature, the underlying Stratix III E silicon platform is also offered in industrial and military temperature grades with the same 1152-ball FCBGA footprint. Avionics subsystems use the device for radar signal processing, electronic warfare, and secure communications. Designers should verify the appropriate temperature-grade variant from the Altera datasheet ordering information for flight-qualified applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE80F1152C4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE80F1152C4 | EP3SE80F1152C3N | EP3SE80F1152C3 | EP3SE80F1152C2N | EP3SE80F1152C2 | EP3SE110F1152C4L |
|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 |
| Speed Grade | C4L | C4 | C3 | C3 | C2 | C2 | C4L |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest-density pin-compatible sibling (vs EP3SE80F1152C4N)
- Direct upsize option in identical package (vs EP3SE110F1152C4L)
- Multiple speed-grade options in same package (vs EP3SE80F1152C3N)
설계 노트
The 1152-ball FC-FBGA package requires a high-density PCB stack-up with microvia (laser-drilled) technology to fan out signals from the inner ball grid. Designers should follow the Altera Stratix III device family pin connection guidelines and use at least 8 PCB layers with dedicated power and ground planes to ensure signal integrity for multi-Gbps SERDES channels.
Stratix III E FPGAs require multiple supply rails (VCCINT, VCCA, VCCIO, VCCD_PLL, VCCPT, etc.) with strict sequencing and ramp-rate requirements per the Stratix III family datasheet. Estimated: at 80K LE utilization, the device can draw 5-15 W depending on toggle rate. A multi-phase VRM solution is recommended to meet transient response, and decoupling must follow the Altera reference design PDN guidelines within 100 mils of each ball.
The 1152-ball FC-FBGA package exposes a thermal pad that must be soldered to the PCB for heat dissipation. Designers should provide sufficient copper thermal vias (estimated 25-40 vias in the thermal pad array, 0.3 mm drill) to the opposite PCB layer and possibly use a heatsink for high-utilization designs where junction temperature could exceed 85C. Thermal resistance theta_JA depends on PCB stack-up and airflow.
Multi-gigabit transceiver channels require controlled-impedance routing (100 ohm differential for SERDES, 50 ohm single-ended for general-purpose I/O) and length matching within tight tolerances. DDR3 interfaces need read/write deskew calibration in the Quartus II IP core. Signal integrity simulations with the Altera Early Power Estimator and IBIS models are recommended before PCB fabrication.
규정 준수 정보
Compliance data not present in verified web data; refer to Altera/Intel FPGA product declaration for the specific date code. AEC-Q100 is not applicable to FPGAs.
