EP3SE80F1152C4L - Stratix III E FPGA 80K LE, 1152-FCBGA | Altera
部品番号: EP3SE80F1152C4L ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2938.24 | $2,938.24 |
| 10 | $2820.5 | $28,205.00 |
| 100 | $2640 | $264,000.00 |
| 500 | $2450 | $1,225,000.00 |
| 1,000 | $2280 | $2,280,000.00 |
EP3SE80F1152C4L 概要
An FPGA (Field Programmable Gate Array) is a programmable logic class of integrated circuit that allows designers to implement arbitrary digital logic through configuration of an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader taxonomy, FPGAs sit at the top of programmable-logic devices (PLD > CPLD > FPGA) and are widely used for hardware acceleration, digital signal processing, and high-speed interface bridging. The Stratix III E family is the enhanced-logic-memory variant of Stratix III, optimized for memory-intensive and DSP-heavy applications.
Key features include 3200 LABs (Logic Array Blocks), 488 embedded 18x18 multipliers, 608 M9K memory blocks, up to 12 transceiver channels, and Quartus II / Qsys design-flow support. The device operates over the commercial 0C to +85C junction range (C4 speed grade) and integrates hard PCIe, hard memory controllers, and SERDES blocks that reduce external component count. The 1152-ball FC-FBGA package provides high pin density and signal integrity for multi-Gbps serial links.
Typical applications include high-performance digital signal processing (radar, medical imaging), ASIC prototyping, high-speed networking line cards, video broadcast infrastructure, and test & measurement equipment. The device's combination of abundant memory and DSP blocks makes it well suited to multi-channel baseband processing and protocol bridging.
When designing with this part, ensure PCB layout supports the flip-chip BGA with proper microvia stack-up, decoupling follows the Stratix III power distribution network guidelines, and configuration is supplied through one of the supported modes (AS, AP, PS, FPP, JTAG).
ドロップイン代替品: EP3SE80F1152C4L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SE80F1152C4L （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SE80F1152C4
✅ ドロップイン✓ 在庫あり
$895 / 個
データシートを見る →EP3SE80F1152C3N
✅ ドロップイン✓ 在庫あり
$1690 / 個
データシートを見る →EP3SE80F1152C3
✅ ドロップイン✓ 在庫あり
$1880 / 個
データシートを見る →EP3SE80F1152C2N
✅ ドロップイン✓ 在庫あり
$2685 / 個
データシートを見る →EP3SE80F1152C2
✅ ドロップイン✓ 在庫あり
$1325 / 個
データシートを見る →EP3SE110F1152C4L
✅ ドロップイン✓ 在庫あり
$3372.13 / 個
データシートを見る →EP3SE80F1152C4L 最大定格＆電気的特性
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Total Memory Bits | 6,843,392 bits |
| Number of LABs | 3200 |
| User I/Os | 744 |
| Operating Frequency (max) | 375 MHz |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| パッケージ | 1152-BBGA, FC-FBGA |
| 実装タイプ | Surface Mount |
| Speed Grade | C4 |
| Temperature Grade | Commercial (0C to +85C) |
EP3SE80F1152C4L 1152-bbga, fc-fbga ピン配置ガイド
EP3SE80F1152C4L (1152-bbga, fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SE80F1152C4L.
詳細は データシート をご参照ください。
主な用途
EP3SE80F1152C4L の用途: 6 件s: High-Performance Digital Signal Processing, ASIC Prototyping and Verification, High-Speed Networking Infrastructure, Video Broadcast and Imaging Systems, Test and Measurement Equipment, Military and Aerospace Avionics.
High-Performance Digital Signal Processing
The EP3SE80F1152C4L is well suited for multi-channel DSP workloads such as radar baseband processing, software-defined radio front-ends, and medical imaging reconstruction. Its 488 embedded 18x18 multipliers combined with 6,843,392 bits of on-chip memory enable FIR/FFT pipelines that previously required multiple DSP chips. With up to 12 high-speed transceiver channels and 744 user I/Os, the device can ingest and process wide-bandwidth data streams while exporting results through DDR3/QDR memory controllers.
おすすめ
ASIC Prototyping and Verification
With 80,000 logic elements and 6.8 Mbits of memory, the EP3SE80F1152C4L provides ample capacity to prototype mid-complexity ASICs before tape-out. The Quartus II design flow supports incremental compilation and partitioning, allowing multiple engineers to develop and integrate IP blocks in parallel. The 1152-ball FCBGA package supports high-performance I/O for connecting to standard ASIC validation environments.
おすすめ
High-Speed Networking Infrastructure
The EP3SE80F1152C4L's integrated multi-gigabit transceivers and hard PCIe/PCI Express Gen1/Gen2 endpoints make it ideal for high-speed line cards, protocol bridges, and network appliances. The 744 user I/Os support multiple SFP+/10 GbE interfaces plus DDR3 external memory for packet buffering, while 488 DSP blocks accelerate packet classification and traffic management algorithms at line rate.
おすすめ
Video Broadcast and Imaging Systems
The EP3SE80F1152C4L is widely used in broadcast video routers, format converters, and multi-channel image processing systems. Its abundant memory bandwidth and 488 multipliers support real-time 4K/8K video processing, color-space conversion, and compression pipelines. The DDR3 controller hard IP eliminates the need for external memory controller logic, simplifying the design while delivering deterministic memory access latency for frame buffers.
おすすめ
Test and Measurement Equipment
Engineers use the EP3SE80F1152C4L in high-speed logic analyzers, protocol testers, and arbitrary waveform generators where flexible I/O and DSP performance are both required. The 80K logic elements implement custom protocol stacks while 488 multipliers accelerate signal conditioning math. The 1152-ball FCBGA package offers extensive high-speed serial connectivity for parallel multi-channel test setups.
おすすめ
Military and Aerospace Avionics
Although the C4L speed grade is commercial temperature, the underlying Stratix III E silicon platform is also offered in industrial and military temperature grades with the same 1152-ball FCBGA footprint. Avionics subsystems use the device for radar signal processing, electronic warfare, and secure communications. Designers should verify the appropriate temperature-grade variant from the Altera datasheet ordering information for flight-qualified applications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SE80F1152C4L — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SE80F1152C4 | EP3SE80F1152C3N | EP3SE80F1152C3 | EP3SE80F1152C2N | EP3SE80F1152C2 | EP3SE110F1152C4L |
|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 |
| Speed Grade | C4L | C4 | C3 | C3 | C2 | C2 | C4L |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- Highest-density pin-compatible sibling （vs EP3SE80F1152C4N)
- Direct upsize option in identical package （vs EP3SE110F1152C4L)
- Multiple speed-grade options in same package （vs EP3SE80F1152C3N)
設計ノート
The 1152-ball FC-FBGA package requires a high-density PCB stack-up with microvia (laser-drilled) technology to fan out signals from the inner ball grid. Designers should follow the Altera Stratix III device family pin connection guidelines and use at least 8 PCB layers with dedicated power and ground planes to ensure signal integrity for multi-Gbps SERDES channels.
Stratix III E FPGAs require multiple supply rails (VCCINT, VCCA, VCCIO, VCCD_PLL, VCCPT, etc.) with strict sequencing and ramp-rate requirements per the Stratix III family datasheet. Estimated: at 80K LE utilization, the device can draw 5-15 W depending on toggle rate. A multi-phase VRM solution is recommended to meet transient response, and decoupling must follow the Altera reference design PDN guidelines within 100 mils of each ball.
The 1152-ball FC-FBGA package exposes a thermal pad that must be soldered to the PCB for heat dissipation. Designers should provide sufficient copper thermal vias (estimated 25-40 vias in the thermal pad array, 0.3 mm drill) to the opposite PCB layer and possibly use a heatsink for high-utilization designs where junction temperature could exceed 85C. Thermal resistance theta_JA depends on PCB stack-up and airflow.
Multi-gigabit transceiver channels require controlled-impedance routing (100 ohm differential for SERDES, 50 ohm single-ended for general-purpose I/O) and length matching within tight tolerances. DDR3 interfaces need read/write deskew calibration in the Quartus II IP core. Signal integrity simulations with the Altera Early Power Estimator and IBIS models are recommended before PCB fabrication.
コンプライアンス情報
Compliance data not present in verified web data; refer to Altera/Intel FPGA product declaration for the specific date code. AEC-Q100 is not applicable to FPGAs.
