EP4CE15F23C8N - Cyclone IV E FPGA 15K LEs 484-BGA | Intel
MPN: EP4CE15F23C8N ✓ פעילEP4CE15F23C8N סקירה
A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic, interconnect, and I/O can be reconfigured after manufacturing by loading a user-defined bitstream, distinguishing it from fixed-function ASICs. FPGAs sit at the top of the programmable-logic hierarchy (FPGA > CPLD > PAL/GAL > discrete logic) and excel at parallel DSP, high-speed serial bridging, and glue-logic consolidation. The Cyclone IV E family specifically targets high-volume, power-conscious applications where 60 nm process efficiency and abundant on-chip memory offer the lowest total cost of ownership in the low-density FPGA segment.
Key features include 15,408 logic elements, 516,096 bits (63 KBytes) of embedded RAM organized in M9K blocks, 343 dedicated 18x18 multipliers, four general-purpose PLLs, and up to 343 user I/O pins. The device supports LVDS, SSTL, and LVCMOS I/O standards and integrates hard IP for PCI Express Gen1, external memory interfaces (DDR/DDR2/QDRII), and serial configuration via AS, PS, JTAG, and FPP modes.
The Cyclone IV E series uses a 60 nm low-leakage CMOS process with a 1.0 V core voltage (VCCINT) and 2.5 V/3.3 V-tolerant I/O banks (VCCIO). This 1.0 V core reduces dynamic power by up to 25% versus the prior Cyclone III generation while preserving timing closure on existing reference designs. Designers typically pair the EP4CE15F23C8N with a separate external configuration flash, which loads the bitstream at power-on through the dedicated AS configuration port.
Typical applications include industrial motor control, video processing pipelines, telecom line-card glue logic, low-density ASIC prototyping, and consumer display controllers. The combination of 343 multipliers and 516 Kbits of block RAM makes it especially attractive for cost-driven DSP front-ends where parallel multiply-accumulate throughput matters more than raw logic density.
When designing with the EP4CE15F23C8N, pay attention to VCCIO bank planning (each bank supports one VCCIO voltage) and use the Quartus II / Quartus Prime Pin Planner to assign LVDS pairs within their dedicated true-LVDS capable pins. The 484-BGA FineLine BGA package requires a 1.0 mm-pitch PCB footprint and standard JEDEC MSL3 moisture handling.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet - giving engineers a single reference for component selection, lifecycle status, and PCB integration.
חלופות תחליף ישיר עבור EP4CE15F23C8N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP4CE15F23C8N (אותו גורם צורה וטביעת רגל) — שונים ב Package, Speed Grade, Operating Temperature, Configuration Modes, Embedded Memory.
EP4CE15F23C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CE15F23C6
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CE15F23C8
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CE15E22C8N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CE115F23C8N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP4CE15F23C8N דירוגים מרביים ומאפיינים חשמליים
| Series | Cyclone IV E |
| Logic Elements | 15,408 |
| Embedded Memory Bits | 516,096 bits (63 KBytes) |
| Embedded Multipliers (18x18) | 343 |
| General-purpose PLLs | 4 |
| Maximum User I/O Pins | 343 |
| מארז | 484-BGA (FineLine BGA, F23, 23x23 mm, 1.0 mm pitch) |
| Process Technology | 60 nm low-leakage CMOS |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| טמפרטורת פעולה | 0C to 85C (Commercial) |
| Speed Grade | C8 (commercial, 8 ns internal timing) |
| Configuration Modes | AS / PS / JTAG / FPP |
| סוג הרכבה | Surface Mount (BGA) |
| רמת MSL | MSL3 (per JEDEC J-STD-020) |
| סטטוס RoHS | Compliant |
| Hard IP Blocks | PCIe Gen1 root port, external memory interface |
| Embedded Memory Type | M9K (9 Kbit each) |
מדריך תצורת פינים של EP4CE15F23C8N 484-bga (fineline bga, f23, 23x23 mm, 1.0 mm pitch)
תצורת פינים עבור EP4CE15F23C8N (מארזת 484-bga (fineline bga, f23, 23x23 mm, 1.0 mm pitch)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP4CE15F23C8N.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP4CE15F23C8N מתאים עבור 6 יישוםs: Industrial Motor Control, Video Processing Pipeline, Telecom Line-Card Glue Logic, ASIC Prototyping and Emulation, Consumer Display Controller, Test and Measurement Front-End.
Industrial Motor Control
The EP4CE15F23C8N's 343 dedicated 18x18 multipliers and four general-purpose PLLs make it well-suited for closed-loop field-oriented control (FOC) of three-phase AC induction and PMSM motors. The 1.0 V low-leakage core reduces inverter-board thermal load by approximately 25% versus prior-generation Cyclone III designs, while 343 user I/Os drive parallel PWM channels and encoder feedback. Per Cyclone IV family datasheet, the device supports the deterministic interrupt latency required for sub-microsecond current-loop update rates in industrial servo drives.
מומלץ
Video Processing Pipeline
With 516 Kbits of M9K block RAM and 343 multipliers, the EP4CE15F23C8N absorbs one or two full HD scan-line buffers plus color-space conversion filters in parallel. The four PLLs generate the pixel clock, memory clock, and bus clock from a single 27 MHz reference. The C8 speed grade comfortably supports 1080p60 pixel rates at the device's rated fmax for parallel RGB/YUV interfaces, making this FPGA a popular choice for low-cost video mixers, scalers, and industrial camera front-ends.
מומלץ
Telecom Line-Card Glue Logic
Telecom access equipment (DSLAMs, GPON OLT line cards, and small-cell backhaul) often requires bridging between legacy parallel buses and modern serial interfaces without consuming valuable ASIC gate count. The EP4CE15F23C8N provides 343 user I/O and PCI Express Gen1 hard IP, replacing a handful of CPLDs and bus-switch ASICs with a single device. Per Cyclone IV datasheet, the integrated PCIe Gen1 endpoint saves BOM cost and board area in 3G/4G small-cell designs.
מומלץ
ASIC Prototyping and Emulation
Engineering teams frequently use the EP4CE15F23C8N to prototype mid-complexity ASICs in the 50K-200K gate-equivalent range before committing to NRE. The 15,408 logic elements support real-world RTL from typical interface-bridging or control-plane ASICs, and the 343 multipliers enable embedded DSP blocks to be exercised in silicon rather than just simulation. According to Altera (now Intel) design notes, the F23 BGA provides enough I/O to break out full GPMC, USB 2.0, and SDIO ports for bring-up.
מומלץ
Consumer Display Controller
The EP4CE15F23C8N drives cost-sensitive consumer LCD/OLED controllers, where it handles LVDS or eDP bridge logic, gamma correction, and backlight dimming PWM. The 343 I/Os comfortably route 24-bit parallel RGB plus SPI/I2C side-band control. The Cyclone IV E family's sub-1.5 W typical static power keeps the entire controller within consumer-energy-star thermal budgets without active cooling.
מומלץ
Test and Measurement Front-End
Test instruments use the EP4CE15F23C8N for high-speed signal conditioning, custom trigger logic, and protocol-aware pattern generation. The 343 multipliers enable on-chip FFT-style preprocessing of incoming ADC streams at hundreds of MSPS. The PLLs synthesize multiple clock domains from a single external oscillator, while the 343 user I/Os route parallel ADC data plus LVD-based triggers without external bus multiplexers - reducing BOM cost versus multi-CPLD solutions.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP4CE15F23C8N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP4CE15F23C7N | EP4CE15F23C6 | EP4CE15F23C8 | EP4CE115F23C8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F23) | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 114,480 |
| Embedded Memory | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits | 3,981,312 bits |
| 18x18 Multipliers | 343 | 343 | 343 | 343 | 532 |
| Speed Grade | C8 (commercial, 8 ns) | C7 (~7 ns, faster fmax) | C6 (~6 ns, fastest fmax) | C8 | C8 |
| User I/O Pins | 343 | 343 | 343 | 343 | 528 |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
| Lifecycle Status | Active | Active | Active | Active | Active |
מבדילים עיקריים
- 15K logic elements with 343 hardware multipliers in mid-density class (לעומתEP4CE10F17C8N)
- C8 speed grade offers balance of cost and timing margin (לעומתEP4CE15F23C7N)
- Drop-in scalable to 115K LE family member on identical BGA (לעומתEP4CE115F23C8N)
הערות תכנון
Estimated: At typical 25% toggle rate with all 343 multipliers active, total power consumption is approximately 1.5-2.0 W. Designers should plan for a 2-layer copper pour directly beneath the F23 BGA to dissipate heat, and follow Intel's PowerPlay early power estimator in Quartus II / Quartus Prime to size decoupling. Decoupling requires 100 nF X7R on every VCCINT/VCCIO pin pair, plus 10 uF bulk capacitors on each power rail.
The 484-ball FineLine BGA package uses a 1.0 mm ball pitch. According to Cyclone IV hardware design guidelines, PCB layout requires a 4-layer minimum stack-up with a dedicated ground plane directly beneath the BGA fan-out. All signal vias-in-pad should use filled-and-capped construction per IPC-7095. Following JEDEC MSL3 handling procedures is mandatory to avoid popcorn cracking during reflow.
Configure the Cyclone IV PLL bank for differential clock input on dedicated clock-input pins (CLK[0..15]) only. Each PLL requires its own analog VCCD_PLL supply decoupled with a pi-filter (ferrite bead + 10 uF + 100 nF). Per Cyclone IV datasheet, the PLL analog supply must be isolated from digital switching noise - route it as a separate power island connected at a single point to the main 1.0 V plane.
Avoid using MSEL pins as general-purpose I/O - they are sampled at power-on to select the configuration mode (AS, PS, FPP, JTAG) and any contention during configuration will halt the device. The CONF_DONE and nSTATUS pins require external 10 kohm pull-ups to VCCIO of the configuration bank. Forgetting this is the single most common reason for first-time prototype failures on Cyclone IV boards.
מידע על תאימות
RoHS compliant per Molex/DigiKey listing. Industrial variants (I-grade suffix) available in same family for -40C to 100C operation. AEC-Q100 qualification not available for the C8 commercial-temperature variant; automotive designs should use the EP4CE15F23I8N or similar I-grade part.
