MPC8572LVJAULE - 1.333GHz Dual-Core PowerQUICC III MPU | NXP
MPN: MPC8572LVJAULE ✓ פעילMPC8572LVJAULE סקירה
A microprocessor unit (MPU) is the central processing unit of an embedded computing system, integrating CPU cores, caches, memory controllers, and high-speed peripherals on a single die. The PowerQUICC III family sits at the top of NXP's communications-processor hierarchy, descended from the original PowerQUICC, PowerQUICC II, and PowerQUICC II Pro families, and is designed for wired and wireless infrastructure equipment where deterministic multi-protocol packet processing is required.
Key features of the MPC8572LVJAULE include 1.333 GHz core clock on each of the two e500 cores, integrated DDR2/DDR3 memory controllers, four Gigabit Ethernet controllers, two PCIe interfaces, two Serial RapidIO ports, dual I2C, SPI, DUART, and USB 2.0, plus an integrated security engine. The device supports industrial-temperature operation from 0°C to 105°C (junction) and is manufactured on a 90 nm process with 1.8V/2.5V/3.3V I/O supply rails.
Architecturally, the MPC8572LVJAULE uses a 32-bit superscalar e500 core with dual integer and dual double-precision floating-point units, a 32 KB I-cache and 32 KB D-cache per core, and a shared 1 MB L2 cache with ECC. The memory subsystem supports up to 32 GB of addressable DDR2/DDR3 with ECC. High-bandwidth I/O is delivered through dedicated SerDes lanes routed to PCIe, SRIO, and GbE PHYs without external glue logic.
Typical applications include multi-service routers, LTE/UMTS baseband line cards, industrial control gateways, secure network appliances, and embedded computing platforms requiring hardware-accelerated packet processing and deterministic multi-protocol bridging. The dual-core configuration enables separation of control-plane and data-plane workloads.
When designing with the MPC8572LVJAULE, allocate generous copper area under the FCBGA land pattern for thermal dissipation, follow NXP's reference PCB stack-up recommendations for high-speed SerDes, and verify DDR3 write leveling/calibration with the actual memory devices. Use NXP's CodeWarrior development suite for bring-up.
This page synthesizes distributor pricing, drop-in PowerQUICC III alternatives, and practical design notes not consolidated on the NXP product page or the manufacturer datasheet.
חלופות תחליף ישיר עבור MPC8572LVJAULE — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
MPC8572EVJAULE
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MPC8572CLVJAULE
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MPC8572LVJAULD
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MPC8572ELVJAULE
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
MPC8572VJAULE
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
MPC8572LVJAULE דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | PowerPC e500 |
| Number of Cores | 2 |
| רוחב אפיק נתונים | 32-bit |
| Core Clock Speed | 1.333 GHz |
| Co-Processors / DSP | Signal Processing; SPE |
| Memory Controller | DDR2 / DDR3 |
| Ethernet | Gigabit Ethernet (4x) |
| High-Speed Serial I/O | PCIe, Serial RapidIO (SRIO) |
| Graphics Acceleration | No |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| מארז | 1023-FCBGA (33x33 mm) |
| סוג הרכבה | Surface Mount (BGA) |
| טמפרטורת פעולה | 0 °C to 105 °C |
| Process Technology | 90 nm CMOS |
| MSL (Moisture Sensitivity Level) | 3 |
| Peak Reflow Temperature | 245 °C (max 30 s) |
| Terminal Finish | Tin-Silver (SnAg) |
| Series | MPC85xx / PowerQUICC III |
| JEDEC JESD-609 Code | e2 |
| סטטוס RoHS | Compliant (per Heisener listing) |
מדריך תצורת פינים של MPC8572LVJAULE 1023-fcbga (33x33 mm)
תצורת פינים עבור MPC8572LVJAULE (מארזת 1023-fcbga (33x33 mm)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור MPC8572LVJAULE.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
MPC8572LVJAULE מתאים עבור 7 יישוםs: Multi-Service Router Line Card, LTE / UMTS Baseband Processing, Industrial Control Gateway, Secure Network Appliance, Embedded Computing Platform, Wireless Backhaul Aggregation, Storage Controller / NAS Bridge.
Multi-Service Router Line Card
The MPC8572LVJAULE's dual PowerPC e500 cores at 1.333 GHz run separate data-plane (packet forwarding via SRIO/GbE) and control-plane (routing protocols, OAM, CLI) tasks in parallel. The integrated four-port Gigabit Ethernet and two SRIO lanes enable direct attach to switch fabrics without external PHYs. Compared to a single-core design, the dual-core topology doubles control-plane throughput while leaving headroom for QoS shaping, ACL lookups, and traffic management on the data-plane core. DDR3 with ECC ensures reliable memory operations at line-rate forwarding loads.
מומלץ
LTE / UMTS Baseband Processing
The MPC8572LVJAULE's dual-core e500 architecture with on-chip SPE signal-processing extensions is well-suited to LTE Layer-1 baseband, channel coding, and HARQ control. PCIe links attach directly to a baseband FPGA or radio card, while four GbE ports backhaul to the baseband pool. The DDR2/DDR3 controller with ECC sustains the high memory bandwidth required by turbo decoding and FFT operations. The 1023-FCBGA package provides sufficient I/O for multi-RAT radio heads and the 0-105 °C temperature range suits outdoor base-station enclosures.
מומלץ
Industrial Control Gateway
The MPC8572LVJAULE's deterministic e500 cores and PCIe/SRIO/GbE mix make it an ideal control gateway between industrial Ethernet fieldbuses and enterprise backhaul. The dual cores isolate time-critical industrial protocols (PROFINET, EtherCAT) from non-real-time SCADA/management traffic. DDR3 with ECC provides robust memory operation in noisy factory environments, while the FCBGA package's industrial temperature rating (0-105 °C) handles the wide thermal range of control cabinets. NXP's CodeWarrior IDE streamlines deterministic real-time software development.
מומלץ
Secure Network Appliance
For VPN gateways, firewalls, and IPS/IDS appliances, the MPC8572EVJAULE (or MPC8572ELVJAULE with security engine) provides hardware-accelerated encryption that the plain MPC8572LVJAULE does not. Even without the E variant, the dual e500 cores can run software cryptography plus full packet inspection in parallel. The four GbE ports support WAN/LAN/DMZ segmentation, while PCIe provides a path to external crypto accelerators or 10 GbE uplinks. DDR3 ECC ensures memory integrity under sustained deep-packet-inspection workloads.
מומלץ
Embedded Computing Platform
In VME or VPX-based embedded computing systems, the MPC8572LVJAULE serves as a CPU payload board controller with dual e500 cores handling real-time operating-system tasks (VxWorks, INTEGRITY) plus housekeeping I/O via DUART, I2C, and SPI. The PCIe and SRIO links connect to neighbouring payload cards on the backplane with deterministic latency. The 1023-FCBGA package's high I/O count exposes all peripherals while the 1.333 GHz clock provides ample headroom for high-rate data acquisition flows on the same payload.
מומלץ
Wireless Backhaul Aggregation
The MPC8572LVJAULE aggregates traffic from multiple microwave/PtP backhaul links via its four GbE ports and routes them upstream over SRIO or PCIe. Dual e500 cores let one core run link-aggregation protocols (LACP, MLAG) while the other handles QoS policing and shaping. The DDR3 controller sustains high-bandwidth buffering during peak aggregation. Compared to discrete CPU + switch designs, the integrated architecture reduces BOM cost and PCB area in compact street-cabinet backhaul units.
מומלץ
Storage Controller / NAS Bridge
The MPC8572LVJAULE can serve as a NAS bridge controller, using PCIe to attach to a RAID/HBA card, GbE for host connectivity, and the dual e500 cores to run a storage OS (Linux with iSCSI or NFS targets). DDR3 ECC protects against silent data corruption in write-back cache operations. SRIO enables direct attach to a high-availability peer controller for clustering. The industrial temperature grade suits unattended edge-storage deployments in factory floors or remote sites.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MPC8572LVJAULE — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MPC8572EVJAULE | MPC8572CLVJAULE | MPC8572LVJAULD | MPC8572ELVJAULE | MPC8572VJAULE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Core Architecture | 2x PowerPC e500 | 2x PowerPC e500 + security engine | 2x PowerPC e500 (lower speed grade) | 2x PowerPC e500 | 2x PowerPC e500 + security engine | 2x PowerPC e500 |
| Core Clock | 1.333 GHz | 1.333 GHz | 1.0 GHz (lower grade) | 1.333 GHz | 1.333 GHz | 1.333 GHz |
| Memory Controller | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 |
| Gigabit Ethernet | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports |
| PCIe / SRIO Lanes | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO |
| Security Engine | No | Yes | No | No | Yes | No |
| Series | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III |
מבדילים עיקריים
- Dual-core e500 at 1.333 GHz in 1023-FCBGA with DDR2/DDR3 + 4 GbE + PCIe + SRIO integrated (לעומתMPC8548EVJAUJD)
- Optional security engine without package change (לעומתMPC8572CLVJAULE)
- Higher I/O integration vs competing QorIQ entry parts (לעומתP1020)
- Long-lifecycle PowerQUICC III silicon (לעומתGeneric ARM SoC)
הערות תכנון
Estimated: the 1023-FCBGA package has limited exposed die area for top-side cooling. For typical 1.333 GHz dual-core operation at 1.8V/2.5V/3.3V, expect 6-8W package dissipation. Provide a thermal pad connection to an inner copper plane with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) under the die shadow, and consider a low-profile heatsink for fan-less enclosure designs above 4-5W total power. Maintain junction temperature below 105 °C.
Use a high-layer-count stack-up (minimum 8 layers) with dedicated ground and power planes adjacent to the outer signal layers. Route SerDes differential pairs (PCIe, SRIO) with 85 ohm differential impedance and length matching within 5 mils per NXP layout guidelines. Place the DDR3 memory devices on the same side as the FCBGA, within 5 cm of the package, with matched routing for byte-lane signals.
Do not rely on the default DDR3 calibration; perform write-leveling at production thermal corners. The SerDes reference clock must be within +/- 100 ppm of the NXP-referenced frequency for PCIe/SRIO link-up. Boot configuration resistors on the cfg pins must match the chosen boot source (NOR flash, NAND flash, I2C EEPROM) - a common bring-up failure is incorrect cfg pull-up/pull-down values.
Keep noisy digital signals (DDR, SerDes) at least 3 mm from analog signals on the same PCB layer. Decoupling must include 0.1 uF X7R caps within 2 mm of each power pin plus bulk 10 uF X5R near the package. Use split analog/digital power domains with ferrite-bead isolation if mixing sensitive analog with the FCBGA's digital switching noise.
Series SRIO links are particularly sensitive to inter-symbol interference; validate eye-mask compliance at the receiver with the actual board stack-up and SerDes pre-emphasis/de-emphasis settings. PCIe Gen1/Gen2 endpoints may require CTLE adaptation; use NXP's SerDes configuration tool rather than generic PHY defaults.
מידע על תאימות
RoHS compliance inferred from Tin-Silver (SnAg) finish and JESD-609 Code e2 per Heisener and Vyrian listings reviewed 2026-10-17. AEC-Q100 not applicable (industrial communications MPU, not automotive). Halogen-free status not stated in Verified Web Data.